AirPrime HL7800 and HL7800-M
Product Technical Specification
41111094
7
October 04, 2019
Product Technical Specification
Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.
Note:
Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door
is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.
Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.
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Product Technical Specification
Patents
This product may contain technology developed by or for Sierra Wireless Inc.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents
licensed from MMP Portfolio Licensing.
Copyright
© 2019 Sierra Wireless. All rights reserved.
Trademarks
Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.
Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other
countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.
Contact Information
Sales information and technical support, including
warranty and returns
Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795
6:00 am to 5:00 pm PST
Corporate and product information
Web: sierrawireless.com
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Product Technical Specification
Document History
Version
Date
Updates
1.0
November 24, 2017
Creation
Added 3.3 Power Consumption States
1.1
February 01, 2018
Updated:
•
Table 2 General Features
•
Table 5 Pin Definition
•
3.2 Current Consumption
•
3.16 Debug Interface
•
3.19.3 Rx Sensitivity
Added:
•
7.1 Japan Radio and Telecom Approval
•
Table 9 Maximum Current Consumption
1.2
May 04, 2018
Updated:
•
GNSS to GPS
•
1.7 ESD Specifications
•
1.8.5 RoHS Directive Compliance
•
3.2 Current Consumption
•
Table 23 Digital I/O Electrical Characteristics
•
3.11 Power On Signal (PWR_ON_N)
•
3.19 RF Interface
•
6 Reliability Specification
Added 1.8.3 ATEX Compliance
1.3
July 05, 2018
1.4
July 10, 2018
1.5
July 25, 2018
1.6
August 10, 2018
41111094
Updated:
•
Table 1 Supported Bands/Connectivity
•
Table 2 General Features
•
1.5 Interfaces
•
Table 5 Pin Definition
•
Table 9 Maximum Current Consumption
•
3.2 Current Consumption
•
3.3 Power Consumption States
•
3.11 Power On Signal (PWR_ON_N)
•
3.12 Reset Signal (RESET_IN_N)
•
Table 43 Typical Conducted Cat-M1 RX Sensitivity
Updated Table 10 Low Current Consumption Mode
Added:
•
1.8.2 Frequency Drift Correction
•
7 Legal Information
•
HL7800-M
Updated:
•
Table 9 Maximum Current Consumption
•
Moved Japan Approval to 7.1; updated Figure 25 Sample Japan
Certification Indication
Updated
•
7.3 FCC Statement
•
7.4 IC Statement
Rev 7
October 04, 2019
4
Product Technical Specification
Version
Date
Updates
Added 7.3.4 Antenna Installation
2.0
September 10, 2018
Updated:
•
Table 1 Supported Bands/Connectivity
•
1.7 ESD Specifications
•
Table 5 Pin Definition
•
Table 9 Maximum Current Consumption
•
Table 17 VGPIO Electrical Characteristics
•
Table 22 USB Electrical Characteristics
•
Table 23 Digital I/O Electrical Characteristics
•
Table 24 GPIO Pin Description
•
Table 25 UART1 Pin Description
•
Table 31 RESET_IN_N Electrical Characteristics
Added 3.3.3 Digital I/O during Hibernate Power Mode
3.0
November 12, 2018
3.1
November 13, 2018
Updated:
•
Table 5 Pin Definition
•
3.2 Current Consumption
•
3.3.1.2 Extended DRX (eDRX)
•
3.3.2 Power Modes
•
Table 17 VGPIO Electrical Characteristics
•
Table 20 USIM1 Electrical Characteristics
•
Table 23 Digital I/O Electrical Characteristics
•
3.10 Main Serial Link (UART1)
•
3.11 Power On Signal (PWR_ON_N)
•
3.12 Reset Signal (RESET_IN_N)
•
3.16 Debug Interfaces
•
Table 38 WAKE_UP Electrical Characteristics
•
Table 43 Typical Conducted Cat-M1 RX Sensitivity
Updated 3.2 Current Consumption
Added 5 Design Guidelines
4.0
March 08, 2019
4.1
March 13, 2019
Updated:
•
Number of GPIOs from 11 to 12
•
Table 1 Supported Bands/Connectivity
•
Table 2 General Features
•
1.7 ESD Specifications
•
1.8.4 Regulatory
•
Table 5 Pin Definition
•
3 Detailed Interface Specifications
Updated 3.8 Electrical Information for Digital I/O
Added Table 44 Typical Conducted NB1 RX Sensitivity
Updated:
•
3.2 Current Consumption
•
3.3.1.1 Power Saving Mode (PSM)
4.2
March 22, 2019
4.3
April 04, 2019
Updated 3.2 Current Consumption
May 08, 2019
Added:
•
VBATT_PA_EN (pin 41)
•
3.21 External RF Voltage Control Indicator
•
7.2 Korean Approval
5.0
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Product Technical Specification
Version
Date
Updates
May 08, 2019
Updated:
•
3.2 Current Consumption
•
3.3.2 Power Modes
•
3.7 USB Interface
•
3.10 Main Serial Link (UART1)
•
Table 29 PWR_ON_N Managed Timing
•
Table 33 ADC Electrical Characteristics
6.0
August 06, 2019
Updated IO state in:
•
3.10 Main Serial Link (UART1)
•
3.21 External RF Voltage Control Indicator
7
October 03, 2019
5.0
41111094
Updated 3.3.1 3GPP Power Saving Features
ADCs, Clock Interface, PWR_ON_N now available
Updated Pin Definition table (pre/post reset state; power supply domain)
- pins C11, C24-C29, C44
Updated 3.4 VGPIO
Updated Table 29 PWR_ON_N Managed Timing
Updated Table 31 RESET_IN_N Electrical Characteristics
Updated 3.20 TX Indictor (TX_ON)
Updated Table 50 GPS Performance
Updated Figure 24 Antenna Connection
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Contents
1. INTRODUCTION ................................................................................................ 13
1.1.
Common Flexible Form Factor (CF3) ................................................................................14
1.2.
Physical Dimensions .........................................................................................................14
1.3.
General Features ...............................................................................................................14
1.4.
Architecture........................................................................................................................16
1.5.
Interfaces ...........................................................................................................................17
1.6.
Connection Interface .........................................................................................................17
1.7.
ESD Specifications ............................................................................................................18
1.8.
Environmental and Certifications .......................................................................................18
1.8.1.
Environmental Specifications...................................................................................18
1.8.2.
Frequency Drift Correction.......................................................................................19
1.8.3.
ATEX Compliance ...................................................................................................19
1.8.4.
Regulatory................................................................................................................19
1.8.5.
RoHS Directive Compliance ....................................................................................19
1.8.6.
Disposing of the Product..........................................................................................20
1.9.
References ........................................................................................................................20
2. PAD DEFINITION ............................................................................................... 21
2.1.
Pin Types ...........................................................................................................................25
2.2.
Pad Configuration (Top View, Through Module) ...............................................................26
3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 27
3.1.
Power Supply.....................................................................................................................27
3.2.
Current Consumption ........................................................................................................28
3.3.
Power Consumption States ...............................................................................................31
3.3.1.
3GPP Power Saving Features .................................................................................31
3.3.2.
Power Modes ...........................................................................................................35
3.3.3.
Digital I/O during Hibernate Power Mode ................................................................36
3.4.
VGPIO ...............................................................................................................................38
3.5.
Real Time Clock (BAT_RTC) ............................................................................................39
3.6.
USIM Interface ...................................................................................................................40
3.6.1.
UIM1_DET ...............................................................................................................41
3.7.
USB Interface ....................................................................................................................41
3.8.
Electrical Information for Digital I/O ...................................................................................41
3.9.
General Purpose Input/Output (GPIO) ..............................................................................42
3.10. Main Serial Link (UART1) ..................................................................................................43
3.10.1. 8-wire Application ....................................................................................................44
3.10.2. 4-wire Application ....................................................................................................44
3.10.3. 2-wire Application ....................................................................................................44
3.11. Power On Signal (PWR_ON_N) ........................................................................................45
3.11.1. PWR_ON_N Not Managed (Default) .......................................................................45
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3.11.2.
PWR_ON_N Managed ............................................................................................46
3.12.
Reset Signal (RESET_IN_N).............................................................................................47
3.13.
Analog to Digital Converter (ADC) ....................................................................................48
3.14.
Clock Interface ...................................................................................................................49
3.15.
PCM ...................................................................................................................................49
3.16. Debug Interfaces ...............................................................................................................49
3.16.1. Command Line Interface (CLI) ................................................................................49
3.16.2. Modem Logs interface .............................................................................................50
3.17.
Wake Up Signal (WAKE_UP) ............................................................................................50
3.18.
Fast Shutdown Signal (FAST_SHUTDOWN_N) ...............................................................51
3.19. RF Interface .......................................................................................................................51
3.19.1. RF Connection .........................................................................................................51
3.19.2. Maximum Output Power ..........................................................................................52
3.19.3. Rx Sensitivity ...........................................................................................................52
3.20.
TX Indicator (TX_ON) ........................................................................................................53
3.21.
External RF Voltage Control Indicator ...............................................................................54
3.22. GPS Interface ....................................................................................................................55
3.22.1. GPS Performance ....................................................................................................55
3.22.2. GPS Antenna Indicator (EXT_LNA_GPS_EN) ........................................................55
4. MECHANICAL DRAWINGS ............................................................................... 56
5. DESIGN GUIDELINES ....................................................................................... 59
5.1.
Power Supply Design ........................................................................................................59
5.2.
Power Cycle.......................................................................................................................59
5.3.
ESD Guidelines for USIM ..................................................................................................59
5.4.
ESD Guidelines for USB....................................................................................................60
5.5.
Radio Frequency Integration .............................................................................................61
6. RELIABILITY SPECIFICATION ......................................................................... 62
6.1.
Preconditioning Test ..........................................................................................................62
6.2.
Performance Test ..............................................................................................................62
6.3.
Aging Tests ........................................................................................................................63
6.4.
Characterization Tests.......................................................................................................64
7. LEGAL INFORMATION ..................................................................................... 65
7.1.
Japan Radio and Telecom Approval .................................................................................65
7.2.
Korean Approval ................................................................................................................65
7.3.
FCC Statement ..................................................................................................................65
7.3.1.
Radiation Exposure Statement ................................................................................66
7.3.2.
End Product Labeling ..............................................................................................66
7.3.3.
Manual Information to the End User ........................................................................66
7.3.4.
Antenna Installation .................................................................................................66
7.4.
IC Statement ......................................................................................................................67
7.4.1.
Radiation Exposure Statement / Déclaration d'Exposition aux Radiations .............68
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Product Technical Specification
7.4.2.
7.4.3.
End Product Labeling / Plaque Signalétique du Produit Final .................................69
Manual Information to the End User / Manuel d'Information à l'Utilisateur Final .....69
8. ORDERING INFORMATION .............................................................................. 70
9. TERMS AND ABBREVIATIONS ........................................................................ 71
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List of Figures
Figure 1.
Architecture Overview ..................................................................................................... 16
Figure 2.
Mechanical Overview (Top View) .................................................................................... 17
Figure 3.
Pad Configuration (Top View through Module) ............................................................... 26
Figure 4.
PSM Example (Simplified)............................................................................................... 32
Figure 5.
eDRX Example (PTW: 4 Paging Occurrences)............................................................... 33
Figure 6.
eDRX Power Consumption Profile Interruption ............................................................... 34
Figure 7.
PSM I/O Toggling during TAU and the Active Window (T3324) ..................................... 37
Figure 8.
eDRX Cycle of 20s sleep and 1.024s of Activity ............................................................. 37
Figure 9.
eDRX with Extra Calibration Wakes ................................................................................ 38
Figure 10.
Stable eDRX Cycle of 81.92s after Calibration ............................................................... 38
Figure 11.
8-wire UART Application Example .................................................................................. 44
Figure 12.
4-wire UART Application Example .................................................................................. 44
Figure 13.
2-wire UART Application Example .................................................................................. 44
Figure 14.
Power Up and Power Down Sequence without PWR_ON_N ......................................... 45
Figure 15.
Power Up Sequence with PWR_ON_N Cold Start ......................................................... 46
Figure 16.
Power On Sequence with PWR_ON_N .......................................................................... 47
Figure 17.
TX_ON State during TX Burst ......................................................................................... 54
Figure 18.
VBATT_PA_EN State during RX/TX windows ................................................................ 54
Figure 19.
Mechanical Drawing ........................................................................................................ 56
Figure 20.
Dimensions Drawing ....................................................................................................... 57
Figure 21.
Footprint Drawing ............................................................................................................ 58
Figure 22.
EMC and ESD Components Close to the USIM ............................................................. 60
Figure 23.
ESD Protection for USB .................................................................................................. 60
Figure 24.
Antenna Connection ........................................................................................................ 61
Figure 25.
Sample Japan Certification Indication ............................................................................. 65
Figure 26.
Sample Korean Approval ................................................................................................ 65
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List of Tables
Table 1.
