XL7ED8K5SI-111YXC-25M

CRYSTAL UNIT YSX211SL Applications Small Size Features ‧SmartWearable ‧Dimensions:2.05 x 1.65 x 0.50 mm. ‧High precision and high frequency stability. IOT Communication. ‧Standard Frequency: 16 to54MHz ‧Excellent heat resistance and environmental characteristics. Specifications 16 to 54MHz or 96MHz Standard Frequency Vibration Mode AT Fundamental Load Capacitance 8pF,9pF,12pF,or specify Frequency Tolerance (at 25 ℃) ±10ppm,±20ppm,or specify Frequency Versus Temperature Characteristics ±20ppm,or specify Operating Temperature -40~+85℃ Storage Temperature -40~+85℃ or specify Shunt Capacitance 3 pF Max. Level of Drive 10~200μWMax.(100uW typical) Aging (at 25 ℃) ±3ppm/year Max. Equivalent Series Resistance(ESR) 16 ~ 30 MHz 30 ~ 54 MHz Dimensions and Patterns [unit:mm] 100 Ω Max. 80 Ω Max. Package Size – Dimensions (Unit: mm) 2.00±0.10 1.60±0.10 4 Recommended Land Pattern (Unit: mm) 3 4 GND 3 Marking GND 2 1 Top View To p Vi e w C r y s t a l C o n n ec t io n 2 0.5Max 1 0.9 Side View 0.7±0.10 3 1 Bottom View 2 0 .8 0.475±0.10 0.5±0.10 0 .3 4 0.9 0 .8 0.575±0.10 0.5 Top View Suggested Layout www.yxcxtal.com Units: mm CRYSTAL UNIT YSX211SL Small Size Reflow Soldering Profile Temperature Pre Heating Temperature Tp1 ~ Tp2 = + 170 °C Heating Temperature TMlt = + 220 °C Peek Temperature TMax. = + 260 °C +260℃ TMax. +220℃ Tmlt Point of measuring In case of Solder ability Terminal. In case of Resistance to soldering heat Surface. Tp2 Tp1 35s 100s t(time) Taping Specification(Unit: mm) Size A B C D E F G H SMD-2016 180±2.0 8.0±0.3 2.30±0.1 1.90±0.1 4.0±0.1 0.95±0.1 61.0±1.0 8.0±1.0 3000 pcs per reel www.yxcxtal.com