Product Technical Specification
AirPrime HL7688
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Product Technical Specification
Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.
Note:
Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door
is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.
Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.
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Product Technical Specification
Patents
This product may contain technology developed by or for Sierra Wireless Inc.
This product includes technology licensed from QUALCOMM®.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents
licensed from InterDigital Group and MMP Portfolio Licensing.
Copyright
© 2016 Sierra Wireless. All rights reserved.
Trademarks
Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.
Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other
countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.
Contact Information
Sales information and technical support,
including warranty and returns
Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795
6:00 am to 6:00 pm PST
Corporate and product information
Web: sierrawireless.com
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Product Technical Specification
Document History
Version
Date
Updates
1.0
May 23, 2016
Creation
1.1
May 26, 2016
Updated:
Table 2 General Features
1.8.2 Regulatory
3.16.2 RF Performances
1.2
May 30, 2016
Updated:
Figure 2 Mechanical Overview
4 Mechanical Drawings
2.0
August 16, 2016
Updated section 7 FCC Regulations
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Contents
1. INTRODUCTION .................................................................................................. 10
1.1.
Common Flexible Form Factor (CF3)............................................................................. 10
1.2.
Physical Dimensions ..................................................................................................... 10
1.3.
General Features .......................................................................................................... 11
1.4.
Architecture ................................................................................................................... 13
1.5.
Interfaces ...................................................................................................................... 14
1.6.
Connection Interface ..................................................................................................... 14
1.7.
ESD .............................................................................................................................. 15
1.8.
Environmental and Certifications ................................................................................... 15
1.8.1.
Environmental Specifications ................................................................................. 15
1.8.2.
Regulatory ............................................................................................................. 16
1.8.3.
RoHS Directive Compliant ..................................................................................... 16
1.8.4.
Disposing of the Product ........................................................................................ 16
1.9.
References .................................................................................................................... 16
2. PAD DEFINITION ................................................................................................. 17
2.1.
Pad Configuration (Top View, Through Module) ........................................................... 22
3. DETAILED INTERFACE SPECIFICATIONS ....................................................... 23
3.1.
Power Supply ................................................................................................................ 23
3.2.
Current Consumption .................................................................................................... 23
3.3.
VGPIO........................................................................................................................... 24
3.4.
BAT_RTC ...................................................................................................................... 25
3.5.
SIM Interface ................................................................................................................. 25
3.5.1.
UIM1_DET ............................................................................................................. 26
3.6.
USB .............................................................................................................................. 26
3.7.
Electrical Information for Digital I/O ............................................................................... 26
3.8.
General Purpose Input/Output (GPIO) .......................................................................... 27
3.9.
Main Serial Link (UART1).............................................................................................. 28
3.10.
POWER-ON Signal (PWR_ON_N)................................................................................ 28
3.11.
Reset Signal (RESET_IN_N) ........................................................................................ 29
3.12.
Analog to Digital Converter (ADC1)............................................................................... 30
3.13.
Clock Interface .............................................................................................................. 30
3.14.
PCM .............................................................................................................................. 31
3.15.
Debug Interfaces ........................................................................................................... 32
3.15.1. Trace Debug .......................................................................................................... 32
3.15.2. JTAG...................................................................................................................... 33
3.16.
RF Interface .................................................................................................................. 33
3.16.1. RF Connection ....................................................................................................... 33
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3.16.2.
3.16.3.
RF Performances ................................................................................................... 34
TX_ON Indicator (TX_ON) ..................................................................................... 34
4. MECHANICAL DRAWINGS................................................................................. 36
5. DESIGN GUIDELINES ......................................................................................... 39
5.1.
Power-Up Sequence ..................................................................................................... 39
5.2.
Module Switch-Off ......................................................................................................... 40
5.3.
Emergency Power OFF ................................................................................................. 40
5.4.
Sleep Mode Management ............................................................................................. 40
5.4.1.
Using UART1 ......................................................................................................... 40
5.4.2.
Using USB ............................................................................................................. 41
5.5.
Power Supply Design .................................................................................................... 41
5.6.
ESD Guidelines for SIM Card ........................................................................................ 41
5.7.
ESD Guidelines for USB ............................................................................................... 42
6. RELIABILITY SPECIFICATION ........................................................................... 43
6.1.
Reliability Compliance ................................................................................................... 43
6.2.
Reliability Prediction Model ........................................................................................... 43
6.2.1.
Life Stress Test ...................................................................................................... 43
6.2.2.
Environmental Resistance Stress Tests ................................................................. 44
6.2.3.
Corrosive Resistance Stress Tests ........................................................................ 44
6.2.4.
Thermal Resistance Cycle Stress Tests................................................................. 45
6.2.5.
Mechanical Resistance Stress Tests ..................................................................... 47
6.2.6.
Handling Resistance Stress Tests ......................................................................... 48
7. FCC REGULATIONS ........................................................................................... 50
8. ORDERING INFORMATION ................................................................................ 52
9. TERMS AND ABBREVIATIONS.......................................................................... 53
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List of Figures
Figure 1.
Architecture Overview ................................................................................................... 13
Figure 2.
Mechanical Overview .................................................................................................... 14
Figure 3.
Pad Configuration ......................................................................................................... 22
Figure 4.
PCM Timing Waveform ................................................................................................. 32
Figure 5.
TX_ON State During Transmission ............................................................................... 35
Figure 6.
Mechanical Drawing ...................................................................................................... 36
Figure 7.
Dimensions Drawing ..................................................................................................... 37
Figure 8.
Footprint ........................................................................................................................ 38
Figure 9.
PWR_ON_N Sequence with VGPIO Information .......................................................... 39
Figure 10.
Power OFF Sequence for PWR_ON_N, VGPIO ........................................................... 40
Figure 11.
Voltage Limiter Example ............................................................................................... 41
Figure 12.
EMC and ESD Components Close to the SIM .............................................................. 42
Figure 13.
ESD Protection for USB ................................................................................................ 42
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List of Tables
Table 1.
Supported Bands/Connectivity ...................................................................................... 10
Table 2.
General Features .......................................................................................................... 11
Table 3.
ESD Specifications........................................................................................................ 15
Table 4.
Environmental Specifications ........................................................................................ 15
Table 5.
Regulation Compliance ................................................................................................. 16
Table 6.
Pad Definition ................................................................................................................ 17
Table 7.
Power Supply ................................................................................................................ 23
Table 8.
Current Consumption .................................................................................................... 23
Table 9.
Current Consumption per Power Supply ....................................................................... 24
Table 10.
VGPIO Electrical Characteristics ................................................................................... 24
Table 11.
BAT_RTC Electrical Characteristics .............................................................................. 25
Table 12.
UIM1 Pad Description ................................................................................................... 25
Table 13.
Electrical Characteristics of UIM1.................................................................................. 26
Table 14.
USB Pad Description .................................................................................................... 26
Table 15.
Digital I/O Electrical Characteristics .............................................................................. 27
Table 16.
GPIO Pad Description ................................................................................................... 27
Table 17.
UART1 Pad Description ................................................................................................ 28
Table 18.
PWR_ON_N Electrical Characteristics .......................................................................... 29
Table 19.
RESET_IN_N Electrical Characteristics ........................................................................ 29
Table 20.
ADC Interface Pad Description ..................................................................................... 30
Table 21.
ADC Electrical Characteristics ...................................................................................... 30
Table 22.
Clock Interface Pad Description .................................................................................... 30
Table 23.
PCM Interface Pad Description ..................................................................................... 31
Table 24.
PCM Electrical Characteristics ...................................................................................... 31
Table 25.
Trace Debug Pad Description ....................................................................................... 32
Table 26.
JTAG Pad Description ................................................................................................... 33
Table 27.