Supported Bands/Connectivity ........................................................................................ 13
Table 2.
General Features ............................................................................................................ 14
Table 3.
Environmental Specifications .......................................................................................... 18
Table 4.
Values for ATEX Compliance .......................................................................................... 19
Table 5.
Pin Definition ................................................................................................................... 21
Table 6.
Pin Type Codes ............................................................................................................... 25
Table 7.
Power Supply Pin Description ......................................................................................... 27
Table 8.
Power Supply Electrical Characteristics .......................................................................... 27
Table 9.
Maximum Current Consumption...................................................................................... 27
Table 10.
Low Current Consumption Mode Cat-M1 ........................................................................ 28
Table 11.
Low Current Consumption Mode Cat-NB1 ...................................................................... 29
Table 12.
Typical Current Consumption for LTE Cat-M1 in Connected Mode for All Bands .......... 30
Table 13.
Expected Typical Current Consumption for NB -1 in Connected Mode for All Bands .... 30
Table 14.
eDRX-Related Commands .............................................................................................. 34
Table 15.
Low Power Modes ........................................................................................................... 35
Table 16.
VGPIO Pin Description .................................................................................................... 39
Table 17.
VGPIO Electrical Characteristics..................................................................................... 39
Table 18.
BAT_RTC Electrical Characteristics................................................................................ 39
Table 19.
USIM1 Pin Description .................................................................................................... 40
Table 20.
USIM1 Electrical Characteristics ..................................................................................... 40
Table 21.
USB Pin Description ........................................................................................................ 41
Table 22.
USB Electrical Characteristics......................................................................................... 41
Table 23.
Digital I/O Electrical Characteristics ................................................................................ 42
Table 24.
GPIO Pin Description ...................................................................................................... 42
Table 25.
UART1 Pin Description ................................................................................................... 43
Table 26.
PWR_ON_N Pin Description ........................................................................................... 45
Table 27.
PWR_ON_N Electrical Characteristics ........................................................................... 45
Table 28.
PWR_ON_N Not Managed Timing.................................................................................. 46
Table 29.
PWR_ON_N Managed Timing ........................................................................................ 47
Table 30.
RESET_IN_N Pin Description ......................................................................................... 48
Table 31.
RESET_IN_N Electrical Characteristics .......................................................................... 48
Table 32.
ADC Pin Description ........................................................................................................ 48
Table 33.
ADC Electrical Characteristics ........................................................................................ 48
Table 34.
Clock Interface Pin Description ....................................................................................... 49
Table 35.
CLI Interface Pin Description........................................................................................... 49
Table 36.
Modem Logs Interface Pin Description ........................................................................... 50
Table 37.
WAKE_UP Pin Description.............................................................................................. 50
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Product Technical Specification
Table 38.
WAKE_UP Electrical Characteristics .............................................................................. 50
Table 39.
FAST_SHUTDOWN_N Pin Description .......................................................................... 51
Table 40.
FAST_SHUTDOWN_N Electrical Characteristics ........................................................... 51
Table 41.
RF Main Pin Description.................................................................................................. 51
Table 42.
Maximum Output Power .................................................................................................. 52
Table 43.
Typical Conducted Cat-M1 RX Sensitivity ...................................................................... 52
Table 44.
Typical Conducted NB1 RX Sensitivity ........................................................................... 53
Table 45.
TX_ON Pin Description ................................................................................................... 53
Table 46.
VBATT_PA_EN Pin Description ...................................................................................... 54
Table 47.
VBATT_PA_EN Characteristics ...................................................................................... 55
Table 48.
GPS Antenna Specifications ........................................................................................... 55
Table 49.
GPS Performance ........................................................................................................... 55
Table 50.
Preconditioning Test........................................................................................................ 62
Table 51.
Performance Test ............................................................................................................ 62
Table 52.
Aging Tests...................................................................................................................... 63
Table 53.
Characterization Tests .................................................................................................... 64
Table 54.
Ordering Information ....................................................................................................... 70
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1. Introduction
This document is the Product Technical Specification for the AirPrime HL7800 and HL7800-M
Embedded Modules designed for M2M and Internet of Things (IoT) markets. It defines the high-level
product features and illustrates the interfaces for these features. This document is intended to cover
the hardware aspects of the product, including electrical and mechanical.
The AirPrime HL7800 and HL7800-M modules belong to the AirPrime HL Series from the Essential
Connectivity Module family. These are industrial grade Embedded Wireless Modules that provides
data connectivity on LTE (as listed in Table 1 Supported Bands/Connectivity).
The AirPrime HL7800 and HL7800-M modules support a large variety of interfaces such as USB FS,
UART, ADC, GPIOs, and also support the new ultra-low-power-consumption hibernation modes to
provide customers with the highest level of flexibility in implementing high-end solutions.
Table 1.
Supported Bands/Connectivity
Transmit Band (Tx)
Receive Band (Rx)
Minimum
Maximum
Minimum
Maximum
B1
1920 MHz
1980 MHz
2110 MHz
B2
1850 MHz
1910 MHz
B3
1710 MHz
1785 MHz
B4
1710 MHz
B5
Cat-M1
(HL7800 and
HL7800-M)
Cat-NB1
(HL7800
only)
2170 MHz
1930 MHz
1990 MHz
1805 MHz
1880 MHz
1755 MHz
2110 MHz
2155 MHz
824 MHz
849 MHz
869 MHz
894 MHz
B8
880 MHz
915 MHz
925 MHz
960 MHz
B9
1749.9 MHz
1784.9 MHz
1844.9 MHz
1879.9 MHz
*
*
B10
1710 MHz
1770 MHz
2110 MHz
2170 MHz
*
*
B12
699 MHz
716 MHz
729 MHz
746 MHz
B13
777 MHz
787 MHz
746 MHz
756 MHz
B14
788 MHz
798 MHz
758 MHz
768 MHz
B17
704 MHz
716 MHz
734 MHz
746 MHz
*
B18
815 MHz
830 MHz
860 MHz
875 MHz
B19
830 MHz
845 MHz
875 MHz
890 MHz
B20
832 MHz
862 MHz
791 MHz
821 MHz
B25
1850 MHz
1915 MHz
1930 MHz
1995 MHz
B26
814 MHz
849 MHz
859 MHz
894 MHz
B27
807 MHz
824 MHz
852 MHz
869 MHz
*
B28
703 MHz
748 MHz
758 MHz
803 MHz
B66
1710 MHz
1780 MHz
2110 MHz
2200 MHz
LTE
Band
* Will be supported in a future release.
Note:
41111094
RF bands supported are configurable through AT command. The software-based radio allows for
the ability to support extra bands for worldwide connectivity.
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13
Product Technical Specification
1.1.
Introduction
Common Flexible Form Factor (CF3)
The AirPrime HL7800 and HL7800-M modules belong to the Common Flexible Form Factor
(CF3) family of modules. This family consists of a series of WWAN modules that share the same
mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF3 form
factor provides a unique solution to a series of problems faced commonly in the WWAN module space
as it:
•
Accommodates multiple radio technologies (LTE advanced) and band groupings.
•
Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions.
•
Offers electrical and functional compatibility.
•
Provides Direct Mount as well as Socket-ability depending on customer needs.
1.2.
Physical Dimensions
AirPrime HL7800 and HL7800-M modules are compact, robust, fully shielded modules with the
following dimensions:
•
Length: 18.0 mm
•
Width: 15.0 mm
•
Thickness: 2.4 mm
•
Weight: 1.17 g
Note:
Dimensions specified above are typical values.
1.3.
General Features
The table below summarizes the AirPrime HL7800 and HL7800-M’s features.
Table 2.
General Features
Feature
Description
•
Physical
Power supply
41111094
•
•
•
Small form factor (86-pad solderable LGA pad) – 15.0mm x 18.0mm x 2.4mm
(nominal)
Metal shield can
RF connection pads (RF main and RF GPS)
Baseband signals connection
Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.35V
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Product Technical Specification
Feature
Description
•
•
RF
•
Note:
•
SIM interface
•
•
•
•
•
Application interface
•
•
•
Protocol stack
•
41111094
Introduction
Cat-M1
Power Class 3 (23dBm)
Software based radio allowing support of extra bands for worldwide
operation (will be supported in a future release)
Cat-NB1 (not supported on the HL7800-M)
Power Class 3 (23dBm)
Software based radio allowing support of extra bands for worldwide
operation (will be supported in a future release)
GPS*
1575.42 MHz
The GPS receiver shares the same RF resources as the 4G receiver. The
end-device target should allow GPS positioning for asset management
applications where infrequent and no real-time position updates are
required.
1.8V only support (legacy 3V SIM is not supported; this should not have any
impact on design)
(Note: Modern SIM cards all support 1.8V.)
SIM extraction / hot plug detection
SIM/USIM support
Conforms with ETSI UICC Specifications.
Supports SIM application tool kit with proactive SIM commands
AT command interface – 3GPP 27.007 standard, plus proprietary extended
AT commands
CMUX multiplexing over UART
USB Full Speed (FS)*
Cat-M1
3GPP Rel. 13
Half-duplex
Channel bandwidth 1.4MHz
LTE carrier bandwidth 1.4 / 3 / 5 / 10 / 15 / 20 MHz
Up to 375kbit/s uplink, 300 kbit/s downlink
Extended Coverage Mode A
PSM (Power Save Mode)
I-DRX (Idle Mode Discontinuous Reception)
C-DRX (Connected Mode Discontinuous Reception)
Idle mode mobility
Connected mode mobility
eDRX (Extended Discontinuous Reception)
CiOT optimizations (U-Plane, C-Plan)*
Cat-NB1 (not supported on the HL7800-M)
3GPP Rel. 13
Half-duplex
Channel bandwidth 180KHz
LTE carrier bandwidth 1.4 / 3 / 5 / 10 / 15 / 20 MHz
Up to 100 kbit/s in downlink
Operational mode – Inband, Guard band, Standalone
CioT EPS optimizations (Data over NAS)
NIDD over SGi tunneling
NIDD over SCEF
Extended coverage
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15
Product Technical Specification
Feature
Introduction
Description
•
Flexible selection
Manual system selection across RATs
Dynamic system selection across RATs (preferred RAT)*
•
•
•
SMS over SG
MO/MT
SMS storage to SIM card or ME storage
•
•
•
•
Multiple cellular packet data profiles
Sleep mode for minimum idle power draw
Mobile-originated PDP context activation / deactivation
Static and Dynamic IP address. The network may assign a fixed IP address or
dynamically assign one using DHCP (Dynamic Host Configuration Protocol).
PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
RFC1144 TCP/IP header compression
Protocol stack
SMS
Connectivity
•
•
Environmental
Operating temperature ranges (industrial grade):
•
Class A: -30°C to +70°C
•
Class B: -40°C to +85°C
RTC
Real Time Clock (RTC)*
* Will be available in a future release.
1.4.
Architecture
The figure below presents an overview of the AirPrime HL7800 and HL7800-M’s internal architecture
and external interfaces.
AirPrime HL7800 and HL7800-M
Baseband/Transceiver
TX FEM
Transceiver
VGPIO
RF 4G
RF GPS*
BAT_RTC*
USIM
LGA86
MCU
USB*
DSP
PMU
PWR_ON_N
RESET_IN_N
32.768KHz
26MHz
Analog Baseband
Embedded SIM
Peripherals
Flash Memory
LGA86
PCM*
RAM Memory
* Will be available in a future release
Figure 1.
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Architecture Overview
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Product Technical Specification
1.5.
Introduction
Interfaces
The AirPrime HL7800 and HL7800-M modules provide the following interfaces and peripheral
connectivity:
•
1x – VGPIO (1.8V)
•
1x – BAT_RTC backup battery interface (will be available in a future firmware release)
•
1x – 1.8V USIM
•
1x – USB FS
•
12x – GPIOs
•
1x – 8-wire UART
•
1x – Active Low POWER ON (will be available in a future firmware release)
•
1x – Active Low RESET
•
2x – ADC
•
2x – System clock out (32.768 KHz and 26 MHz)
•
1x – PCM (will be available in a future firmware release)
•
1x – 4-wire UART for debug interface only
•
1x – Wake up signal
•
1x – Fast shutdown signal (will be available in a future firmware release)
•
1x – Main RF Antenna
•
1x – TX indicator
•
1x – GPS Antenna (will be available in a future firmware release)
1.6.
Connection Interface
AirPrime HL7800 and HL7800-M modules are LGA form factor devices. All electrical and mechanical
connections are made through the 86 Land Grid Array (LGA) pads on the bottom side of the PCB.
Figure 2.
Mechanical Overview (Top View)
The 86 pads have the following distribution:
•
66 inner signal pads, 1x0.5mm, pitch 0.8mm
•
16 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm
•
4 outer corner ground pads, 0.85x0.97mm
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1.7.
