AirPrime BX310x Wi-Fi/BT
Module
Product Technical Specification
41111444
Rev 6
Product Technical Specification
Important
Notice
Safety and
Hazards
Due to the nature of wireless communications, transmission and reception of data can
never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally
lost. Although significant delays or losses of data are rare when wireless devices such
as the Sierra Wireless modem are used in a normal manner with a well-constructed
network, the Sierra Wireless modem should not be used in situations where failure to
transmit or receive data could result in damage of any kind to the user or any other
party, including but not limited to personal injury, death, or loss of property. Sierra
Wireless accepts no responsibility for damages of any kind resulting from delays or
errors in data transmitted or received using the Sierra Wireless modem, or for failure
of the Sierra Wireless modem to transmit or receive such data.
Do not operate the Sierra Wireless modem in areas where blasting is in progress,
where explosive atmospheres may be present, near medical equipment, near life
support equipment, or any equipment which may be susceptible to any form of radio
interference. In such areas, the Sierra Wireless modem MUST BE IN AIRPLANE
MODE OR POWERED OFF. The Sierra Wireless modem can transmit signals that
could interfere with this equipment.
Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on
the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE IN
AIRPLANE MODE OR POWERED OFF. When operating, the Sierra Wireless modem
can transmit signals that could interfere with various onboard systems.
Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground
and the door is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem
while in control of a vehicle. Doing so will detract from the driver or operator's control
and operation of that vehicle. In some states and provinces, operating such
communications devices while in control of a vehicle is an offence.
Limitation of
Liability
The information in this manual is subject to change without notice and does not
represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS
AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT,
INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR
EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS
OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE
USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF
SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR
CLAIMS BY ANY THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates
aggregate liability arising under or in connection with the Sierra Wireless product,
regardless of the number of events, occurrences, or claims giving rise to liability, be in
excess of the price paid by the purchaser for the Sierra Wireless product.
Rev 6 Jul.18
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Preface
Patents
This product may contain technology developed by or for Sierra Wireless Inc. This
product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or
more patents licensed from MMP Portfolio Licensing.
Copyright
Trademarks
©2018 Sierra Wireless. All rights reserved.
Sierra Wireless®, AirPrime®, AirLink®, AirVantage® and the Sierra Wireless logo are
registered trademarks of Sierra Wireless, Inc.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
The Bluetooth® word mark and logos are registered trademarks owned by the
Bluetooth SIG, Inc. and any use of such marks by Sierra Wireless is under license.
Other trademarks are the property of their respective owners.
Contact
Information
Sales information and technical
support, including warranty and returns
Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795
6:00 am to 5:00 pm PST
Corporate and product information
Web: sierrawireless.com
Revision
History
Revision
number
Release date
Changes
1
August 2017
Creation (limited release)
2
October 2017
General release
3
February 2018
Updated application schematic
Updated VDD_PADS_BB voltage
Updated current consumption measurement power supply to 3.3V
Updated Table 2-1 AirPrime BX310x Capabilities—noted Bluetooth features not yet
supported
Updated Table 3-5 RF Current Consumption Specifications
Updated Table 3-7 Generic Radio Characteristics
Updated Table 3-8 Generic Radio Characteristics
Updated Table 3-9 Absolute Maximum Ratings
Updated Table 3-10 Recommended Operating Conditions
Updated Mechanical drawings
Updated Table 6-1 Pin Definitions—VDD_PADS_BB min voltage
4
February 2018
Updated Table 2-1 (moved Data Transfer entry from Bluetooth to Wi-Fi section)
Corrected pin types in Table 6-1 Pin Definitions (11–13, 24–27)
Rev 6 Jul.18
3
41111444
Product Technical Specification
Revision
number
Release date
Changes
5
July 2018
Added module weight
Removed system clock outputs
Updated schematics
Updated mechanical drawings
Updated Power Supply Ratings (voltage ranges)
Added Analog Power Considerations section
Updated Digital Power Considerations section
Updated VGPIO Power Considerations section
Updated Power Management description
Updated Current Consumption section
Updated Generic Radio section
Updated Wi-Fi Radio section
Updated Bluetooth Radio section
Updated Antenna section
Added Suggested Antennas section
Updated UART section
Added ADC/Voltage Measurement topic (replaced ADC topic and Voltage
Measurement topic)
Updated General Purpose Input/Output topic
Updated SPI Bus topic
Updated SDIO topic
Updated Module Enable topic
Added General Layout Recommendations chapter
Added Firmware Upgrade chapter
Removed United States and Canada Regulatory Information topics
Updated Bluetooth Qualification Program topic
Added References section
6
July 2018
Updated VDD_PADS_BB voltage range
Updated Wi-Fi Radio Generic Radio Characteristics table values
Updated Bluetooth Radio Generic Radio Characteristics table values
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Contents
1: Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.1 Module Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2 General RF/Software Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2.1 Wi-Fi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2.2 Bluetooth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2.3 Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
1.2.4 Configuration Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.3 General Hardware Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.3.1 Physical Dimensions and Connection Interface . . . . . . . . . . . . . . . . . . . . . . . 11
2: Functional Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3: Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2 Power Supply Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2.1 Analog Power Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2.2 Digital Power Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2.3 VGPIO Power Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2.4 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.2.5 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3 RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.1 Generic Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
3.3.2 Wi-Fi Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.3 Bluetooth Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.4 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.5 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.6 Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.7 Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.7.1 Suggested Antennas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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Product Technical Specification
4: Interfaces Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.2 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.3 ADC/Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.4 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.4.1 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.5 I2S Interface (Digital Audio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.6 General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.7 Bootstrap Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.8 SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.9 Secure Digital IO (SDIO) Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
4.10 Module Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.11 PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5: General Layout Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6: Firmware Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
7: Regulatory Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.1 Bluetooth Qualification Program (BQP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.1.1 Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8: Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
9: References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9.1 Web Site Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9.2 Reference Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
10: Abbreviations
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List of Figures
Figure 2-1: AirPrime BX310x Application Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 2-2: Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 3-1: VDD_3V3_RF Capacitor Requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 3-2: AirPrime BX3100 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 3-3: AirPrime BX3105 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 3-4: BX3105 Placement Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 3-5: BX3105 Placement Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 3-6: Simulated Radiated Antenna Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 4-1: Example of I2C Bus Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 8-1: Pin Configuration (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
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List of Tables
Table 1-1: Supported RF Frequencies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 1-2: AirPrime BX310x Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 1-3: LGA Pad Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 2-1: AirPrime BX310x Capabilities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 3-1: Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 3-2: Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 3-3: Power Modes—Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 3-4: RF Current Consumption Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 3-5: Generic Radio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 3-6: Generic Radio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 3-7: Generic Radio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 3-8: Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 3-9: Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 3-10: BX310x—Typical Range Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 3-11: Antennas. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 4-1: UART0 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 4-2: ADC Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 4-3: Voltage-measurement GPIO Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 4-4: I2C Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 4-5: I2S Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 4-6: GPIO Pins (Dedicated) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 4-7: GPIO Pins (Alternate function) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 4-8: GPIO Bootstrap Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 4-9: SDIO Slave Timing Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 4-10: SPI Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 4-11: SDIO Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 4-12: Enable Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 7-1: QDID (Qualified Design Identifications) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 8-1: Pin Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
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Contents
Table 10-1: Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
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1
1: Introduction
This document defines and illustrates the AirPrime BX310x (BX3100, BX3105) Wi-Fi/
BT Host-less module’s high-level product features, interfaces, and hardware features
(including electrical and mechanical performance criteria).
1.1 Module Variants
AirPrime BX310x module variants include:
• AirPrime BX3100—External antenna connection
• AirPrime BX3105—Embedded antenna
1.2 General RF/Software Features
The AirPrime BX310x is a low-power, small form-factor self-contained Wi-Fi/
Bluetooth® (Wi-Fi/BT) module.
With an embedded software suite, the BX310x is an ideal solution for developers who
want to quickly and cost-effectively integrate Wi-Fi/BT functionality into their products.
The following table summarizes the module’s supported wireless frequencies and
modes:
Table 1-1: Supported RF Frequencies
Technology
Wi-Fi
RF band
2.4GHz (2.400–2.485 GHz)
Bluetooth
Notes
•
•
802.11b/g/n/e/i
Max data rate—MCS7 HT40 150 Mbps
•
v4.2 BR/EDR and BLE compliant
1.2.1 Wi-Fi
The AirPrime BX310x supports 2.4 GHz Wi-Fi operation. Key features include:
• TCP/IP
• 802.11 b/g/n/e/i
• Connection methods—BSS STA, SoftAP
• Transmit power—Adjustable, up to 20 dBm (maximum)
For a list of additional supported Wi-Fi functionality, protocols, and features, see
Features on page 14.
