HL7800_1103933

AirPrime HL7800 and HL7800-M Product Technical Specification 41111094 1.5 July 25, 2018 Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. 41111094 Rev 1.5 July 25, 2018 2 Product Technical Specification Patents This product may contain technology developed by or for Sierra Wireless Inc. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from MMP Portfolio Licensing. Copyright © 2018 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries. Watcher® is a registered trademark of NETGEAR, Inc., used under license. Windows® and Windows Vista® are registered trademarks of Microsoft Corporation. Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of their respective owners. Contact Information Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/ Global toll-free number: 1-877-687-7795 6:00 am to 5:00 pm PST Corporate and product information Web: sierrawireless.com 41111094 Rev 1.5 July 25, 2018 3 Product Technical Specification Document History Version Date Updates 1.0 November 24, 2017 Creation Added 3.3 Power Consumption States 1.1 February 01, 2018 Updated: • Table 2 General Features • Table 5 Pin Definition • 3.2 Current Consumption • Table 11 Current Consumption Mode • 3.16 Debug Interface • 3.19.3 Rx Sensitivity Added: • 1.1.1 • Table 9 Maximum Current Consumption 1.2 May 04, 2018 Updated: • GNSS to GPS • 1.7 ESD Specifications • 1.8.5 RoHS Directive Compliance • 3.2 Current Consumption • Table 21 Digital I/O Electrical Characteristics • 3.11 Power On Signal (PWR_ON_N) • 3.19 RF Interface • 5 Reliability Specification Added 1.8.3 ATEX Compliance 1.3 July 05, 2018 1.4 July 10, 2018 1.5 July 25, 2018 Updated: • Table 1 Supported Bands/Connectivity • Table 2 General Features • 1.5 Interfaces • Table 5 Pin Definition • Table 9 Maximum Current Consumption • 3.2 Current Consumption • 3.3 Power Consumption States • 3.11 Power On Signal (PWR_ON_N) • 3.12 Reset Signal (RESET_IN_N) • Table 40 Typical Conducted RX Sensitivity Updated Table 10 Low Current Consumption Mode Added: • 1.8.2 Frequency Drift Correction • 6 Legal Information • HL7800-M Updated: • Table 9 Maximum Current Consumption • Moved Japan Approval to 6.1; updated Figure 16 Sample Japan Certification Indication 41111094 Rev 1.5 July 25, 2018 4 Contents 1. INTRODUCTION ................................................................................................ 10 1.1. Common Flexible Form Factor (CF3) ................................................................................11 1.2. Physical Dimensions .........................................................................................................11 1.3. General Features ...............................................................................................................11 1.4. Architecture........................................................................................................................13 1.5. Interfaces ...........................................................................................................................14 1.6. Connection Interface .........................................................................................................14 1.7. ESD Specifications ............................................................................................................15 1.8. Environmental and Certifications .......................................................................................15 1.8.1. Environmental Specifications ...................................................................................15 1.8.2. Frequency Drift Correction .......................................................................................16 1.8.3. ATEX Compliance ...................................................................................................16 1.8.4. Regulatory................................................................................................................16 1.8.5. RoHS Directive Compliance ....................................................................................16 1.8.6. Disposing of the Product ..........................................................................................17 1.9. References ........................................................................................................................17 2. PAD DEFINITION ............................................................................................... 18 2.1. Pin Types ...........................................................................................................................22 2.2. Pad Configuration (Top View, Through Module) ...............................................................23 3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 24 3.1. Power Supply.....................................................................................................................24 3.2. Current Consumption ........................................................................................................25 3.3. Power Consumption States ...............................................................................................26 3.3.1. 