MSD0008

microSD™, microSDHC™ and microSDXC™Cards OEM Product Manual Revision 3.7 Document No. 80-36-03335 September 2015 SanDisk Corporation Corporate Headquarters • 951 SanDisk Drive • Milpitas, CA 95035 Phone (408) 801-1000 • Fax (408) 801-8657 www.sandisk.com Sep 2015 Version 3.7 ©2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable nondisclosure agreements SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Products, samples and prototypes are subject to update and change for technological and manufacturing purposes. SanDisk Corporation general policy does not recommend the use of its products in life support applications wherein a failure or malfunction of the product may directly threaten life or injury. Without limitation to the foregoing, SanDisk shall not be liable for any loss, injury or damage caused by use of its products in any of the following applications: • Special applications such as military related equipment, nuclear reactor control, and aerospace • Control devices for automotive vehicles, train, ship and traffic equipment • Safety system for disaster prevention and crime prevention • Medical-related equipment including medical measurement device Accordingly, in any use of SanDisk products in life support systems or other applications where failure could cause damage, injury or loss of life, the products should only be incorporated in systems designed with appropriate redundancy, fault tolerant or back-up features. Per SanDisk Terms and Conditions of Sale, the user of SanDisk products in life support or other such applications assumes all risk of such use and agrees to indemnify, defend and hold harmless SanDisk Corporation and its affiliates against all damages. Security safeguards, by their nature, are capable of circumvention. SanDisk cannot, and does not, guarantee that data will not be accessed by unauthorized persons, and SanDisk disclaims any warranties to that effect to the fullest extent permitted by law. This document and related material is for information use only and is subject to change without prior notice. SanDisk Corporation assumes no responsibility for any errors that may appear in this document or related material, nor for any damages or claims resulting from the furnishing, performance or use of this document or related material. SanDisk Corporation explicitly disclaims any express and implied warranties and indemnities of any kind that may or could be associated with this document and related material, and any user of this document or related material agrees to such disclaimer as a precondition to receipt and usage hereof. EACH USER OF THIS DOCUMENT EXPRESSLY WAIVES ALL GUARANTIES AND WARRANTIES OF ANY KIND ASSOCIATED WITH THIS DOCUMENT AND/OR RELATED MATERIALS, WHETHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR INFRINGEMENT, TOGETHER WITH ANY LIABILITY OF SANDISK CORPORATION AND ITS AFFILIATES UNDER ANY CONTRACT, NEGLIGENCE, STRICT LIABILITY OR OTHER LEGAL OR EQUITABLE THEORY FOR LOSS OF USE, REVENUE, OR PROFIT OR OTHER INCIDENTAL, PUNITIVE, INDIRECT, SPECIAL OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION PHYSICAL INJURY OR DEATH, PROPERTY DAMAGE, LOST DATA, OR COSTS OF PROCUREMENT OF SUBSTITUTE GOODS, TECHNOLOGY OR SERVICES. No part of this document may be reproduced, transmitted, transcribed, stored in a retrievable manner or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written consent of an officer of SanDisk Corporation. All parts of the SanDisk documentation are protected by copyright law and all rights are reserved. SanDisk and the SanDisk logo are trademarks of SanDisk Corporation, registered in the United States and other countries. SD, microSD, microSDHC and microSDXC marks and logos are trademarks of SD-3C, LLC. All other brand names mentioned herein are for identification purposes only and may be the trademarks of their respective holder(s). © 2015 SanDisk Corporation. All rights reserved. Document No. 80-36-03335 Rev 3.7 Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. i SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Revision History Date Revision Description July 2008 1.0 First Revision June 2010 2.0 Added 32 GB Replaced SD 2.0 with SD 3.0 ACMD41 to ready after power up updated Updated marking, section 5 Updated Tables 7, 9, and 11 to remove < 1G references Updated Figure 1 – SD card block diagram March 2011 2.1 Added speed class to Ordering Information Table April 2011 2.2 Added 64GB and updated SDA 3.0 to SD3.UHS-I 50 October 2011 2.3 Added SDSDQAC SKUs to Ordering Information. Updated Figure 7 to add High Performance figure. November 2011 2.4 Added Ordering Information. Reference to SDA corrections. Added SDSDQAD SKUs to Ordering Information Marking info updated with alternate laser marking guide and Premier microSD product marking info January 2012 2.5 July 2012 2.6 July 2013 3.0 November 2013 3.1 February 2014 3.2 May 2014 3.3 June 2014 3.4 Remove figures 4 and 5. Update Table 2. Update Section 5. July 2014 3.5 Updated section 1.1 and 1.2, from 64GB to 128GB October 2014 3.6 Updated CID Register September 2015 3.7 Added 200GB part number Removed High Performance line (SDSDQAC) Added SDSDQAE SKUs Removed SDSDQ SKUs Removed random IOPs performance from ordering information Updated Table 2: Card Power and Section 6: Ordering information Added 128GB microSD – SDSDQAD-128G Updated Table 10 Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. ii SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Table of Contents 1 Introduction......................................................................................... 1 1.1 General Description ....................................................................... 1 1.2 Features....................................................................................... 2 1.3 Scope .......................................................................................... 2 1.4 SD Card Standard ......................................................................... 