1.2.2 Bluetooth
The AirPrime BX310x supports 2.4 GHz Bluetooth classic and BLE operation. Key
features include:
• Bluetooth v4.2 BR/EDR and BLE compliant
• SPP (Serial Port Profile)
For a list of additional supported Bluetooth functionality, protocols, and features, see
Features on page 14.
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Introduction
1.2.3 Interfaces
The AirPrime BX310x provides the following interfaces and peripheral connectivity:
• Power supply—See Power Supply Ratings on page 17.
• RF—See RF on page 21.
• UART serial link—See UART on page 29.
• ADC/Voltage measurement—See ADC/Voltage Measurement on page 30.
• I2C—See I2C Interface on page 31.
• Digital audio (I2S)—See I2S Interface (Digital Audio) on page 32.
• GPIOs—See General Purpose Input/Output (GPIO) on page 32.
• SPI bus—See SPI Bus on page 34.
• SDIO—See Secure Digital IO (SDIO) Interface on page 35.
• Module enable—See Module Enable on page 36.
• PWM—See PWM on page 36.
1.2.4 Configuration Utility
The AirPrime BX310x includes a browser-based utility for device configuration. For
usage details, refer to [1] AirPrime BX310x AT Command Reference available at
source.sierrawireless.com.
1.3 General Hardware Features
1.3.1 Physical Dimensions and Connection
Interface
AirPrime BX310x modules are compact, robust, fully shielded and laser-marked
modules with the dimensions noted in Table 1-2.
Table 1-2: AirPrime BX310x Dimensions a
Nominal
BX3100 b
BX3105
Tolerance
Units
Length
11.5
13.5
±0.10
mm
Width
9.5
11.5
±0.10
mm
Thickness
2.4
2.4
±0.20
mm
Weight
0.56
0.65
±0.10
g
Parameter
a. Dimensions are accurate as of the release date of this document.
b. BX3100 is a CF3 xSmall module, which belongs to the Common Flexible Form Factor (CF3)
family of WWAN modules
The AirPrime BX310x module is an LGA form factor device. All electrical and
mechanical connections are made through the 70 Land Grid Array (LGA) pads on the
bottom side of the PCB. (See Figure 8-1 on page 43 for details.)
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Product Technical Specification
The LGA pads have the following distribution:
Table 1-3: LGA Pad Types
Pad Type / Quantity
Signal Pads
54 outer pads
Ground Pads 16 inner pads
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Dimensions
Pitch
0.75x0.35 mm
0.65 mm
1.0x1.0 mm
1.83 mm/1.48 mm
41111444
BX3105 uses an internal PIFA Antenna leave Pin 40 unconnected
ANTENNA
1
6
7
8
10
11
12
13
15
20
21
22
23
29
38
48
49
40
40
C2
22uF
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC (BX3105)
RF_MAIN (BX3100)
C1
10uF
50
VDD_3V3_RF
VDD_PADS
VGPIO
{
GPIO(5)
GPIO(27)
I2S_LRCLK_GPIO(18)
I2S_MCLK_GPIO(0)
I2S_DO_GPIO(32)
I2S_DI_GPIO(33)
I2S_BCLK_GPIO(26)
GPIO(36)_SENSOR_VP
GPIO(37)_SENSOR_CAPP
GPIO(38) SENSOR_CAPN
GPIO(39)_SENSOR_VN
GPIO(34)_VDET_1
GPIO(35)_VDET_2
GPIO(23)_I2C1_SCL
GPIO(25)_I2C1_SDA
GPIO(16)_I2C2_SDA
GPIO(17)_I2C2_SCL
VDD_PADS_BB
VDD_PADS_BB
VDD_PADS_BB
{
{
VDD_PADS_BB
{
{
SD_CMD_GPIO(15)_HSPICS0
SD_DATA2_GPIO(12)_HSPIQ
SD_CLK_GPIO(14)_HSPICLK
SD_DATA3_GPIO(13)_HSPIID
SD_DATA0_GPIO(2)_HSPIWP
SD_DATA1_GPIO(4)_HSPIHD
VGPIO
{
VDD_PADS_BB
{ EN
UART0_RTS_GPIO(22)
UART0_CTS_GPIO(19)
UART0_TXD
UART0_RXD
{
VDD_PADS_BB
VDD_PADS_BB
BX310x Dual Mode Wi-Fi & BT Module(s)
(BX3100 LGA70 9.5mm x 11.5mm)
(BX3105 LGA70 13.5mm x 11.5mm)
28
30
39
41
GND
GND
GND
GND
3V3
VDD_3V3_PA
52
VDD_PADS_BB
33
VGPIO
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
13
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
Rev 6 Jul.18
51
Voltage Domains
VDD_3V3_RF (2.3V to 3.6V) Analogue Supply
VDD_3V3_PA (2.3V to 3.6V) Power Amplifier Supply
VDD_PADS_BB (2.3V to 3.6V) Digital IO Supply
VGPIO(3.3V) Internal Interface Reference Voltage Output
Note VGPIO provides voltage reference for the internal SPI FLASH Interface & GPIOs 16 & 17
UART0_RTS_GPIO(22)
UART0_CTS_GPIO(19)
UART0_TXD
UART0_RXD
SD_CMD_GPIO(15)_HSPICS0
0
SD_DATA2_GPIO(12)_HSPIQ
SD_CLK_GPIO(14)_HSPICLK
K
SD_DATA3_GPIO(13)_HSPID
SD_DATA0_GPIO(2)_HSPIWP
P
SD_DATA1_GPIO(4)_HSPIHD
D
GPIO(16)_I2C2_SDA
GPIO(17)_I2C2_SCL
GPIO(23)_I2C1_SCL
GPIO(25)_I2C1_SDA
GPIO(36)_SENSOR_VP
GPIO(37)_SENSOR_CAPP
GPIO(38)_SENSOR_CAPN
GPIO(39)_SENSOR_VN
GPIO(34)_VDET_1
GPIO(35)_VDET_2
I2S_LRCLK_GPIO(18)
I2S_MCLK_GPIO(0)
I2S_DO_GPIO(32)
I2S_DI_GPIO(33)
I2S_BCLK_GPIO(26)
GPIO(5)
GPIO(27)
42
43
44
45
46
47
53
54
9
17
31
32
34
36
18
19
26
16
24
25
27
14
35
ENABLE
2
3
4
5
37
U1
BX310x Module Schematic Symbol
Spare GPIO
I2S Audio Interface
Voltage/Current Measurement Interface
Primary I2C Interface
Secondary I2C Interface / Spare GPIOs
SDIO Interface
UART Interface
C3
100nF
R5
10k
The following figure presents an overview of the AirPrime BX310x module’s internal
architecture and external interfaces.
GPIO(16)_I2C2_SDA
GPIO(17)_I2C2_SCL
I2C Pull Resistors
(If Used)
GPIO(23)_I2C1_SCL
GPIO(25)_I2C1_SDA
I2C Pull Resistors
R3
2k2
VGPIO
R1
2k2
R4
2k2
R2
2k2
VDD_PADS
* If EN is not controlled by HOST use the o
circuit to boot the module when supply volt
1ms delay to Enable signal to allow for iner
ENABLE
VDD_PADS
Optional Enable Delay*
2: Functional Specifications
2
2.1 Architecture
Figure 2-1: AirPrime BX310x Application Schematic
41111444
Product Technical Specification
SPI
UART
Bluetooth Link
Controller
Bluetooth
Baseband
RF Transceiver
RF Front End
Wi-Fi MAC
Wi-Fi Baseband
Reference
Clock
Generator
40MHz XTAL
SDIO
I2S
I2C
2x Xtensa® 32-bit LX6
Microprocessors
ADC
ROM
Cryptographic hardware acceleration
SRAM
RSA
GPIO
PMU
32Mb Flash
PWM
Analog
Bluetooth
Wi-Fi
RTC Domain
SHA
ULP CoProcessor
Core & Memory
AES
RNG
Recovery
Memory
Security
I/O
Figure 2-2: Block diagram
2.2 Features
Table 2-1 summarizes the AirPrime BX310x module’s RF (Wi-Fi and Bluetooth),
Power, software, and hardware capabilities.
Note: Table contents are preliminary and subject to change.
Table 2-1: AirPrime BX310x Capabilities
Feature
Module
Rev 6 Jul.18
Description
•
•
•
•
•
Secure boot
Secure update
FOTA (Firmware update Over The Air)
Sierra Wireless AirVantage support
CF3-compliant footprint (BX3100)
14
41111444
Functional Specifications
Table 2-1: AirPrime BX310x Capabilities (Continued)
Feature
Description
•
Protocols:
802.11 b/g/n/e/i
802.11 n (2.4 GHz), up to 150 Mbps; MCS0-7 in 20/40 MHz bandwidths
Receiving STBC (Space-time Block Code) 2x1
802.11 e: QoS for wireless multimedia technology
Additional 802.11i security features (pre-authentication, TSN, etc.)