3GPP Power Saving Features .................................................................................26 3.3.2. Power Modes ...........................................................................................................29 3.4. VGPIO ...............................................................................................................................29 3.5. Real Time Clock (BAT_RTC) ............................................................................................30 3.6. USIM Interface ...................................................................................................................30 3.6.1. UIM1_DET ...............................................................................................................31 3.7. USB Interface ....................................................................................................................32 3.8. Electrical Information for Digital I/O ...................................................................................32 3.9. General Purpose Input/Output (GPIO) ..............................................................................33 3.10. Main Serial Link (UART1) ..................................................................................................33 3.10.1. 8-wire Application ....................................................................................................34 3.10.2. 4-wire Application (TBC) ..........................................................................................35 3.10.3. 2-wire Application (TBC) ..........................................................................................35 3.11. Power On Signal (PWR_ON_N) ........................................................................................35 3.11.1. Not Managed (Default) ............................................................................................36 41111094 Rev 1.5 July 25, 2018 5 Product Technical Specification 3.11.2. Managed ..................................................................................................................37 3.12. Reset Signal (RESET_IN_N).............................................................................................38 3.13. Analog to Digital Converter (ADC).....................................................................................39 3.14. Clock Interface ...................................................................................................................39 3.15. PCM ...................................................................................................................................40 3.16. Debug Interface .................................................................................................................40 3.17. Wake Up Signal (WAKE_UP) ............................................................................................40 3.18. Fast Shutdown Signal (FAST_SHUTDOWN_N) ...............................................................41 3.19. RF Interface .......................................................................................................................42 3.19.1. RF Connection .........................................................................................................42 3.19.2. Maximum Output Power ..........................................................................................42 3.19.3. Rx Sensitivity ...........................................................................................................42 3.19.4. TX Indicator (TX_ON) ..............................................................................................43 3.20. GPS Interface ....................................................................................................................44 3.20.1. GPS Performance ....................................................................................................44 3.20.2. GPS Antenna Indicator (EXT_LNA_GPS_EN) ........................................................44 4. MECHANICAL DRAWINGS ............................................................................... 45 5. RELIABILITY SPECIFICATION ......................................................................... 48 5.1. Preconditioning Test ..........................................................................................................48 5.2. Performance Test ..............................................................................................................48 5.3. Aging Tests ........................................................................................................................49 5.4. Characterization Tests .......................................................................................................50 6. LEGAL INFORMATION ..................................................................................... 