•
Introduction
ESD Specifications
IEC-61000-4-2 (test carried out on test vehicle including ESD protection)
Contact Voltage: ±2kV, ±4kV, ±6kV
GPS pad C38: ±500V
Air Voltage: ±2kV, ±4kV, ±8kV
•
JESD22-A114 ± 250V Human Body Model
•
JESD22-C101C ± 250V Charged Device Model
1.8.
Environmental and Certifications
1.8.1.
Environmental Specifications
The environmental specification for both operating and storage conditions are defined in the table
below.
Table 3.
Environmental Specifications
Conditions
Range
Operating Class A
-30°C to +70°C
Operating Class B
-40°C to +85°C
Storage
-40°C to +85°C
Class A is defined as the operating temperature ranges that the device:
•
Shall exhibit normal function during and after environmental exposure.
•
Shall meet the minimum requirements of 3GPP or appropriate wireless standards.
Class B is defined as the operating temperature ranges that the device:
•
Shall remain fully functional during and after environmental exposure
•
Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even
when one or more environmental constraint exceeds the specified tolerance.
•
Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.
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1.8.2.
Introduction
Frequency Drift Correction
The HL7800 and HL7800-M are environment-sensitive like any electronic device, but able to correct
temperature and aging effects automatically. Parameters to be considered when addressing the
environmental effect on the HL7800 and HL7800-M are as follows:
•
Maximum deviation correction: 20 ppm
•
Environmental Temperature effect: 0.5 ppm
•
Factory reflow effect: 1 ppm + 1 ppm / reflow
•
Aging effect: 1 ppm /year of use
For example, if an HL7800 module is mounted on a single side (1 reflow) customer PCB and used for
10 years between -40 and +85°C, the frequency drift will be up to 0.5 + (1 + 1) + (1 * 10) = 12.5 ppm,
which is in the limits of the 20 ppm maximum correction.
1.8.3.
ATEX Compliance
The following table lists the inductor and capacitor values to be considered for ATEX certification of
the system hosting the HL7800 and HL7800-M modules. All supplies in the modules are linear LDO
except for one 1.3V DC/DC step-down.
Table 4.
Values for ATEX Compliance
Parameter
Value
Tolerance
Total Inductance
2.21 µH
30%
Total Capacitance
43.64 µF
20%
1.8.4.
Regulatory
The AirPrime HL7800 and HL7800-M modules will be compliant with the following regulations:
•
RED
•
FCC
•
IC
•
RCM
•
JRF/JPA
•
KC
1.8.5.
RoHS Directive Compliance
AirPrime HL7800 and HL7800-M modules are compliant with RoHS Directive 2011/65/EU, including
directive 2015/863 amending annex II, which sets limits for the use of certain restricted hazardous
substances. This directive states that electrical and electronic equipment put on the market does not
contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB),
polybrominated diphenyl ethers (PBDE), Bis (2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate
(BBP), Dibutyl phthalate (DBP) or Di-isobutyl phthalate (DIBP) above threshold limits.
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Product Technical Specification
1.8.6.
Introduction
Disposing of the Product
This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmentally friendly manner.
1.9.
[1]
References
AirPrime HL78xx Customer Process Guidelines
Reference Number: 41112095
[2]
AirPrime HL78xx AT Commands Interface Guide
Reference Number: 41111821
[3]
AirPrime HL Series Development Kit User Guide
Reference Number: 4114877
[4]
AirPrime HL7800 Low Power Modes Application Note
Reference Number: 2174229
[5]
AirPrime HL7800-M MNO and RF Band Customization at Customer Production Site
Application Note
Reference Number: 2174213
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2.
Pad Definition
AirPrime HL7800 and HL7800-M pins are divided into 2 functional categories.
•
Core functions and associated pins cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of
modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions
and associated pads are guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
•
Extension functions and associated pins bring additional capabilities to the customer. Whenever an Extension function is available on a module, it
is always at the same pad location.
Other pins marked as “not connected” or “reserved” should not be used.
Table 5.
Pin Definition
Pad #
Signal Name
Function
I/O
Pre and Post
Reset State*
Power Supply
Domain
Recommendation
for Unused Pads
Type
C1
GPIO1
General purpose input/output
I/O
PU
1.8V (VGPIO)
Left open
Extension
C2
UART1_RI
UART1 Ring indicator
O
PU**
1.8V (VGPIO)
Connect to test point
Core
C3
UART1_RTS
UART1 Request to send
I
PU
1.8V (VGPIO)
Connect to test point
Core
C4
UART1_CTS
UART1 Clear to send
O
PU
1.8V (VGPIO)
Connect to test point
Core
C5
UART1_TX
UART1 Transmit data
I
PU
1.8V (VGPIO)
Connect to test point
Core
C6
UART1_RX
UART1 Receive data
O
PU
1.8V (VGPIO)
Connect to test point
Core
C7
UART1_DTR
UART1 Data terminal ready
I
PU
1.8V (VGPIO)
Connect to test point
Core
C8
UART1_DCD
UART1 Data carrier detect
O
PU
1.8V (VGPIO)
Connect to test point
Core
C9
UART1_DSR
UART1 Data set ready
O
PU
1.8V (VGPIO)
Connect to test point
Core
C10
GPIO2
General purpose input/output
I/O
PD**
1.8V (VGPIO)
Connect to test point
Core
C11
RESET_IN_N
Input reset signal
I
PU
1.8V
Left open
Core
C12
USB_D-
USB Data Negative (Full Speed)
I/O
3.3V
Connect to test point
Extension
C13
USB_D+
USB Data Positive (Full Speed)
I/O
3.3V
Connect to test point
Extension
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Product Technical Specification
Pad Definition
Recommendation
for Unused Pads
Type
Not Connected
Left open
Not connected
Not Connected
Left open
Not connected
Mandatory connection
if USB is used
Extension
Not Connected
Left open
Not connected
NC
Not Connected
Left open
Not connected
C19
NC
Not Connected
Left open
Not Connected
C20
NC
Not Connected
Left open
Not Connected
C21
BAT_RTC
Power supply for RTC backup
I
Left open
Extension
C22
26M_CLKOUT
26M System Clock Output
O
PD
1.8V (VGPIO)
Left open
Extension
C23
32K_CLKOUT
32.768kHz System Clock Output
O
PU
1.8V (VGPIO)
Left open
Extension
C24
ADC1
Analog to digital converter
I
PD
1.8V (VGPIO)
Left open
Extension
C25
ADC0
Analog to digital converter
I
PU
C26
UIM1_VCC
1.8V USIM1 Power supply
O
C27
UIM1_CLK
1.8V USIM1 Clock
O
C28
UIM1_DATA
1.8V USIM1 Data
C29
UIM1_RESET
C30
Pad #
Signal Name
Function
C14
NC
C15
NC
C16
USB_VBUS
USB VBUS
C17
NC
C18
I/O
Pre and Post
Reset State*
I
Power Supply
Domain
5V
1.8V (VGPIO)
Left open
Extension
1.8V
Mandatory connection
Core
PD
1.8V (VGPIO)
Mandatory connection
Core
I/O
PD
1.8V (VGPIO)
Mandatory connection
Core
1.8V USIM1 Reset
O
PD
1.8V (VGPIO)
Mandatory connection
Core
GND
Ground
0V
0V
Recommended
connection but can be
left open
Extension
C31
NC
Not Connected
C32
GND
Ground
0V
C33
PCM_OUT
PCM data out
O
C34
PCM_IN
PCM data in
C35
PCM_SYNC
C36
PCM_CLK
41111094
Not connected
0V
Recommended
connection but can be
left open
Extension
PU
1.8V (VGPIO)
Left open
Extension
I
PU
1.8V (VGPIO)
Left open
Extension
PCM sync out
I/O
PU
1.8V (VGPIO)
Left open
Extension
PCM clock
I/O
PD
1.8V (VGPIO)
Left open
Extension
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Product Technical Specification
Pad Definition
Pad #
Signal Name
Function
I/O
C37
GND
Ground
0V
C38
RF_GPS
RF_GPS
C39
GND
Ground
0V
C40
GPIO7
General purpose input/output
I/O
C41
GPIO8 / VBATT_PA_EN
General purpose input/output /
External RF voltage control
I/O
C42
NC
Not Connected
C43
EXT_LNA_GPS_EN
External GPS LNA enable
C44
WAKE_UP
Wake up signal
I
C45
VGPIO
GPIO voltage output
O
C46
GPIO6
General purpose input/output
I/O
C47
NC
Not Connected
C48
GND
Ground
C49
RF_MAIN
RF Input/output
C50
GND
Ground
0V
C51
GPIO14
General purpose input/output
I/O
C52
GPIO10
General purpose input/output
I/O
C53
GPIO11
General purpose input/output
C54
GPIO15
General purpose input/output
C55
UART0_RX
Debug Receive data
C56
UART0_TX
C57
C58
Pre and Post
Reset State*
Power Supply
Domain
Recommendation
for Unused Pads
Type
0V
Mandatory connection
Core
Left open
Core
0V
Mandatory connection
Core
PU
1.8V (VGPIO)
Left open
Core
PD
1.8V (VGPIO)
Left open
Core
Not connected
Left open
Extension
1.8V
Mandatory connection
Extension
1.8V (VGPIO)
Left open
Core
1.8V (VGPIO)
Left open
Core
Left open
Not connected
Mandatory connection
Core
Mandatory connection
Core
0V
Mandatory connection
Core
PU
1.8V (VGPIO)
Connect to test point
Extension
PU
1.8V (VGPIO)
Connect to test point
Extension
I/O
PU
1.8V (VGPIO)
Connect to test point
Extension
I/O
PU
1.8V (VGPIO)
Connect to test point
Extension
O
PU
1.8V (VGPIO)
Mandatory connection
Extension
Debug Transmit data
I
PU
1.8V (VGPIO)
Mandatory connection
Extension
UART0_CTS
Debug Clear to Send
O
PU
1.8V (VGPIO)
Mandatory connection
Extension
UART0_RTS
Debug Request to Send
I
PD
1.8V (VGPIO)
Mandatory connection
Extension
C59
PWR_ON_N
Active Low Power On control signal
I
1.8V
Mandatory connection
Core
C60
TX_ON
TX transmission indication
O
1.8V (VGPIO)
Left open
Extension
41111094
PU
PD
0V
Rev 7
0V
PU
October 04, 2019
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Product Technical Specification
Pad Definition
Power Supply
Domain
Recommendation
for Unused Pads
Type
I
3.2V (min)
3.7V (typ)
4.35V (max)
Mandatory connection
Core
Power supply (refer to section 3.1
Power Supply for more information)
I
3.2V (min)
3.7V (typ)
4.35V (max)
Mandatory connection
Core
VBATT
Power supply (refer to section 3.1
Power Supply for more information)
I
3.2V (min)
3.7V (typ)
4.35V (max)
Mandatory connection
Core
C64
UIM1_DET / GPIO3
USIM1 Detection / General purpose
input/output
I/O
PD
1.8V (VGPIO)
Left open
Core
C65
FAST_SHUTDOWN_N /
GPIO4
Fast Shutdown signal / General
purpose input/output
I/O
PU
1.8V (VGPIO)
Left open
Extension
C66
GPIO5
General purpose input/output
I/O
PU
1.8V (VGPIO)
Left open
Extension
CG1 – CG4,
G1 – G16
GND
Ground
GND
Pad #
Signal Name
Function
I/O
C61
VBATT_PA
Power supply (refer to section 3.1
Power Supply for more information)
C62
VBATT_PA
C63
Pre and Post
Reset State*
0V
Core
* This refers to the state before and after RESET_IN_N; state is Undefined during Reset, Hibernate or OFF modes. Refer to section 3.12 Reset Signal (RESET_IN_N) for more details.
** During hibernation (not applicable to Lite Hibernate mode), all the pulled up (PU) signals will toggle at the rate of wake events. Therefore, if the RI signal is to be used in a system to warn the
main MCU of an incoming network event (like SMS or DATA), this RI signal cannot be used as it will toggle at the rate of the eDRX or PSM recurrent wakes. It is therefore recommended to use
GPIO2 with a built-in pull down (PD) instead of RI. This will allow the module to trigger the GPIO instead of the RI safely, without unwanted toggles.
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Product Technical Specification
2.1.
Table 6.
Pad Definition
Pin Types
Pin Type Codes
Type
Definition
I
Digital Input
O
Digital Output
I/O
Digital Input / Output
T
Tristate
T/PU
Tristate with pull-up enabled
T/PD
Tristate with pull-down enabled
PU
Pull-up enabled
PD
Pull-down enabled
N/A
Not Applicable
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Product Technical Specification
Pad Definition
RF_MAIN
GND
NC
GPIO6
VGPIO
WAKE_UP
EXT_LNA_GPS_EN
NC
GPIO8/VBATT_PA_EN
GPIO7
GND
RF_GPS
GND
PCM_CLK
PCM_SYNC
PCM_IN
C47
C46
C45
C44
C43
C42
C41
C40
C39
C38
C37
C36
C35
C34
GPIO10
GPIO11
C48
CG4
GND
GND
C49
The following diagram shows the pad configuration from DV2 onwards.