WMM-PS, UAPSD
A-MPDU, A-MSDU aggregation
Block ACK (RTS/CTS/ACK/BA)
Fragmentation/defragmentation
CCMP (CBC-MAC, counter model), TKIP (MIC, RC4), WAPI (SMS4), WEP
(RC4), CRC
· Frame encapsulation (802.11h/RFC 1042)
· Pre-authentication, TSN
·
·
·
·
·
·
·
·
·
·
Wi-Fi
•
•
•
•
•
•
•
•
•
•
•
Rev 6 Jul.18
Supported channels—1–14
Data transfer (HTTP, HTTPS, MQTT, TCP/UDP)
Autoconnection—After device reset, automatically connects to available AP
based on previous configuration
Infrastructure BSS Station mode/SoftAP mode: AP mode, STA mode,
concurrent AP/STA mode
Up to 8a simultaneous Wi-Fi clients
IP configuration—IP address in STA mode via DHCP or static assignment
Authentication (security) modes: WPA, WPA2, WPA/WPA2, WPA2 Enterprise
UMA-compliant and certified
Open interface for various upper layer authentication schemes over EAP (e.g.
TLS, PEAP, LEAP, SIM, AKA, customer-specific)
Adaptive rate fallback algorithm
Automatic retransmission/response on slow hosts
15
41111444
Product Technical Specification
Table 2-1: AirPrime BX310x Capabilities (Continued)
Feature
Description
•
•
•
Bluetooth
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Bluetooth v4.2 BR/EDRb and BLE compliant
Supported channels: BT Classicb —0–78; BLE—0–39
Supported v4.2 modes: BRb (Basic Rate); EDRb (Enhanced Data Rate); LE
(Low Energy)
BTb classic mandatory features
BT low-energy mandatory features
Class 1/Class 2/Class 3 transmitter without external power amplifier
Class 1 operation without external PA
Enhanced power control (>30 dB dynamic control range)
+10 dBm transmitting power
NZIF receiver with -98 dBm sensitivity
Modulation—p/4 DQPSKb, 8 DPSKb
ACLb, SCOb, eSCOb
Adaptive Frequency Hopping (AFH)
BT 4.2 controller and host stackb
Service Discover Protocol (SDP)b
General Access Profile (GAP)
Security Manage Protocol (SMP)b
Bluetooth Low Energy (BLE)
ATT/GATT
BLE Beaconb
SPPb, RFCOMM
Profiles: Wi-Fi Autoconnection—After device reset, automatically connects to
available AP based on previous configuration.
UART features: GATT profiles, Define personal services
Roles—Simultaneous Central (access point)/Peripheral (client)
Simultaneous connections:
· Up to 7a (total) simultaneous connections, including up to 3a BLE connections
· Simultaneous BT Classicb and BLE connections
PCMb/I2Sb
Configuration
Device configuration methods:
• Built-in web-based configuration utility. See Configuration Utility on page 11.
• AT commands available over UART, Wi-Fi, and BT links. Refer to [1] AirPrime
BX310x AT Command Reference at source.sierrawireless.com.
Security
•
•
•
•
All standard IEEE802.11 security features, including WFA, WPA/WPA2, WAPI
Secure boot
Flash encryption
Cryptographic hardware acceleration: AES, HASH (SHA-2) library, RSA, ECC,
Random Number Generator (RNG)
Multiple power modesb to reduce power consumption: Active, Radio off, Light sleep,
Power management Deep sleep, Hibernation
Sleep Patterns: Association sleep pattern, ULP sensor-monitored patternb
a. Subject to firmware support and RAM limitations.
b. Support pending firmware upgrade.
Rev 6 Jul.18
16
41111444
3
3: Technical Specifications
3.1 Environmental
The environmental specifications for operation and storage of the AirPrime BX310x
are defined in Table 3-1.
Table 3-1: Environmental Specifications
Parameter
Range
Ambient Operating Temperature
-40°C to +85°C
Ambient Storage Temperature
-40°C to +105°C
(Recommended)
3.2 Power Supply Ratings
DC power is supplied via the pins described in Table 3-2 on page 17.
Note: Operation above the maximum specified operating voltage (see Table 3-9 on page 23) is
not recommended, and specified typical performance or functional operation of the device is
neither implied nor guaranteed.
Table 3-2: Power Supply Pins
Pin
Name
Voltage
Direction
Function
33
VGPIO
3.3V
Output
50
VDD_3V3_RF
2.3–3.6V
Input
RF/Analog signal power supply
51
VDD_3V3_PA
2.3–3.6V
Input
Internal Power Amplifier power supply
52
VDD_PADS_BB
2.7–3.6V
Input
Baseband/Digital I/O power supply
Supply voltage reference for
secondary I2C interface (pins 53/54)
3.2.1 Analog Power Considerations
Pin 51 (VDD_3V3_PA) supplies the power amplifiers, and pin 50 (VDD_3V3_RF)
supplies the remaining analog domains. During radio operation, a transient increase
in current supplied via pin 50 could cause power rail collapse if not appropriately
decoupled with a reservoir capacitor. Therefore, as shown in Figure 3-1, external
10 F and 22 F decoupling capacitors are required to be connected close to pin 50.
Rev 6 Jul.18
17
41111444
Product Technical Specification
If the module is powered with a single 3.3V supply derived from an LDO or SMPS,
ensure that the regulator’s peak current handling is at least 500 mA (600 mA
preferred).
Recommended
Capacitors
3V3
VDD_PADS
52
33
VGPIO
VDD_3V3_PA
VDD_3V3_RF
Figure 3-1: VDD_3V3_RF Capacitor Requirement
DD_PADS_BB
51
C2
22uF
50
C1
10uF
VGPIO
To avoid resistive losses affecting the power rail stability and level, ensure sufficient
tracking width from the regulator output to the decoupling capacitors—a track width of
0.3 mm is recommended:
• Acceptable peak-to-peak voltage ripple on the analog voltage pins (50, 51) is
80 mV maximum.
• Typically, the analog and digital pins (50, 51, 52) are supplied by the same
source. If this is the case (two or three pins with same source), connect the output
of the external LDO or SMPS to those pins via both decoupling capacitors to form
a star point for the supply inputs.
3.2.2 Digital Power Considerations
Pin 52 (VDD_PADS_BB) supplies the baseband digital parts of the design, including
the CPU domains and the RTC domains. There are no specific requirements for
decoupling of this pin.
As noted in Analog Power Considerations, the analog and digital pins (50, 51, 52)
typically are supplied by the same source. If this is the case (two or three pins with
same source), connect the output of the external LDO or SMPS to those pins via both
decoupling capacitors to form a star point for the supply inputs.
Pin 52 also connects to an internal LDO to generate the VGPIO voltage on pin 33.
3.2.3 VGPIO Power Considerations
VGPIO provides the voltage reference for the GPIO pins and, if required, is available
to supply 3.3V to external circuitry.
VGPIO is generated internally from the VDD_PADS_BB input pin via a configurable
LDO that provides either 1.8V or VDD_PADS_BB as its output.
No external pull-down is required.
Rev 6 Jul.18
18
41111444
Technical Specifications
Important: A limitation on the module’s internal Flash voltage range requires VGPIO to be
set at 3.3V. If the voltage is switched to 1.8V, the module will not boot. Therefore do not include
any external pull-up on pin 43 (GPIO(12)/MTDI/SD_DATA2/HSPIQ), which if pulled high at
boot time will cause VGPIO to switch to 1.8V.
3.2.4 Power Management
The AirPrime BX310x switches between several power modes to minimize current
consumption.
Light Sleep and Deep Sleep modes are enabled via AT commands from the host.
Refer to [1] AirPrime BX310x AT Command Reference for details.
Table 3-3 describes the AirPrime BX310x’s supported power modes.
Table 3-3: Power Modes — Descriptions
Power Mode
CPU
Wi-Fi / BT
radio /
baseband
Active
On
On
On
On
Radio offa
On
Off
On
On
Pause
Off
On
On
Deep sleepa
Off
Off
On
On/Off
Connection data stored in RTC memory
Hibernatea
Off
Off
Off
Off
Only RTC timer or specific RTC GPIOs
can wake the module.
Light
sleepa
RTC
ULP coprocessor
Notes
Fully functional
Wake up events will wake the module.
a. Available in future firmware release.
