1104230 BX3100

AirPrime BX310x Wi-Fi/BT Module Product Technical Specification 41111444 Rev 2 Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where blasting is in progress, where explosive atmospheres may be present, near medical equipment, near life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the Sierra Wireless modem MUST BE IN AIRPLANE MODE OR POWERED OFF. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE IN AIRPLANE MODE OR POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator's control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitation of Liability The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. Rev 2 Oct.17 2 41111444 Preface Patents This product may contain technology developed by or for Sierra Wireless Inc. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from MMP Portfolio Licensing. Copyright ©2017 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage® and the Sierra Wireless logo are registered trademarks of Sierra Wireless, Inc. Windows® and Windows Vista® are registered trademarks of Microsoft Corporation. Other trademarks are the property of their respective owners. Contact Information Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/ Global toll-free number: 1-877-687-7795 6:00 am to 5:00 pm PST Corporate and product information Web: sierrawireless.com Revision History Revision number Release date Changes 1 August 2017 Creation (limited release) 2 October 2017 General release Rev 2 Oct.17 3 41111444 Contents 1: Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 1.1 Module Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 1.2 General RF/Software Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 1.2.1 Wi-Fi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 1.2.2 Bluetooth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 1.2.3 Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 1.2.4 Configuration Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 1.3 General Hardware Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 1.3.1 Physical Dimensions and Connection Interface . . . . . . . . . . . . . . . . . . . . . . . .9 2: Functional Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.1 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 3: Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2 Power Supply Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2.1 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.2.2 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.3 RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3.1 Generic Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 3.3.2 Wi-Fi Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3.3 Bluetooth Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.4 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.5 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.6 Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.7 Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 4: Interfaces Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 4.2 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Rev 2 Oct.17 4 41111444 Contents 4.3 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.4 Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.5 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.5.1 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.6 I2S Interface (Digital Audio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.7 General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.8 SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 4.9 Secure Digital IO (SDIO) Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.10 Module Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.11 Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.12 PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5: Regulatory Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 United States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Bluetooth Qualification Program (BQP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6: Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 6.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 6.2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7: Abbreviations Rev 2 Oct.17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 5 41111444 List of Figures Figure 2-1: AirPrime BX310x Application Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 2-2: Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 3-1: AirPrime BX3100 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 3-2: AirPrime BX3105 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 4-1: Example of I2C Bus Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 6-1: Pin Configuration (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Rev 2 Oct.17 6 41111444 List of Tables Table 1-1: Supported RF Frequencies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 1-2: AirPrime BX310x Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 1-3: LGA Pad Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 2-1: AirPrime BX310x Capabilities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 3-1: Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 3-2: Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 3-3: Power Modes—Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 3-4: Power Modes—Typical Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 3-5: RF Current Consumption Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 3-6: Generic Radio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table 