C50
Note:
GPIO14
Pad Configuration (Top View, Through Module)
C51
2.2.
Core pin
Extension pin
CG3
GND
C52
C33
C53
C32
PCM_OUT
GND
GPIO15
C54
C31
NC
UART0_RX
C55
C30
GND
G13
G14
G15
G16
C29
UIM1_RESET
C28
G9
G10
G11
G12
C27
UIM1_DATA
UIM1_CLK
C26
UIM1_VCC
G5
G6
G7
G8
C25
ADC0
G1
G2
G3
G4
C24
C23
ADC1
32K_CLKOUT
C63
C22
26M_CLKOUT
C64
C21
BAT_RTC
FAST_SHUTDOWN_N/GPIO4
C65
C20
NC
GPIO5
C66
C19
NC
GND
CG1
CG2
GND
Figure 3.
41111094
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
UART1_DTR
UART1_DCD
UART1_DSR
GPIO2
RESET_IN_N
USB_DUSB_D+
NC
NC
USB_VBUS
NC
NC
UIM1_DET/ GPIO3
C6
C62
UART1_TX
UART1_RX
C61
VBATT_PA
VBATT
C5
VBATT_PA
GND
C4
C60
UART1_CTS
C59
TX_ON
C3
POWER_ON_N
C2
C58
UART1_RI
UART0_RTS
UART1_RTS
C57
C1
C56
GPIO1
UART0_TX
UART0_CTS
Pad Configuration (Top View through Module)
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3. Detailed Interface Specifications
Note:
If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of
25°C.
For standard applications, VBATT and VBATT_PA must be tied externally to the same power
supply. For some specific applications, the module supports separate VBATT and VBATT_PA
connection if the requirements below are fulfilled.
3.1.
Power Supply
The AirPrime HL7800 and HL7800-M modules are supplied through the VBATT and VBATT_PA
signals.
Note:
The rise of the VBATT power signal initiates the power on sequence of the module. Refer to
sections 3.11 Power On Signal (PWR_ON_N) and 3.12 Reset Signal (RESET_IN_N) for additional
information.
Refer to the following table for the pin description of the Power Supply interface.
Table 7.
Power Supply Pin Description
Pad Number
Signal Name
I/O
Description
C63
VBATT
I
Power supply (base band)
C61, C62
VBATT_PA
I
CG1 – CG4, G1 – G16
GND
Power supply (radio frequency)
Ground
Refer to the following table for the electrical characteristics of the Power Supply interface.
Table 8.
Power Supply Electrical Characteristics
Supply
Minimum
Typical
Maximum
VBATT voltage (V)
3.2
3.7
4.35
VBATT_PA voltage (V) Full Specification
3.2
3.7
4.35
VBATT_PA voltage (V) Extended Range
2.8*
3.7
4.35
* No guarantee of 3GPP performances for VBATT_PA from 2.8 to 3.2V.
Table 9.
Maximum Current Consumption
Supply
Maximum
VBATT
300mA
VBATT_PA
400mA
Note:
If a single PSU is used, the recommended power supply capability is 400 mA + 300 mA = 700 mA.
Maximum values are provided for VSWR 2.5:1 with worst conditions among supported ranges of
voltages and temperature (including GPS consumption).
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3.2.
Detailed Interface Specifications
Current Consumption
The following tables list the current consumption of the module at different conditions.
Note:
Table 10.
Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF
ports. USIM current consumption is not included.
Low Current Consumption Mode Cat-M1
Modem
Radio State
Lowest Power
Mode
Configuration
Typical
Average Value
Unit
OFF
OFF
Module is switched off by AT
command and VBATs are
connected
1.8
µA
1.8
µA
30
µA
175a
µA
185a
µA
9a
µA
35a
µA
Hibernate
Floor current
Lite Hibernate
PSM
Hibernate
1h cycle and T3324 = 20s
Lite Hibernate
Hibernate
24h cycle and T3324 = 20s
Lite Hibernate
TAU
Occurrence is network dependent
82
µAh
Calibration
Applies to eDRX 81.92s and more
12
µAh
26
µA
28
µA
eDRX cycle (TI-eDRX) = 20.48s and
PTW and DRX = 1.28s
Refer to section 3.3.1.2 Extended
DRX (eDRX)
135c
µA
135c
µA
eDRX cycle (TI-eDRX) = 81.92s and
PTW and DRX = 1.28s
Refer to section 3.3.1.2 Extended
DRX (eDRX)
50c
µA
55c
µA
50 characters received
120
µAh
1.28s
2.4
(Target: 450 µAd)
mA
2.56s
1.9
(Target: 300 µAd)
mA
35
mA
Hibernate
Floor during eDRX
Lite Hibernateb
eDRX
Hibernate Cycle
Lite Hibernate Cycleb
Hibernate Cycle
Lite Hibernate Cycleb
SMS Reception
DRX
Sleep
DRX independent, +KSLEEP=2 or
Wake active
Running
a
Values are T3324 dependent.
b
Recommended mode.
c
Values are PTW and DRX dependent.
d
Enhancement will be available in a future firmware version.
Refer to section 3.3.2 Power Modes for details regarding different low power modes.
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Product Technical Specification
Detailed Interface Specifications
The values above assume the following conditions:
•
Cat-M1
•
Good channel conditions (SINR > 5dB)
•
Static scenario
•
Cycle includes boot, cell acquisition, network attach, wait for timer expiry and back to sleep
Table 11.
Low Current Consumption Mode Cat-NB1
Modem
Radio State
Lowest Power
Mode
Configuration
Typical
Average Value
Unit
OFF
OFF
Module is switched off by AT
command and VBATs are
connected
1.8
µA
1.8
µA
30
µA
235a
µA
265a
µA
10a
µA
40a
µA
Hibernate
Floor current
Lite Hibernate
PSM
Hibernate
1h cycle and T3324 = 20s
Lite Hibernate
Hibernate
24h cycle and T3324 = 20s
Lite Hibernate
TAU
Occurrence is network dependent
100
µAh
Calibration
Applies to eDRX 81.92s and more
21
µAh
22
µA
27
µA
550c
µA
560c
µA
145c
µA
150c
µA
1.28s
10
(Target: 1.3 mAd)
mA
2.56s
4.2
(Target: 700 µAd)
mA
10.24s
2.5
(Target: 200 µAd)
mA
38
mA
Hibernate
Floor during eDRX
Lite Hibernateb
eDRX
Hibernate Cycle
Lite Hibernate Cycleb
Hibernate Cycle
Lite Hibernate Cycleb
Sleep
eDRX cycle (TI-eDRX) = 20.48s and
PTW and DRX = 1.28s
Refer to section 3.3.1.2 Extended
DRX (eDRX)
eDRX cycle (TI-eDRX) = 81.92s and
PTW and DRX = 1.28s
Refer to section 3.3.1.2 Extended
DRX (eDRX)
DRX
DRX independent, +KSLEEP=2 or
Wake active
Running
a
Values are T3324 dependent.
b
Recommended mode.
c
Values are PTW and DRX dependent.
d
Enhancement will be available in a future firmware version.
Refer to section 3.3.2 Power Modes for details regarding different low power modes.
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The values above assume the following conditions:
•
Cat-NB1
•
Good channel conditions
•
Static scenario
•
Cycle includes boot, cell acquisition, network attachment, wait for timer expiry and back to
sleep
Hibernate mode assumes the following conditions:
•
I/Os are not held (I/O state is undefined; VGPIO is off)
•
Customer application is not allowed to drive the module’s I/Os to level > 0.2V
•
UICC / USIM is off (ensure using a power saving compliant USIM/UICC)
•
The module only wakes up by a high level on the WAKE_UP pin
Refer to document [4] AirPrime HL7800 Low Power Modes Application Note for additional information.
Table 12.
Typical Current Consumption for LTE Cat-M1 in Connected Mode for All Bands
Parameter
Band
LTE Cat-M1
•
Modem State: Connected (Connection is
established)
•
4RB_DL and 1RB_UL on 3UL/DL sub
frames
Table 13.
5, 8, 12, 13, 14, 18,
19, 20, 26, 27, 28
Average
Current
(Typical
Values)
23 dBm
205 mA
0 dBm
115 mA
23 dBm
210 mA
0 dBm
120 mA
Expected Typical Current Consumption for NB -1 in Connected Mode for All Bands
Parameter
Band
NB1 DL peak throughput (27.2kbps)
1 NPDCCH, 4 Guard, 3 NPDSCH, 12
Guard, 2 NPUSCH, 3 Guard
NB1 UL peak throughput (62.5kbps)
1 NPDCCH, 8 Guard, 4 NPUSCH, 3 Guard
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Output
Power
Rev 7
1, 2, 3, 4, 5, 8,
12, 13, 14, 17,
18, 19, 20, 25,
26, 28, 66
Output Power
Average Current
(Typical Values)
23 dBm
105 mA
0 dBm
100 mA
23 dBm
165 mA
0 dBm
130 mA
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3.3.
Detailed Interface Specifications
Power Consumption States
3.3.1.
3GPP Power Saving Features
This section describes power saving features that are specified by 3GPP and that are supported by
the HL7800 and HL7800-M modules. As per 3GPP specification, these features include power states
and behaviors that pertain only to the cellular communication part of the module and do not consider
memory states, I/O states, etc., of the module overall.
3.3.1.1.
Power Saving Mode (PSM)
Power Saving Mode (PSM) is a 3GPP feature that allows the HL7800 and HL7800-M to minimize
power consumption by registering on a PSM-supporting LTE network and entering PSM state (a very
low power ‘dormant’ state). In order for the LTE network to know that the module is still present while
it is in PSM state, the network will require the modem to periodically send a TAU (Tracking Area
Update). If the module sends any data or does any other type of network transmission, the periodic
TAU timer would be restarted. The periodic TAU periodicity is negotiated with the LTE network
(i.e. the module will request the desired duration and the network will reply with the value to be used).
During the PSM state the module is unreachable by the network until it wakes up to perform the
periodic TAU or the module is woken up by the WAKE_UP pin. Host processor can wake up the
module using the WAKE_UP and send data to the network at any time during the PSM state. It is not
necessary to synchronize the application data transmission periodicity with that of the periodic TAU.
While the HL7800 or HL7800-M is in PSM:
•
Power consumption is significantly reduced with longer dormant periods
•
Networking layer signaling overhead is reduced
•
Radio resource signaling is reduced
Typical candidates for PSM are systems (such as monitors and sensors) that:
•
Require long battery life (low power consumption)
•
Infrequently send mobile originated data (every few hours, days, weeks, etc.), with optional
reply data from network
•
Tolerate modules being inaccessible for long periods of time
•
Do not use mobile-terminated voice/data/SMS. Some networks may not allow mobile
terminated data during PSM but using eDRX is a better option for applications that need
mobile terminated (network originated) data.
PSM can be activated by the user either before or after the module attaches to the network. If PSM is
activated before the attach, then module will request PSM during the attach. If PSM is activated after
the attach, the module will immediately request PSM from the network with a TAU message. The user
may also modify the requested PSM parameters afterwards, the module will update the network using
a TAU. The following example describes how the module uses PSM by requesting PSM after the
attach (as shown in Figure 4 PSM Example (Simplified)):
1. Module attaches on an LTE network.
2. User enables PSM via +CPSMS, specifying the desired periodic TAU timer and Active timer
periods.
3. The PSM request including the settings (as specified in +CPSMS) are sent to the network by
the module within a TAU message.
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4. Network sends a response that indicates if the UE may use PSM and the PSM parameters
that should be used. The network may adjust the PSM parameters from those requested by
the UE.
5. If the network supports PSM:
a. Module enters idle mode (waiting for Rx from network).
b. When module has remained idle for the Active timer period, module powers off (except for
maintaining timer and interrupts) and enters PSM.
c.
Module remains in PSM for the specified TAU timer period or until the WAKE_UP pin
wakes it.
i.
If the module does not send any data or does not access the network before the
TAU timer period expires, then the module sends a TAU to the network.
ii.
If the module sends data to the network before the TAU timer period expires, the
TAU timer is restarted. The module can be woken with the WAKE_UP in order to
send data at any time. The network application server may send data back to the
module before the PSM active timer expires. If the module sends data to the
network more often than the periodic TAU timer period, the UE would not need to
send a TAU.
d. Module enters idle mode and cycle repeats.
Current (not to scale)
Note: Simplified current consumption
pattern to illustrate general structure of
PSM cycle power state transitions.
Module
registered on
network
1.
2.
3.
4.
Module transmits TAU and
exchanges data with network
User enables PSM.
Module requests user-specified TAU-timer period.
Network responds with actual TAU-timer period to use.