RF Main Connection ..................................................................................................... 33
Table 28.
RF Diversity Connection ............................................................................................... 33
Table 29.
Conducted RX Sensitivity – UMTS Bands ..................................................................... 34
Table 30.
Conducted RX Sensitivity – LTE Bands ........................................................................ 34
Table 31.
TX_ON Indicator Pad Description ................................................................................. 34
Table 32.
TX_ON Characteristics ................................................................................................. 34
Table 33.
Standards Conformity ................................................................................................... 43
Table 34.
Life Stress Test ............................................................................................................. 43
Table 35.
Environmental Resistance Stress Tests ........................................................................ 44
Table 36.
Corrosive Resistance Stress Tests ............................................................................... 44
Table 37.
Thermal Resistance Cycle Stress Tests ........................................................................ 45
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Product Technical Specification
Table 38.
Mechanical Resistance Stress Tests............................................................................. 47
Table 39.
Handling Resistance Stress Tests ................................................................................ 48
Table 40.
Ordering Information ..................................................................................................... 52
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1. Introduction
This document is the Product Technical Specification for the AirPrime HL7688 Embedded Module. It
defines the high level product features and illustrates the interfaces for these features. This document
is intended to cover the hardware aspects of the product, including electrical and mechanical.
The AirPrime HL7688 belongs to the AirPrime HL Series from Essential Connectivity Module family.
These are industrial grade Embedded Wireless Modules that provide data connectivity on wireless
networks (as listed in Table 1 Supported Bands/Connectivity).
The HL7688 supports a large variety of interfaces such as USB 2.0, UART and GPIOs to provide
customers with the highest level of flexibility in implementing high-end solutions.
Table 1.
Supported Bands/Connectivity
RF Band
Transmit Band (Tx)
Receive Band (Rx)
Maximum Output Power
LTE B2
1850 to 1910 MHz
1930 to 1990 MHz
23 dBm (+/- 2dBm) Class 3bis
LTE B4
1710 to 1755 MHz
2110 to 2155 MHz
23 dBm (+/- 2dBm) Class 3bis
LTE B5
824 to 849 MHz
869 to 894 MHz
23 dBm (+/- 2dBm) Class 3bis
LTE B17
704 to 716 MHz
734 to 746 MHz
23 dBm (+/- 2dBm) Class 3bis
UMTS B2
1850 to 1910 MHz
1930 to 1990 MHz
23 dBm (+/- 2dBm) Class 3bis
UMTS B5
824 to 849 MHz
869 to 894 MHz
23 dBm (+/- 2dBm) Class 3bis
1.1.
Common Flexible Form Factor (CF3)
The AirPrime HL7688 belongs to the Common Flexible Form Factor (CF3) family of modules. This
family consists of a series of WWAN modules that share the same mechanical dimensions (same
width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique
solution to a series of problems faced commonly in the WWAN module space as it:
Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings
Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions
Offers electrical and functional compatibility
Provides Direct Mount as well as Socketability depending on customer needs
1.2.
Physical Dimensions
AirPrime HL7688 modules are compact, robust, fully shielded modules with the following dimensions:
Length: 23 mm
Width: 22 mm
Thickness: 2.5 mm
Weight: 3.5 g
Note:
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Dimensions specified above are typical values.
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Product Technical Specification
1.3.
Introduction
General Features
The table below summarizes the AirPrime HL7688 features.
Table 2.
General Features
Feature
Physical
Electrical
Description
Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x
2.5mm (nominal)
Complete body shielding
RF connection pads (RF main interface)
Baseband signals connection
Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V
RF
SIM interface
Application interface
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Quad-band LTE:
LTE B2: 1900 PCS
LTE B4: 1700 AWS
LTE B5: 850 CLR
LTE B17: 700
Dual-band UMTS:
UMTS B2: 1900 PCS
UMTS B5: 850 CLR
Dual SIM Single Standby (DSSS)
1.8V/3V support
SIM extraction / hot plug detection
SIM/USIM support
Conforms with ETSI UICC Specifications
Supports SIM application tool kit with proactive SIM commands
NDIS NIC interface support (Windows XP, Windows 7, Windows 8,
Windows CE, Linux)
Multiple non-multiplexed USB channel support
Dial-up networking
USB selective suspend to maximize power savings
CMUX multiplexing over UART*
AT command interface – 3GPP 27.007 standard, plus proprietary
extended AT commands
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Product Technical Specification
Feature
Introduction
Description
Protocol Stack
Single mode LTE operation:
LTE FDD, bandwidth 1.4-20 MHz
System Release: 3GPP Rel. 9
Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink)
Rx Diversity
Max modulation 64 QAM DL, 16 QAM UL
Intra-frequency and inter-frequency mobility
SMS over SGs and IMS
SON ANR
Public Warning System PWS
HSDPA (High Speed Downlink Packet Access)
Evolved High Speed Downlink Packet Access (HSDPA+)
Compliant with 3GPP Release 9
Up to Category 24 (DC, 42.2Mbps)
Continuous Packet Connectivity (CPC)
Enhance fractional DPCH
IPv6 support
HSUPA (High Speed Uplink Packet Access)
Compliant with 3GPP Release 9
Category 7 (11.5Mbps)
Robust Header Compression (RoHC)
RXDIV Performance Enhancements
SMS
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Type 3i (HSDPA)
HSPA Enhancements
MAC-ehs Rel. 7
HSDPA Enhanced CELL_FACH/PCH states
HSUPA Enhanced CELL_FACH states (eFACH) Rel 8
MAC-i/is Rel.8
Serving cell change enhancements Rel. 8
SMS over SGs and IMS
SMS MO and MT
SMS saving to SIM card or ME storage
SMS reading from SIM card or ME storage
SMS sorting
SMS concatenation
SMS Status Report
SMS replacement support
SMS storing rules (support of AT+CNMI, AT+CNMA)
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Product Technical Specification
Feature
Introduction
Description
Multiple (up to 20) cellular packet data profiles
Sleep mode for minimum idle power draw
Mobile-originated PDP context activation / deactivation
Support QoS profile
Connectivity
Release 97 – Precedence Class, Reliability Class, Delay Class, Peak
Throughput, Mean Throughput
Release 99 QoS negotiation – Background, Interactive, and
Streaming
Static and Dynamic IP address. The network may assign a fixed IP
address or dynamically assign one using DHCP (Dynamic Host
Configuration Protocol).
Supports PAP and CHAP authentication protocols
PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
RFC1144 TCP/IP header compression
Operating temperature ranges (industrial grade):
Environmental
RTC
1.4.
Class A: -30°C to +70°C
Class B: -40°C to +85°C
Real Time Clock (RTC) with calendar
Architecture
The figure below presents an overview of the AirPrime HL7688’s internal architecture and external
interfaces.
Memory
(Flash + RAM)
VBATT
GND
VGPIO
Baseband
AirPrime HL7688
RX_LTE
Dulpexer
TX_LTE
PA
RF
BAT_RTC
Antenna
Switch
RF Main
GPIO x 12
UART x 1
LGA146
MCU
DSP
PMU
RF
Trace Debug (5 pins)
JTAG
26M_CLKOUT
32K_CLKOUT
LGA146
Analog Baseband
SIM1
RESET_IN
PWR_ON
Peripherals
RX_LTE
SAW
Filters
RF
Antenna
Switch
RF DIV
USB
ADC x 1
PCM
TX_ON
26MHz
Figure 1.
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32.768KHz
Architecture Overview
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Product Technical Specification
1.5.