3-7: Generic Radio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table 3-8: Generic Radio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 3-9: Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 3-10: Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 4-1: UART0 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 4-2: ADC Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 4-3: Voltage-measurement GPIO Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 4-4: I2C Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 4-5: I2S Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 4-6: GPIO Pins (Dedicated) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 4-8: SPI Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 4-7: GPIO Pins (Alternate function) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 4-9: SDIO Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table 4-10: Enable Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table 6-1: Pin Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table 7-1: Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Rev 2 Oct.17 741111444 1 1: Introduction This document defines and illustrates the AirPrime BX310x (BX3100, BX3105) Wi-Fi/ BT Host-less module’s high-level product features, interfaces, and hardware features (including electrical and mechanical performance criteria). 1.1 Module Variants AirPrime BX310x module variants include: • AirPrime BX3100—External antenna connection • AirPrime BX3105—Embedded antenna 1.2 General RF/Software Features The AirPrime BX310x is a low-power, small form-factor self-contained Wi-Fi/ Bluetooth (Wi-Fi/BT) module. With an embedded software suite, the BX310x is an ideal solution for developers who want to quickly and cost-effectively integrate Wi-Fi/BT functionality into their products. The following table summarizes the module’s supported wireless frequencies: Table 1-1: Supported RF Frequencies Technology RF band Wi-Fi • Notes • 2.4GHz (2.400–2.485 GHz) • • Bluetooth 802.11b/g/n/e/i Max data rate—MCS7 HT40 150 Mbps v4.2 BR/EDR and BLE compliant 1.2.1 Wi-Fi The AirPrime BX310x supports 2.4 GHz Wi-Fi operation. Key features include: • TCP/IP • 802.11 b/g/n/e/i • Connection methods—BSS STA, SoftAP, Wi-Fi Direct (Wi-Fi P2P) • Transmit power—Adjustable, up to 21 dBm (maximum) For a list of additional supported Wi-Fi functionality, protocols, and features, see Features on page 12. 1.2.2 Bluetooth The AirPrime BX310x supports 2.4 GHz Bluetooth classic and BLE operation. Key features include: • Bluetooth v4.2 BR/EDR and BLE compliant • SPP (Serial Port Profile) For a list of additional supported Bluetooth functionality, protocols, and features, see Features on page 12. Rev 2 Oct.17 8 41111444 Introduction 1.2.3 Interfaces The AirPrime BX310x provides the following interfaces and peripheral connectivity: • Power supply—See Power Supply Ratings on page 15. • RF—See RF on page 18. • UART serial link—See UART on page 23. • ADC—See ADC on page 24. • Voltage measurement—See Voltage Measurement on page 24. • I2C—See I2C Interface on page 24. • Digital audio (I2S)—See I2S Interface (Digital Audio) on page 26. • GPIOs—See General Purpose Input/Output (GPIO) on page 26. • SPI bus—See SPI Bus on page 27. • SDIO—See Secure Digital IO (SDIO) Interface on page 28. • Module enable—See Module Enable on page 28. • System clock outputs—See Clock on page 29. • PWM—See PWM on page 29. 1.2.4 Configuration Utility The AirPrime BX310x includes a browser-based utility for device configuration. For usage details, refer to the AirPrime BX Series Development Kit User Guide available at source.sierrawireless.com (forthcoming). 1.3 General Hardware Features 1.3.1 Physical Dimensions and Connection Interface AirPrime BX310x modules are compact, robust, fully shielded and labeled modules with the dimensions noted in Table 1-2. Table 1-2: AirPrime BX310x Dimensions a Nominal BX3100 b BX3105 Tolerance Units Length 11.5 13.5 ±0.10 mm Width 9.5 11.5 ±0.10 mm Thickness 2.4 2.4 ±0.20 mm TBD TBD TBD g Parameter Weight a. Dimensions are accurate as of the release date of this document. b. BX3100 is a CF3 xSmall module, which belongs to the Common Flexible Form Factor (CF3) family of WWAN modules The AirPrime BX310x module is an LGA form factor device. All electrical and mechanical connections are made through the 70 Land Grid Array (LGA) pads on the bottom side of the PCB. (See Figure 6-1 on page 33 for details.) Rev 2 Oct.17 9 41111444 Product Technical Specification The LGA pads have the following distribution: Table 1-3: LGA Pad Types Pad Type / Quantity Signal Pads 54 outer pads Ground Pads 16 inner pads Rev 2 Oct.17 10 Dimensions Pitch 0.75x0.35 mm 0.65 mm 1.0x1.0 mm 1.83 mm/1.48 mm 41111444 2.45GHz GNDGND IN OUT F1 4 2 BX3105 uses an internal PIFA Antenna leave Pin 40 unconnected 3 1 BX3100 requires external filtering to provide harmonic rejection and in situations where co-locating with LTE or cellular radios 1 6 7 8 10 11 12 13 15 20 21 22 23 29 3 48 49 40 40 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC (BX3105) RF_MAIN (BX3100) 3V3 VDD_PADS VGPIO { GPIO(5) GPIO(27) I2S_LRCLK_GPIO(18) I2S_MCLK_GPIO(0) I2S_DO_GPIO(32) I2S_DI_GPIO(33) I2S_BCLK_GPIO(26) GPIO(36)_SENSOR_VP GPIO(37)_SENSOR_CAPP GPIO(38) SENSOR_CAPN GPIO(39)_SENSOR_VN GPIO(34)_VDET_1 GPIO(35)_VDET_2 GPIO(23)_I2C1_SCL GPIO(25)_I2C1_SDA GPIO(16)_I2C2_SDA GPIO(17)_I2C2_SCL VDD_PADS_BB VDD_PADS_BB VDD_PADS_BB { { VDD_PADS_BB { { SD_CMD_GPIO(15)_HSPICS0 SD_DATA2_GPIO(12)_HSPIQ SD_CLK_GPIO(14)_HSPICLK