Module enters and stays in idle mode until idle mode
remains uninterrupted for the Active timer duration.
Data
Tx Idle window — Module waits for Rx
Wake event:
- TAU timer expires
- WAKE_UP Pin before timer
expires
Power
off Module enters PSM
(Dormant, very low
power)
Idle
(Active timer
(T3324))
Power
up
TAU
procedure
Periodic TAU — PSM
Cycle Timer (T3412)
Power
off
Module returns to
dormant state,
PSM cycle repeats
Time
Idle
(Active timer
(T3324))
PSM Cycle
Figure 4.
PSM Example (Simplified)
Note that:
•
The PSM Periodic-TAU timer and Active Time values must be carefully selected to match the
intended use case(s) for the module:
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Periodic TAU PSM Cycle timer (T3412) – This is the maximum time the module can be
away from the network (i.e. without a transmission). The module will automatically send a
periodic TAU message to the network when this timer expires. If the module accesses the
network (for example for mobile originated data) this timer would restart, and the module
does not need to access the network for another T3412 duration. Typically, PSM should
be used for applications that originate data from the module so the requested T3412
should be much longer than the expected period of the data originating from the module.
Reducing the number of TAU will help reduce current consumption. Note that if the
module were to fail to access the network within this time, the module would need to
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reattach to the network. While the module is in PSM the network will not attempt to
access the module.
Active Time (T3324) – This is the duration of time that the module and the network are to
be idle (without sending/receiving any data) to trigger the module to enter PSM state. This
timer starts when the module enters idle state and will restart when there are any data
transfers (to/from module). If the module/network do not send any data for T3324 period,
the module will enter PSM state. The intent of this timer is to allow for a period of time for
the module and the network server to communicate. The value of this timer should be
selected to match the expected module to/from network server packet delays (using
shorter durations would save more current).
While it may be possible to set a large Active Time (T3324) such that mobile terminated
access after a TAU is possible, it may be difficult to reliably send data to the UE as the
exact time of the TAU may vary. Instead, the module application should periodically poll
the network server if the module is to be accessible. With this approach a shorter Active
Time (T3324) can be used and a longer periodic TAU time (T3412) – the timing of when
the module is accessible is also more accurate. The polling packet sent by the module
would use a similar amount of current as a TAU. It is recommended to use eDRX (as
described in the next section) instead of PSM if the module needs to be truly accessible.
When using multiple devices, consider scheduling the modules to wake at different times so
that the network does not get flooded by all modules waking and transmitting simultaneously.
•
3.3.1.2.
Extended DRX (eDRX)
Current
Extended Idle DRX (I-eDRX) is a 3GPP specified feature that reduces the number of Paging
Occasions (PO) that the module needs to monitor. Many data module applications are tolerant to
delays in downlink data packets so extending the paging cycle would allow for current consumption
savings for these applications. The HL7800 and HL7800-M support eDRX and can take advantage of
the feature by entering a low power state between the eDRX cycles. The periodicity of the eDRX
cycles (TI-eDRX) and the duration of the Paging Transmission Window (PTW) are shown in the
diagram below. The module application can negotiate specific eDRX parameter values with the
network.
Device in
C-DRX
mode
Idle DRX
(I-DRX)
TI-DRX
Current
Paging
Occurrence
4
Paging
Occurrence
4
Time
PTW
Very long sleep duration
TI-eDRX
Time
Idle eDRX
(I-eDRX)
Figure 5.
eDRX Example (PTW: 4 Paging Occurrences)
The HL7800 and HL7800-M enter a very low current consumption state between eDRX cycles.
However, for short period of time right after the module enters idle state, the module will have a few
extra short wake ups for clock calibration (shorter than an eDRX monitor). The following figure shows
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an eDRX power consumption profile with a periodic TAU event. Notice that after the TAU, the eDRX
81.92s cycle is restored slowly by several iterations from 10s to 20s then to 40s before reaching the
81.92s wake. This behavior is mandatory by design and cannot be avoided.
Figure 6.
eDRX Power Consumption Profile Interruption
The following table describes available methods for configuring eDRX.
Table 14.
eDRX-Related Commands
AT Command
Description
AT+CEDRXS
Enable/disable eDRX and configure related settings
AT+CEDRXRDP
Display current eDRX settings
For example:
•
Use the AT+CEDRXS command to configure the desired TI-eDRX value.
•
During the network attach or TAU process:
•
eDRX request with the settings (as specified in AT+CEDRXS) is sent to the network.
Network responds if the UE may use eDRX and the eDRX parameters that should be
used. The network may adjust the eDRX parameters from those requested by the UE.
If eDRX is accepted by the network, the UE will only need to monitor during the eDRX paging
occurrences. The UE may enter low power mode state between the eDRX paging
occurrences (depending on the UE configuration).
Note that:
•
The eDRX parameters must be carefully selected to match the intended use case(s) for the
module. The module can only be paged at an eDRX paging occasion, hence, longer eDRX
cycles will delay mobile terminated data reception. Selecting shorter eDRX cycles will reduce
the latency but if the eDRX cycles are too short then there will be lower power savings. The
duration of the eDRX cycle should be appropriately selected for the specific use case.
•
Network-side store and forward is supported – Packets will be stored until the module’s next
eDRX paging occurrence.
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3.3.1.3.
Detailed Interface Specifications
Possible Concurrent Modes
These two modes may run concurrently in a future firmware release; that is, eDRX may be performed
during the active window of PSM.
For example, for a PSM of one day (T3412 of 86400s) with an active window (T3324) of 5 minutes
(300s), the module may be in an eDRX power saving mode of 82s for 3 cycles then sleep for 23h55
until the next TAU during the 5-minute active window.
3.3.2.
Power Modes
In addition to the 3GPP power saving features, several low power modes are defined for the AirPrime
HL7800 and HL7800-M modules. There are three power modes defined, as follows:
•
Sleep mode: 26Mhz system clock is OFF, all memories and I/O states are retained. The
module can wake-up via the WAKE_UP signal or UART1_DTR.
•
Lite Hibernate mode: RTC, I/O states and a part of the RAM are ON (RAM is only used for 4G
protocol state and data). The module can wake-up via the WAKE_UP signal or UART1_DTR.
•
Hibernate mode: RTC and optionally part of the RAM (depending on the 4G modem state) are
ON. The module can only wake-up only via the WAKE_UP signal. (All I/Os are in undefined
state.)
These modes can be configured using the +KSLEEP AT command.
Note that:
•
When the module exits from Lite Hibernate or Hibernate mode, the host processor will act as
after a module reset (all non-persistent configurations are lost).
•
Sleep mode is recommended for regular DRX mode.
•
Hibernate mode is recommended when the module is configured in PSM or eDRX mode.
The table below summarizes these low power modes.
Table 15.
Low Power Modes
Power Mode
Possible Modem State
I/O State
Hardware Wake-Up
Signal Source
Sleep
Stack OFF, DRX, eDRX, PSM, No service
Retained
UART1_DTR
WAKE_UP
Lite Hibernate
Stack OFF, eDRX, PSM, No service
Retained
UART1_DTR
WAKE_UP
Hibernate
Stack OFF, eDRX, PSM
Not retained
WAKE_UP
Warning:
If USB_VBUS is connected, it will not be possible to enter Lite Hibernate or Hibernate mode.
Refer to document [4] AirPrime HL7800 Low Power Modes Application Note for additional details,
especially on the relationship between 3GPP power saving features and the HL7800 and HL7800-M
power modes. Additionally, refer to document [5] AirPrime HL7800-M MNO and RF Band
Customization at Customer Production Site Application Note for band selection details since it impacts
power consumption.
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3.3.3.
Detailed Interface Specifications
Digital I/O during Hibernate Power Mode
The following behavior are only applicable to digital I/Os in Hibernate mode in eDRX and PSM; it is
not applicable when in Lite Hibernate or Sleep mode.
•
VGPIO is OFF.
•
No I/O should be biased as no internal source exists. The maximum allowed voltage is ±0.2V
at any I/O.
•
All I/Os referenced to VGPIO are undefined.
•
All I/Os referenced to VGPIO are restored to their state at every wake; that also includes their
reset state as described in Table 5 Pin Definition.
For example, if an I/O has a low state before entering Hibernate mode but has a PU state during
reset, the I/O state will be undefined during Hibernate mode and then will be high due to the PU
during the few hundred ms reset mode and then restored at its low level; this happens at every wake
cycle of hibernate mode.
The behavior described above generates a toggling of various I/Os like the UART lines and the
GPIOs during the Hibernate mode and can result in unwanted I/O activity from the host processor’s
point of view.
Every line referenced to VGPIO as described in section 2 Pad Definition is affected by this behavior.
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3.3.3.1.
Detailed Interface Specifications
In PSM Mode
VGPIO and I/O (with Pull Up by default) are both high for 34.9 s corresponding to the TAU procedure
+ 30s of activity window, time duration while the module can be reach from the network (T3324).
Figure 7.
3.3.3.2.
PSM I/O Toggling during TAU and the Active Window (T3324)
In eDRX Mode
At every eDRX paging wake, the VGPIO is present and so is any GPIO (with Pull Up by default).
In the figure below, the eDRX cycle is 20s of sleep and 1.024s of activity.
Figure 8.
eDRX Cycle of 20s sleep and 1.024s of Activity
For eDRX cycles of 81.92 s or longer, that is a 10-minute internal calibration period that repeats at
every TAU cycle. In this case, the eDRX wakes are added to the internal calibration wakes and results
in thin extra wakes of VGPIO that results in I/O toggling. This may influence the application processor
or customers’ interface. Also, these thin internal calibration wakes (that lasts for 10 minutes) repeat
every 10 seconds, then every 20 s, then every 40 s before reaching the final 80 seconds wake.
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Figure 9.
Detailed Interface Specifications
eDRX with Extra Calibration Wakes
Eventually, a stable eDRX wake repeats every cycle without extra wakes. In the following figure, a
PTW of 1.02 is used with a cycle of 81.92s.
Figure 10.
Stable eDRX Cycle of 81.92s after Calibration
3.4.
VGPIO
The VGPIO output can be used to:
•
Pull-up signals such as I/Os.
•
Supply the digital transistors driving LEDs.
The VGPIO output is available when the module is switched ON. Note that VGPIO is OFF during
Hibernate mode.
Refer to the following table for the pin description of the VGPIO interface.
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Table 16.
Detailed Interface Specifications
VGPIO Pin Description
Pad Number
Signal Name
I/O
Description
C45
VGPIO
O
GPIO voltage output
Refer to the following table for the electrical characteristics of the VGPIO interface.
Table 17.
VGPIO Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Remarks
Voltage level (V)
1.7
1.8
1.9
Applies to Active, Sleep, and Lite
Hibernate modes. VGPIO is turned off
during Hibernate mode.
Current capability Active
Mode (mA)
-
-
50
The total current from all I/Os combined,
and supplied by VGPIO, should not
exceed 50 mA.
Current capability Sleep
Mode (mA)
Rise Time (ms)
1
-
-
0.5
Start-Up time from 0V
3.5.
Real Time Clock (BAT_RTC)
Note:
This interface will be available in a future firmware release.
The AirPrime HL7800 and HL7800-M modules provide an input to connect a Real Time Clock power
supply.
This pin is used as a back-up power supply for the internal Real Time Clock. The RTC is supported
when VBATT is available but a back-up power supply is needed to save date and hour when VBATT
is switched off.
This pin is input only and is not capable of charging a backup capacitor.
Table 18.
BAT_RTC Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Unit
Input voltage
2.2
-
4.35
V
Input current consumption
-
10
µA
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3.6.
Detailed Interface Specifications
USIM Interface
The AirPrime HL7800 and HL7800-M modules have one physical USIM interface, USIM1, and an
optional internal USIM or eUICC.
The USIM1 interface allows control of a 1.8V USIM (3V not supported) and is fully compliant with
GSM 11.11 recommendations concerning USIM functions.
The five signals used by this interface UIM1 are as follows:
•
UIM1_VCC: Power supply
•
UIM1_CLK: Clock
•
UIM1_DATA: I/O port
•
UIM1_RESET: Reset
•
UIM1_DET/GPIO3: Hardware SIM detection
Refer to the following table for the pad description of the USIM1 interface.
Table 19.
USIM1 Pin Description
Pad Number
Signal Name
Description
C26
UIM1_VCC
1.8V USIM1 Power supply
C27
UIM1_CLK
1.8V USIM1 Clock
C28
UIM1_DATA
1.8V USIM1 Data
C29
UIM1_RESET
1.8V USIM1 Reset
C64
UIM1_DET
1.8V USIM1 Detection
Multiplex
GPIO3
Refer to the following table for the electrical characteristics of the USIM1 interface.
Table 20.
USIM1 Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Remarks
UIM1 Interface Voltage (V)
(VCC, CLK, I/O, RESET)
-
1.80
-
The appropriate output voltage
is auto detected and selected
by software.