Introduction
Interfaces
The AirPrime HL7688 module provides the following interfaces and peripheral connectivity:
1x – 8-wire UART
1x – Active Low RESET
1x – USB 2.0
1x – Backup Battery Interface
2x – System Clock Out
1x – Active Low POWER-ON
1x – 1.8V/3V SIM
1x – JTAG Interface
12x – GPIOs (2 of which have multiplexes)
1x – Main Antenna
1x – RX Diversity Antenna
1x – VGPIO
1x – TX_ON
1x – ADC
1x – PCM
1x – Debug Interface
1.6.
Connection Interface
The AirPrime HL7688 module is an LGA form factor device. All electrical and mechanical connections
are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.
Figure 2.
Mechanical Overview
The 146 pads have the following distribution:
66 inner signal pads, 1x0.5mm, pitch 0.8mm
1 reserved test point (do not connect), 1.0mm diameter
7 test point (JTAG), 0.8mm diameter, 1.20mm pitch
64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm
4 inner corner ground pads, 1x1mm
4 outer corner ground pads, 1x0.9mm
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Product Technical Specification
1.7.
Introduction
ESD
Refer to the following table for ESD Specifications.
Note:
Information specified in the following table is preliminary and subject to change.
Table 3.
ESD Specifications
Category
Connection
Operational
RF ports
Specification
IEC-61000-4-2 – Level (Electrostatic Discharge Immunity Test)
Unless otherwise specified:
Non-operational
Host connector
interface
SIM connector
Signals
Other host signals
1.8.
JESD22-A114 +/- 1kV Human Body Model
JESD22-A115 +/- 200V Machine Model
JESD22-C101C +/- 250V Charged Device Model
Adding ESD protection is highly recommended at the point where
the USIM contacts are exposed, and for any other signals that
would be subjected to ESD by the user.
Environmental and Certifications
1.8.1.
Environmental Specifications
The environmental specification for both operating and storage conditions are defined in the table
below.
Table 4.
Environmental Specifications
Conditions
Range
Operating Class A
-30°C to +70°C
Operating Class B
-40°C to +85°C
Storage
-40°C to +85°C
Class A is defined as the operating temperature ranges that the device:
Shall exhibit normal function during and after environmental exposure.
Shall meet the minimum requirements of 3GPP or appropriate wireless standards.
Class B is defined as the operating temperature ranges that the device:
Shall remain fully functional during and after environmental exposure
Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even
when one or more environmental constraint exceeds the specified tolerance.
Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.
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Product Technical Specification
1.8.2.
Introduction
Regulatory
The AirPrime HL7688 is compliant with FCC regulations.
FCC compliance will be reflected on the AirPrime HL7688 label.
Table 5.
Regulation Compliance
Document
Current Version
Description
GCF-CC
v3.56.1 or later
GCF Conformance Certification Criteria
NAPRD.03
V5.22 or later
North American Program Reference Document
FCC Part 22, 24, 27
NA
Federal Communications Commission
1.8.3.
RoHS Directive Compliant
The AirPrime HL7688 module is compliant with RoHS Directive 2011/65/EU which sets limits for the
use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new
electrical and electronic equipment put on the market does not contain lead, mercury, cadmium,
hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.
1.8.4.
Disposing of the Product
This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.
1.9.
[1]
References
AirPrime HL Series Customer Process Guidelines
Reference Number: 4114330
[2]
AirPrime HL7688 AT Commands Interface Guide
Reference Number: TBD
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2.
Pad Definition
AirPrime HL7688 pads are divided into 3 functional categories.
Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of
modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions
and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it
is always at the same pad location.
Custom functions and associated pads are specific to a given module, and make an opportunistic use of specific chipset functions and I/Os.
Custom features should be used with caution as there is no guarantee that the custom functions available on a given module will be available on
other CF3 modules.
Other pads marked as “not connected” or “reserved” should not be used.
Table 6.
Pad Definition
Power Supply
Domain
Recommendation
for Unused Pads
Type
I/O
1.8V
Left Open
Extension
UART1 Ring indicator / Trace data 3
O
1.8V
Connect to test point
Core / Custom
UART1_RTS
UART1 Request to send
I
L
1.8V
Connect to test point
Core
UART1_CTS
UART1 Clear to send
O
L
1.8V
Connect to test point
Core
5
UART1_TX
UART1 Transmit data
I
1.8V
Connect to test point
Core
6
UART1_RX
UART1 Receive data
O
1.8V
Connect to test point
Core
7
UART1_DTR
UART1 Data terminal ready
I
L
1.8V
Connect to test point
Core
8
UART1_DCD /
TRACE_DATA1
UART1 Data carrier detect / Trace data 1
O
L
1.8V
Connect to test point
Core / Custom
Pad #
Signal Name
Function
I/O
1
GPIO1
General purpose input/output
2
UART1_RI /
TRACE_DATA3
3
4
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Product Technical Specification
Pad Definition
Pad #
Signal Name
Function
I/O
Active
Low / High
Power Supply
Domain
Recommendation
for Unused Pads
Type
9
UART1_DSR /
TRACE_DATA0
UART1 Data set ready / Trace data 0
O
L
1.8V
Connect to test point
Core / Custom
10
GPIO2 / TRACE_DATA2
General purpose input/output / Trace data 2
I/O
1.8V
Connect to test point
Core / Custom
11
RESET_IN_N
Input reset signal
I
1.8V
Left Open
Core
12
USB_D-
Connect to test point
Extension
13
USB_D+
Connect to test point
Extension
14
NC
Not Connected (Reserved for future use)
Left Open
Not connected
15
NC
Not Connected (Reserved for future use)
16
USB_VBUS
USB VBUS
17
NC
18
USB Data Negative (Low / Full Speed)
USB Data Negative (High Speed)
USB Data Positive (Low / Full Speed)
USB Data Positive (High Speed)
I/O
I/O
L
3.3V
0.38V
3.3V
0.38V
Left Open
Not connected
Connect to test point
Extension
Not Connected (Reserved for future use)
Left Open
Not connected
NC
Not Connected (Reserved for future use)
Left Open
Not connected
19
NC
Not Connected (Reserved for future use)
Left Open
Not connected
20
NC
Not Connected (Reserved for future use)
Left Open
Not connected
21
BAT_RTC
Power supply for RTC backup
I/O
1.8V
Left Open
Extension
22
26M_CLKOUT
26MHz System Clock Output
O
1.8V
Left Open
Extension
23
32K_CLKOUT
32.768kHz System Clock Output
O
1.8V
Left Open
Extension
24
ADC1
Analog to digital converter
I
1.2V
Left Open
Extension
25
NC
Not Connected (Reserved for future use)
Left Open
Not connected
26
UIM1_VCC
1.8V/3V SIM1 Power supply
O
1.8V/3V
Mandatory
connection
Core
27
UIM1_CLK
1.8V/3V SIM1 Clock
O
1.8V/3V
Mandatory
connection
Core
28
UIM1_DATA
1.8V/3V SIM1 Data
I/O
1.8V/3V
Mandatory
connection
Core
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Product Technical Specification
Pad Definition
Pad #
Signal Name
Function
I/O
Active
Low / High
Power Supply
Domain
Recommendation
for Unused Pads
Type
29
UIM1_RESET