51 6.1. Japan Radio and Telecom Approval .................................................................................51 6.2. FCC Statement ..................................................................................................................51 6.2.1. Radiation Exposure Statement ................................................................................51 6.2.2. End Product Labeling ..............................................................................................52 6.2.3. Manual Information to the End User ........................................................................52 6.3. IC Statement ......................................................................................................................52 6.3.1. Radiation Exposure Statement / Déclaration d'Exposition aux Radiations .............53 6.3.2. End Product Labeling / Plaque Signalétique du Produit Final .................................54 6.3.3. Manual Information to the End User / Manuel d'Information à l'Utilisateur Final .....54 7. ORDERING INFORMATION .............................................................................. 55 8. TERMS AND ABBREVIATIONS ........................................................................ 56 41111094 Rev 1.5 July 25, 2018 6 List of Figures Figure 1. Architecture Overview ..................................................................................................... 13 Figure 2. Mechanical Overview (Top View) .................................................................................... 14 Figure 3. Pad Configuration (Top View through Module) ............................................................... 23 Figure 4. PSM Example (Simplified) ............................................................................................... 26 Figure 5. eDRX Example (PTW=4) ................................................................................................ 28 Figure 6. 8-wire UART Application Example .................................................................................. 34 Figure 7. 4-wire UART Application Example .................................................................................. 35 Figure 8. 2-wire UART Application Example .................................................................................. 35 Figure 9. Power Up and Power Down Sequence without PWR_ON_N ......................................... 36 Figure 10. Power Up Sequence with PWR_ON_N Cold Start ......................................................... 37 Figure 11. Power On Sequence with PWR_ON_N .......................................................................... 37 Figure 12. TX_ON State during TX Burst ......................................................................................... 43 Figure 13. Mechanical Drawing ........................................................................................................ 45 Figure 14. Dimensions Drawing ....................................................................................................... 46 Figure 15. Footprint Drawing ............................................................................................................ 47 Figure 16. Sample Japan Certification Indication ............................................................................. 51 41111094 Rev 1.5 July 25, 2018 7 List of Tables Table 1. Supported Bands/Connectivity ........................................................................................ 10 Table 2. General Features ............................................................................................................ 11 Table 3. Environmental Specifications .......................................................................................... 15 Table 4. Values for ATEX Compliance .......................................................................................... 16 Table 5. Pin Definition ................................................................................................................... 18 Table 6. Pin Type Codes ............................................................................................................... 22 Table 7. Power Supply Pin Description ......................................................................................... 24 Table 8. Power Supply Electrical Characteristics .......................................................................... 24 Table 9. Maximum Current Consumption...................................................................................... 24 Table 10. Low Current Consumption Mode ..................................................................................... 25 Table 11. Current Consumption Mode ............................................................................................ 26 Table 12. eDRX-Related Commands .............................................................................................. 28 Table 13. Low Power Modes ........................................................................................................... 