SD_DATA3_GPIO(13)_HSPIID SD_DATA0_GPIO(2)_HSPIWP SD_DATA1_GPIO(4)_HSPIHD VGPIO { VDD_PADS_BB { EN UART0_RTS_GPIO(22) UART0_CTS_GPIO(19) UART0_TXD UART0_RXD { VDD_PADS_BB VDD_PADS_BB BX310x Dual Mode Wi-Fi & BT Module(s) (BX3100 LGA70 9.5mm x 11.5mm) (BX3105 LGA70 13.5mm x 11.5mm) GND GND GND GND 28 30 39 41 50 VDD_3V3_RF 51 VDD_3V3_PA 52 VDD_PADS_BB 33 VGPIO GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 11 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 Rev 2 Oct.17 3V3 Voltage Domains VDD_3V3_RF (2.3V to 3.6V) Analogue Supply VDD_3V3_PA (2.3V to 3.6V) Power Amplifier Supply VDD_PADS_BB (1.8V to 3.3V) Digital IO Supply VGPIO(3.3V) Internal Interface Reference Voltage Output Note VGPIO provides voltage reference for the internal SPI FLASH Interface & GPIOs 16 & 17 SD_CMD_GPIO(15)_HSPICS0 0 SD_DATA2_GPIO(12)_HSPIQ SD_CLK_GPIO(14)_HSPICLK K SD_DATA3_GPIO(13)_HSPID P SD_DATA0_GPIO(2)_HSPIWP D SD_DATA1_GPIO(4)_HSPIHD GPIO(16)_I2C2_SDA GPIO(17)_I2C2_SCL GPIO(23)_I2C1_SCL GPIO(25)_I2C1_SDA GPIO(36)_SENSOR_VP GPIO(37)_SENSOR_CAPP GPIO(38)_SENSOR_CAPN GPIO(39)_SENSOR_VN GPIO(34)_VDET_1 GPIO(35)_VDET_2 I2S_LRCLK_GPIO(18) I2S_MCLK_GPIO(0) I2S_DI_GPIO(32) I2S_DO_GPIO(33) I2S_BCLK_GPIO(26) 42 43 44 45 46 47 53 54 9 17 31 32 34 36 18 19 26 16 24 25 27 GPIO(5) GPIO(27) UART0_RTS_GPIO(22) UART0_CTS_GPIO(19) UART0_TXD UART0_RXD 2 3 4 5 14 3 ENABLE 37 U? BX310x Module Schematic Symbol Spare GPIO I2S Audio Interface Voltage/Current Measurement Interface Primary I2C Interface Secondary I2C Interface / Spare GPIOs SDIO Interface UART Interface GPIO(16)_I2C2_SDA GPIO(17)_I2C2_SCL I2C Pull Resistors (If Used) GPIO(23)_I2C1_SCL GPIO(25)_I2C1_SDA I2C Pull Resistors R3 2k2 VGPIO R1 2k2 R4 2k2 R2 2k2 VDD_PADS 2: Functional Specifications 2 2.1 Architecture The following figure presents an overview of the AirPrime BX310x module’s internal architecture and external interfaces. Figure 2-1: AirPrime BX310x Application Schematic 41111444 Product Technical Specification SPI UART Bluetooth Link Controller Bluetooth Baseband RF Transceiver RF Front End Wi-Fi MAC Wi-Fi Baseband Reference Clock Generator 40MHz XTAL SDIO I2S I2C 2x Xtensa® 32-bit LX6 Microprocessors ADC ROM Cryptographic hardware acceleration SRAM RSA GPIO PMU 32Mb Flash PWM Analog Bluetooth Wi-Fi RTC Domain SHA ULP CoProcessor Core & Memory AES RNG Recovery Memory Security I/O Figure 2-2: Block diagram 2.2 Features Table 2-1 summarizes the AirPrime BX310x module’s RF (Wi-Fi and Bluetooth), Power, software, and hardware capabilities. Note: Table contents are preliminary and subject to change. Table 2-1: AirPrime BX310x Capabilities Feature Module Rev 2 Oct.17 Description • • • • • Secure boot Secure update FOTA (Firmware update Over The Air) Sierra Wireless AirVantage support CF3-compliant footprint (BX3100) 12 41111444 Functional Specifications Table 2-1: AirPrime BX310x Capabilities (Continued) Feature Description • Protocols: 802.11 b/g/n/e/i 802.11 n (2.4 GHz), up to 150 Mbps; MCS0-7 in 20/40 MHz bandwidths Receiving STBC (Space-time Block Code) 2x1 802.11 e: QoS for wireless multimedia technology Additional 802.11i security features (pre-authentication, TSN, etc.) WMM-PS, UAPSD A-MPDU, A-MSDU aggregation Block ACK (RTS/CTS/ACK/BA) Fragmentation/defragmentation CCMP (CBC-MAC, counter model), TKIP (MIC, RC4), WAPI (SMS4), WEP (RC4), CRC · Frame encapsulation (802.11h/RFC 1042) · Pre-authentication, TSN · · · · · · · · · · Wi-Fi • • • • • • • • • • Rev 2 Oct.17 Supported channels—1–14 Autoconnection—After device reset, automatically connects to available AP based on previous configuration Infrastructure BSS Station mode/SoftAP mode: AP mode, STA mode, concurrent AP/STA mode Up to 8 simultaneous Wi-Fi clients IP configuration—IP address in STA mode via DHCP or static assignment Authentication (security) modes: WPA, WPA2, WPA/WPA2, WPA2 Enterprise UMA-compliant and certified Open interface for various upper layer authentication schemes over EAP (e.g. TLS, PEAP, LEAP, SIM, AKA, customer-specific) Adaptive rate fallback algorithm Automatic retransmission/response on slow hosts 13 41111444 Product Technical Specification Table 2-1: AirPrime BX310x Capabilities (Continued) Feature Description • • • Bluetooth • • • • • • • • • • • • • • • • • • • • • • • Configuration Security Bluetooth v4.2 BR/EDR and BLE compliant Supported channels: BT Classic—0–78; BLE—0–39 Supported v4.2 modes: BR (Basic Rate); EDR (Enhanced Data Rate); LE (Low Energy) BT classic mandatory features BT low-energy mandatory features Class 1/Class 2/Class 3 transmitter without external power amplifier Class 1 operation without external PA Enhanced power control (>30 dB dynamic control range) +10 dBm transmitting power NZIF receiver with -98 dBm sensitivity Modulation—p/4 DQPSK, 8 DPSK ACL, SCO, eSCO, AFH Adaptive Frequency Hopping (AFH) BT 4.2 controller and host stack Service Discover Protocol (SDP) General Access Profile (GAP) Security Manage Protocol (SMP) Bluetooth Low Energy (BLE) ATT/GATT BLE Beacon SPP, RFCOMM Profiles: SPPAutoconnection—After device reset, automatically connects to available AP based on previous configuration. UART features: GATT profiles, Data transfer (HTTP, HTTPS, MQTT, TCP/ UDP), Define personal services Roles—Simultaneous Central (access point)/Peripheral (client) Simultaneous connections: · Up to 7 (total) simultaneous connections, including up to 3 BLE connections · Simultaneous BT Classic and BLE connections PCM/I2S Device configuration methods: • Built-in web-based configuration utility. See Configuration