UIM1 Detect
-
1.80
-
High active
UIM1_VCC Current (mA)
-
-
50
Max output current in sleep
mode = 3 mA
UIM1_VCC Power-up Setting
Time (µs) from power down
-
10
-
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3.6.1.
Detailed Interface Specifications
UIM1_DET
Note:
This interface will be available in a future release.
UIM1_DET is used to detect and notify the application about the insertion and removal of a USIM
device in the USIM socket connected to the main USIM interface (UIM1). When a USIM is inserted,
the state of UIM1_DET transitions from logic 0 to logic 1. Inversely, when a USIM is removed, the
state of UIM1_DET transitions from logic 1 to logic 0.
Enabling or disabling this USIM detect feature can be done using the AT+KSIMDET command. For
more information about this command, refer to document [2] AirPrime HL78xx AT Commands
Interface Guide. (Note that this command is not yet available.)
3.7.
USB Interface
The AirPrime HL7800 and HL7800-M modules have one Universal Serial Bus Interface Full Speed.
Refer to the following table for the pad description of the USB interface.
Table 21.
USB Pin Description
Pad Number
Signal Name
I/O
Function
C12
USB_D-
I/O
USB Data Negative
C13
USB_D+
I/O
USB Data Positive
C16
USB_VBUS
I
USB VBUS
Refer to the following table for the electrical characteristics of the USB interface.
Table 22.
USB Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Unit
Input voltage at pins USB_D+ / USB_D-
3.15
3.3
3.45
V
USB_VBUS
4.75
5.0
5.25
V
Note:
USB_VBUS is a mandatory connection to supply the USB interface.
When USB is used, the lowest power mode supported is Sleep mode.
USB_VBUS must be not be connected if Hibernate or Lite Hibernate mode is used.
3.8.
Electrical Information for Digital I/O
The table below enumerates the electrical characteristics of the following digital interfaces.
•
UART
•
PCM
•
GPIOs
•
FAST_SHUTDOWN_N
•
EXT_LNA_GPS_EN
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Table 23.
Detailed Interface Specifications
Digital I/O Electrical Characteristics
Parameter
Description
Minimum
VIH
Logic High Input Voltage
VIL
Typical
Maximum
Unit
0.7 x VGPIO
**
V
Logic Low Input Voltage
**
0.3 x VGPIO
V
VOH
Logic High Output Voltage
0.8 x VGPIO
VOL
Logic Low Output Voltage
V
0.2 x VGPIO
V
I O*
I/O Drive Strength
2
4
mA
IIH
Input current in Pull Down
+10
+35
+45
µA
IIL
Input Current in Pull up
-10
-35
-45
µA
RPU
Internal Pull-Down Resistor
13
50
65
KΩ
RPD
Internal Pull-Up Resistor
13
50
65
KΩ
* The total current from all I/Os combined, and supplied by VGPIO, should not exceed 50mA.
** The maximum voltage allowed on digital I/O is ±0.2V during Hibernate mode.
3.9.
General Purpose Input/Output (GPIO)
The AirPrime HL7800 and HL7800-M modules provide 12 GPIOs, 3 of which are multiplexed.
The following table describes the pin description of the GPIO interface.
Table 24.
GPIO Pin Description
Pad Number
Signal Name
C1
Multiplex
I/O
Power Supply Domain
GPIO1
I/O
1.8V
C10
GPIO2
I/O
1.8V
C40
GPIO7
I/O
1.8V
C41
GPIO8
I/O
1.8V
C46
GPIO6
I/O
1.8V
C51
GPIO14
I/O
1.8V
C52
GPIO10
I/O
1.8V
C53
GPIO11
I/O
1.8V
C54
GPIO15
I/O
1.8V
C64
GPIO3
UIM1_DET
I/O
1.8V
C65
GPIO4*
FAST_SHUTDOWN_N
I/O
1.8V
C66
GPIO5
I/O
1.8V
VBATT_PA_EN
* GPIO4 will be available in a future release.
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3.10. Main Serial Link (UART1)
The main serial link (UART1 up to 921.6Kbps) is used for communication between the module and a
PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232
interface. The main serial link (UART1) is an asynchronous serial interface; and is also used to
upgrade the firmware locally.
If possible, it is highly recommended to add 0Ω on every line to help the debug process. This will force
the UART signal layout to the top PCB layer and allow access to the signal on the resistors.
The signals used by UART1 are as follows:
•
TX data (UART1_TX)
•
RX data (UART1_RX)
•
Request To Send (UART1_RTS)
•
Clear To Send (UART1_CTS)
•
Data Terminal Ready (UART1_DTR)
•
Data Set Ready (UART1_DSR)
•
Data Carrier Detect (UART1_DCD)
•
Ring Indicator (UART1_RI)
Note:
Signal names are according to PC view.
Refer to the following table for the pin description of the main serial link (UART1) interface.
Table 25.
UART1 Pin Description
Pad Number
Signal Name*
I/O*
Description
C2
UART1_RI
O (active low)
Signal incoming calls (data only), SMS, etc.
C3
UART1_RTS
I (active low)
Request to send
C4
UART1_CTS
O (active low)
The module is ready to receive AT commands
C5
UART1_TX
I
Transmit data
C6
UART1_RX
O
Receive data
C7
UART1_DTR
I (active low)
Prevents the module from entering sleep mode,
switches between data mode and command mode,
and wakes the module up.
C8
UART1_DCD
O (active low)
Signal data connection in progress
C9
UART1_DSR
O (active low)
Signal UART interface is ON
* DTE (Data Terminal Equipment) convention, i.e. according to PC view.
Some customer applications require to wake-up its host processor with the RI signal after SMS or IP
reception. When using eDRX mode in combination with Hibernate low power mode, this use case
cannot be handled through the standard UART1_RI signal because it is active low and cannot remain
high in Hibernate mode. In order to overcome this system issue, several GPIOs can be configured as
an inverted RI signal (RI_inverse_gpio; refer to AT+KRIC in documents [2] AirPrime HL78xx AT
Commands Interface Guide and [4] AirPrime HL7800 Low Power Modes Application Note for details.)
GPIO2 is used by default for this function; however, all GPIOs with an internal Pull Down (see Table
5) can also be used with AT+KRIC (it is recommended to add an external 470kΩ PD to keep the I/O in
a defined state during Hibernate mode).
41111094
Rev 7
October 04, 2019
43
Product Technical Specification
Detailed Interface Specifications
3.10.1. 8-wire Application
AirPrime
HL7800 and
HL7800-M
VGPIO
TP
UART1_RX
TP
UART1_CTS
TP
UART1_DSR
TP
UART1_DCD
TP
UART1_RI
TP
UART1_DTR
TP
UART1_TX
TP
UART1_RTS
TP
Level shifter use
R
R
R
R
R
R
R
R
RXD
CTS
DSR
DCD
RI
Customer
Application
DTR
TXD
RTS
Note: R is a 0Ω resistor (default value)
Figure 11.
8-wire UART Application Example
3.10.2. 4-wire Application
AirPrime
HL7800 and
HL7800-M
VGPIO
TP
UART1_RX
TP
UART1_CTS
TP
UART1_TX
TP
UART1_RTS
TP
Level shifter use
R
R
R
R
RXD
CTS
TXD
Customer
Application
RTS
Note: R is a 0Ω resistor (default value)
Figure 12.
4-wire UART Application Example
3.10.3. 2-wire Application
AirPrime
HL7800 and
HL7800-M
VGPIO
TP
UART1_RX
TP
UART1_TX
TP
Level shifter use
R
R
RXD
TXD
Customer
Application
Note: R is a 0Ω resistor (default value)
Figure 13.
41111094
2-wire UART Application Example
Rev 7
October 04, 2019
44
Product Technical Specification
Detailed Interface Specifications
3.11. Power On Signal (PWR_ON_N)
The PWR_ON_N signal is internally pulled-up. Once VBATT is supplied to the module, the internal
supply regulator is enabled and so the PWR_ON_N signal is by default at high level.
In case the PWR_ON_N pin is not configured as managed by host (default configuration), the module
starts regardless of the PWR_ON_N state. In case the RESET_IN_N signal is maintained low, the
module will not start until RESET_IN_N is released.
In case the PWR_ON_N pin is configured as managed by host, a low-level signal must be provided to
switch the module ON.
Table 26.
PWR_ON_N Pin Description
Pad Number
Signal Name
I/O
Description
C59
PWR_ON_N
I
Powers the module ON
Table 27.
PWR_ON_N Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Input Voltage-Low (V)
Note:
0.3
As PWR_ON_N is internally pulled up, an open collector or open drain transistor must be used for
ignition.
VGPIO is an output from the module that can be used to check if the module is active.
•
When VGPIO = 0V, the module is OFF (or in low power mode)
•
When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode)
Note:
PWR_ON_N cannot be used to power the module off. To power the module off, use AT command
AT+CPOF or the RESET_IN_N pin. Also, don’t put the PWR_ON_N at low level or the WAKE_UP
pin at high level during the power off sequence.
3.11.1. PWR_ON_N Not Managed (Default)
COLD START
VBATT
VBATT_PA
SOFT POWER OFF
(AT+CPOF)
HARD RESET
RESTART from
RESET_IN_N
SOFT RESET
(AT+CFUN=1,1)
EMERGENCY OFF
(HARD)
T1
PWR_ON_N not managed (Keep this pin at low
level (10µA over consumption) or Open)
AT+CFUN=1,1
HW RESET
HW RESET
RESET_IN_N
HW RESET Keep Low
T5
T5
AT+CPOF
VGPIO
T2
UART1_CTS
T3
T4
OFF
Figure 14.
41111094
T2
T2
ON
Module is
ready to
receive AT
commands
via UART1
AT 3GPP
READY
T2
T3
T3
T4
OFF
ON
AT 3GPP
READY
T3
T4
OFF
ON
T4
AT 3GPP
READY
AT 3GPP
READY
OFF
Power Up and Power Down Sequence without PWR_ON_N
Rev 7
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Product Technical Specification
Table 28.
Detailed Interface Specifications
PWR_ON_N Not Managed Timing
Parameter
Minimum
Maximum*
Unit
T1: delay between VBATT and RESET_IN_N
1
ms
T2: delay between RESET_IN_N and VGPIO
5
ms
T3: delay between VGPIO and UART1_CTS
100
µs
10
s
T4: delay
Typical
8
T5: HW RESET delay
1
ms
* Any external capacitor or resistor added on the customer application will change these values.
3.11.2. PWR_ON_N Managed
Note:
This interface will be available in a future firmware release.
3.11.2.1.
First Power On
On the first battery connection, the first power on sequence (cold start) will appear one time after
PWR_ON_N configuration via AT command. Refer to section 3.11.2.2 Power Up and Power Down
after the First Cold Start for details.
COLD START
VBATT
VBATT_PA
PWR_ON_N
CONFIGURATION
T1
PWR_ON_N not managed (Keep this pin at low level
(10µA over consumption) or Open)
RESET_IN_N
VGPIO
T2
UART1_CTS
T3
OFF
Figure 15.
41111094
ON
T4
Module is ready to receive
AT commands via UART1
AT CMD for PWR_ON_N Manage
AT 3GPP
READY
Power Up Sequence with PWR_ON_N Cold Start
Rev 7
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Product Technical Specification
3.11.2.2.
Detailed Interface Specifications
Power Up and Power Down after the First Cold Start
HARD RESET
PWR_ON_N START
SOFT POWER OFF
(AT+CPOF)
RESTART from
PWR_ON_N*
SOFT RESET
(AT+CFUN=1,1)
EMERGENCY OFF
(HARD)
P
VBATT
VBATT_PA
T6
PWR_ON_N
T9
T9
RESET_IN_N
AT+CFUN=1,1
HW RESET
HW RESET Keep Low
T5
VGPIO
T7
T8
UART1_CTS
AT+CPOF
T2
T3
ON
T3
T4
AT 3GPP
READY
OFF
ON
T8
T3
T4
AT 3GPP
READY
OFF
T4
AT 3GPP
READY
ON
T3
T4
AT 3GPP
READY
OFF
* After AT+CPOF, the module can be woken up by either the PWR_ON_N or WAKE_UP pin
Figure 16.
Power On Sequence with PWR_ON_N
3.11.2.3.
Table 29.
Timing
PWR_ON_N Managed Timing
Parameter
Minimum
T1: delay between VBATT and RESET_IN_N
0
T2: delay between RESET_IN_N and VGPIO
Typical
Unit
ms
5
T3: delay between VGPIO and UART1_CTS
T5: HW RESET delay
Maximum*
ms
100
1
ms
ms
T6: delay between VBATT and PWR_ON_N
100
ms
T7: delay between VBATT and VGPIO
5
ms
T8: delay between PWR_ON_N and VGPIO
5
ms
T9: PWR_ON_N assertion time
25
1500
ms
* Any external capacitor or resistor added on the customer application will change these values.