3.2.5 Current Consumption
The following current consumption values are taken using a single 3.3 V supply input
and measuring the current drawn in the various operational modes. RF power is
referenced to the Antenna port into a 50 load. The values provided are average
current taken at 25C ambient temperature.
All Wi-Fi transmitter measurements are based on 50% duty cycle and continuous
transmit mode. All Bluetooth transmitter measurements are based on 11% (DH1) duty
cycle.
Table 3-4: RF Current Consumption Specifications
Rev 6 Jul.18
Mode
Typ
Unit
50% Duty Cycle Transmit 802.11b, DSSS 1 Mbps,
POUT=+18.0 dBm
192
mA
50% Duty Cycle Transmit 802.11b, CCK 11 Mbps,
POUT=+18.0 dBm
194
mA
19
41111444
Product Technical Specification
Table 3-4: RF Current Consumption Specifications (Continued)
Rev 6 Jul.18
Mode
Typ
Unit
50% Duty Cycle Transmit 802.11g, OFDM 54 Mbps, POUT =
+14 dBm
155
mA
50% Duty Cycle Transmit 802.11n, MCS7 HT20,
POUT=+11.5 dBm
152
mA
50% Duty Cycle Transmit 802.11n, MCS7 HT40,
POUT=+11.5 dBm
152
mA
Receive 802.11b, packet length=1024 byes, -80 dBm
57
mA
Receive 802.11g, packet length=1024 bytes, -70 dBm
57
mA
Receive 802.11n HT20, packet length=1024 bytes, -65 dBm
57
mA
Receive 802.11n HT40, packet length=1024 bytes, -65 dBm
57
mA
11% Duty Cycle, DH1 Transmit Bluetooth 1 Mbps, 0 dBm
64
mA
11% Duty Cycle, 2DH1 Continuous Transmit Bluetooth
2 Mbps, 0 dBm
64
mA
11% Duty Cycle, 3DH1 Continuous Transmit Bluetooth
3 Mbps, 0 dBm
64
mA
11% Duty Cycle Continuous Transmit Bluetooth 1 Mbps,
10 dBm
69.6
mA
11% Duty Cycle Continuous Transmit Bluetooth 2 Mbps,
4.0 dBm
67.4
mA
11% Duty Cycle Continuous Transmit Bluetooth 3 Mbps,
4.0 dBm
67.4
mA
84% Duty Cycle Transmit LE 1 Mbps, 10 dBm
137
mA
84% Duty Cycle Transmit LE 1 Mbps, 4.0 dBm
114
mA
84% Duty Cycle Transmit LE 1 Mbps, 0 dBm
95
mA
Continuous Bluetooth Receive
58
mA
Light Sleep
1.9
A
Deep Sleep
1.4
A
20
41111444
Technical Specifications
3.3 RF
3.3.1 Generic Radio
Measurements conducted at 25C ambient temperature.
Table 3-5: Generic Radio Characteristics
Description
Min
BX3100 RF Port Impedance
Typ
Max
50
Frequency Band
2.4
BX3105 Antenna Gain
2.45
Unit
2.485
0
GHz
dBi
3.3.2 Wi-Fi Radio
Measurements conducted at 25C ambient temperature.
Table 3-6: Generic Radio Characteristics
Rev 6 Jul.18
Description
Typ
Unit
Transmit 802.11b, CCK 11 Mbps, Output Power, EVM and Mask Compliant
15.5
dBm
Transmit 802.11g, OFDM 54 Mbps, Output Power, EVM and Mask Compliant
13.5
dBm
Transmit 802.11n, MCS7 HT20 72.2 Mbps, Output Power, EVM and Mask
Compliant
11.5
dBm
Transmit 802.11n, MCS7 HT40 135 Mbps, Output Power, EVM and Mask
Compliant
11.5
dBm
Receiver Sensitivity 11b DSSS, 1 Mbps
-95
dBm
Receiver Sensitivity 11b CCK, 11 Mbps
-88
dBm
Receiver Sensitivity 11g OFDM, 6 Mbps
-91.5
dBm
Receiver Sensitivity 11g OFDM, 54 Mbps
-74.5
dBm
Receiver Sensitivity 11n HT20 OFDM, 72.2 Mbps
-71.5
dBm
Receiver Sensitivity 11n HT40 OFDM, 135 Mbps
-70
dBm
BX3100 Harmonics 2F0
-42
dBm
BX3100 Harmonics 3F0
-54
dBm
21
41111444
Product Technical Specification
3.3.3 Bluetooth Radio
Measurements conducted at 25C ambient temperature.
Table 3-7: Generic Radio Characteristics
Description
Min
Typ
Unit
Transmit Power BR 1 Mbps, ACR & Modulation Compliant
-
4a
dBm
Transmit Power BR 2 Mbps, ACR & Modulation Compliant
-
4
dBm
Transmit Power BR 3 Mbps, ACR & Modulation Compliant
-
4
dBm
Transmit Power LE 1 Mbps, ACR & Modulation Compliant
-
4b
dBm
Receiver Sensitivity BR 1 Mbps
-
-87
dBm
Receiver Sensitivity EDR 2 Mbps
-
-88
dBm
Receiver Sensitivity EDR 3 Mbps
-
-81
dBm
Receiver Sensitivity LE 1 Mbps
-
-90
dBm
Out-of-band blocking performance 30 MHz~2000 MHz
-10
-
dBm
Out-of-band blocking performance 2000 MHz~2400 MHz
-27
-
dBm
Out-of-band blocking performance 2500 MHz~3000 MHz
-27
-
dBm
Out-of-band blocking performance 3000 MHz~12.5 GHz
-10
-
dBm
a. For FCC Band edge compliance on channel 78
b. For FCC Band edge compliance on channel 39
Rev 6 Jul.18
22
41111444
Technical Specifications
3.4 Electrical Specifications
3.4.1 Absolute Maximum Ratings
Table 3-8: Absolute Maximum Ratings
Parameter
Min
Max
Units
VIL
Input low voltage
-0.3
0.25VIO
V
VIH
Input high voltage
0.75VIO
3.6
V
IIL
Input leakage current
-
50
nA
VOL
Output low voltage
-
0.1VIO
V
VOH
Output high voltage
0.8VIO
-
V
Cpad
Input pin capacitance
-
2
pF
VIO
VDD_PADS_BB
2.7
3.6
V
IMAX
GPIO maximum drive capability
-
12
mA
-40
150
C
TSTR Storage temperature range
Table 3-9: Recommended Operating Conditions
Parameter
Min
Typ
Max
Units
VDD
Supply voltage (VDD_3V3_PA, VDD_3V3_RF)
2.3
3.3
3.6
V
VIO
I/O supply voltage (VDD_PADS_BB)
2.7
3.3
3.6
V
-40
-
85
C
TOPR Operating temperature range
VIL
CMOS low level input voltage
0
-
0.3VIO
V
VIH
CMOS high level input voltage
0.7VIO
-
VIO
V
VTH
CMOS threshold voltage
-
0.5VIO
-
V
3.5 Mechanical
3.6 Mechanical Drawings
The AirPrime BX310x module’s LGA footprint is a 70-pad array of copper pads (see
Physical Dimensions and Connection Interface on page 11). The following drawings
illustrate the device footprint and dimensions.
Rev 6 Jul.18
23
41111444
Product Technical Specification
Note: Dimensions in Figure 3-2 and Figure 3-3 are preliminary and subject to change.
10.6mm ± 0.1mm
9.5mm ± 0.1mm
8.6mm ± 0.08mm
2.4mm ± 0.2mm
mX
X
X
11.5mm ± 0.1mm
m
NSMD
0.05mm R
0.25mm
3.012mm
0.75mm
1.825mm
1mm
SMD
1mm
Pin 1 Ground Pad Detail
0.725mm
SMD
1mm
0.35mm
2.538mm
1.475mm
0.5mm
Pin 42
Ground Pad Detail
0.725mm
Pin 14
1.0mm
0.675mm
1.0mm
0.65mm
0.5mm
1.35mm Pin 1
0.30mm
0.75mm
0.35mm
Signal Pad Detail
1mm
Pin 28
Figure 3-2: AirPrime BX3100 Mechanical Drawing
Rev 6 Jul.18
24
41111444
Technical Specifications
11.5mm ± 0.1mm
m
X
2.4mm ± 0.2mm
mX
8.6mm ± 0.08mm
X
13.5mm ± 0.1mm
10.6mm ± 0.08mm
1mm ± 0.1mm
3.012mm
1.35mm
0.25mm
Pin 42
Pin 28
0.75mm
m
1mm
SM D
1mm
Pin 1 Ground Pad Detail
0.725mm
0.725mm
1.825mm
0.75mm
Ground Pad Detail
0.65mm
0.35mm
NSM D
0.05mm R
0.35mm
Signal Pad Detail
Pin 15
SM D
1mm
0.30mm
1.0mm
1.475mm
0.675mm
2.538mm
1.0mm
0.5mm
Pin 1
1mm
Figure 3-3: AirPrime BX3105 Mechanical Drawing
3.7 Antenna
The AirPrime BX3100 connects the RF I/O to the LGA pad (pin 40—RF_MAIN). The
port is nominally matched to 50 , which the application typically will connect to an
external antenna. Tracking from the LGA pad to the antenna port should use a
controlled 50 impedance transmission line technique. Provision for an antennamatching circuit is recommended for conversion of the nominal 50 module port to
the antenna impedance required for optimum transmission.