Utility on page 9. • AT commands available over UART, Wi-Fi, and BT links. Refer to AirPrime BX310x AT Command Reference at source.sierrawireless.com. • • • • All standard IEEE802.11 security features, including WFA, WPA/WPA2, WAPI Secure boot Flash encryption Cryptographic hardware acceleration: AES, HASH (SHA-2) library, RSA, ECC, Random Number Generator (RNG) Multiple power modes to reduce power consumption: Active, Radio off, Light sleep, Power management Deep sleep, Hibernation Sleep Patterns: Association sleep pattern, ULP sensor-monitored pattern Rev 2 Oct.17 14 41111444 3 3: Technical Specifications 3.1 Environmental The environmental specifications for operation and storage of the AirPrime BX310x are defined in Table 3-1. Table 3-1: Environmental Specifications Parameter Range Ambient Operating Temperature -40°C to +85°C Ambient Storage Temperature -40°C to +105°C (Recommended) Ambient Humidity TBD 3.2 Power Supply Ratings DC power is supplied via the pins described in Table 3-2 on page 15. Note: Operation above the maximum specified operating voltage (see Table 3-10 on page 20) is not recommended, and specified typical performance or functional operation of the device is neither implied nor guaranteed. Table 3-2: Power Supply Pins Rev 2 Oct.17 Pin Name Voltage Direction Function 33 VGPIO 3.3V Output Supply voltage reference for secondary I2C interface (pins 53/54) 50 VDD_3V3_RF 2.7–3.6V Input RF/Analog signal power supply 51 VDD_3V3_PA 2.7–3.6V Input Internal Power Amplifier power supply 52 VDD_3V3_BB 1.8–3.3V Input Baseband/Digital I/O power supply 15 41111444 Product Technical Specification 3.2.1 Power Management The AirPrime BX310x switches between several power modes to minimize current consumption. The following tables describe these modes and their typical current consumption: Table 3-3: Power Modes — Descriptions Power Mode CPU Wi-Fi / BT radio / baseband RTC ULP coprocessor Notes Active On On On On Fully functional Radio off On Off On On Light sleep Pause Off On On Wake up events will wake the module. Deep sleep Off Off On On/Off Connection data stored in RTC memory Hibernate Off Off Off Off Only RTC timer or specific RTC GPIOs can wake the module. Table 3-4: Power Modes — Typical Current Consumption Power Mode Description Current Consumption Wi-Fi Tx packet 13 dB~21 dBm 160~260 mA Wi-Fi/BT Tx packet 0 dBm 120 mA Wi-Fi/BT Rx and listening 80~90 mA Active (RF on) Association sleep patter (by Light-sleep) 0.9 mA@DTIM3, 1.2 mA@DTIM1 Max speed: 20 mA Modem-sleep CPU is powered on. Normal speed: 5~10 mA Slow speed: 3 mA Light-sleep Deep-sleep Hibernation - 0.8 mA ULP processor powered on 0.15 mA ULP sensor-monitored pattern 25 A @ 1% duty RTC timer + RTC memory 10 A RTC timer only 5 A 3.2.2 Current Consumption Current consumption measurements are conducted at the module antenna port with 3.0 V supply at 25C ambient temperature. Rev 2 Oct.17 16 41111444 Technical Specifications All transmitter measurements are based on 90% duty cycle and continuous transmit mode. Table 3-5: RF Current Consumption Specifications Rev 2 Oct.17 Mode Min Typ Max Unit Transmit 802.11b, DSSS 1 Mbps, POUT=+18.0 dBm - 225 - mA Transmit 802.11b, CCK 11 Mbps, POUT=+18.0 dBm - 205 - mA Transmit 802.11g, OFDM 54 Mbps, POUT = +14 dBm - 160 - mA Transmit 802.11n, MCS7 HT20, POUT=+11.5 dBm - 152 - mA Transmit 802.11n, MCS7 HT40, POUT=+11.5 dBm - 152 - mA Receive 802.11b, packet length=1024 byes, -80 dBm - 85 - mA Receive 802.11g, packet length=1024 bytes, -70 dBm - 85 - mA Receive 802.11n HT20, packet length=1024 bytes, -65 dBm - 80 - mA Receive 802.11n HT40, packet length=1024 bytes, -65 dBm - 80 - mA Power Save, DTIM 1 TBD mA Power Save, DTIM 3 TBD mA Power Save, DTIM 10 TBD mA Continuous Transmit Bluetooth 1 Mbps TBD mA Continuous Transmit Bluetooth 2 Mbps TBD mA Continuous Transmit Bluetooth 3 Mbps TBD mA Continuous Bluetooth Receive TBD mA 1.28 sec page scan (non-interlaced) TBD mA 1.28 sec LE ADV TBD mA 1.28 sec Sniff as master TBD mA 1.28 sec Sniff as slave TBD mA Modem Sleep 10 mA Light Sleep 0.8 mA Deep Sleep 25 A Hibernation 5 A 17 41111444 Product Technical Specification 3.3 RF 3.3.1 Generic Radio Measurements conducted at 25C ambient temperature. Table 3-6: Generic Radio Characteristics Description Min BX3100 RF Port Impedance Typ Max Unit  50 Frequency Band 2.4 BX3105 Antenna Gain 2.45 2.485 TBD GHz dBi 3.3.2 Wi-Fi Radio Measurements conducted at 25C ambient temperature. Table 3-7: Generic Radio Characteristics Description Rev 2 Oct.17 Min Typ Max Unit Transmit 802.11b, CCK 11 Mbps, Output Power, EVM and Mask Compliant 18.0 dBm Transmit 802.11g, OFDM 54 Mbps, Output Power, EVM and Mask Compliant 14.0 dBm Transmit 802.11n, MCS7 HT20 72.2 Mbps, Output Power, EVM and Mask Compliant 11.5 dBm Transmit 802.11n, MCS7 HT40 135 Mbps, Output Power, EVM and Mask Compliant 11.5 dBm Receiver Sensitivity 11b DSSS, 1 Mbps TBD dBm Receiver Sensitivity 11b CCK, 11 Mbps TBD dBm Receiver Sensitivity 11g OFDM, 6 Mbps TBD dBm Receiver Sensitivity 11g OFDM, 54 Mbps TBD dBm Receiver Sensitivity 11n HT20 OFDM, 72.2 Mbps TBD dBm Receiver Sensitivity 11n HT40 OFDM, 135 Mbps TBD dBm BX3100 Harmonics 2F0 -35 dBm BX3100 Harmonics 3F0 -50 dBm 18 41111444 Technical Specifications 3.3.3 Bluetooth Radio Measurements conducted at 25C ambient temperature. Table 3-8: Generic Radio Characteristics Description Rev 2 Oct.17 Min Typ Max Unit Transmit Power BR 1 Mbps, ACR & Modulation Compliant TBD dBm Transmit Power BR 2 Mbps, ACR & Modulation Compliant TBD dBm Transmit Power BR 3 