3.12. Reset Signal (RESET_IN_N)
To reset the module, a low-level pulse must be sent on the RESET_IN_N pad for at least 1 ms. This
action will immediately restart the module. During reset, all I/Os will be undefined if no external signal
is driven high (if the host processor drives some I/O high, a voltage leakage will appear on VGPIO
and on all GPIOs with a pull-up).
Warning:
It is forbidden to drive any I/Os during reset or Hibernate mode to high electrical level over 0.2V.
It is also forbidden to set RESET_IN_N low during a power recycle. VBATT must always be ≥ 3.2V
when reset is at low level.
41111094
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47
Product Technical Specification
Detailed Interface Specifications
As RESET_IN_N is internally pulled up, an open collector or open drain transistor should be used to
control this signal.
Refer to the following table for the pad description of the RESET_IN_N interface.
Table 30.
RESET_IN_N Pin Description
Pad Number
Signal Name
I/O
Description
C11
RESET_IN_N
I
Reset signal
Refer to the following table for the electrical characteristics of the RESET_IN_N interface.
Table 31.
RESET_IN_N Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Input Voltage-Low (V)
0.3V
Reset assertion time (ms)
Note:
1 ms
As RESET_IN_N is internally pulled up, an open collector or open drain transistor must be used for
ignition.
3.13. Analog to Digital Converter (ADC)
Two Analog to Digital Converter inputs, ADC0 and ADC1, are provided by AirPrime HL7800 and
HL7800-M modules. These converters are 12-bit resolution ADCs ranging from 0 to 1.8V.
Typical ADC use is for monitoring external voltage, wherein an application is used to safely power
OFF an external supply in case of overvoltage.
Refer to the following table for the pad description of the ADC interface.
Table 32.
ADC Pin Description
Pad Number
Signal Name
I/O
Description
C24
ADC1
I
Analog to digital converter
C25
ADC0
I
Analog to digital converter
Refer to the following table for the electrical characteristics of the ADC interface.
Table 33.
ADC Electrical Characteristics
Parameter
Minimum
ADCx Resolution
6
FCLK
4
Typical
40
FS
FCLK / (N+3)
Input Voltage Range
1.8
Integral Nonlinearity
± 1.0
Differential Nonlinearity
41111094
± 1.0
Rev 7
Maximum
Unit
12
bits
52
MHz
Remarks
MSPS
Conversion rate per channel*
V
General purpose input
± 2.0
LSB
± 1.0
LSB
October 04, 2019
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Product Technical Specification
Parameter
Detailed Interface Specifications
Minimum
Typical
Maximum
Unit
Remarks
Offset Error
± 1.0
± 2.0
LSB
% FS
Gain Error
± 1.0
± 2.0
LSB
% FS
0.5
KΩ
Input Resistance
Input Capacitance
during sampling phase
2.6
pF
* The general formula for this conversion rate is FS=FCLK / (N+3) / number of sources.
3.14. Clock Interface
The AirPrime HL7800 and HL7800-M modules support two digital clock interfaces.
Enabling or disabling the clock out feature can be done using AT commands. For more information
about AT commands; refer to document [2] AirPrime HL78xx AT Commands Interface Guide.
Refer to the following table for the pad description of the clock out interfaces.
Table 34.
Clock Interface Pin Description
Pad Number
Signal Name
I/O
I/O Type
Description
C22
26M_CLKOUT
O
1.8V
26MHz Digital Clock output
C23
32K_CLKOUT
O
1.8V
32.768kHz Digital Clock output
3.15. PCM
Note:
This interface will be available in a future release.
3.16. Debug Interfaces
The AirPrime HL7800 and HL7800-M modules provide two 4-wire debug port interfaces. The CLI
interface and the Modem Logs interface can be used with the AT interface for full debug capability.
3.16.1. Command Line Interface (CLI)
Table 35.
CLI Interface Pin Description
Pad Number
Signal Name*
I/O*
I/O Type
Description
C55
UART0_RX
O
1.8V
Debug Receive Data
C56
UART0_TX
I
1.8V
Debug Transmit Data
C57
UART0_CTS
O
1.8V
Debug Clear to Send
C58
UART0_RTS
I
1.8V
Debug Request to Send
* According to PC/host view.
Note:
41111094
It is highly recommended to provide access through Test Points to this UART0 interface (required to
enter in recovery mode; for example, for Flash dump).
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49
Product Technical Specification
Detailed Interface Specifications
3.16.2. Modem Logs interface
Table 36.
Modem Logs Interface Pin Description
Pad Number
Signal Name*
I/O*
I/O Type
Description
C51
GPIO14
O
1.8V
UART3_CTS
C52
GPIO10
I
1.8V
UART3_TX
C53
GPIO11
I
1.8V
UART3_RTS
C54
GPIO15
O
1.8V
UART3_RX
* According to PC/host view.
Note:
If there are no constrains on GPIO use, it is highly recommended to provide access through Test
Points to these 4 GPIOs to access to the UART3 interface (required to debug modem logs).
3.17. Wake Up Signal (WAKE_UP)
The AirPrime HL7800 and HL7800-M modules provide one WAKE_UP signal.
The WAKE_UP pin is used to wake up the system from low power modes (from OFF, Sleep modes,
FAST_SHUTDOWN, or after a software power off). This signal should be set to high level (external
1.8V) until the system is active to wake the module up from these modes.
The system will not be allowed to go into low power or off mode for as long as this signal is kept high.
By default, the software waits for a high state to wake up (100KΩ internal pull-down).
Refer to the following table for the pad description of the WAKE_UP signal.
Table 37.
WAKE_UP Pin Description
Pad Number
Signal Name
I/O
I/O Type
Description
C44
WAKE_UP
I
1.8V
Wakes the module up from low power mode
Refer to the following table for the electrical characteristics of the WAKE_UP signal.
Table 38.
I/O Type
Digital
41111094
WAKE_UP Electrical Characteristics
Parameter
Minimum
VIL
VIH
1.2
Rev 7
Typical
Maximum
Unit
0.3
V
V
October 04, 2019
50
Product Technical Specification
Detailed Interface Specifications
3.18. Fast Shutdown Signal (FAST_SHUTDOWN_N)
Note:
This signal will be available in a future firmware release.
The AirPrime HL7800 and HL7800-M modules provide one Fast Shutdown signal,
FAST_SHUTDOWN_N.
Refer to the following table for the pad description.
Table 39.
FAST_SHUTDOWN_N Pin Description
Pad
Number
Signal Name
I/O
I/O Type
Description
C65
FAST_SHUTDOWN_N
I
1.8V
Shuts the module down without deregistration from
the network
Refer to the following table for the electrical characteristics of the FAST_SHUTDOWN_N signal.
Table 40.
FAST_SHUTDOWN_N Electrical Characteristics
I/O Type
Parameter
Minimum
Typical
VIL
Digital
VIH
Maximum
Unit
0.3xVGPIO
V
0.7 x VGPIO
V
* VGPIO typical = 1.8 V.
3.19. RF Interface
The RF interface of the AirPrime HL7800 and HL7800-M modules allow the transmission of RF
signals.
Contact Sierra Wireless technical support for assistance in integrating the AirPrime HL7800 or
HL7800-M on applications with embedded antennas.
3.19.1. RF Connection
A 50Ω (with maximum VSWR 1.1:1, and 0.5dB loss) RF track is recommended to be connected to
standard RF connectors such as SMA, UFL, etc. for antenna connection.
Refer to the following table for the pad description of the RF interface.
Table 41.
RF Main Pin Description
Pad Number
RF Signal
C48
GND
C49
RF_MAIN
C50
GND
41111094
Rev 7
Impedance
VSWR Rx (max)
VSWR Tx (max)
50Ω
2.5:1
2.5:1
October 04, 2019
51
Product Technical Specification
Detailed Interface Specifications
3.19.2. Maximum Output Power
The maximum transmitter output power of the AirPrime HL7800 and HL7800-M for all bands in normal
operation conditions (25°C) is specified in the following table.
Table 42.
Maximum Output Power
Minimum
Typical
Maximum
Units
Notes
21.5
23
24.5
dBm
Power class 3
3.19.3. Rx Sensitivity
The module’s receiver sensitivity is specified in the following table. The test condition used for the
following values are those defined in 3GPP TS36.521v13, as follows:
•
Cat-M1: BW of 5 MHz, on Reference Measurement Channel
•
NB1: on DL Reference Measurement Channel defined
Table 43.
Typical Conducted Cat-M1 RX Sensitivity
LTE Band
Typical Reference Sensitivity Level @ 95% of the Maximum Throughput
@+25°C (dBm)
@Class A (dBm)
3GPP Limit (dBm)
B1
-105
-103.5
-102.3
B2
-105
-104
-100.3
B3
-106
-104.5
-99.3
B4
-105
-103.5
-102.3
B5
-106
-105
-100.8
B8
-106
-104
-99.8
B9
-106
-104.5
B10
-105
-103.5
B12
-106
-104.5
-99.3
B13
-106
-105
-99.3
B14
-106
-105
B17
-106
-104.5
B18
-106
-105
-100.3
B19
-106
-105
-102.3
B20
-106
-105
-99.8
B25
-106
-104
B26
-106
-104.5
-100.3
B27
-106
-105.5
-100.8
B28
-106
-105
-100.8
B66
-105
-103.5
41111094
Rev 7
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Product Technical Specification
Table 44.
Detailed Interface Specifications
Typical Conducted NB1 RX Sensitivity
Typical Reference Sensitivity Level @ 95% of the Maximum Throughput
LTE Band
@+25°C (dBm)
@Class A (dBm)
3GPP Limit (dBm)
B1
-114
-112.5
-107.5
B2
-114.5
-113.1
-107.5
B3
-115
-113.5
-107.5
B4
-114
-112.6
-107.5
B5
-114.5
-113.3
-107.5
B8
-114
-112.8
-107.5
B9
NA
NA
NA
B10
NA
NA
NA
B12
-113.5
-112.2
-107.5
B13
-114
-112.8
-107.5
B14
-113.5
-112.3
-107.5
B17
-114
-112.7
-107.5
B18
-114.5
-113.2
-107.5
B19
-114.5
-113.2
-107.5
B20
-114
-112.7
-107.5
B25
-114
-112.7
-107.5
B26
-114.8
-113.5
-107.5
B27
NA
NA
NA
B28
-114
-112.7
-107.5
B66
-114
-112.5
-107.5
3.20. TX Indicator (TX_ON)
Note:
This signal will be available in a future firmware release.
The AirPrime HL7800 and HL7800-M modules provide a signal, TX_ON, for TX emission indication.
Table 45.
TX_ON Pin Description
Pad Number
Signal Name
I/O
I/O Type
Description
C60
TX_ON
O
1.8V
High during TX emission, low when there is no TX
41111094
Rev 7
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53
Product Technical Specification
TX_ON
Detailed Interface Specifications
T duration
VBATT_PA
Voltage drop
T advance
Figure 17.
T delay
TX_ON State during TX Burst
3.21. External RF Voltage Control Indicator
Note:
This signal will be available in a future firmware release.
The AirPrime HL7800 and HL7800-M modules provide a signal, VBATT_PA_EN, for RF activity
indication. VBATT_PA_EN is used to drive an external LDO or DCDC that provides VBATT_PA power
supply. It is recommended to add an external 470kΩ PD to keep the I/O in a defined state during
Hibernate mode.
Table 46.
VBATT_PA_EN Pin Description
Pad
Number
Signal Name
I/O
I/O Type
Description
C41
GPIO8 /
VBATT_PA_EN
O
1.8V
High when VBATT_PA is supplied, low if no
power supply is required
GPIO8 /
VBATT_PA_EN
T duration
VBATT_PA
T advance
Figure 18.
41111094
T delay
VBATT_PA_EN State during RX/TX windows
Rev 7
October 04, 2019
54
Product Technical Specification
Table 47.
Detailed Interface Specifications
VBATT_PA_EN Characteristics
Parameter
Typical*
Tadvance
400 µs
Tdelay
400 µs
* Typical values to be optimized in a future firmware release.
3.22. GPS Interface
Note:
This interface will be available in a future release.
The AirPrime HL7800 and HL7800-M’s GPS supports GPS L1 signal (1575.42 ± 20 MHz) and
GLONASS L1 FDMA signals (1597.5 – 1605.8 MHz), with 50Ω connection on the RF_GPS pad.
Note:
The GPS receiver shares the same RF resources as the 4G receiver. The end-device target should
allow GPS positioning for asset management applications where infrequent and no real-time
position updates are required.
GPS antenna interface specifications are defined in the table below.
Table 48.
GPS Antenna Specifications
Characteristics
Frequency (MHz)
Value
GPS L1
1575.42 ± 20
RF Impedance (Ω)
50
VSWR max
2:1
3.22.1. GPS Performance
Refer to the following table for GPS performance details.
Table 49.