2 1.5 Functional Description .................................................................... 3 1.5.1 Technology Independence .................................................... 3 1.5.2 Defect and Error Management ............................................... 3 1.5.3 Content Protection ............................................................... 3 1.5.4 Wear Leveling ..................................................................... 3 1.5.5 Automatic Sleep Mode.......................................................... 3 1.5.6 Hot Insertion ...................................................................... 4 1.6 microSD Card Products in SD Bus Mode ............................................ 4 1.7 SPI Mode ..................................................................................... 6 2 Product Specifications ........................................................................... 7 2.1 microSD Card Product Family .......................................................... 7 2.1.1 Typical Card Power Requirements .......................................... 7 2.1.2 System Performance ............................................................ 8 2.1.3 Reliability and Durability ....................................................... 9 2.1.4 Physical Specifications ......................................................... 9 3 Interface Description........................................................................... 10 3.1 Pins and Registers ....................................................................... 10 3.2 Bus Topology .............................................................................. 11 3.2.1 SD Bus ............................................................................ 11 3.2.2 SPI Bus ............................................................................ 11 3.3 Hot Insertion and Power Protection ................................................ 11 3.4 Electrical Interface ....................................................................... 11 3.4.1 Power Up ......................................................................... 11 3.4.2 Bus Operating Conditions ................................................... 12 3.4.3 Bus Timing ....................................................................... 12 3.5 microSD Card Product Family Registers .......................................... 12 3.5.1 Operation Conditions Register ............................................. 12 3.5.2 Card Identification Register................................................. 12 3.5.3 Card Specific Data Register ................................................. 13 3.5.4 Card Status Register .......................................................... 16 3.5.5 SD Status Register ............................................................ 16 3.5.6 Relative Card Address Register ............................................ 16 3.5.7 SD Card Configuration Register ........................................... 16 3.5.8 microSD Card Product Family Registers in SPI Mode ............... 16 3.5.9 Data Interchange Format and Card Sizes .............................. 16 4 microSD Card Protocol Description ........................................................ 17 4.1 General Description ..................................................................... 17 4.2 SD Bus Protocol .......................................................................... 17 4.3 Functional Description .................................................................. 17 Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. iii SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 4.3.1 Card Identification Mode..................................................... 17 4.3.2 Data Transfer Mode ........................................................... 17 4.3.3 Clock Control .................................................................... 18 4.3.4 Cyclic Redundancy Codes ................................................... 18 4.3.5 Error Conditions ................................................................ 18 4.3.6 Commands ....................................................................... 18 4.3.7 Card State Transition ......................................................... 18 4.3.8 Timing Diagrams and Values ............................................... 18 4.3.9 Speed Class Specification ................................................... 18 4.3.10 Erase Timeout Calculation .................................................. 18 5 Marking............................................................................................. 19 6 Ordering Information .......................................................................... 20 Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. iv SanDisk microSD™, microSDHC™ and microSDXC™ cards 1 OEM Product Manual 3.7 INTRODUCTION 1.1 General Description SanDisk’s microSD™, microSDHC™ (High Capacity) and microSDXC™ (Extended Capacity) cards are flash based removable non-volatile memory devices specifically designed to meet the security, capacity, performance and environmental requirements inherent in next generation mobile phones and consumer electronic devices. The microSD card includes a content protection system that complies with the security of the Secure Digital Music Initiative (SDMI) standard and has a higher memory capacity. In the microSD card, card content is protected from unauthorized use by mutual authentication and a cipher algorithm. Unsecured access to the user's own content is also available. microSD cards are based on an 8-pin interface designed to operate in a maximum operating frequency of 208 MHz. The interface for microSD card products allows for easy integration into any design, regardless of which type of microprocessor is used. In addition to the interface, microSD card products offer an alternate communicationprotocol based on the SPI standard. SanDisk’s microSD card Product Family provides up to 200 gigabytes (GB)1 of memory using flash memory chips, which were designed especially for use in mass storage applications. In addition to the mass storage-specific flash memory chip, cards in the microSD card product family includes an on-board intelligent controller which manages interface protocols; security algorithms for content protection; data storage and retrieval, as well as Error Correction Code (ECC) algorithms; defect handling; power management; wear leveling, and clock control. SD Bus/SPI Bus Interface SanDisk Single Chip Controller Data In/Out Control NAND SanDisk microSD Card Figure 1: SanDisk’s microSD Card Block Diagram 1 1  Gigabyte  (GB)  =  1  billion  bytes.  