The AirPrime BX3105 includes an integrated PCB antenna. In this case, pin 40 is not
connected internally to the RF port, however Sierra Wireless recommends leaving
pin 40 unconnected on the application PCB.
Rev 6 Jul.18
25
41111444
Product Technical Specification
For optimum antenna performance, the AirPrime BX3105 requires restrictions on
metal, ground, and other tracking around the BX3105 antenna area. The module is
designed to be placed in a corner area of the customer application, as shown in
Figure 3-4.
Customer
Application
PCB
Customer
Application
PCB
Customer
Application
PCB
Figure 3-4: BX3105 Placement Examples
Table 3-10 presents operating range information for the integrated antenna.
Table 3-10: BX310x — Typical Range Performance
Radio
BLE
Wi-Fi
Mode
Range (m)
Advertising
105
Connection
105
Connection to Mobile
110
Connection
> ~250
Notes
LOS (Line of Sight)
When the BX3105 module is placed along a side of the PCB, ground, metal tracking,
and metallic objects should not be placed in the area indicated by red arrows in
Figure 3-5. Also, when the application PCB is placed in a housing, do not use metallic
coatings or structures in the area adjacent to the area indicated by red arrows.
Figure 3-5: BX3105 Placement Restrictions
Rev 6 Jul.18
26
41111444
Technical Specifications
The integrated antenna in the BX3105 requires a solid ground plane on the
application PCB. At the PCB edges (indicated in Figure 3-5 by yellow dots), place
dense vias to connect internal and external ground planes together. Continue the via
pattern throughout the application PCB where possible. An insufficient ground plane
that is poorly connected throughout the application PCB may cause poor radiated
performance of the module. Figure 3-6 shows the simulated radiated performance of
the Antenna and module when placed on a 50 mm × 75 mm application PCB.
Simulated Performance—Measurements pending final tuning
Figure 3-6: Simulated Radiated Antenna Performance
3.7.1 Suggested Antennas
The following table describes several suggested antennas. Comparable antennas
may also be used.
Table 3-11: Antennas
Module
Antenna
Description
Type
Maximum Gain
BX3105
3D PIFA Antenna
-
Integrated antenna
2 dBi
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Product Technical Specification
Table 3-11: Antennas (Continued)
Module
BX3100
Rev 6 Jul.18
Antenna
Description
Type
Maximum Gain
Gemwave Technologies, Ltd
FSD_BL3404-50T
2.4 GHz; S-SMA (M/M);
swivel antenna
Dipole
1.5 dBi
RF Solutions
ANT-24G-S21
2.4 GHz General
purpose whip; straight
RF antenna
Monopole
0 dBi
RF Solutions
ANT-24G-DPL-SMA
2.4 GHz Whip Wi-Fi
antenna; SMA male
Dipole
2.1 dBi
Molex
47950-0011
2.4 GHz/5 GHz; microcoaxial RF connector
Dipole
2.27 dBi @ 2.4 GHz
4.9 dBi @ 5 GHz
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4
4: Interfaces Specification
4.1 Overview
This section describes the interfaces supported by the AirPrime BX310x embedded
module and provides specific voltage, timing, and circuit recommendations for each
interface.
4.2 UART
The AirPrime BX310x provides one UART interface for asynchronous communication
between the AirPrime BX310x module and a host device (e.g. a PC or host
processor):
• UART0—4-wire, RS-232-compliant interface
Note: Up to two additional UART interfaces can be added by configuring GPIOs using AT
commands.
Flow control is managed using:
• RTS/CTS signals (This method is required for higher UART interface speeds.)
•
or
Software XON/XOFF
Table 4-1 on page 29 describes the signals used for UART0.
Table 4-1: UART0 Pins a
Pin
Interface
2
3
4
5
UART0
Name
Direction
Function
UART0_RTS
I
Ready To Send, flow control
UART0_CTS
O
Clear To Send, flow control
UART0_TXD
I
Transmit Data
UART0_RXD
O
Receive Data
Voltage Level
VDD_PADS_BB
a. If UART0 pins are not used, leave open.
Note: UART signals are named with respect to the HOST, and directions are listed with respect
to the module. For example, UART0_RXD is an output from the module to the host.
The UART interface is configurable via AT commands:
• Default configuration—115200 (baudrate), 8 bit, no parity, no handshaking
• Baudrate considerations:
·
Maximum supported—5 Mbaud
·
Maximum tested—3 Mbaud. This is the maximum baudrate supported by the
BX310x Dev Kit FTDI converter IC.
·
HW handshaking is recommended above rates of 1 Mbaud and can be
enabled via AT command (AT&K3).
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Product Technical Specification
·
·
·
Common baud rates are supported—any baud rate in the supported range
can be selected via AT+IPR= command. The device
automatically configures the clock dividers appropriately for the chosen baud
rate.
Baud rates are persistent post-reset.
Recommendation—Add series termination resistors close to the module in
the UART lines for management of clock harmonics. 499 resistors are
recommended.
4.3 ADC/Voltage Measurement
The AirPrime BX310x provides a general purpose ADC (Analog to Digital Converter)
input, which can sample multiple inputs configured using AT commands.
Pins VDET_1, VDET_2, SENSOR_VP, and SENSOR_VN are used to measure
single-ended analog voltages referenced to ground. The voltage on these pins is read
via an AT command.
Noise can have a large impact on sensitive voltage measurements. To improve the
accuracy of small voltage level measurements, a100 nF capacitor to ground is
recommended on the input to the VDET_1, VDET_2, SENSOR_VP, and
SENSOR_VN pins.
Table 4-2: ADC Interface Pins a
Pin
Signal name
Direction b
18
VDET_1
I
19
VDET_2
I
Function
Analog to Digital Converter
Voltage Level
VDD_PADS_BB
a. Leave open any pins that are not used.
b. Signal direction with respect to the module.
Table 4-3: Voltage-measurement GPIO Pins a
Pin
Signal Name
Direction b
31
SENSOR_VP
I
32
SENSOR_CAPP
I
34
SENSOR_CAPN
I
36
SENSOR_VN
I
Voltage level
VDD_PADS_BB
a. Leave open any pins that are not used.
b. Signal direction with respect to the module.
Access to a Hall effect sensor is supported via firmware, and is selected using AT
commands.
The sensor pins (SENSOR_VP or SENSOR_VN) will trigger an input perturbation
(glitch) lasting for 80 ns when the ADC or Hall sensor is initialized.
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Interfaces Specification
4.4 I2C Interface
The AirPrime BX310x module provides two I2C (Inter-Integrated Circuit) dedicated
serial ports (bus interface) based on [8] The I2C Bus Specification, Version 2.1,
January 2000 (Phillips Semiconductor document number 9398 393 40011).
The interfaces use the pins indicated in Table 4-4.
Table 4-4: I 2 C Interface Pins a
Pin
Signal name
Direction
Function
9
I2C1_SCL
I/O
Primary I2C interface
17
I2C1_SDA
I/O
Primary I2C interface
53
I2C2_SDA
I/O
Secondary I2C interface
54
I2C2_SCL
I/O
Secondary I2C interface
Voltage Level
VDD_PADS_BB
VGPIO
a. Leave open any pins that are not used.
This implementation of the I2C interface includes the following characteristics:
• Supported voltage:
·
Primary I2C (3.3 V, configurable)
·
Secondary I2C (3.3 V)
• Standard-mode interface—Data transfer rates up to 100 kbit/s
• Fast-mode interface—Data transfer rates up to 400 kbit/s)
• Master mode operation
• Addressing modes—7-bit; 10-bit; Dual addressing mode
External 2.2 k pull-up resistors must be applied to I2C signals (see Figure 4-1 on
page 31).
For I2C bus details, including I2C bus waveform and timing details, refer to the
I2C Bus Specification.