1.8V/3V SIM1 Reset
O
L
1.8V/3V
Mandatory
connection
Core
30
GND
Ground
0V
0V
Mandatory
connection
Extension
31
RF_DIV
RF Input - Diversity
Mandatory
connection
Extension
32
GND
Ground
0V
0V
Mandatory
connection
Extension
33
PCM_OUT
PCM data out
O
1.8V
Left Open
Extension
34
PCM_IN
PCM data in
I
1.8V
Left Open
Extension
35
PCM_SYNC
PCM sync out
I/O
1.8V
Left Open
Extension
36
PCM_CLK
PCM clock
I/O
1.8V
Left Open
Extension
0V
Mandatory
connection
Core
37
GND
Ground
0V
38
NC
Not Connected (Reserved for future use)
Left Open
Not connected
Core
39
GND
Ground
0V
0V
Mandatory
connection
40
GPIO7
General purpose input/output
I/O
1.8V
Left Open
Core
41
GPIO8 / TRACE_CLK
General purpose input/output / Trace clock
I/O
1.8V
Connect to test point
Core/Custom
42
NC
Not Connected (Reserved for future use)
Left Open
Not connected
43
NC
Not Connected (Reserved for future use)
Left Open
Not connected
44
GPIO13
General purpose input/output
O
1.8V
Left Open
Extension
45
VGPIO
GPIO voltage output
O
1.8V
Left Open
Core
46
GPIO6
General purpose input/output
I/O
1.8V
Left Open
Core
47
NC
Not Connected (Reserved for future use)
Left Open
Not connected
48
GND
Ground
Mandatory
connection
Core
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Product Technical Specification
Pad Definition
Recommendation
for Unused Pads
Type
Mandatory
connection
Core
0V
Mandatory
connection
Core
I
1.8V
Left Open
Extension
General purpose input/output
I/O
1.8V
Left Open
Extension
GPIO11
General purpose input/output
I/O
1.8V
Left Open
Extension
54
GPIO15
General purpose input/output
I/O
1.8V
Left Open
Extension
55
NC
Not Connected (Reserved for future use)
Left Open
Not connected
56
NC
Not Connected (Reserved for future use)
Left Open
Not connected
57
NC
Not Connected (Reserved for future use)
Left Open
Not connected
58
NC
Not Connected (Reserved for future use)
Left Open
Not connected
59
PWR_ON
Active Low Power On control signal
I
1.8V
Mandatory
connection
Core
60
TX_ON
TX indicator
O
2.3V
Left Open
Extension
Mandatory
connection
Core
Pad #
Signal Name
Function
I/O
49
RF_MAIN
RF Input/output
50
GND
Ground
0V
51
GPIO14
General purpose input/output
52
GPIO10
53
Active
Low / High
L
Power Supply
Domain
61
VBATT_PA
Power supply (refer to section 3.1 Power
Supply for more information)
I
3.2V (min)
3.7V (typ)
4.5V (max)
62
VBATT_PA
Power supply (refer to section 3.1 Power
Supply for more information)
I
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory
connection
Core
63
VBATT
Power supply
I
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory
connection
Core
64
UIM1_DET
UIM1 Detection
I/O
H
1.8V
Left Open
Core
65
GPIO4
General purpose input/output
I/O
H
1.8V
Left Open
Extension
66
GPIO5
General purpose input/output
I/O
1.8V
Left Open
Extension
67-70
GND
Ground
GND
0V
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Product Technical Specification
Pad #
Signal Name
71 - 166
Note:
Pad Definition
Function
I/O
Active
Low / High
Power Supply
Domain
Recommendation
for Unused Pads
Type
These pads are not available on the AirPrime HL7688 module.
167 - 234
GND
Ground
GND
236
JTAG_RESET
JTAG RESET
I
237
JTAG_TCK
JTAG Test Clock
238
JTAG_TDO
239
240
0V
Core
1.8V
Left Open
Extension
I
1.8V
Left Open
Extension
JTAG Test Data Output
O
1.8V
Left Open
Extension
JTAG_TMS
JTAG Test Mode Select
I
1.8V
Left Open
Extension
JTAG_TRST
JTAG Test Reset
I
1.8V
Left Open
Extension
241
JTAG_TDI
JTAG Test Data Input
I
1.8V
Left Open
Extension
242
JTAG_RTCK
JTAG Returned Test Clock
O
1.8V
Left Open
Extension
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Product Technical Specification
2.1.
Figure 3.
4119272
Pad Definition
Pad Configuration (Top View, Through Module)
Pad Configuration
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3. Detailed Interface Specifications
Note:
If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of
25°C.
For standard applications, VBATT and VBATT_PA must be tied externally to the same power
supply. For some specific applications, AirPrime HL7688 modules support separate VBATT and
VBATT_PA connection if requirements below are fulfilled.
3.1.
Power Supply
The AirPrime HL7688 modules is supplied through the VBATT signal with the following
characteristics.
Table 7.
Power Supply
Supply
Minimum
Typical
Maximum
VBATT voltage (V)
3.2*
3.7
4.5
VBATT_PA voltage (V) Full Specification
3.2*
3.7
4.5
VBATT_PA voltage (V) Extended Range
2.8
3.7
4.5
*
This value has to be guaranteed during the burst.
Note:
Load capacitance for VBATT is around 32µF ± 20% embedded inside the module.
Load capacitance for VBATT_PA is around 10µF ± 20% embedded inside the module.
3.2.
Current Consumption
The following table lists the current consumption of the AirPrime HL7688 at different conditions.
Note:
The following data is with USB disconnected to achieve the lowest current consumption. An
additional 0.6mA will be consumed if USB is connected.
Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF
ports. Maximum values are provided for VSWR3:1 with worst conditions among supported ranges
of voltages and temperature.
Table 8.
Current Consumption
Parameter
Minimum
Typical
Maximum
Unit
Off mode
95
110
202
µA
Sleep mode – LTE
DRX = 1.28s
USB = disconnected
4119272
Band 2
1.2
1.4
6.2
mA
Band 4
1.2
1.4
6.2
mA
Band 5
1.2
1.4
6.2
mA
Band 17
1.2
1.4
6.2
mA
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Product Technical Specification
Detailed Interface Specifications
Parameter
LTE in
communication mode
(TX Max)
UMTS (TX Max)
Table 9.
Minimum
Typical
Maximum
Unit
Band 2
630
650
895
mA
Band 4
510
610
945
mA
Band 5
440
520
745
mA
Band 17
540
560
780
mA
Band 2
570
660
770
mA
Band 5
400
460
500
mA
Typical
Unit
Band 2
214
mA
Band 4
207
mA
Band 5
211
mA
Band 17
218
mA
Current Consumption per Power Supply
Parameter (at nominal voltage, 3.7 V)
LTE in communication mode (TX Max)
USB = disconnected
VBATT_BB
UMTS (TX Max)
USB = disconnected
LTE in communication mode (TX Max)
USB = disconnected
VBATT_PA
UMTS (TX Max)
USB = disconnected
3.3.
Band 2
124
mA
Band 5
118
mA
Band 2
436
mA
Band 4
403
mA
Band 5
309
mA
Band 17
342
mA
Band 2
536
mA
Band 5
342
mA
VGPIO
The VGPIO output can be used to:
Pull-up signals such as I/Os
Supply the digital transistors driving LEDs
The VGPIO output is available when the AirPrime HL7688 module is switched ON.
Table 10.
VGPIO Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Remarks
Voltage level (V)
1.7
1.8
1.9
Both active mode and sleep mode
Current capability
Active Mode (mA)
-
-
50
Power management support up to 50mA
output in Active mode
Current capability
Sleep Mode (mA)
-
-
3
Power management support up to 3mA
output in Sleep mode
Rise Time(ms)
-
-
1.5
Start-Up time from 0V
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3.4.
Detailed Interface Specifications
BAT_RTC
The AirPrime HL7688 module provides an input/output to connect a Real Time Clock power supply.
This pad is used as a back-up power supply for the internal Real Time Clock. The RTC is supported
when VBATT is available but a back-up power supply is needed to save date and hour when VBATT
is switched off.
If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator.
Table 11.