Some  capacity  is  not  available  for  data  storage. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 1 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 1.2 Features General features of cards in the SanDisk microSD Memory Card Product Family include: • • • • • • • • • • • • • Up to 200 GB2 of data storage SD - protocol compatible Supports SPI Mode Targeted for portable and stationary applications for secured (content protected) and unsecured data storage Voltage range of 2.7 to 3.6V Variable clock rate 0-25 MHz (standard), 0-50 MHz (high performance), 0-208 MHz (Ultra High Speed) Up to 104 MB/sec* data transfer rate (using four parallel data lines) Memory field error correction Content protection mechanism that complies with highest security of SDMI standard Password protection Built-in write protection features (permanent and temporary) Supports card detection (insertion and removal) Application-specific commands 1.3 Scope This document describes key features and specifications of the microSD cards as well as the information required to interface these products to a host system. Chapter 2 describes the physical and mechanical properties of cards in the microSD card product family, Chapter 3 contains the pins and register overview, and Chapter 4 gives a general overview of the SD protocol. Information about SPI Protocol can be referenced in Section 7 of the SDA Physical Layer Specification, Version 3.01. 1.4 SD Card Standard SanDisk’s microSD memory cards are fully compatible with the SDA Physical Layer Specification, Version 3.01. This specification is available from the SD Card Association (SDA). SD Card Association 2400 Camino Ramon, Suite 375 San Ramon, CA 94583 USA Telephone: +1 (925) 275-6615 Fax: +1 (925) 886-4870 E-mail: office@sdcard.org Web site: www.sdcard.org 2 1  Gigabyte  (GB)  =  1  billion  bytes.  Some  capacity  is  not  available  for  data  storage. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 2 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 1.5 Functional Description The family of SanDisk microSD cards contains a high-level, intelligent subsystem as shown in Figure 1. This intelligent (microprocessor) subsystem provides many capabilities not found in other types of memory cards. These capabilities include: • Host independence from details of erasing and programming flash memory • Sophisticated system for managing defects (analogous to systems found in magnetic disk drives) • Sophisticated system for error recovery including a powerful ECC • Power management for low power operation 1.5.1 Technology Independence The 512-byte sector size of a card in the microSD card product family is the same as that in an IDE magnetic disk drive. To write or read a sector (or multiple sectors), the host software simply issues a read or write command to the card. The command contains the address and number of sectors to write or read. The host software then waits for the command to complete. The host software does not get involved in the details of how the flash memory is erased, programmed or read. This is extremely important because flash devices are expected to get increasingly complex in the future. Because cards in the SanDisk microSD Card Product Family use an intelligent on-board controller, host system software will not need to be updated as new flash memory evolves. In other words, systems that support the microSD Card Product Family today will be able to access future SanDisk cards built with new flash technology without having to update or change host software. 1.5.2 Defect and Error Management The SanDisk microSD Card Product Family contains a sophisticated defect and error management system. This system is analogous to the systems found in magnetic disk drives and in many cases offers enhancements. If necessary, SanDisk microSD Card Product Family will rewrite data from a defective sector to a good sector. This is completely transparent to the host and does not consume any user data space. In the extremely rare case that a read error does occur, SanDisk microSD Memory Card Product Family has innovative algorithms to recover the data. These defect and error management systems, coupled with the solid state construction, give SanDisk microSD Card Product Family enormous reliability. 1.5.3 Content Protection A detailed description of the content protection mechanism and related security SD commands can be found in the SD Security Specification from the SDA. All SD security-related commands in the SanDisk microSD Card Product Family operate in the data transfer mode. 1.5.4 Wear Leveling Wear leveling is an intrinsic part of the erase pooling functionality of cards in the SanDisk microSD Card Product Family using NAND memory. 1.5.5 Automatic Sleep Mode A unique feature of cards in the SanDisk microSD Card Product Family is automatic entrance and exit from sleep mode. Upon completion of an operation, cards enter Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 3 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 sleep mode to conserve power if no further commands are received in less than 5 milliseconds (ms). The host does not have to take any action for this to occur. However, in order to achieve the lowest sleep current, the host needs to shut down its clock to the card. In most systems, cards are in sleep mode except when accessed by the host, thus conserving power. When the host is ready to access a card in sleep mode, any command issued to it will cause it to exit sleep, and respond. 