29 Table 14. VGPIO Pin Description .................................................................................................... 30 Table 15. VGPIO Electrical Characteristics ..................................................................................... 30 Table 16. BAT_RTC Electrical Characteristics................................................................................ 30 Table 17. USIM1 Pin Description .................................................................................................... 31 Table 18. USIM1 Electrical Characteristics ..................................................................................... 31 Table 19. USB Pin Description ........................................................................................................ 32 Table 20. USB Electrical Characteristics ......................................................................................... 32 Table 21. Digital I/O Electrical Characteristics ................................................................................ 32 Table 22. GPIO Pin Description ...................................................................................................... 33 Table 23. UART1 Pin Description ................................................................................................... 34 Table 24. PWR_ON_N Pin Description ........................................................................................... 36 Table 25. PWR_ON_N Electrical Characteristics ........................................................................... 36 Table 26. PWR_ON_N Not Managed Timing.................................................................................. 36 Table 27. PWR_ON_N Managed Timing ........................................................................................ 38 Table 28. RESET_IN_N Pin Description ......................................................................................... 38 Table 29. RESET_IN_N Electrical Characteristics .......................................................................... 38 Table 30. ADC Pin Description ........................................................................................................ 39 Table 31. ADC Electrical Characteristics ........................................................................................ 39 Table 32. Clock Interface Pin Description ....................................................................................... 40 Table 33. Debug Pin Description ..................................................................................................... 40 Table 34. WAKE_UP Pin Description .............................................................................................. 40 Table 35. WAKE_UP Electrical Characteristics .............................................................................. 41 Table 36. FAST_SHUTDOWN_N Pin Description .......................................................................... 41 Table 37. FAST_SHUTDOWN_N Electrical Characteristics ........................................................... 41 41111094 Rev 1.5 July 25, 2018 8 Product Technical Specification Table 38. RF Main Pin Description .................................................................................................. 42 Table 39. Maximum Output Power .................................................................................................. 42 Table 40. Typical Conducted RX Sensitivity ................................................................................... 42 Table 41. TX_ON Pin Description ................................................................................................... 43 Table 42. TX_ON Characteristics .................................................................................................... 44 Table 43. GPS Antenna Specifications ........................................................................................... 44 Table 44. GPS Performance ........................................................................................................... 44 Table 45. Preconditioning Test ........................................................................................................ 48 Table 46. Performance Test ............................................................................................................ 48 Table 47. Aging Tests...................................................................................................................... 49 Table 48. Characterization Tests .................................................................................................... 50 Table 49. Ordering Information ....................................................................................................... 