Mbps, ACR & Modulation Compliant TBD dBm Transmit Power LE 1 Mbps, ACR & Modulation Compliant TBD dBm Receiver Sensitivity BR 1 Mbps TBD dBm Receiver Sensitivity EDR 2 Mbps TBD dBm Receiver Sensitivity EDR 3 Mbps TBD dBm Receiver Sensitivity LE 1 Mbps TBD dBm Out-of-band blocking performance 30 MHz~2000 MHz TBD dBm Out-of-band blocking performance 2500 MHz~3000 MHz TBD dBm Out-of-band blocking performance 3000 MHz~12.5 GHz TBD dBm 19 41111444 Product Technical Specification 3.4 Electrical Specifications 3.4.1 Absolute Maximum Ratings Table 3-9: Absolute Maximum Ratings Parameter Min Max Units VIL Input low voltage -0.3 0.25VIO V VIH Input high voltage 0.75VIO 3.3 V IIL Input leakage current - 50 nA VOL Output low voltage - 0.1VIO V VOH Output high voltage 0.8VIO - V Cpad Input pin capacitance - 2 pF VIO VDDIO 1.8 3.3 V IMAX Maximum drive capability - 12 mA TSTR Storage temperature range -40 150 C Table 3-10: Recommended Operating Conditions Parameter Min Typ Max Units VBAT Battery regulator supply voltage 2.8 3.3 3.6 V VIO I/O supply voltage 1.8 3.3 3.3 V TOPR Operating temperature range -40 - 85 C VIL CMOS low level input voltage 0 - 0.3VIO V VIH CMOS high level input voltage 0.7VIO - VIO V VTH CMOS threshold voltage - 0.5VIO - V 3.5 Mechanical 3.6 Mechanical Drawings The AirPrime BX310x module’s LGA footprint is a 70-pad array of copper pads (see Physical Dimensions and Connection Interface on page 9). The following drawings illustrate the device footprint and dimensions. Rev 2 Oct.17 20 41111444 Technical Specifications Note: Dimensions in Figure 3-1 and Figure 3-2 are preliminary and subject to change. 2.4mm ± 0.2mm mX X 9.5mm ± 0.1mm X 11.5mm ± 0.1mm m 1.35mm Pin 1 1.0mm 0.25mm 1.825mm Pin 42 0.75mm NSMD 0.05mm R 0.75mm 0.35mm Signal Pad Detail Ground Pad Detail SMD 1mm 0.35mm 0.65mm 0.30mm 0.5mm 1.475mm 1.0mm 0.67mm Pin 14 1mm Pin 28 Figure 3-1: AirPrime BX3100 Mechanical Drawing Rev 2 Oct.17 21 41111444 Product Technical Specification 11.5mm ± 0.1mm m X 2.4mm ± 0.2mm mX 8.6mm ± 0.1mm X 13.5mm ± 0.1mm 8.6mm ± 0.1mm 1mm ± 0.1mm 1.35mm Pin 1 1.0mm 0.25mm 1.825mm Pin 42 0.75mm NSM D 0.05mm R 0.75mm 0.35mm Signal Pad Detail Ground Pad Detail SM D 1mm 0.35mm 0.65mm 0.30mm 0.5mm 1.475mm 1.0mm 0.67mm Pin 14 1mm Pin 28 Figure 3-2: AirPrime BX3105 Mechanical Drawing 3.7 Antenna The AirPrime BX3100 uses an LGA pad (pin 40—RF_MAIN), which the application must connect to an external antenna. The AirPrime BX3105 includes an integrated PCB antenna. Leave the LGA pad (pin 40) unconnected. Rev 2 Oct.17 22 41111444 4 4: Interfaces Specification 4.1 Overview This section describes the interfaces supported by the AirPrime BX310x embedded module and provides specific voltage, timing, and circuit recommendations for each interface. 4.2 UART The AirPrime BX310x provides one UART interface for asynchronous communication between the AirPrime BX310x module and a host device (e.g. a PC or host processor): • UART0—4-wire, RS-232-compliant interface Note: Up to two additional UART interfaces can be added by configuring GPIOs using AT commands. Flow control is managed using: • RTS/CTS signals (This method is required for higher UART interface speeds.) • or Software XON/XOFF Table 4-1 on page 23 describes the signals used for UART0. Note: UART signals are named with respect to the module, and directions are listed with respect to the module. For example, UART0_RXD is an output from the module to the host. Table 4-1: UART0 Pins a Pin Interface Name Direction UART0_RTS I Ready To Send, flow control UART0_CTS O Clear To Send, flow control 4 UART0_TXD I Transmit Data 5 UART0_RXD O Receive Data 2 3 Function UART0 Voltage Level VDD_PADS_BB a. If UART0 pins are not used, leave open. Rev 2 Oct.17 23 41111444 Product Technical Specification 4.3 ADC The AirPrime BX310x provides two general purpose ADC (Analog to Digital Converter) inputs that are used to measure analog voltages. Table 4-2: ADC Interface Pins a Pin Signal name Direction b 18 VDET_1 I 19 VDET_2 I Function Analog to Digital Converter Voltage Level VDD_PADS_BB a. Leave open any pins that are not used. b. Signal direction with respect to the module. 4.4 Voltage Measurement The AirPrime BX310x supports the measurement of analog voltages using the following methods: • ADCs—Two input pins that can be used for direct voltage measurements. See ADC on page 24. • Combination of four GPIOs and external capacitors—Small analog signals can be measured by configuring (using AT commands) the pins in Table 4-3 below to support a low-noise programmable gain amplifier with the addition of external 270 pF capacitors between pins 31/32 and pins 34/36. The internal ULP-coprocessor is also designed to measure the voltages while operating in the sleep mode, to enable low power consumption; the CPU can be woken up by a threshold setting and/or via other triggers. Table 4-3: Voltage-measurement GPIO Pins a Pin Signal Name Direction b 31 SENSOR_VP I 32 SENSOR_CAPP I 34 SENSOR_CAPN I 36 SENSOR_VN I Voltage level VDD_PADS_BB a. Leave open any pins that are not used. b. Signal direction with respect to the module. 