BAT_RTC Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Unit
Input voltage
-
1.8
-
V
Input current consumption
-
2.5 (TBC)
-
µA
Output voltage
-5%
1.8
+5%
V
Max charging current (@VBATT=3.7V)
-
25
-
mA
Note:
When used with the HL Series snap-in socket, or when compatibility with HL6528x is needed,
Sierra Wireless recommends adding a 10µF capacitor to the BAT_RTC pad.
3.5.
SIM Interface
The AirPrime HL7688 has one physical SIM interface, UIM1, which has optional support for dual SIM
application with an external SIM switch.
The UIM1 interface allows control of a 1.8V/3V SIM and is fully compliant with GSM 11.11
recommendations concerning SIM functions.
The five signals used by this interface are as follows:
UIM1_VCC: power supply
UIM1_CLK: clock
UIM1_DATA: I/O port
UIM1_RESET: reset
UIM1_DET: SIM detection
Table 12.
UIM1 Pad Description
Pad #
Signal Name
Description
26
UIM1_VCC
1.8V/3V SIM1 Power supply
27
UIM1_CLK
1.8V/3V SIM1 Clock
28
UIM1_DATA
1.8V/3V SIM1 Data
29
UIM1_RESET
1.8V/3V SIM1 Reset
64
UIM1_DET
UIM1 Detection
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Product Technical Specification
Table 13.
Detailed Interface Specifications
Electrical Characteristics of UIM1
Parameter
Minimum
Typical
Maximum
Remarks
UIM1 Interface Voltage (V)
(VCC,CLK,IO,RST)
-
2.9
-
-
1.80
-
The appropriate output voltage
is auto detected and selected by
software.
UIM1 Detect
-
1.80
-
High active
UIM1_VCC Current (mA)
-
-
10
Max output current in sleep
mode = 3 mA
UIM1_VCC Line Regulation
(mV/V)
-
-
50
At Iout_Max
UIM1_VCC Power-up Setting
Time (µs) from power down
-
10
-
3.5.1.
UIM1_DET
UIM1_DET is used to detect and notify the application about the insertion and removal of a SIM
device in the SIM socket connected to the SIM interface. When a SIM is inserted, the state of
UIM1_DET transitions from logic 0 to logic 1. Inversely, when a SIM is removed, the state of
UIM1_DET transitions from logic 1 to logic 0.
3.6.
USB
The AirPrime HL7688 has one USB interface.
Table 14.
USB Pad Description
Pad Number
Signal Name
I/O
Function
12
USB_D-
I/O
USB Data Negative
13
USB_D+
I/O
USB Data Positive
16
USB_VBUS
I
USB VBUS
Note:
When the 5V USB supply is not available, connect USB_VBUS to VBATT to supply the USB
interface.
3.7.
Electrical Information for Digital I/O
The AirPrime HL7688 supports two groups of digital interfaces with varying current drain limits. The
following list enumerates these interface groupings and the following table enumerates the electrical
characteristics of each digital interface.
Group 1 (6mA current drain limit)
4119272
GPIO2, GPIO4, GPIO6, GPIO8, GPIO10, GPIO11, GPIO13, GPIO14, GPIO15
Group 2 (1mA current drain limit)
GPIO1, GPIO5, GPIO7
UART1
JTAG
PCM
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Product Technical Specification
Table 15.
Detailed Interface Specifications
Digital I/O Electrical Characteristics
Parameter
Symbol
Minimum
Typical
Maximum
Input Current-High(µA)
IIH
-
-
240
Input Current-Low(µA)
IIL
-
-
240
DC Output Current-High (mA)
IOH
-
-
6
DC Output Current-Low (mA)
IOL
-6
-
-
DC Output Current-High (mA)
IOH
-
-
1
DC Output Current-Low (mA)
Group 1
Group 2
Remarks
IOL
-1
-
-
Input Voltage-High(V)
VIH
1.19
-
2.10
Input Voltage-Low(V)
VIL
-0.20
-
0.38
VOH
1.35
-
-
IOH = -6mA
VOH
1.50
-
-
IOH = -0.1mA
VOL
-
-
0.35
IOH = 6mA
VOL
-
-
0.2
IOH = 0.1mA
Output Voltage-High(V)
Output Voltage-Low(V)
3.8.
General Purpose Input/Output (GPIO)
The AirPrime HL7688 module provides 12 GPIOs, 2 of which have multiplexes.
Table 16.
GPIO Pad Description
Pad Number
Signal Name
Multiplex
I/O
Power Supply Domain
I/O
1.8V
TRACE_DATA2
I/O
1.8V
I/O
1.8V
TRACE_CLK
I/O
1.8V
1
GPIO1
10
GPIO2
40
GPIO7
41
GPIO8
44
GPIO13
I/O
1.8V
46
GPIO6
I/O
1.8V
51
GPIO14
I/O
1.8V
52
GPIO10
I/O
1.8V
53
GPIO11
I/O
1.8V
54
GPIO15
I/O
1.8V
65
GPIO4
I/O
1.8V
66
GPIO5
I/O
1.8V
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Product Technical Specification
3.9.
Detailed Interface Specifications
Main Serial Link (UART1)
The main serial link (UART1) is used for communication between the AirPrime HL7688 module and a
PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232
interface.
The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600,
115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000 and 3250000 bit/s.
The signals used by UART1 are as follows:
TX data (UART1_TX)
RX data (UART1_RX)
Request To Send (UART1_RTS)
Clear To Send (UART1_CTS)
Data Terminal Ready (UART1_DTR)
Data Set Ready (UART1_DSR)
Data Carrier Detect (UART1_DCD)
Ring Indicator (UART1_RI)
Note:
Signal names are according to PC view.
UART1 pad description is summarized in the table below.
Table 17.
Pad #
UART1 Pad Description
Signal Name*
I/O*
Description
2
UART1_RI
O
Signal incoming calls (data only), SMS, etc.
3
UART1_RTS
I
Request to send
4
UART1_CTS
O
AirPrime HL7688 is ready to receive AT commands
5
UART1_TX
I
Transmit data
6
UART1_RX
O
Receive data
7
UART1_DTR
I (active low)
Prevents the AirPrime HL7688 from entering sleep mode,
switches between data mode and command mode, and
wakes the module up.
8
UART1_DCD
O
Signal data connection in progress
9
UART1_DSR
O
Signal UART interface is ON
*
According to PC view.
3.10. POWER-ON Signal (PWR_ON_N)
A low level signal has to be provided to switch the AirPrime HL7688 module ON.
It is internally connected to the permanent 1.8V supply regulator inside the HL7688 via a pull-up
resistor. Once VBAT is supplied to the HL7688 module, this 1.8V supply regulator will be enabled and
so the PWR_ON_N signal is by default at high level.
The PWR_ON_N signal’s characteristics are listed in the table below.
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Product Technical Specification
Table 18.
Detailed Interface Specifications
PWR_ON_N Electrical Characteristics
Parameter
Minimum
Input Voltage-Low (V)
Typical
Maximum
-
0.51
Input Voltage-High (V)
1.33
-
2.2
Power-up period (ms) from PWR_ON_N falling edge
2000
-
-
PWR_ON_N assertion time (ms)
25
Note:
As PWR_ON_N is internally pulled up with 47kΩ, an open collector or open drain transistor must be
used for ignition.
VGPIO is an output from the module that can be used to check if the module is active.
When VGPIO = 0V, the module is OFF
When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode)
Note:
PWR_ON_N signal cannot be used to power the module off. To power the module off, use AT
command AT+CPWROFF.
3.11. Reset Signal (RESET_IN_N)
To reset the module, a low level pulse must be sent on the RESET_IN_N pad for 20ms. This action
will immediately restart the AirPrime HL7688 module with the PWR_ON_N signal at low level. (If the
PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally
pulled up, an open collector or open drain transistor has to be used to control this signal.
The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well, for
the next power on.
Note:
Table 19.