55 41111094 Rev 1.5 July 25, 2018 9 1. Introduction This document is the Product Technical Specification for the AirPrime HL7800 and HL7800-M Embedded Modules designed for M2M and Internet of Things (IoT) markets. It defines the high-level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical. The AirPrime HL7800 and HL7800-M modules belongs to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provides data connectivity on LTE (as listed in Table 1 Supported Bands/Connectivity). The AirPrime HL7800 and HL7800-M modules supports a large variety of interfaces such as USB FS, UART, ADC, and GPIOs to provide customers with the highest level of flexibility in implementing highend solutions. Table 1. Supported Bands/Connectivity Maximum Cat-M1 (HL7800 and HL7800-M) Cat-NB1 (HL7800 only) 2110 MHz 2170 MHz ✓ ✓ 1930 MHz 1990 MHz ✓ ✓ ✓ Transmit Band (Tx) Receive Band (Rx) Minimum Maximum Minimum B1 1920 MHz 1980 MHz B2 1850 MHz 1910 MHz LTE Band B3 1710 MHz 1785 MHz 1805 MHz 1880 MHz ✓ B4 1710 MHz 1755 MHz 2110 MHz 2155 MHz ✓ * B5 824 MHz 849 MHz 869 MHz 894 MHz ✓ ✓ B8 880 MHz 915 MHz 925 MHz 960 MHz ✓ ✓ B9 1749.9 MHz 1784.9 MHz 1844.9 MHz 1879.9 MHz * * B10 1710 MHz 1770 MHz 2110 MHz 2170 MHz * * B12 699 MHz 716 MHz 729 MHz 746 MHz ✓ ✓ ✓ B13 777 MHz 787 MHz 746 MHz 756 MHz ✓ B14 788 MHz 798 MHz 758 MHz 768 MHz ✓ * B17 704 MHz 716 MHz 734 MHz 746 MHz * ✓ B18 815 MHz 830 MHz 860 MHz 875 MHz ✓ ✓ B19 830 MHz 845 MHz 875 MHz 890 MHz ✓ ✓ B20 832 MHz 862 MHz 791 MHz 821 MHz ✓ ✓ B25 1850 MHz 1915 MHz 1930 MHz 1995 MHz ✓ ✓ B26 814 MHz 849 MHz 859 MHz 894 MHz ✓ ✓ B27 807 MHz 824 MHz 852 MHz 869 MHz ✓ * B28 703 MHz 748 MHz 758 MHz 803 MHz ✓ ✓ B66 1710 MHz 1780 MHz 2110 MHz 2200 MHz ✓ ✓ * Note: 41111094 Will be supported in a future release. RF bands supported are configurable through AT command. The software-based radio allows for the ability to support extra bands for worldwide connectivity. Rev 1.5 July 25, 2018 10 Product Technical Specification Introduction Common Flexible Form Factor (CF3) 1.1. The AirPrime HL7800 and HL7800-M modules belong to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF 3 form factor provides a unique solution to a series of problems faced commonly in the WWAN module space as it: • Accommodates multiple radio technologies (LTE advanced) and band groupings. • Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions. • Offers electrical and functional compatibility. • Provides Direct Mount as well as Socketability depending on customer needs. 1.2. Physical Dimensions AirPrime HL7800 and HL7800-M modules are compact, robust, fully shielded modules with the following dimensions: • Length: 18.0 mm • Width: 15.0 mm • Thickness: 2.4 mm • Weight: 1.17 g Note: Dimensions specified above are typical values. 1.3. General Features The table below summarizes the AirPrime HL7800 and HL7800-M’s features. Table 2. General Features Feature Description • Physical Power supply 41111094 • • • Small form factor (86-pad solderable LGA pad) – 15.0mm x 18.0mm x 2.4mm (nominal) Metal shield can RF connection pads (RF main and RF GPS) Baseband signals connection Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.35V Rev 1.5 July 25, 2018 11 Product Technical Specification Feature Description • • RF • Note: SIM interface Application interface The GPS receiver shares the same RF resources as the 4G receiver. The end-device target should allow GPS positioning for asset management applications where infrequent and no real-time position updates are required. 1.8V only support (3V SIM is not supported) SIM extraction / hot plug detection SIM/USIM support Conforms with ETSI UICC Specifications. Supports SIM application tool kit with proactive SIM commands • AT command interface – 3GPP 27.007 standard, plus proprietary extended AT commands CMUX multiplexing over UART USB FS* • • Protocol stack • • 41111094 Cat-M1 ▪ Power Class 3 (23dBm) ▪ Software based radio allowing support of extra bands for worldwide operation (will be supported in a future release) Cat-NB1 (not supported on the HL7800-M) ▪ Power Class 3 (23dBm) ▪ Software based radio allowing support of extra bands for worldwide operation (will be supported in a future release) GPS* ▪ 1575.42 MHz • • • • • • Protocol stack Introduction Cat-M1 ▪ 3GPP Rel. 13 ▪ Half-duplex ▪ Channel bandwidth 1.4MHz ▪ LTE carrier bandwidth 1.4 / 3 / 5 / 10 / 15 / 20 MHz ▪ Up to 375kbit/s uplink, 300 kbit/s downlink ▪ Extended Coverage Mode A ▪ PSM (Power Save Mode) ▪ I-DRX ▪ C-DRX ▪ Idle mode mobility ▪ Connected mode mobility ▪ eDRX (Extended Discontinuous Reception) ▪ CiOT optimizations (U-Plane, C-Plan)* Cat-NB1* (not supported on the HL7800-M) ▪ 3GPP Rel. 13 ▪ Half-duplex ▪ Channel bandwidth 180KHz ▪ LTE carrier bandwidth 1.4 / 3 / 5 / 10 / 15 / 20 MHz ▪ Up to 100 kbit/s in downlink ▪ Operational mode – Inband, Guard band, Standalone ▪ CioT EPS optimizations (Data over NAS) ▪ Extended coverage Flexible selection ▪ Manual system selection across RATs ▪ Dynamic system selection across RATs (preferred RAT)* Rev 1.5 July 25, 2018 12 Product Technical Specification Feature Introduction Description SMS Connectivity • • • SMS over SG MO/MT SMS storage to SIM card or ME storage • • • • Multiple cellular packet data