4.4.1 Application
VDD_PADS_BB
AirPrime BX310x
Wi-Fi/BT Module
I2C1_SCL
Customer
Application
2.2K
2.2K
I2C1_SDA
VGPIO
I2C2_SDA
2.2K
2.2K
I2C2_SCL
Figure 4-1: Example of I2C Bus Application
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Product Technical Specification
4.5 I2S Interface (Digital Audio)
Note: Interface support is forthcoming.
The AirPrime BX310x provides a 4-wire I2S (digital audio) interface that can be used
to transfer serial digital audio to or from an external stereo DAC/ADC, and supports
the following features:
• Modes—Master, Slave
• Transmission format—Full duplex, Half duplex
• Resolution (bits per frame)—8, 16, 32, 40, 48
• Channels—Input, Output
• Bit clock—10 kHz–40 MHz
• Supported audio interfaces (forthcoming)—PDM (Pulse Density Modulation),
BT PCM (Pulse Code Modulation)
The interface uses the pins indicated in Table 4-5.
Table 4-5: I2S Interface Pins a
Pin
Signal name
Direction b
Function
16
I2S_MCLK
O
I2S MasterClock
24
I2S_DO
O
I2S Data Out
25
I2S_DI
I
I2S Data In
26
I2S_LRCLK
I/O
I2S Left-Right Clock (Word Select)
27
I2S_BCLK
I/O
I2S Bit Clock
Voltage Level
VDD_PADS_BB
a. Leave open any pins that are not used.
b. Signal direction with respect to the module.
4.6 General Purpose Input/Output (GPIO)
The AirPrime BX310x defines several GPIOs for customer use, as described in
Table 4-6 and Table 4-7.
Note: The pins carrying the ‘Alternate function’ GPIOs are multi-function. The alternate interfaces (SDIO or SPI) can be selected via an AT command.
Table 4-6: GPIO Pins (Dedicated) a
Pin
Signal Name
Direction
Default State
14
GPIO(5)
I/O
Pull highb
35
GPIO(27)
I/O
No pullc
Function
Voltage Level
General purpose I/O VDD_PADS_BB
a. Leave open any pins that are not used.
b. Pulled high internally
c. Internal configuration—no internal pull-ups
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Interfaces Specification
Table 4-7: GPIO Pins (Alternate function) a
Pin
Signal Name
Direction
Default State
9
GPIO(23)
No pullb
16
GPIO(0)
Pull highc
17
GPIO(25)
No pullb
18
GPIO(34)
No pullb
19
GPIO(35)
No pullb
24
GPIO(32)
No pullb
25
GPIO(33)
No pullb
26
GPIO(18)
No pullb
27
GPIO(26)
No pullb
31
GPIO(36)
No pullb
32
GPIO(37)
34
GPIO(38)
No pullb
36
GPIO(39)
No pullb
42
GPIO(15)
Pull highc d
43
GPIO(12)
Pull lowe
44
GPIO(14)
Pull highc
45
GPIO(13)
Pull highc
46
GPIO(2)
Pull lowe
47
GPIO(4)
Pull lowe
53
GPIO(16)
No pullb
54
GPIO(17)
No pullb
No pullb
I/O
Function
Voltage Level
General purpose I/O VDD_PADS_BB
a.
b.
c.
d.
Leave open any pins that are not used.
Internal configuration—no internal pull-ups
Pulled high internally
GPIO(15) default state (pull HIGH) enables UART boot messaging. To disable UART boot messages, drive GPIO(15) LOW prior to boot.
e. Pulled low internally
4.7 Bootstrap Pins
The GPIOs listed in Table 4-8 are used as Bootstrap pins during start-up.
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Product Technical Specification
Table 4-8: GPIO Bootstrap Functions
GPIO
Function
Default State
0
Boot Source
High, Internal pull 45 k
2
Boot Source
High, Internal pull 45 k
5
SDIO Slave Timing
15 (MTDO)
12 (MTDI)
Default Function
High, Internal pull 45 k
High, Internal pull 45 k
SDIO Interface Voltage Low, Internal pull 45 k
Alternative
Boot from Internal Flash
Download to Flash (Disabled)
Rising Edge Input & Output See Table 4-9.
3.3V
1.8V (Not supported)
Table 4-9: SDIO Slave Timing Configuration
GPIO(5)
GPIO(15)
Configuration
Low
Low
Falling Edge Input & Output
Low
High
Rising Edge Input, Falling Edge Output
High
Low
Falling Edge Input, Rising Edge Output
High
High
Rising Edge Input & Output
4.8 SPI Bus
Note: Interface support is forthcoming.
The AirPrime BX310x provides one 6-wire Serial Flash SPI-compatible interface
(SPI Master).
Note: Traditional 5-wire (MOSI/MISO/SCLK/CS/SRDY) SPI Slave interface can also be
implemented over this same interface.
Table 4-10 describes the SPI interface pins for both configurations (5- and 6-wire).
Note: The pins carrying the SPI interface are multi-function. The alternate interfaces (SDIO or
GPIO) can be selected via an AT command.
Table 4-10: SPI Pin Descriptions a
Rev 6 Jul.18
Direction b
SPI Master
SPI Slave
Pin
6-Wire Signal Name
5-Wire Signal Name
Master
Slave
Function
42
HSPICS0
CS
O
I
SPI Chip Select
43
HSPIQ
MISO
I
O
MISO
44
HSPICLK
SCLK
O
I
SPI Clock
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Interfaces Specification
Table 4-10: SPI Pin Descriptions a (Continued)
Direction b
SPI Master
SPI Slave
Pin
6-Wire Signal Name
5-Wire Signal Name
Master
Slave
45
HSPID
MOSI
O
I
MOSI
46
HSPIWP
-
O
-
Write Protect (M)
47
HSPIHD
SRDY
O
O
Hold
Function
a. Leave open any pins that are not used.
b. Signal direction with respect to the module.
4.9 Secure Digital IO (SDIO) Interface
Note: Interface support is forthcoming.
The AirPrime BX310x defines one SDIO slave-controller interface (SD 2.0-compliant),
which supports connections to SD memory and I/O cards.
The following features are supported:
• SPI/1-bit/4-bit modes
• Data transfer rates—0–50 MHz
• Block size—Up to 512 bytes
• Interrupts—Module-initiated and host-initiated
• Module-initiated data transfer via host interrupt
• Configurable features—Sampling, driving clock edge
• Registers for direct access by host
Table 4-11 describes the signals used for SDIO.
Note: The pins carrying the SDIO interface are multi-function. The alternate interfaces (GPIO
or SPI) can be selected via an AT command.
Table 4-11: SDIO Pin Descriptions a
Pin
Signal Name
Direction
Function
42
SD_CMD
I/O
SDIO command
43
SD_DATA2
I/O
SDIO data bit 2
44
SD_CLK
O
SDIO clock
45
SD_DATA3
I/O
SDIO data bit 3
46
SD_DATA0
I/O
SDIO data bit 0
47
SD_DATA1
I/O
SDIO data bit 1
a. Leave open any pins that are not used.
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Product Technical Specification
SDIO is particularly susceptible to tracking impedance and length variations between
the SDIO tracks. Ensure that controlled impedance tracking is used, and minimize
tracking length between the module and SD slave device. Add series resistor
footprints at the host end to decrease the drive current and reduce potential
interference, and match the length of all the SD tracks to within 1 mm.
SDIO tracking can cause significant radiated interference at integer multiples of the
SD clock frequency, which can be picked up by the BX310x antenna. Bury SDIO
tracks between ground planes and ensure stitching ground vias are placed throughout
the board surrounding the SDIO tracking.
SDIO timing during the boot process is provided by GPIO(5) and GPIO(15). See
Table 4-9 on page 34 for details.
4.10 Module Enable
The AirPrime BX310x uses the ENABLE (Module Enable) signal to turn the module
on/off:
• Turn module on—Drive ENABLE high (to VDD_PADS_BB)
• Turn module off—Drive ENABLE low (to 0V)
Table 4-12: Enable Pin Description
Pin
Signal Name
Direction a
37b
ENABLE
I
Function
Voltage Level
Start/stop module VDD_PADS_BB
a. Signal direction with respect to the module.
b. Do not leave this pin unconnected.
To avoid a possible implementation-dependent issue where enabling/disabling Wi-Fi
functionality could cause a perturbation (glitch) on the power supply rails that impacts
module operations, a short delay (1 ms recommended) is required for the power
supply to stabilize before enabling the module.
If ENABLE is controlled by the Host, the host implements the delay (from the time the
supply is present) before driving ENABLE high.