As RESET_IN_N is referenced to the VRTC (200kΩ pull-up resistor to VRTC 1.8V) an open
collector or open drain transistor has to be used to control this signal.
RESET_IN_N Electrical Characteristics
Parameter
Minimum
Typical
-
0.51
Input Voltage-High (V)
1.33
-
2.2
Reset assertion time (ms)
20
-
-
Power-up period (ms) from RESET_IN_N falling edge*
2000
-
-
Input Voltage-Low (V)
*
4119272
Maximum
With the PWR_ON_N Signal at low level
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Product Technical Specification
Detailed Interface Specifications
3.12. Analog to Digital Converter (ADC1)
One Analog to Digital Converter input, ADC1, is provided by the AirPrime HL7688 module. This
converter is a 10-bit resolution ADC ranging from 0 to 1.2V.
The following table describes the pad description of the ADC interface.
Table 20.
ADC Interface Pad Description
Pad Number
Signal Name
I/O
Description
24
ADC1
I
Analog to digital converter
Typical ADC1 use is for monitoring external voltage; wherein an application is used to safely power
OFF an external supply in case of overvoltage.
Table 21.
ADC Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Remarks
ADC1 Resolution (bits)
-
10
-
Input Voltage Range (V)
0
-
1.2
Update rate per channel (kHz)
-
-
125
Integral Nonlinearity (bits)
-
-
±2
LSB
LSB
General purpose input
Offset Error (bits)
-
-
±1
Gain
849
853
858
Input Resistance (MΩ)
1
-
-
Input Capacitance (pF)
-
1
-
3.13. Clock Interface
The AirPrime HL7688 module supports two digital clock interfaces.
The following table describes the pad description of the clock out interfaces.
Table 22.
Clock Interface Pad Description
Pad Number
Signal Name
I/O
I/O Type
Description
22
26M_CLKOUT
O
1.8V
26MHz Digital Clock output
23
32K_CLKOUT
O
1.8V
32.768kHz Digital Clock output
Enabling or disabling the clock out feature can be done using AT commands. For more information
about AT commands, refer to document [2] AirPrime HL7688 AT Commands Interface Guide.
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Detailed Interface Specifications
3.14. PCM
The Digital Audio (PCM) Interface allows connectivity with standard audio peripherals. It can be used,
for example, to connect an external audio codec.
The programmability of this interface allows addressing a large range of audio peripherals.
The signals used by the Digital Audio Interface are as follows:
PCM_SYNC: The frame synchronization signal delivers an 8 kHz frequency pulse that
synchronizes the frame data in and the frame data out.
PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral.
PCM_OUT: The frame “data out” relies on the selected configuration mode.
PCM_IN: The frame “data in” relies on the selected configuration mode.
The PCM interface is a high speed full duplex interface that can be used to send and receive digital
audio data to external audio ICs. The Digital Audio Interface also features the following:
PCM master or slave
16 bits data word length, linear mode
MSB first
Configurable PCM bit clock rate on 256kHz, 384kHz or 512kHz
Long frame sync
The following table describes the pad description of the PCM interface.
Table 23.
PCM Interface Pad Description
Pad Number
Signal Name
I/O
Description
33
PCM_OUT
O
PCM data out
34
PCM_IN
I
PCM data in
35
PCM_SYNC
I/O
PCM sync out
36
PCM_CLK
I/O
PCM clock
Refer to the following table for the electrical characteristics of the digital audio interface.
Table 24.
PCM Electrical Characteristics
Signal
Description
Minimum
Tsync_low +
Tsync_high
PCM-SYNC period
Typical
Maximum
125
Unit
µs
Tsync_low
PCM-SYNC low time
62.5
µs
Tsync_high
PCM-SYNC high time
62.5
µs
TCLK-cycle
PCM-CLK period (T)
1.95
TIN-setup
PCM-IN setup time
59.6
TIN-hold
PCM-IN hold time
12
TOUT-delay
PCM-OUT delay time
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ns
ns
21.6
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Product Technical Specification
Detailed Interface Specifications
Signal
Description
Minimum
TSYNC-delay
PCM-SYNC output delay
-24
Typical
Maximum
Unit
31.2
ns
The following figure shows the PCM timing waveform.
Figure 4.
PCM Timing Waveform
3.15. Debug Interfaces
The AirPrime HL7688 module provides 2 interfaces for a powerful debug system.
3.15.1. Trace Debug
The AirPrime HL7688 module provides a Trace Debug interface, providing real-time instruction and
data trace of the modem core.
Table 25.
Trace Debug Pad Description
Pad Number
Signal Name
Function
2
TRACE_DATA3
Trace data 3
8
TRACE_DATA1
Trace data 1
9
TRACE_DATA0
Trace data 0
10
TRACE_DATA2
Trace data 2
GPIO2
41
TRACE_CLK
Trace clock
GPIO8
Note:
4119272
Multiplex
It is strongly recommended to provide access to this interface through Test Points.
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Product Technical Specification
Detailed Interface Specifications
3.15.2. JTAG
The JTAG interface provides debug access to the core of the AirPrime HL7688. These JTAG signals
are accessible through solder-able test points.
Table 26.
JTAG Pad Description
Pad Number
Signal Name
Function
236
JTAG_RESET
JTAG RESET
237
JTAG_TCK
JTAG Test Clock
238
JTAG_TDO
JTAG Test Data Output
239
JTAG_TMS
JTAG Test Mode Select
240
JTAG_TRST
JTAG Test Reset
241
JTAG_TDI
JTAG Test Data Input
242
JTAG_RTCK
JTAG Returned Test Clock
Note:
It is recommended to provide access through Test Points to this interface the JTAG pads (for
Failure Analysis debugging). All signals listed in table above shall be outputs on the customer board
to allow JTAG debugging.
3.16. RF Interface
The RF interface of the HL7688 module allows the transmission of RF signals. This interface has a
50Ω nominal impedance.
3.16.1. RF Connection
A 50Ω stripline can be used to connect to standard RF connectors such as SMA, UFL, etc. for
antenna connection.
Table 27.
RF Main Connection
Pad Number
RF Signal
Impedance
VSWR Rx (max)
VSWR Tx (max)
49
RF_MAIN
50Ω
1.5:1
1.5:1
Table 28.
RF Diversity Connection
Pad Number
RF Signal
Impedance
VSWR Rx (max)
VSWR Tx (max)
31
RF_DIV
50Ω
1.5:1
---
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Detailed Interface Specifications
3.16.2. RF Performances
Note:
Table 29.
Values in the tables below are preliminary and subject to change.
Conducted RX Sensitivity – UMTS Bands
Conducted Rx Sensitivity (dBm)
Frequency Band
Band 2
0.1% BER 12.2 kbps
Band 5
Primary (Typical)
Secondary (Typical)
-109.5
-110.0
-110.0
-110.5
4G RF performances are compliant with 3GPP recommendation TS 36.101.
Table 30.
Conducted RX Sensitivity – LTE Bands
Conducted Rx Sensitivity (dBm)
Frequency Band
LTE B2
Full RB; BW: 20 MHz*
Primary (Typical)
Secondary (Typical)
SIMO (Typical)
-93
-94
-97
LTE B4
Full RB; BW: 20 MHz*
-95
-95
-98
LTE B5
Full RB; BW: 10 MHz*
-98
-99
-101
LTE B17
Full RB; BW: 10 MHz*
-98
-99
-101
*
Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10 MHz_Sensitivity – 10*log (10 MHz/x_MHz)
3.16.3. TX_ON Indicator (TX_ON)
The AirPrime HL7688 module provides a signal, TX_ON, for TX indication. The TX_ON is a 2.3V
signal and its status signal depends on the module transmitter state.