profiles Sleep mode for minimum idle power draw Mobile-originated PDP context activation / deactivation Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol). PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context RFC1144 TCP/IP header compression • • Environmental Operating temperature ranges (industrial grade): • Class A: -30°C to +70°C RTC Real Time Clock (RTC) • * 1.4. Class B: -40°C to +85°C Will be available in a future release. Architecture The figure below presents an overview of the AirPrime HL7800 and HL7800-M’s internal architecture and external interfaces. AirPrime HL7800 and HL7800-M Baseband/Transceiver RF 4G TX FEM VGPIO Transceiver BAT_RTC* USIM LGA86 RF GPS* 32.768KHz MCU USB* DSP PMU LGA86 26MHz PWR_ON_N RESET_IN_N Analog Baseband Embedded SIM Peripherals Flash Memory PCM* RAM Memory * Will be available in a future release Figure 1. 41111094 Architecture Overview Rev 1.5 July 25, 2018 13 Product Technical Specification 1.5. Introduction Interfaces The AirPrime HL7800 and HL7800-M modules provide the following interfaces and peripheral connectivity: • 1x – VGPIO (1.8V) • 1x – BAT_RTC backup battery interface (will be available in a future release) • 1x – 1.8V USIM • 1x – USB FS (will be available in a future release) • 11x – GPIOs • 1x – 8-wire UART • 1x – Active Low POWER ON (will be available in a future release) • 1x – Active Low RESET • 2x – ADC (will be available in a future release) • 2x – System clock out (32.768 KHz and 26 MHz) (will be available in a future release) • 1x – PCM (will be available in a future release) • 1x – 4-wire UART for debug interface only • 1x – Wake up signal • 1x – Fast shutdown signal (will be available in a future release) • 1x – Main RF Antenna • 1x – TX indicator • 1x – GPS Antenna (will be available in a future release) 1.6. Connection Interface AirPrime HL7800 and HL7800-M modules are LGA form factor devices. All electrical and mechanical connections are made through the 86 Land Grid Array (LGA) pads on the bottom side of the PCB. Figure 2. Mechanical Overview (Top View) The 86 pads have the following distribution: • 66 inner signal pads, 1x0.5mm, pitch 0.8mm • 16 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm • 4 outer corner ground pads, 0.85x0.97mm 41111094 Rev 1.5 July 25, 2018 14 Product Technical Specification 1.7. • • Introduction ESD Specifications IEC-61000-4-2 (test carried out on test vehicle including ESD protection) ▪ Contact Voltage: ±2kV, ±4kV, ±6kV (design target) ▪ Air Voltage: ±2kV, ±4kV, ±8kV (design target) Unless otherwise specified: ▪ JESD22-A114 ± 250kV Human Body Model ▪ JESD22-C101C ± 250V Charged Device Model 1.8. Environmental and Certifications 1.8.1. Environmental Specifications The environmental specification for both operating and storage conditions are defined in the table below. Table 3. Environmental Specifications Conditions Range Operating Class A -30°C to +70°C Operating Class B -40°C to +85°C Storage -40°C to +85°C Class A is defined as the operating temperature ranges that the device: • Shall exhibit normal function during and after environmental exposure. • Shall meet the minimum requirements of 3GPP or appropriate wireless standards. Class B is defined as the operating temperature ranges that the device: • Shall remain fully functional during and after environmental exposure • Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even when one or more environmental constraint exceeds the specified tolerance. • Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed. 41111094 Rev 1.5 July 25, 2018 15 Product Technical Specification 1.8.2. Introduction Frequency Drift Correction The HL7800 and HL7800-M are environmental sensitive and able to correct temperature and aging effects automatically. Parameters to be considered when addressing the environmental effect on the HL7800 and HL7800-M are as follows: • Maximum deviation correction: 20 ppm • Environmental Temperature effect: 0.5 ppm • Factory reflow effect: 1 ppm + 1 ppm / reflow • Aging effect: 1 ppm /year of use For example, if an HL7800 module is mounted on a single side (1 reflow) customer PCB and used for 10 years between -40 and +85°C, the frequency drift will be up to 0.5 + (1 + 1) + (1 * 10) = 12.5 ppm, which is in the limits of the 20 ppm maximum correction. 1.8.3. ATEX Compliance The following table lists the inductor and capacitor values to be considered for ATEX certification of the system hosting the HL7800 and HL7800-M modules. All supplies in the modules are linear LDO except for one 1.3V DC/DC step-down. Table 4. Values for ATEX Compliance Parameter Value Tolerance Total Inductance 2.21 µH 30% Total Capacitance 43.64 µF 20 % 1.8.4. Regulatory The AirPrime HL7800 and HL7800-M modules will be compliant with the following regulations: • RED • FCC • IC • RCM • JRF/JPA 1.8.5. RoHS Directive Compliance AirPrime HL7800 and HL7800-M modules are compliant with RoHS Directive 2011/65/EU, including directive 2015/863 amending annex II, which sets limits for the use of certain restricted hazardous substances. This directive states that electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE), Bis (2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) or Diisobutyl phthalate (DIBP) above threshold limits. 