If ENABLE is hard-wired to the supply (VDD_PADS_BB), an RC circuit (10k &
0.1uF) is required. The RC circuit will create the required delay, allowing the supply to
stabilize before ENABLE is pulled high.
Do not leave this pin unconnected.
4.11 PWM
The AirPrime BX310x supports the use of PWM functionality on GPIOs (GPIO(5) and
GPIO(27)) via AT command configuration. Refer to [1] AirPrime BX310x AT Command
Reference for details.
Rev 6 Jul.18
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5: General Layout Recommendations
In addition to specific requirements for the antenna implementation and clearance of
the BX3105 detailed in this document, good mixed-signal layout practices should be
followed:
• Avoid tracking of high frequency signals near the RF sections of the module.
• Ensure plenty of ground vias throughout the application board.
• Tightly tie ground planes together throughout the application board.
• BX3100 RF tracking to application board antenna or RF connector:
·
Use 50 impedance controlled tracks.
·
Do not track near sources of digital interference.
·
Provide continuous unbroken ground plane reference.
·
Avoid multiple layer changes.
• Supply decoupling should be placed as close to the supply pins as possible.
• Avoid long digital tracks on surface layers—they may support significant RF
harmonic content.
Rev 6 Jul.18
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5
6
6: Firmware Upgrade
The BX310x is firmware-upgradeable via the following methods:
• AirVantage FOTA (Firmware Over The Air)
Once the BX310x is registered on AirVantage, the customer can select public
firmware packages for the device and initiate the FOTA update. If connected to the
cloud, the BX310x can respond to a service request for firmware update or can
initiate the update via AT commands.
For AT commands and notification details, refer to [1] AirPrime BX310x AT Command Reference.
•
For AirVantage FOTA details, refer to source.sierrawireless.com/airvantage/fota.
Non-AirVantage OTA (Over The Air)
The BX310x supports non-AirVantage OTA via the AT+FOTA= command.
The BX310x connects to the specified and downloads the firmware package
using the MQTT protocol.
•
The firmware package will be posted on source.sierrawireless.com for customers
to use their own OTA service to update the firmware on the BX310x. For +FOTA
details, refer to [1] AirPrime BX310x AT Command Reference. The customer is
responsible for securing the communication between the BX310x and the MQTT
server where the firmware package resides.
UART from HOST
A firmware file can be downloaded to the module using the UART interface connected to a host device. A UART updater tool and source code is available on
source.sierrawireless.com for customers who wish to implement this functionality
in their own application.
Currently, the BX310x is put into update mode by driving GPIO(27) high prior to
boot. If the customer wishes to use UART mode, then GPIO(27) must be controlled by the HOST to enable this mode.
The firmware file is transferred and written encrypted into Flash over the UART
interface prior to initiating the update process.
Note: Only authentic, signed Sierra firmware can be used in the update process.
Each of the upgrade methods follows the same process:
1. Firmware is written encrypted into an empty (or unused) Flash partition.
Rev 6 Jul.18
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Firmware Upgrade
2. Firmware signature is verified by the bootloader prior to use.
·
If verification passes, then:
·
The boot process switches to the new partition and the device boots normally using the
new firmware file.
·
·
Rev 6 Jul.18
The verification process is not retriggered on subsequent boots until another update
process is initiated.
If verification fails, then:
·
The device reverts to the original partition.
·
If the upgrade was attempted OTA, the running firmware indicates a failure to update. If
the upgrade was attempted over the UART, a verification failure message is reported.
·
The failed firmware file is not erased from Flash, but can be overwritten if another update
process is initiated.
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7
7: Regulatory Compliance
Caution: Unauthorized modifications or changes not expressly approved by Sierra Wireless
could void compliance with regulatory rules, and thereby your authority to use this equipment.
The BX3100/BX3105 module is designed to meet the requirements of the following
regulatory bodies and regulations, where applicable:
• Federal Communications Commission (FCC) of the United States
• Innovation, Science and Economic Development Canada (ISED)
• Ministry of Internal Affairs and Communications (MIC) of Japan
• Radio Equipment Directive of the European Union
• Ministry of Industry and Information Technology (People’s Republic of China)
• The National Communications Commission (NCC) of Taiwan, Republic of China
• The National Telecommunications Agency (ANATEL)
• National Radio Research Agency (South Korea)
Note: To determine whether specific approvals have been received or to obtain the anticipated
schedule for approvals, please contact your Sierra Wireless account representative.
Upon commercial release, the following industry certification will have been obtained,
where applicable:
• Bluetooth SIG
Additional certifications and details on specific country approvals may be obtained
upon customer request — contact your Sierra Wireless account representative for
details.
Additional testing and certification may be required for the end product with an
embedded BX3100/BX3105 module and are the responsibility of the OEM. Sierra
Wireless offers professional services-based assistance to OEMs with the testing and
certification process, if required.
7.1 Bluetooth Qualification Program (BQP)
•
•
In case no other non-certified Bluetooth components are incorporated, the
BX3100/BX3105's BQP marking certification allows users to integrate the
module into products without the need to obtain subsequent and separate
approval.
The BX3100/BX3105 is undergoing approval (as of publication date of this
document) by the Bluetooth Qualification Body (BQB) to use the Bluetooth
trademark and to offer official Bluetooth functionality. The approval according to
the V4.2 Bluetooth specification confirms that the module complies with the
Bluetooth specification and will successfully operate with other products
supporting the same profiles. This certification applies globally.
Note: To determine whether specific approvals have been received or to obtain the anticipated
schedule for approvals, please contact your Sierra Wireless account representative.
Rev 6 Jul.18
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Regulatory Compliance
Table 7-1: QDID (Qualified Design Identifications)
Module
QDID
BX3100
TBD
BX3105
TBD
7.1.1 Labeling
•
Products complying with all relevant requirements are allowed to bear the official
Bluetooth logo
For further information regarding the BQP certification requirements please review the
following website:
• Bluetooth Special Interest Group—https://www.bluetooth.org/apps/content/
Rev 6 Jul.18
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8
8: Pinout
The system interface of the AirPrime BX310x is through the LGA pattern on the
bottom of the PCB.
AirPrime BX310x pins are divided into three functional categories:
• Core functions and associated pins—Cover all the mandatory features for M2M
connectivity and will be available by default across all CF3 family of modules.
These Core functions are always available and always at the same physical pin
locations. A customer platform using only these functions and associated pins is
guaranteed to be forward and/or backward compatible with the next generation of
CF3 modules.
• Extension functions and associated pins—Bring additional capabilities to the
customer. Whenever an Extension function is available on a module, it is always
at the same pin location.
• Custom functions and associated pins—These are module-specific and make
use of specific chipset functions and I/Os.
Warning: Custom features should be used with caution as there is no guarantee that the
custom functions available on a given module will be available on other CF3 modules.
Pins marked as "Leave open" or "Reserved" should not be used or connected.
Rev 6 Jul.18
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Pinout
8.1 Pin Configuration
Figure 8-1 illustrates the pin configuration of the AirPrime BX310x module.
Figure 8-1: Pin Configuration (Bottom View)
8.2 Pin Description
Table 8-1 on page 43 lists detailed information for the LGA pins.
Important: Leave open all pins that are not used.