GPS Performance
Parameters
Sensitivity
TTFF
2D Position Error
Conditions
Typical Value
Cold Start
-146dBm
Hot Start
-152dBm (TBC)
Tracking
-161dBm
Cold start, Input power -130dBm
40s
Hot start, Input power -130dBm
2s (TBC)
Input power -130dBm
2.5m
3.22.2. GPS Antenna Indicator (EXT_LNA_GPS_EN)
Note:
41111094
This signal will be available in a future firmware release.
Rev 7
October 04, 2019
55
4. Mechanical Drawings
Figure 19.
41111094
Mechanical Drawing
Rev 7
October 04, 2019
56
Product Technical Specification
Figure 20.
41111094
Mechanical Drawings
Dimensions Drawing
Rev 7
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57
Product Technical Specification
Figure 21.
41111094
Mechanical Drawings
Footprint Drawing
Rev 7
October 04, 2019
58
5. Design Guidelines
5.1.
Power Supply Design
The AirPrime HL7800 and HL7800-M should not be supplied with voltage over 4.35V, even
temporarily or however briefly.
If the system’s main board power supply unit is unstable or supplied with voltage over 4.35V, even in
the case of transient voltage presence on the circuit, the module’s power amplifier may be severely
damaged.
To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and
VBATT_PA signal pads will never receive a voltage surge over 4.35V. The voltage limiter can be as
simple as a Zener diode.
5.2.
Power Cycle
In addition to Sierra Wireless’ reliable recovery mechanisms, it is highly recommended that the ability
for a power cycle to reboot the module be included in the design in case the module becomes blocked
and stops responding to reset commands.
5.3.
ESD Guidelines for USIM
Decoupling capacitors must be added according to the drawings below as close as possible to the
USIM connectors on UIM1_CLK, UIM1_RST, UIM1_VCC, UIM1_DATA and UIM1_DET signals to
avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the
USIM electrical interface.
A typical schematic including USIM detection is provided below.
41111094
Rev 7
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Product Technical Specification
Design Guidelines
D100
UIM1_VCC
UIM1_CLK
UIM1_RESET
UIM1_DATA
UIM1_DET
12pF
GND 5
UIM1_RESET
2 RST
VPP 6
3 CLK
I/O 7
4 C4
C8 8
100nF
DNI
UIM1_CLK
VGPIO
9 SW_A
SW_B 10
Figure 22.
1KΩ
UIM1_DET
100KΩ
CN100
UIM1_DATA
DNI
1 VCC
1nF
UIM1_VCC
EMC and ESD Components Close to the USIM
Sierra Wireless recommends using diode ESDALC6V1-5P6 ESD for D100.
5.4.
ESD Guidelines for USB
CONNECTOR
When the USB interface is externally accessible, it is required to have ESD protection on the
USB_VBUS, USB_D+ and USB_D- signals.
USB_VBUS
USB_D+
USB_D-
1
2
2
3
1
AirPrime HL7800
and HL7800-M
3
Figure 23.
ESD Protection for USB
Note:
It is not recommended to have an ESD diode with feedback path from USB_VBUS to either
USB_D+ or USB_D-.
Sierra Wireless recommends using ESD diode RCLAMP0503N or ESD5V3U2U-03LRH.
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5.5.
Design Guidelines
Radio Frequency Integration
The AirPrime HL7800 and HL7800-M are equipped with an external antenna. A 50Ω line matching
circuit between the module, the customer’s board and the RF antenna is required as shown in the
example below.
AirPrime
HL7800 and
HL7800-M
RF_GPS
TBD
RF_MAIN
TBD
TBD
33pF
TBD components are
optional circuits for tuning.
Figure 24.
Antenna Connection
Sierra Wireless recommends using ESD diode ESD103-B1-02EL E6327 for RF_MAIN and
ESD8011MUT5G for RF_GPS.
Note:
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6. Reliability Specification
The AirPrime HL7800 and HL7800-M modules will be tested against the Sierra Wireless Industrial
Reliability Specification defined below.
6.1.
Preconditioning Test
Per JESD22A113, this test the preconditioning of non-hermetic surface mount devices prior to
reliability testing.
Table 50.
Preconditioning Test
Designation
Condition
Preconditioning Test
PCRM
2 reflow cycles with Tmax 245-250°C
6.2.
Table 51.
Performance Test
Performance Test
Designation
Condition
Performance Test
PT3T & PTRT
Standard: N/A
Special conditions:
•
Temperature:
Class A: -30°C to +70°C
Class B: -40°C to +85°C
Rate of temperature change: ± 3°C/min
•
Recovery time: 3 hours
Operating conditions: Powered
Duration: 14 days
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6.3.
Table 52.
Reliability Specification
Aging Tests
Aging Tests
Designation
Condition
High Temperature Operating
Life test
HTOL
Standard: IEC 680068-2-2, Test Bb
Special conditions:
•
Temperature: +85°C
•
Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 45 minutes ON
and 15 minutes Idle
Duration: 20 days
Thermal Shock Test
TSKT
Standard: IEC 60068-2-14, Test Na
Special conditions:
•
Temperature: -40°C to +85°C
•
Temperature Variation: less than 30s
•
Number of cycles: 300
•
Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 7 days
Humidity Test
HUT
Standard: IEC 60068-2-3, Test Ca
Special conditions:
•
Temperature: +85°C
•
RH: 85%
Operating conditions: Powered on, DUT is powered up for 15 minutes and
OFF for 15 minutes
Duration: 10 days
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6.4.
Table 53.
Reliability Specification
Characterization Tests
Characterization Tests
Designation
Low Temperature and Cold
Start Cycles
LTCS
Condition
Special conditions:
•
Temperature: -40°C
•
AT commands read or write memory
Operating conditions: 5 mins powered ON, 30 mins powered OFF (1
power cycle)
Duration: 5 days
Component Solder Wettability
CSW
Standard: JESD22 – B102, Method 1/Condition C, Solderability Test
Method
Special conditions:
•
Test method: Surface mount process simulation test
(preconditioning 16 h ±30 minutes dry bake)
Operating conditions: Un-powered
Duration: 1 day
Unprotected Free Fall Test
FFT 1
Standard: IEC 60068-2-32, Test Ed
Special conditions:
•
Number of drops: 6 drops per unit (1 drop per direction: ±X, ±Y,
±Z)
•
Height: 1m
Operating conditions: Un-powered
Duration: 1 day
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7. Legal Information
7.1.
Japan Radio and Telecom Approval
The end device embedding the AirPrime HL7800 or HL7800-M should affix the certification indication
on its surface following the recommendations below:
•
The diameter of the Japan Approval mark must be 3mm or bigger.
•
The size, font and color of the Radio Certification Type number is not regulated but should be
easily distinguished.
Figure 25.
Sample Japan Certification Indication
7.2.
Korean Approval
The end device embedding the AirPrime HL7800 or HL7800-M should affix the certification indication
on its surface following the recommendations below:
Figure 26.
Sample Korean Approval
7.3.
FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions:
1. This device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause
undesired operation.
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
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7.3.1.
Legal Information
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator
and your body.
This device is intended only for OEM integrators under the following conditions:
1. The antenna must be installed such that 20 cm is maintained between the antenna and users,
and
2. The transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer
considered valid and the FCC ID cannot be used on the final product. In these circumstances, the
OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC authorization.
7.3.2.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users. The final end product must be labeled
in a visible area with the following: “Contains FCC ID: N7NHL78M”. The grantee's FCC ID can be
used only when all FCC compliance requirements are met.
7.3.3.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as shown in this
manual.
7.3.4.
Antenna Installation
The RF signal must be routed on the application board using tracks with a 50Ω characteristic
impedance. Basically, the characteristic impedance depends on the dielectric, the track width and the
ground plane spacing. In order to respect this constraint, Sierra Wireless recommends using
MicroStrip or StripLine structure and computing the track’s width with a simulation tool (like AppCad
shown in the figure below and that is available free of charge at https://www.broadcom.com/appcad).
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If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or
supply).
If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An
example of proper routing is shown in the figure below.
Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it
is necessary to add some vias along the RF path. RF tracks must be isolated from any others signals
by ground.
RF tracks width should be as large as possible to reduce the insertion loss (at least > 250 µm).
In many cases, depending on PCB layout structure, it is easier to have a large RF tracks width with
Microstrip structure compared to Stripline or Coplanar structure.
The RF signal (when transmitting) may interfere with neighboring electronics (AF amplifier, etc.) In the
same way, the neighboring electronics (microcontrollers, etc.) may degrade the reception
performances. In such cases, Stripline structure can be useful because the RF track is shielded.
The GSM/GPRS connector is intended to be directly connected to a 50Ω antenna and no matching is
needed.
7.4.
IC Statement
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
the following two conditions:
1. this device may not cause interference, and
2. this device must accept any interference, including interference that may cause undesired
operation of the device.
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Legal Information
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this
device does not cause harmful interference.
Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la
condition que cet appareil ne provoque aucune interférence nuisible.
This device and its antenna(s) must not be co-located or operating in conjunction with any other
antenna or transmitter, except tested built-in radios.
Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre
antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.
The County Code Selection feature is disabled for products marketed in the US/ Canada.
La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux
États-Unis et au Canada.
7.4.1.
Radiation Exposure Statement / Déclaration
d'Exposition aux Radiations
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator
and your body.
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de
distance entre la source de rayonnement et votre corps.
This device is intended only for OEM integrators under the following conditions: (For module device
use)
1. The antenna must be installed such that 20 cm is maintained between the antenna and users,
and
2. The transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
Cet appareil est conçu nt pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de
dispositif module)
1. L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre
l'antenne et les utilisateurs, et
2. Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
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Legal Information
Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne
seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son
produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.
IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop
configurations or co-location with another transmitter), then the Canada authorization is no longer
considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM
integrator will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate Canada authorization.
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour
certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur),
l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le
produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y
compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
7.4.2.
End Product Labeling / Plaque Signalétique du
Produit Final
This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users. The final end product must be labeled
in a visible area with the following: “Contains IC: 2417C-HL78M”.
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut
être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les
utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante:
"Contient des IC: 2417C-HL78M".
7.4.3.
Manual Information to the End User / Manuel
d'Information à l'Utilisateur Final
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la
façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui
intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et
avertissements comme indiqué dans ce manuel.
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8. Ordering Information
Table 54.
Ordering Information
Model Name
Description
Part Number
HL7800
HL7800 embedded module
Contact Sierra Wireless for the latest SKU
HL7800-M
HL7800-M embedded module
Contact Sierra Wireless for the latest SKU
DEV-KIT
HL Series Development Kit
6001210
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9. Terms and Abbreviations
Abbreviation
Definition
ADC
Analog to Digital Converter
AGC
Automatic Gain Control
AT
Attention (prefix for modem commands)
CDMA
Code Division Multiple Access
CF3
Common Flexible Form Factor
CLK
Clock
CODEC
Coder Decoder
CPU
Central Processing Unit
DAC
Digital to Analog Converter
DTR
Data Terminal Ready
DRX
Discontinuous Reception
eDRX
Extended DRX
EMC
Electro-Magnetic Compatibility
EMI
Electro-Magnetic Interference
EN
Enable
ESD
Electro-Static Discharges
ETSI
European Telecommunications Standards Institute
FDMA
Frequency-division multiple access
GLONASS
Global Navigation Satellite System
GND
Ground
GNSS
Global Navigation Satellite System
GPIO
General Purpose Input Output
GPRS
General Packet Radio Service
GPS
Global Positioning System
GSM
Global System for Mobile communications
Hi Z
High impedance (Z)
IC
Integrated Circuit
IMEI
International Mobile Equipment Identification
I/O
Input / Output
LED
Light Emitting Diode
LNA
Low Noise Amplifier
MAX
Maximum
MIN
Minimum
N/A
Not Applicable
PA
Power Amplifier
PC
Personal Computer
PCB
Printed Circuit Board
PCL
Power Control Level
PLL
Phase Lock Loop
PSM
Power Save Mode
PSRAM
Pseudo Static RAM
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Terms and Abbreviations
Abbreviation
Definition
PSU
Power Supply Unit
PTW
Paging Transmission Window
PWM
Pulse Width Modulation
RF
Radio Frequency
RFI
Radio Frequency Interference
RMS
Root Mean Square
RST
Reset
RTC
Real Time Clock
RX
Receive
SCL
Serial Clock
SDA
Serial Data
SIM
Subscriber Identification Module
SMD
Surface Mounted Device/Design
SPI
Serial Peripheral Interface
SW
Software
TAU
Tracking Area Update
TBC
To Be Confirmed
TBD
To Be Defined
TP
Test Point
TX
Transmit
TYP
Typical
UART
Universal Asynchronous Receiver-Transmitter
UICC
Universal Integrated Circuit Card
USB
Universal Serial Bus
UIM
User Identity Module
VBATT
Main Supply Voltage from Battery or DC adapter
VSWR
Voltage Standing Wave Ratio
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