41111094 Rev 1.5 July 25, 2018 16 Product Technical Specification 1.8.6. Introduction Disposing of the Product This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner. 1.9. [1] References AirPrime HL78xx Customer Process Guidelines Reference Number: 41112095 [2] AirPrime HL78xx AT Commands Interface Guide Reference Number: 41111821 [3] AirPrime HL Series Development Kit User Guide Reference Number: 4114877 [4] AirPrime HL7800 Low Power Modes Application Note Reference Number: 41112578 41111094 Rev 1.5 July 25, 2018 17 2. Pad Definition AirPrime HL7800 and HL7800-M pins are divided into 2 functional categories. • Core functions and associated pins cover all the mandatory features for M2M connectivity and will be available by default across all CF 3 family of modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions and associated pads are guaranteed to be forward and/or backward compatible with the next generation of CF 3 modules. • Extension functions and associated pins bring additional capabilities to the customer. Whenever an Extension function is available on a module, it is always at the same pad location. Other pins marked as “not connected” or “reserved” should not be used. Table 5. Pin Definition Pad # Signal Name Function I/O Pre and Post Reset State* Power Supply Domain Recommendation for Unused Pads Type C1 GPIO1 General purpose input/output I/O PU 1.8V Left Open Extension C2 UART1_RI UART1 Ring indicator O PU 1.8V Connect to test point Core C3 UART1_RTS UART1 Request to send I PU 1.8V Connect to test point Core C4 UART1_CTS UART1 Clear to send O PU 1.8V Connect to test point Core C5 UART1_TX UART1 Transmit data I PU 1.8V Connect to test point Core C6 UART1_RX UART1 Receive data O PU 1.8V Connect to test point Core C7 UART1_DTR UART1 Data terminal ready I PU 1.8V Connect to test point Core C8 UART1_DCD UART1 Data carrier detect O PU 1.8V Connect to test point Core C9 UART1_DSR UART1 Data set ready O PU 1.8V Connect to test point Core C10 GPIO2 General purpose input/output I/O PD 1.8V Connect to test point Core C11 RESET_IN_N Input reset signal I 1.8V Left Open Core C12 USB_D- USB Data Negative (Full Speed) I/O 3.3V Connect to test point Extension C13 USB_D+ USB Data Positive (Full Speed) I/O 3.3V Connect to test point Extension 41111094 Rev 1.5 July 25, 2018 18 Product Technical Specification Pad Definition Recommendation for Unused Pads Type Not Connected Left Open Not connected Not Connected Left Open Not connected Connect to test point Extension Not Connected Left Open Not connected NC Not Connected Left Open Not connected NC Not Connected Left Open Not Connected C20 NC Not Connected Left Open Not Connected C21 BAT_RTC Power supply for RTC backup I Left Open Extension C22 26M_CLKOUT 26M System Clock Output O PD 1.8V Left Open Extension C23 32K_CLKOUT 32.768kHz System Clock Output O PU 1.8V Left Open Extension C24 ADC1 Analog to digital converter I 1.2V Left Open Extension C25 ADC0 Analog to digital converter I 1.2V Left Open Extension C26 UIM1_VCC 1.8V USIM1 Power supply O 1.8V Mandatory connection Core C27 UIM1_CLK 1.8V USIM1 Clock O 1.8V Mandatory connection Core C28 UIM1_DATA 1.8V USIM1 Data I/O 1.8V Mandatory connection Core C29 UIM1_RESET 1.8V USIM1 Reset O 1.8V Mandatory connection Core C30 GND Ground 0V 0V Mandatory connection Extension C31 NC Not Connected C32 GND Ground 0V 0V Mandatory connection Extension C33 PCM_OUT PCM data out O PU 1.8V Left Open Extension C34 PCM_IN PCM data in I PU 1.8V Left Open Extension C35 PCM_SYNC PCM sync out I/O PU 1.8V Left Open Extension C36 PCM_CLK PCM clock I/O PD 1.8V Left Open Extension C37 GND Ground 0V 0V Mandatory connection Core C38 RF_GPS RF_GPS Left Open Core C39 GND Ground 0V 0V Mandatory connection Core C40 GPIO7 General purpose input/output I/O 1.8V Left Open Core Pad # Signal Name Function C14 NC C15 NC C16 USB_VBUS USB VBUS C17 NC C18 C19 41111094 I/O Pre and Post Reset State* I Rev 1.5 Power Supply Domain 5V Not connected PU July 25, 2018 19 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Pre and Post Reset State* Power Supply Domain Recommendation for Unused Pads Type C41 GPIO8 General purpose input/output I/O PD 1.8V Left Open Core C42 NC Not Connected C43 EXT_LNA_GPS_EN External GPS LNA enable C44 WAKE_UP Wake up signal I C45 VGPIO GPIO voltage output O C46 GPIO6 General purpose input/output I/O C47 NC Not Connected C48 GND Ground C49 RF_MAIN RF Input/output C50 GND C51 Not connected PU PD PD Left Open Extension 1.8V Mandatory connection Extension 1.8V Left Open Core 1.8V Left Open Core Left Open Not connected Mandatory connection Core 0V 0V Mandatory connection Core Ground 0V 0V Mandatory connection Core GPIO14 General purpose input/output I/O PU 1.8V Left Open Extension C52 GPIO10 General purpose input/output I/O PU 1.8V Left Open Extension C53 GPIO11 General purpose