4.5 I2C Interface The AirPrime BX310x module provides two I2C (Inter-Integrated Circuit) dedicated serial ports (bus interface) based on [8] The I2C Bus Specification, Version 2.1, January 2000 (Phillips Semiconductor document number 9398 393 40011). Rev 2 Oct.17 24 41111444 Interfaces Specification The interfaces use the pins indicated in Table 4-4. Table 4-4: I 2 C Interface Pins a Pin Signal name Direction Function 9 I2C1_SCL I/O Primary I2C interface 17 I2C1_SDA I/O Primary I2C interface 53 I2C2_SDA I/O Secondary I2C interface 54 I2C2_SCL I/O Secondary I2C interface Voltage Level VDD_PADS_BB VGPIO a. Leave open any pins that are not used. This implementation of the I2C interface includes the following characteristics: • Supported voltage: · Primary I2C (1.8 V/3.3 V, configurable) · Secondary I2C (3.3 V) • Standard-mode interface—Data transfer rates up to 100 kbit/s • Fast-mode interface—Data transfer rates up to 400 kbit/s) • Master mode operation • Addressing modes—7-bit; 10-bit; Dual addressing mode External 2.2 k pull-up resistors must be applied to I2C signals (see Figure 4-1 on page 25). For I2C bus details, including I2C bus waveform and timing details, refer to the I2C Bus Specification. 4.5.1 Application VDD_PADS_BB AirPrime BX310x Wi-Fi/BT Module I2C1_SCL Customer Application 2.2K 2.2K I2C1_SDA VGPIO I2C2_SDA 2.2K 2.2K I2C2_SCL Figure 4-1: Example of I2C Bus Application Rev 2 Oct.17 25 41111444 Product Technical Specification 4.6 I2S Interface (Digital Audio) Note: Interface support is forthcoming. The AirPrime BX310x provides a 4-wire I2S (digital audio) interface that can be used to transfer serial digital audio to or from an external stereo DAC/ADC, and supports the following features: • Modes—Master, Slave • Transmission format—Full duplex, Half duplex • Resolution (bits per frame)—8, 16, 32, 40, 48 • Channels—Input, Output • Bit clock—10 kHz–40 MHz • Supported audio interfaces (forthcoming)—PDM (Pulse Density Modulation), BT PCM (Pulse Code Modulation) The interface uses the pins indicated in Table 4-5. Table 4-5: I2S Interface Pins a Pin Signal name Direction b Function 16 I2S_MCLK O I2S MasterClock 24 I2S_DO O I2S Data Out 25 I2S_DI I I2S Data In 26 I2S_LRCLK I/O I2S Left-Right Clock (Word Select) 27 I2S_BCLK I/O I2S Bit Clock Voltage Level VDD_PADS_BB a. Leave open any pins that are not used. b. Signal direction with respect to the module. 4.7 General Purpose Input/Output (GPIO) The AirPrime BX310x defines several GPIOs for customer use, as described in Table 4-6 and Table 4-7. Note: The pins carrying the ‘Alternate function’ GPIOs are multi-function. The alternate interfaces (SDIO or SPI) can be selected via an AT command. Table 4-6: GPIO Pins (Dedicated) a Pin Signal Name Direction 14 GPIO(5) I/O 35 GPIO(27) I/O Default State No pullb Function Voltage Level General purpose I/O VDD_PADS_BB a. Leave open any pins that are not used. b. Internal configuration of all GPIOs—no internal pull-ups Rev 2 Oct.17 26 41111444 Interfaces Specification Table 4-7: GPIO Pins (Alternate function) a Pin Signal Name 42 GPIO(15) 43 GPIO(12) 44 GPIO(14) 45 GPIO(13) 46 GPIO(2) 47 GPIO(4) Direction Default State I/O No pullb Function Voltage Level General purpose I/O VDD_PADS_BB a. Leave open any pins that are not used. b. Internal configuration of all GPIOs—no internal pull-ups 4.8 SPI Bus Note: Interface support is forthcoming. The AirPrime BX310x provides one 6-wire Serial Flash SPI-compatible interface. Note: Traditional 4-wire (MOSI/MISO/SCLK/SS) SPI can also be implemented over using appropriate pins. Table 4-8 on page 27 describes the SPI interface pins. Note: The pins carrying the SPI interface are multi-function. The alternate interfaces (SDIO or GPIO) can be selected via an AT command. Table 4-8: SPI Pin Descriptions a Pin Signal Name Direction b 42 HSPICS0 I/O SPI Chip Select 43 HSPIQ I/O SPI Data In 44 HSPICLK I/O SPI Clock 45 HSPID I/O SPI Data Out 46 HSPIWP O SPI Write Protect 47 HSPIHD O SPI Hold Function Voltage Level VDD_PADS_BB a. Leave open any pins that are not used. b. Signal direction with respect to the module. Rev 2 Oct.17 27 41111444 Product Technical Specification 4.9 Secure Digital IO (SDIO) Interface Note: Interface support is forthcoming. The AirPrime BX310x defines one SDIO slave-controller interface (SD 2.0-compliant), which allows a host controller to access the module (the slave device) on the SDIO bus. The following features are supported: • Data transfer rates—0–50 MHz • Block size—Up to 512 bytes • Interrupts—module-initiated and host-initiated • Module-initiated data transfer via host interrupt • Configurable features—Sampling, driving clock edge • Registers for direct access by host Table 4-9 describes the signals used for SDIO. Note: The pins carrying the SDIO interface are multi-function. The alternate interfaces (GPIO or SPI) can be selected via an AT command. Table 4-9: SDIO Pin Descriptions a Pin Signal Name Direction Function 42 SD_CMD I/O SDIO command 43 SD_DATA2 I/O SDIO data bit 2 44 SD_CLK I/O SDIO clock 45 SD_DATA3 I/O SDIO data bit 3 46 SD_DATA0 I/O SDIO data bit 0 47 SD_DATA1 I/O SDIO data bit 1 Voltage Level VDD_PADS_BB a. Leave open any pins that are not used. 4.10 Module Enable The AirPrime BX310x uses the ENABLE (Module Enable) signal to turn the module on/off: • Turn module on—Drive ENABLE high (to VDD_PADS_BB) • Turn module off—Drive ENABLE low (to 0V) Table 4-10: Enable Pin Description a Pin Signal Name Direction b Function Voltage Level 37 ENABLE I Start/stop module VDD_PADS_BB a. Leave open any pins that are not used. b. Signal direction with respect to the module. Rev 2 Oct.17 28 41111444 Interfaces Specification 4.11 Clock The AirPrime BX310x outputs the I2S Master Clock (pin 16, GPIO(0)_I2S_MCLK) and can output a configurable RTC on some GPIOs (details TBD). 