Refer to the following table for the status of the TX_ON signal depending on the embedded module’s
state.
Table 31.
TX_ON Indicator Pad Description
Pad Number
Signal Name
Function
I/O Type
Power Supply Domain
60
TX_ON
TX indicator
O
2.3V
Table 32.
TX_ON Characteristics
Parameter
Minimum
Tadvance
30µs
Tdelay
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Typical
Maximum
10µs
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Product Technical Specification
Figure 5.
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Detailed Interface Specifications
TX_ON State During Transmission
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4. Mechanical Drawings
Figure 6.
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Mechanical Drawing
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Product Technical Specification
Figure 7.
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Mechanical Drawings
Dimensions Drawing
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Product Technical Specification
Figure 8.
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Mechanical Drawings
Footprint
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5. Design Guidelines
5.1.
Power-Up Sequence
Apply a LOW level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will
appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The
AT command interface is available in about 7 seconds after PWR_ON_N for either UART1 or USB.
When using UART1, the AT command interface is available after the transition of UART1_CTS from
high to low level.
When using a USB connection, the HL7688 will start communicating with the host after USB
enumeration. The time when AT commands can be sent will depend on the initialization time on the
USB host.
Figure 9.
Note:
PWR_ON_N Sequence with VGPIO Information
As PWR_ON_N is internally pulled up with 47kΩ, an open collector or open drain transistor must be
used for ignition.
The PWR_ON_N pad has the minimum assertion time requirement of 25ms, with LOW active. Once
the valid power on trigger is detected, the PWR_ON_N pad status can be left open.
The maximum inrush current is 1.3 A and lasts less than 1.5 ms.
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Product Technical Specification
5.2.
Design Guidelines
Module Switch-Off
AT command AT+CPWROFF enables the user to properly switch the AirPrime HL7688 module off.
Figure 10.
Power OFF Sequence for PWR_ON_N, VGPIO
Note:
PWR_ON_N is internally pulled up by 47kΩ to 1.8V.
5.3.
Emergency Power OFF
If required, the module can be switched off by controlling the RESET_IN_N pad (pad 11). This must
only be used in emergency situations if the system freezes (not responding to AT commands).
To perform an emergency power off, a low level pulse must be sent on the RESET_IN_N pad for
20ms while the PWR_ON_N signal is inactive (high level). This action will immediately shut the
HL7688 module down and the registers of the CPU and RAM memory will be reset for the next power
on.
5.4.
Sleep Mode Management
5.4.1.
Using UART1
AT command AT+KSLEEP enables sleep mode configuration.
AT+KSLEEP=0:
The module is active when DTR signal is active (low electrical level).
When DTR is deactivated (high electrical level), the module enters sleep mode after a while.
On DTR activation (low electrical level), the module wakes up.
AT+KSLEEP=1:
The module determines when it enters sleep mode (when no more tasks are running).
“0x00” character on the serial link wakes the module up.
AT+KSLEEP=2:
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Design Guidelines
The module never enters sleep mode.
5.4.2.
Using USB
Use AT+KSLEEP=1 to allows the module to automatically enter sleep mode while the USB interface is
in use.
5.5.
Power Supply Design
The AirPrime HL7688 module should not be supplied with voltage over 4.5V even temporarily or
however briefly.
If the system’s main board power supply unit is unstable or if the system’s main board is supplied with
over 4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier
may be severely damaged.
To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and
VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as
simple as a Zener diode with decoupling capacitors as shown in the diagram below.
Figure 11.
5.6.
Voltage Limiter Example
ESD Guidelines for SIM Card
Decoupling capacitors must be added according to the drawings below as close as possible to the
SIM card connectors on UIM1_CLK, UIM1_RST, UIM1_VCC, UIM1_DATA and UIM1_DET signals to
avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the
SIM electrical interface.
A typical schematic including SIM detection is provided below.
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Product Technical Specification
Figure 12.
5.7.
Design Guidelines
EMC and ESD Components Close to the SIM
ESD Guidelines for USB
When the USB interface is externally accessible, it is required to have ESD protection on the
USB_VBUS, USB_D+ and USB_D- signals.
Figure 13.
Note:
ESD Protection for USB
It is not recommended to have an ESD diode with feedback path from USB_VBUS to either
USB_D+ or USB_D-.
Sierra Wireless recommends using a 90Ω DLP0NSN900HL2L EMC filter and an RCLAMP0503N or
ESD5V3U2U-03LRH ESD diode.
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6. Reliability Specification
AirPrime HL7688 modules are tested against the Sierra Wireless Industrial Reliability Specification
defined below.
6.1.
Reliability Compliance
The AirPrime HL7688 module connected on a development kit board application is compliant with the
following requirements.
Table 33.
Standards Conformity
Abbreviation
Definition
IEC
International Electro technical Commission
ISO
International Organization for Standardization
6.2.
Reliability Prediction Model
6.2.1.
Life Stress Test
The following tests the AirPrime HL7688 module’s product performance.
Table 34.
Life Stress Test
Designation
Condition
Standard: N/A
Performance Test
PT3T & PTRT
Special conditions:
Temperature:
Class A: -30°C to +70°C
Class B: -40°C to +85°C
Rate of temperature change: ± 3°C/min
Recovery time: 3 hours
Operating conditions: Powered
Duration: 14 days
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Product Technical Specification
6.2.2.
Reliability Specification
Environmental Resistance Stress Tests
The following tests the AirPrime HL7688 module’s resistance to extreme temperature.
Table 35.
Environmental Resistance Stress Tests
Designation
Condition
Cold Test Active
COTA
Standard: IEC 680068-2-1, Test Ad
Special conditions:
Temperature: -40°C
Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 1 minute ON and
2 minutes OFF
Duration: 3 days
Resistance to Heat Test
RH
Standard: IEC 680068-2-2, Test Bb
Special conditions:
Temperature: +85°C
Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 15 minutes ON
and 15 minutes OFF
Duration: 50 days
6.2.3.
Corrosive Resistance Stress Tests
The following tests the AirPrime HL7688 module’s resistance to corrosive atmosphere.
Table 36.
Corrosive Resistance Stress Tests
Designation
Condition
Humidity Test
HUT
Standard: IEC 60068-2-3, Test Ca
Special conditions:
Temperature: +65°C
RH: 95%
Temperature variation: 3 +/- 0.6°C/min
Operating conditions: Powered on, DUT is powered up for 15 minutes and
OFF for 15 minutes
Duration: 10 days
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Product Technical Specification
Reliability Specification
Designation
Condition
Component Solder Wettability
CSW
Standard: JESD22 – B102, Method 1/Condition C, Solderability Test
Method
Special conditions:
Test method: Dip and Look Test with Steam preconditioning 8
h+/-15min. dip for 5 +0/-0.5 seconds
Operating conditions: Un-powered
Duration: 1 day
Standard: IEC 60068-2-30, Test Db
Moist Heat Cyclic Test
MHCT
Special conditions:
Upper temperature: +40 ± 2°C
Lower temperature: +25 ± 5°C
RH:
Upper temperature: 93%
Lower temperature: 95%
Number of cycles: 21 (1 cycle/24 hours)
Temperature Variation: 3 +/- 0.6°C/min
Operating conditions: Powered ON for 15 minutes during each 3 hours
ramp up and 3 hours ramp down (in middle) for every cycle
Duration: 21 days
6.2.4.
Thermal Resistance Cycle Stress Tests
The following tests the AirPrime HL7688 module’s resistance to extreme temperature cycling.
Table 37.