input/output I/O PU 1.8V Left Open Extension C54 GPIO15 General purpose input/output I/O PU 1.8V Left Open Extension C55 UART0_RX Debug Receive data O PU 1.8V Mandatory connection Extension C56 UART0_TX Debug Transmit data I PU 1.8V Mandatory connection Extension C57 UART0_CTS Debug Clear to Send O PU 1.8V Mandatory connection Extension C58 UART0_RTS Debug Request to Send I PD 1.8V Mandatory connection Extension C59 PWR_ON_N Active Low Power On control signal I 1.8V Mandatory connection Core C60 TX_ON TX transmission indication O 1.8V Left Open Extension C61 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I 3.2V (min) 3.7V (typ) 4.35V (max) Mandatory connection Core C62 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I 3.2V (min) 3.7V (typ) 4.35V (max) Mandatory connection Core 41111094 Rev 1.5 PU July 25, 2018 20 Product Technical Specification Pad Definition Power Supply Domain Recommendation for Unused Pads Type 3.2V (min) 3.7V (typ) 4.35V (max) Mandatory connection Core PD 1.8V Left Open Core I PU 1.8V Left Open Extension General purpose input/output I/O PU 1.8V Left Open Extension Ground GND Pad # Signal Name Function I/O C63 VBATT Power supply (refer to section 3.1 Power Supply for more information) I C64 UIM1_DET / GPIO3 USIM1 Detection / General purpose input/output I/O C65 FAST_SHUTDOWN_N Fast Shutdown signal C66 GPIO5 CG1 – CG4, G1 – G16 GND * 41111094 Pre and Post Reset State* 0V Core This refers to the state before and after RESET_IN_N; state is Undefined during reset. Refer to section 3.12 Reset Signal (RESET_IN_N) for more details. Rev 1.5 July 25, 2018 21 Product Technical Specification 2.1. Table 6. Pad Definition Pin Types Pin Type Codes Type Definition I Digital Input O Digital Output I/O Digital Input / Output L Active High H Active Low T Tristate T/PU Tristate with pull-up enabled T/PD Tristate with pull-down enabled PU Pull-up enabled PD Pull-down enabled N/A Not Applicable 41111094 Rev 1.5 July 25, 2018 22 Product Technical Specification Pad Definition GND NC GPIO6 VGPIO WAKE_UP EXT_LNA_GPS_EN NC GPIO8 GPIO7 GND RF_GPS GND PCM_CLK PCM_SYNC PCM_IN C48 C47 C46 C45 C44 C43 C42 C41 C40 C39 C38 C37 C36 C35 C34 GPIO10 GPIO11 RF_MAIN CG4 C49 GND GND The following diagram shows the pad configuration from DV2 onwards. GPIO14 Note: C50 Pad Configuration (Top View, Through Module) C51 2.2. Core pin Extension pin CG3 GND C52 C33 C53 C32 PCM_OUT GND GPIO15 C54 C31 NC UART0_RX C55 C30 GND C29 UIM1_RESET C28 C27 UIM1_DATA UIM1_CLK C26 UIM1_VCC C25 ADC0 C24 C23 ADC1 32K_CLKOUT UART0_TX C56 UART0_CTS C57 UART0_RTS C58 POWER_ON_N C59 TX_ON C60 VBATT_PA C61 VBATT_PA C62 G13 G14 G15 G16 G9 G10 G11 G12 G5 G6 G7 G8 G1 G2 G3 G4 GND Figure 3. 41111094 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 UART1_DCD UART1_DSR GPIO2 RESET_IN_N USB_D- USB_D+ NC NC USB_VBUS NC NC GND C7 CG2 C6 CG1 UART1_DTR GND UART1_TX UART1_RX NC C5 NC C19 C4 C20 C66 UART1_CTS C65 GPIO5 C3 FAST_SHUTDOWN_N UART1_RTS BAT_RTC C2 26M_CLKOUT C21 C1 C22 C64 GPIO1 C63 UART1_RI VBATT UIM1_DET/ GPIO3 Pad Configuration (Top View through Module) Rev 1.5 July 25, 2018 23 3. Detailed Interface Specifications Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25°C. For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL7800 and HL780-M modules support separate VBATT and VBATT_PA connection if requirements below are fulfilled. 3.1. Power Supply The AirPrime HL7800 and HL7800-M modules are supplied through the VBATT and VBATT_PA signals. Refer to the following table for the pin description of the Power Supply interface. Table 7. Power Supply Pin Description Pad Number Signal Name I/O Description C63 VBATT I Power supply (base band) C61, C62 VBATT_PA I Power supply (radio frequency) CG1 – CG4, G1 – G16 GND Ground Refer to the following table for the electrical characteristics of the Power Supply interface. Table 8. Power Supply Electrical Characteristics Supply Minimum Typical Maximum VBATT voltage (V) 3.2 3.7 4.35 VBATT_PA voltage (V) Full Specification 3.2 3.7 4.35 VBATT_PA voltage (V) Extended Range 2.8* (TBC) 3.7 4.35 * Table 9. No guarantee of 3GPP performances over extended range. Maximum Current Consumption Supply Maximum VBATT 500mA VBATT_PA 500mA Note: 41111094 If a single PSU is used, the recommended power supply capability is 500 mA + 500 mA = 1A. Rev 1.5 July 25, 2018 24 Product Technical Specification 3.2. Detailed Interface Specifications Current Consumption The following tables list the current consumption of the AirPrime HL7800 and HL7800-M modules at different conditions. Note: Table 10. Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF ports. Maximum values are provided for VSWR2.5:1 (TBC) with worst conditions among supported ranges of voltages and temperature. Low Current Consumption Mode Parameter Typical Unit Off mode (module switched off & VBATs Connected) 3 µA PSM Floor in Hibernate mode 3 µA PSM 1h in Hibernate mode 70 µA PSM 24h in Hibernate mode 6 µA DRX 1.28 s in Sleep mode 3.4 1.8* mA DRX 2.56 s in Sleep mode 3.0 1.5* mA eDRX 20.48 s / PTW 1 in Hibernate mode 200**