4.12 PWM The AirPrime BX310x supports the use of any signal in Table 6-1 on page 33 that includes “(GPIOx)” in its name as a PWM, via AT command configuration. Rev 2 Oct.17 29 41111444 5 5: Regulatory Certifications Caution: Unauthorized modifications or changes not expressly approved by Sierra Wireless could void compliance with regulatory rules, and thereby your authority to use this equipment. The BX3100/BX3105 module is designed to meet, and upon commercial release, will meet the requirements of the following regulatory bodies and regulations, where applicable: • Federal Communications Commission (FCC) of the United States • The Certification and Engineering Bureau of Industry Canada (IC) • Ministry of Internal Affairs and Communications (MIC) of Japan • Radio Equipment Directive of the European Union Upon commercial release, the following industry certification will have been obtained, where applicable: • Bluetooth SIG Additional certifications and details on specific country approvals may be obtained upon customer request — contact your Sierra Wireless account representative for details. Additional testing and certification may be required for the end product with an embedded BX3100/BX3105 module and are the responsibility of the OEM. Sierra Wireless offers professional services-based assistance to OEMs with the testing and certification process, if required. United States The BX3100/BX3105 module, upon commercial release, will have been granted modular approval by the FCC. Integrators may use the BX3100/BX3105 module in their end products without additional FCC certification if the following conditions are met. • At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. • The BX3100/BX3105 module must not be collocated with any other transmitter within a host device. • The regulatory label on the end product must include the text “Contains FCC ID: TBD” and the following compliance statement: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. A user manual with the end product must clearly indicate the operating requirements and conditions to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded BX3100/BX3105 module may also need to meet the FCC Part 15 unintentional emission requirements and be properly authorized per FCC Part 15 Subpart B. Rev 2 Oct.17 30 41111444 Regulatory Certifications Canada The BX3100/BX3105 module, upon commercial release, will have been granted modular approval by IC. Integrators may use the BX3100/BX3105 module in their end products without additional IC certification if the following conditions are met. • At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. • The BX3100/BX3105 module must not be collocated with any other transmitter within a host device. • The regulatory label on the end product must include the text “Contains IC : TBD” and the following compliance statement: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Bluetooth Qualification Program (BQP) • • In case no other non-certified Bluetooth components are incorporated, the BX3100/BX3105's BQP marking certification allows users to integrate the module into products without the need to obtain subsequent and separate approval. The BX3100/BX3105 has been approved by the Bluetooth Qualification Body (BQB) to use the Bluetooth trademark and to offer official Bluetooth functionality. The approval according to the V4.2 Bluetooth specification confirms that the module complies with the Bluetooth specification and will successfully operate with other products supporting the same profile. BQP certification also ensures that the module has gone through safety assessment. This certification was granted through a combination of product performance testing and interoperability testing. This certification applies globally. Labelling • Products complying with all relevant requirements are allowed to bear the official Bluetooth logo For further information regarding the BQP certification requirements please review the following websites: Bluetooth Special Interest Group: https://www.bluetooth.org/apps/content/ Rev 2 Oct.17 31 41111444 6 6: Pinout The system interface of the AirPrime BX310x is through the LGA pattern on the bottom of the PCB. AirPrime BX310x pins are divided into three functional categories: • Core functions and associated pins—Cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of modules. These Core functions are always available and always at the same physical pin locations. A customer platform using only these functions and associated pins is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules. • Extension functions and associated pins—Bring additional capabilities to the customer. Whenever an Extension function is available on a module, it is always at the same pin location. • Custom functions and associated pins—These are module-specific and make use of specific chipset functions and I/Os. Warning: Custom features should be used with caution as there is no guarantee that the custom functions available on a given module will be available on other CF3 modules. Pins marked as "Leave open" or "Reserved" should not be used or connected. Rev 2 Oct.17 32 41111444 Pinout 6.1 Pin Configuration Figure 6-1 illustrates the pin configuration of the AirPrime BX310x module. Figure 6-1: Pin Configuration (Bottom View) 6.2 Pin Description Table 6-1 on page 33 lists detailed information for the LGA pins. Important: Leave open all pins that are not used. Table 6-1: Pin Definitions PU/ Pin Signal name Group I/O a PD b Active c Function Type d - - - - E 1 Reserved 2 UART0_RTS_GPIO(22) UART0 I VDD_PADS_BB PU L UART0 Request To Send C 3 UART0_CTS_GPIO(19) UART0 O VDD_PADS_BB PU L UART0 