Thermal Resistance Cycle Stress Tests
Designation
Condition
Thermal Shock Test
TSKT
Special conditions:
Standard: IEC 60068-2-14, Test Na
Temperature: -30°C to +80°C
Temperature Variation: less than 30s
Number of cycles: 600
Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 9 days
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Product Technical Specification
Designation
Reliability Specification
Condition
Standard: IEC 60068-2-14, Test Nb
Temperature Change
TCH
Special conditions:
Temperature: -40°C to +90°C
Temperature Variation: 3 +/- 0.6°C/min
Number of cycles: 400
Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 29 days
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6.2.5.
Reliability Specification
Mechanical Resistance Stress Tests
The following tests the AirPrime HL7688 module’s resistance to vibrations and mechanical shocks.
Table 38.
Mechanical Resistance Stress Tests
Designation
Condition
Standard: IEC 60068-2-6, Test Fc
Special conditions:
Sinusoidal Vibration Test
SVT
Frequency range: 16 Hz to 1000 Hz
Displacement: 0.35mm (peak-peak)
Acceleration:
5G from 16 to 62 Hz
3G from 62 to 200 Hz
1G from 200 to 1000 Hz
Sweep rate: 1 octave / cycle
Number of Sweep: 20 sweeps/axis
Sweep direction: +/- X,+/- Y, +/- Z
Operating conditions: Un-powered
Duration: 2 days
Standard: IEC 60068-2-64, Test Fh
Special conditions:
Random Vibration Test
RVT
Frequency range: 10 Hz – 2000 Hz
Power Spectral Density in [(m/s²)²/Hz]
0.1 g2/Hz at 10Hz
0.01 g2/Hz at 250Hz
0.005 g2/Hz at 1000Hz
0.005 g2/Hz at 2000Hz
Peak factor: 3
Duration per Axis: 1 hr / axis
Operating conditions: Un-powered
Duration: 1 day
Mechanical Shock Test
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Standard: IEC 60068-2-27, Test Ea
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Reliability Specification
Designation
Condition
MST
Special conditions:
Shock Test 1:
Wave form: Half sine
Peak acceleration: 30g
Duration: 11ms
Number of shocks: 8
Direction: ±X, ±Y, ±Z
Shock Test 2:
Wave form: Half sine
Peak acceleration: 100g
Duration: 6ms
Number of shocks: 3
Direction: ±X, ±Y, ±Z
Operating conditions: Un-powered
Duration: 72 hours
6.2.6.
Handling Resistance Stress Tests
The following tests the AirPrime HL7688 module’s resistance to handling malfunctions and damage.
Table 39.
Handling Resistance Stress Tests
Designation
Condition
Standard: JESD22-A114, JESD22-A115, JESD22-C101
ESDC Test
Special conditions:
HBM (Human Body Model): 1KV (Class 1C)
MM (Machine Model): 200V
CDM (Charged Device Model): 250V (Class II)
Operating conditions: Powered
Duration: 3 days
ESD Test
Standard: IEC 61000-4-2
Special conditions:
Contact Voltage: ±2kV, ±4kV, ±6kV
Air Voltage: ±2kV, ±4kV, ±8kV
Operating conditions: Powered
Duration: 3 days
Standard : IEC 60068-2-32, Test Ed
Free Fall Test
FFT 1
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Special conditions:
Number of drops: 2 drops per unit
Height: 1m
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Product Technical Specification
Designation
Reliability Specification
Condition
Operating conditions: Un-powered
Duration: 6 hours
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7. FCC Regulations
The AirPrime HL7688 module has been granted modular approval for mobile applications. Integrators
may use the HL7688 module in their final products without additional FCC certification if they meet the
following conditions. Otherwise, additional FCC approvals must be obtained.
1. At least 20 cm separation distance between the antenna and the user’s body must be
maintained at all times.
2. To comply with FCC regulations limiting both maximum RF output power and human
exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only
exposure condition must not exceed:
9.01 dBi in Band 2
6.00 dBi in Band 4
10.41 dBi in Band 5
9.74 dBi in Band 17
3. The HL7688 module must not transmit simultaneously with other collocated radio transmitters
within a host device.
4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic
impedance. Basically, the characteristic impedance depends on the dielectric, the track width
and the ground plane spacing. In order to respect this constraint, Sierra Wireless
recommends using MicroStrip or StripLine structure and computing the Tracks width with a
simulation tool (like AppCad shown in the figure below and that is available free of charge at
http://www.agilent.com).
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FCC Regulations
If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital,
analog or supply).
If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An
example of proper routing is shown in the figure below.
Stripline and Coplanar design requires having a correct ground plane at both sides.
Consequently, it is necessary to add some vias along the RF path. It is recommended to use
Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not
shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring
electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (microcontrollers, etc.) may degrade the reception performances. The antenna connector is
intended to be directly connected to a 50Ω antenna and no matching is needed.
5. A label must be affixed to the outside of the end product into which the HL7688 module is
incorporated, with a statement similar to the following:
This device contains FCC ID: N7NHL7688
6. A user manual with the end product must clearly indicate the operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure
guidelines.
The end product with an embedded HL7688 module may also need to pass the FCC Part 15
unintentional emission testing requirements and be properly authorized per FCC Part 15.
Note:
4119272
If this module is intended for use in a portable device, you are responsible for separate approval to
satisfy the SAR requirements of FCC Part 2.1093.
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8. Ordering Information
Table 40.
Ordering Information
Model Name
Description
Part Number
HL7688
HL7688 embedded module
Contact Sierra Wireless for the latest SKU
DEV-KIT
HL Series Development Kit
6000620
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9. Terms and Abbreviations
Abbreviation
Definition
ADC
Analog to Digital Converter
AGC
Automatic Gain Control
AT
Attention (prefix for modem commands)
CDMA
Code Division Multiple Access
CF3
Common Flexible Form Factor
CLK
Clock
CODEC
Coder Decoder
CPU
Central Processing Unit
DAC
Digital to Analog Converter
DTR
Data Terminal Ready
EGNOS
European Geostationary Navigation Overlay Service
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
EN
Enable
ESD
Electrostatic Discharges
ETSI
European Telecommunications Standards Institute
FDMA
Frequency-division multiple access
GAGAN
GPS aided geo augmented navigation
GLONASS
Global Navigation Satellite System
GND
Ground
GNSS
Global Navigation Satellite System
GPIO
General Purpose Input Output
GPRS
General Packet Radio Service
GSM
Global System for Mobile communications
Hi Z
High impedance (Z)
IC
Integrated Circuit
IMEI
International Mobile Equipment Identification
I/O
Input / Output
LED
Light Emitting Diode
LNA
Low Noise Amplifier
MAX
Maximum
MIN
Minimum
MSAS
Multi-functional Satellite Augmentation System
N/A
Not Applicable
PA
Power Amplifier
PC
Personal Computer
PCB
Printed Circuit Board
PCL
Power Control Level
PLL
Phase Lock Loop
PWM
Pulse Width Modulation
QZSS
Quasi-Zenith Satellite System
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Terms and Abbreviations
Abbreviation
Definition
RF
Radio Frequency
RFI
Radio Frequency Interference
RMS
Root Mean Square
RST
Reset
RTC
Real Time Clock
RX
Receive
SCL
Serial Clock
SDA
Serial Data
SIM
Subscriber Identification Module
SMD
Surface Mounted Device/Design
SPI
Serial Peripheral Interface
SW
Software
PSRAM
Pseudo Static RAM
TBC
To Be Confirmed
TBD
To Be Defined
TP
Test Point
TX
Transmit
TYP
Typical
UART
Universal Asynchronous Receiver-Transmitter
UICC
Universal Integrated Circuit Card
USB
Universal Serial Bus
UIM
User Identity Module
VBATT
Main Supply Voltage from Battery or DC adapter
VSWR
Voltage Standing Wave Ratio
WAAS
Wide Area Augmentation System
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