Table 8-1: Pin Definitions
PU/
Pin
Signal name
Group
I/O a
PD b
Active c
Function
Type d
-
-
-
-
E
1
Reserved
2
UART0_RTS_GPIO(22)
UART0
I
VDD_PADS_BB
PU
L
UART0 Request To Send
C
3
UART0_CTS_GPIO(19)
UART0
O
VDD_PADS_BB
PU
L
UART0 Clear To Send
C
4
UART0_TXD
UART0
I
VDD_PADS_BB
PU
L
UART0 Transmit Data
C
5
UART0_RXD
UART0
O
VDD_PADS_BB
PU
L
UART0 Receive Data
C
6
Reserved
NoConnect
-
-
-
-
Rev 6 Jul.18
NoConnect
Voltage
43
-
E
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Product Technical Specification
Table 8-1: Pin Definitions (Continued)
PU/
Pin
Signal name
Group
I/O a
Voltage
PD b
Active c
Function
Type d
7
Reserved
NoConnect
-
-
-
-
-
E
8
Reserved
NoConnect
-
-
-
-
-
E
GPIO(23)
GPIO
I/O
NP
SW
PUE
L
9
General Purpose I/O
C
VDD_PADS_BB
I2C1_SCL
I2C1
I/O
10
Reserved
NoConnect
-
-
-
-
-
C
11
Reserved
NoConnect
-
-
-
-
-
C
12
Reserved
NoConnect
-
-
-
-
-
C
13
Reserved
NoConnect
-
-
-
-
-
C
14
GPIO(5)
GPIO
I/O
VDD_PADS_BB
NP
SW
15
Reserved
NoConnect
-
-
-
-
I2S_MCLK
I2S
O
NP
H
NP
SW
General Purpose I/O
NP
SW
General Purpose I/O
PUE
L
Primary I2C interface—Data
NP
H
ADC input for voltage measurement
NP
SW
NP
H
NP
SW
16
Primary I2C interface—Clock
General Purpose I/O
E
-
E
I2S Master Clock
E
VDD_PADS_BB
GPIO(0)
GPIO
I/O
GPIO(25)
GPIO
I/O
17
E
VDD_PADS_BB
I2C1_SDA
VDET_1
I2C1
I/O
VoltMeasure
I
18
C
VDD_PADS_BB
GPIO(34)
GPIO
I/O
VDET_2
VoltMeasure
I
19
General Purpose I/O
ADC input for voltage measurement
C
VDD_PADS_BB
GPIO(35)
GPIO
I/O
20
Reserved
NoConnect
-
-
-
-
-
C
21
Reserved
NoConnect
-
-
-
-
-
C
22
Reserved
NoConnect
-
-
-
-
-
C
23
Reserved
NoConnect
-
-
-
-
-
C
I2S
O
PD
H
NP
SW
PD
H
NP
SW
General Purpose I/O
PD
L/H
I2S Left-Right Clock (Word Select)
NP
SW
General Purpose I/O
PD
H
NP
SW
I2S_DO
24
General Purpose I/O
I2S Data Out
C
VDD_PADS_BB
GPIO(32)
I2S_DI
GPIO
I/O
I2S
I
25
General Purpose I/O
I2S Data In
C
VDD_PADS_BB
GPIO(33)
I2S_LRCLK
GPIO
I/O
I2S
I/O
26
C
VDD_PADS_BB
GPIO(18)
GPIO
I/O
I2S_BCLK
I2S
I/O
27
I2S Bit Clock
C
VDD_PADS_BB
GPIO(26)
28
GND
29
Reserved
Rev 6 Jul.18
GPIO
I/O
Ground
0V
0V
-
-
NoConnect
-
-
-
-
44
General Purpose I/O
Ground
C
-
E
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Pinout
Table 8-1: Pin Definitions (Continued)
PU/
Pin
30
Signal name
GND
GPIO(36)
Group
I/O a
Voltage
PD b
Active c
Ground
0V
0V
-
-
GPIO
I/O
NP
SW
NP
H
NP
SW
NP
H
31
GPIO(37)
VoltMeasure
I
GPIO
I/O
32
C
General Purpose I/O
C
ADC input for voltage measurement
General Purpose I/O
C
VDD_PADS_BB
SENSOR_CAPP
VoldMeasure
I
VGPIO
Power
O
GPIO(38)
GPIO
I/O
34
3.3V
ADC input for voltage measurement
Reference voltage output
C
General Purpose I/O
C
NP
SW
NP
H
ADC input for voltage measurement
NP
L
General Purpose I/O
E
NP
SW
General Purpose I/O
C
NP
H
ADC input for voltage measurement
L
Turn module on/off
C
-
E
VDD_PADS_BB
SENSOR_CAPN
35
Ground
VDD_PADS_BB
SENSOR_VP
33
Type d
Function
VoltMeasure
I
GPIO(27)
GPIO
I/O
GPIO(39)
GPIO
I/O
36
VDD_PADS_BB
VDD_PADS_BB
SENSOR_VN
VoltMeasure
I
37
ENABLE
Control
I
VDD_PADS_BB
38
Reserved
NoConnect
-
-
-
-
39
GND
Ground
0V
0V
-
-
Ground
C
40
RF_MAIN
RF
I/O
-
-
(BX3100) RF antenna, DC blocked
(BX3105) Leave pin unconnected
C
41
GND
Ground
0V
-
-
Ground
C
SD_CMD
SDIO
I/O
NP
H
SDIO Command
E
HSPICS0
SPI
I/O
NP
SW
SPI Chip Select
C
GPIO(15)
GPIO
I/O
NP
SW
General Purpose I/O
E
SD_DATA2
SDIO
I/O
NP
H
SDIO Data bit 2
E
SPI
I/O
NP
SW
SPI Data In
C
GPIO(12)
GPIO
I/O
NP
SW
General Purpose I/O
E
SD_CLK
SDIO
I/O
NP
H
SDIO Clock
E
HSPICLK
SPI
I/O
NP
SW
SPI Clock (output from Master)
C
GPIO(14)
GPIO
I/O
NP
SW
General Purpose I/O
E
SD_DATA3
SDIO
I/O
NP
H
SDIO Data bit 3
E
SPI
I/O
NP
SW
SPI Data Out
C
GPIO(13)
GPIO
I/O
NP
SW
General Purpose I/O
E
SD_DATA0
SDIO
I/O
NP
H
SDIO Data bit 0
E
HSPIWP
SPI
O
NP
SW
SPI Write Protect
E
GPIO(2)
GPIO
I/O
NP
SW
General Purpose I/O
E
42
43
44
45
46
HSPIQ
HSPID
Rev 6 Jul.18
0V
VDD_PADS_BB
VDD_PADS_BB
VDD_PADS_BB
VDD_PADS_BB
VDD_PADS_BB
45
41111444
Product Technical Specification
Table 8-1: Pin Definitions (Continued)
PU/
Group
I/O a
SDIO
I/O
HSPIHD
SPI
O
GPIO(4)
GPIO
I/O
48
Reserved
NoConnect
-
49
Reserved
NoConnect
50
VDD_3V3_RF
51
52
Pin
Signal name
SD_DATA1
47
Active c
NP
H
NP
Function
Type d
E
SW
SPI Hold
E
NP
SW
General Purpose I/O
E
-
-
-
-
E
-
-
-
-
-
E
Power
I
2.8 (Min)
3.3V (Typ)
3.6 (Max)
-
-
3.3v nominal supply for Analog/RF
C
VDD_3V3_PA
Power
I
2.8 (Min)
3.3V (Typ)
3.6 (Max)
-
-
3.3v nominal supply for Internal
Power Amplifier
C
VDD_PADS_BB
Power
I
2.7 (Min)
3.3V (Typ)
3.6 (Max)
-
-
3.3v nominal supply for Baseband
and Digital I/O
C
GPIO(16)
GPIO
I/O
NP
SW
General Purpose I/O
C
PUE
L
NP
SW
PUE
L
Primary I2C interface—Clock
-
-
Ground
VDD_PADS_BB
VGPIO
I2C2_SDA
I2C2
I/O
GPIO(17)
GPIO
I/O
54
Primary I2C interface—Data
General Purpose I/O
C
VDD_PADS_BB
I2C2_SCL
a.
b.
c.
d.
PD b
SDIO Data bit 1
53
G1–
G16
Voltage
Ground
I2C2
I/O
Ground
0V
0V
C
I/O: Signal direction with respect to the module
PU/PD: NP—No Pull; PD—Pull Down; PU—Pull Up; PUE—Pull Up External
Active: H—High; L—Low; SW—Software defined
Type: C—Core; E—Extended; K—Custom
Rev 6 Jul.18
46
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9
9: References
9.1 Web Site Support
Check http://source.sierrawireless.com for the latest documentation available for the
AirPrime BX310x.
9.2 Reference Documents
[1] AirPrime BX310x AT Command Reference
Reference number: 41111445
Rev 6 Jul.18
47
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10
10: Abbreviations
Table 10-1: Acronyms and Definitions
Acronym or term
Definition
AFH
Adaptive Frequency Rate Hopping
AP
Access Point
BLE
Bluetooth Low Energy
BR
Basic Rate
BSS
Basic Service Set
BT
Bluetooth (Classic)
EDR
Enhanced Data Rate
EDR
Enhanced Data Rate
GAP
Generic Access Profile
GAP
General Access Profile
GATT
General Attribute Profile
HTTP
Hypertext Transfer Protocol
HTTPS
Hypertext Transfer Protocol Secure
LE
Low Energy
MQTT
Message Queuing Telemetry Transport
PAN
Personal Area Network
RFCOMM
Radio Frequency Communication
SDP
Service Discover Protocol
SMP
Security Manage Protocol
SPP
Bluetooth Serial Port Profile
STA
Station (client)
UART
Universal Asynchronous Receiver-Transmitter
Wi-Fi
Wireless Networking
WPA
Wi-Fi Protected Access
WPA2
Wi-Fi Protected Access 2
WPS
Wi-Fi Protected Setup
Rev 6 Jul.18
48
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