Clear To Send C 4 UART0_TXD UART0 I VDD_PADS_BB PU L UART0 Transmit Data C 5 UART0_RXD UART0 O VDD_PADS_BB PU L UART0 Receive Data C 6 Reserved NoConnect - - - - Rev 2 Oct.17 NoConnect Voltage 33 - E 41111444 Product Technical Specification Table 6-1: Pin Definitions (Continued) PU/ Pin Signal name Group I/O a Voltage PD b Active c Function Type d 7 Reserved NoConnect - - - - - E 8 Reserved NoConnect - - - - - E GPIO(23) GPIO I/O NP SW PUE L 9 General Purpose I/O C VDD_PADS_BB I2C1_SCL I2C1 I/O 10 Reserved NoConnect - - - - - C 11 Reserved NoConnect - - - - - E 12 Reserved NoConnect - - - - - E 13 Reserved NoConnect - - - - - E 14 GPIO(5) GPIO I/O VDD_PADS_BB NP SW 15 Reserved NoConnect - - - - I2S_MCLK I2S O NP H NP SW General Purpose I/O NP SW General Purpose I/O PUE L Primary I2C interface—Data NP H ADC input for voltage measurement NP SW NP H NP SW 16 Primary I2C interface—Clock General Purpose I/O E - E I2S Master Clock E VDD_PADS_BB GPIO(0) GPIO I/O GPIO(25) GPIO I/O 17 E VDD_PADS_BB I2C1_SDA VDET_1 I2C1 I/O VoltMeasure I 18 C VDD_PADS_BB GPIO(34) GPIO I/O VDET_2 VoltMeasure I 19 General Purpose I/O ADC input for voltage measurement C VDD_PADS_BB GPIO(35) GPIO I/O 20 Reserved NoConnect - - - - - C 21 Reserved NoConnect - - - - - C 22 Reserved NoConnect - - - - - C 23 Reserved NoConnect - - - - - C I2S O PD H NP SW PD H NP SW General Purpose I/O PD L/H I2S Left-Right Clock (Word Select) NP SW General Purpose I/O PD H NP SW I2S_DO 24 General Purpose I/O I2S Data Out E%% VDD_PADS_BB GPIO(32) I2S_DI GPIO I/O I2S I 25 General Purpose I/O I2S Data In E%% VDD_PADS_BB GPIO(33) I2S_LRCLK GPIO I/O I2S I/O 26 E VDD_PADS_BB GPIO(18) GPIO I/O I2S_BCLK I2S I/O 27 I2S Bit Clock E VDD_PADS_BB GPIO(26) 28 GND 29 Reserved Rev 2 Oct.17 GPIO I/O Ground 0V 0V - - NoConnect - - - - 34 General Purpose I/O Ground C - E 41111444 Pinout Table 6-1: Pin Definitions (Continued) PU/ Pin 30 Signal name GND GPIO(36) Group I/O a Voltage PD b Active c Ground 0V 0V - - GPIO I/O NP SW NP H NP SW NP H 31 GPIO(37) VoltMeasure I GPIO I/O 32 C General Purpose I/O C ADC input for voltage measurement General Purpose I/O C VDD_PADS_BB SENSOR_CAPP VoldMeasure I VGPIO Power O GPIO(38) GPIO I/O 34 3.3V ADC input for voltage measurement Reference voltage output C General Purpose I/O C NP SW NP H ADC input for voltage measurement NP L General Purpose I/O E NP SW General Purpose I/O C NP H ADC input for voltage measurement L Turn module on/off C - E VDD_PADS_BB SENSOR_CAPN 35 Ground VDD_PADS_BB SENSOR_VP 33 Type d Function VoltMeasure I GPIO(27) GPIO I/O GPIO(39) GPIO I/O 36 VDD_PADS_BB VDD_PADS_BB SENSOR_VN VoltMeasure I 37 ENABLE Control I VDD_PADS_BB 38 Reserved NoConnect - - - - 39 GND Ground 0V 0V - - Ground C 40 RF_MAIN RF I/O - - (BX3100) RF antenna, DC blocked (BX3105) Leave pin unconnected C 41 GND Ground 0V - - Ground C SD_CMD SDIO I/O NP H SDIO Command E HSPICS0 SPI I/O NP SW SPI Chip Select C GPIO(15) GPIO I/O NP SW General Purpose I/O E SD_DATA2 SDIO I/O NP H SDIO Data bit 2 E SPI I/O NP SW SPI Data In C GPIO(12) GPIO I/O NP SW General Purpose I/O E SD_CLK SDIO I/O NP H SDIO Clock E HSPICLK SPI I/O NP SW SPI Clock (output from Master) C GPIO(14) GPIO I/O NP SW General Purpose I/O E SD_DATA3 SDIO I/O NP H SDIO Data bit 3 E SPI I/O NP SW SPI Data Out C GPIO(13) GPIO I/O NP SW General Purpose I/O E SD_DATA0 SDIO I/O NP H SDIO Data bit 0 E HSPIWP SPI O NP SW SPI Write Protect E GPIO(2) GPIO I/O NP SW General Purpose I/O E 42 43 44 45 46 HSPIQ HSPID Rev 2 Oct.17 0V VDD_PADS_BB VDD_PADS_BB VDD_PADS_BB VDD_PADS_BB VDD_PADS_BB 35 41111444 Product Technical Specification Table 6-1: Pin Definitions (Continued) PU/ Group I/O a SDIO I/O HSPIHD SPI O GPIO(4) GPIO I/O 48 Reserved NoConnect - 49 Reserved NoConnect 50 VDD_3V3_RF 51 52 Pin Signal name SD_DATA1 47 Active c NP H NP Function Type d E SW SPI Hold E NP SW General Purpose I/O E - - - - E - - - - - E Power I 2.8 (Min) 3.3V (Typ) 3.6 (Max) - - 3.3v nominal supply for Analog/RF C VDD_3V3_PA Power I 2.8 (Min) 3.3V (Typ) 3.6 (Max) - - 3.3v nominal supply for Internal Power Amplifier C VDD_PADS_BB Power I 1.8 (Min) 3.3V (Typ) 3.6 (Max) - - 3.3v nominal supply for Baseband and Digital I/O C GPIO(16) GPIO I/O NP SW General Purpose I/O C PUE L NP SW PUE L Primary I2C interface—Clock - - Ground VDD_PADS_BB VGPIO I2C2_SDA I2C2 I/O GPIO(17) GPIO I/O 54 Primary I2C interface—Data General Purpose I/O C VDD_PADS_BB I2C2_SCL a. b. c. d. PD b SDIO Data bit 1 53 G1– G16 Voltage Ground I2C2 I/O Ground 0V 0V C I/O: Signal direction with respect to the module PU/PD: NP—No Pull; PD—Pull Down; PU—Pull Up; PUE—Pull Up External Active: H—High; L—Low; SW—Software defined Type: C—Core; E—Extended; K—Custom Rev 2 Oct.17 36 41111444 7 7: Abbreviations Table 7-1: Acronyms and Definitions Acronym or term Definition AFH Adaptive Frequency Rate Hopping AP Access Point BLE Bluetooth Low Energy BR Basic Rate BSS Basic Service Set BT Bluetooth (Classic) EDR Enhanced Data Rate EDR Enhanced Data Rate GAP Generic Access Profile GAP General Access Profile GATT General Attribute Profile HTTP Hypertext Transfer Protocol HTTPS Hypertext Transfer Protocol Secure LE Low Energy MQTT Message Queuing Telemetry Transport PAN Personal Area Network RFCOMM Radio Frequency Communication SDP Service Discover Protocol SMP Security Manage Protocol SPP Bluetooth Serial Port Profile STA Station (client) UART Universal Asynchronous Receiver-Transmitter Wi-Fi Wireless Networking WPA Wi-Fi Protected Access WPA2 Wi-Fi Protected Access 2 WPS Wi-Fi Protected Setup Rev 2 Oct.17 37 41111444