1.5.6 Hot Insertion Support for hot insertion will be required on the host but will be supported through the connector. Connector manufacturers will provide connectors that have power pins long enough to be powered before contact is made with the other pins. 1.6 microSD Card Products in SD Bus Mode The following sections provide valuable information on cards in the SanDisk microSD Card Product Family in SD Bus mode. Cards in the SanDisk microSD Card Product Family are fully compliant with the SDA Physical Layer Specification, Version 3.01. Card Specific Data (CSD) Register structures are compliant with CSD Structure 1.0 and 2.0. This section covers Negotiating Operating Conditions, Card Acquisition and Identification, Card Status, Memory Array Partitioning, Read/Write Operations, Data Transfer Rate, Data Protection in Flash Cards, Write Protection, Copy Bit, and CSD Register. Additional practical card detection methods can be found in application notes pertaining to the SDA Physical Layer Specification, Version 3.01. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 4 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 SanDisk microSD Card Figure 2: Memory Array Partitioning Figure 3: Data Transfer Formats Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 5 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Table 1 contains descriptions for each transfer mode. Table 1: Mode Descriptions Mode Single Block Description In this mode the host reads or writes one data block in a pre-specified length. The data block transmission is protected with 16-bit CRC that is generated by the sending unit and checked by the receiving unit. The block length for read operations is limited by the device sector size (512 bytes) but can be as small as a single byte. Misalignment is not allowed. Every data block must be contained in a single physical sector. The block length for write operations must be identical to the sector size and the start address aligned to a sector boundary. Multiple Block This mode is similar to the single block mode, except for the host can read/ write multiple data blocks (all have the same length) that are stored or retrieved from contiguous memory addresses starting at the address specified in the command. The operation is terminated with a stop transmission command. Misalignment and block length restrictions apply to multiple blocks and are identical to the single block read/write operations. 1.7 SPI Mode The SPI Mode is a secondary communication protocol for cards in the SanDisk microSD Card Product Family. This mode is a subset of the SD Protocol, designed to communicate with an SPI channel, commonly found in Motorola and other vendors' microcontrollers. Detailed information about SPI Mode can be found in Section 7 or the SDA Physical Layer Specification, Version 3.01. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 6 SanDisk microSD™, microSDHC™ and microSDXC™ cards 2 OEM Product Manual 3.7 PRODUCT SPECIFICATIONS 2.1 microSD Card Product Family This section provides product specifications for the microSD Card Product Family. For more details about the environmental, reliability and durability specifications, refer the SDA Physical Layer Specification, Version 3.01 and microSD card addendum v3.0. 2.1.1 Typical Card Power Requirements The values stated in Table 2 represent the SanDisk microSD Card power requirements. Table 2: microSD Card Power Requirements Mode Maximum Value Typical Value at 25C Standard Mode (25 MHz) 500 uA 600 uA (128/200GB) Sleep Read 100 mA Write 100 mA Standard Mode – for SDXC card XPC bit on (25 MHz) Host selected XPC bit in ACMD41 500 uA 600 uA (128/200GB) Sleep Read 150 mA Write 150 mA High Performance Mode (50 MHz) 500 uA 600 uA (128/200GB) Sleep Read 200 mA Write 200 mA UHS-I SDR50 Mode – (100 MHz) 500 uA 600 uA (128/200GB) Sleep Read 400 mA Write 400 mA UHS-I DDR50 Mode – (50 MHz) 500 uA 600 uA (128/200GB) Sleep Read 400 mA Write 400 mA UHS-I SDR104 Mode – (208 MHz) 500 uA 600 uA (128/200GB) Sleep Read 800 mA Write 800 mA Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 7 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Note: Current consumption is measured by averaging over one (1) second. Refer to Section 6.6.3 of the SDA Physical Layer Specification, Version 3.01 for more information 2.1.2 System Performance This section provides the system performance specifications for the SanDisk microSD Card Product Family. All performance values in Table 3 were measured under the following conditions: • Voltage range 2.7 to 3.6V • Operating temperature -25°C to 85°C • Independent of card clock frequency Table 3: System Performance Timing Maximum Value Block Read Access Time 100 ms Block Write Access Time 250 ms for SDHC, 500 ms for SDXC ACMD41 to ready after power-up 1s Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 8 SanDisk microSD™, microSDHC™ and microSDXC™ cards 2.1.3 OEM Product Manual 3.7 Reliability and Durability For microSD environmental, reliability and durability specifications, refer to SDA Physical Layer Specification, Version 3.01 and microSD Card Addendum v3.0. 2.1.4 Physical Specifications For detail dimensions and tolerances refer to SDA microSD Card Addendum, Mechanical Specification for microSD Memory Card. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 9 SanDisk microSD™, microSDHC™ and microSDXC™ cards 3 OEM Product Manual 3.7 INTERFACE DESCRIPTION 3.1 Pins and Registers The microSD Card Product Family has exposed contacts on one side. The host uses a dedicated connector to connect to microSD cards. In Table 4, pin assignments for the microSD Card are described for SD Bus Mode and SPI Bus Mode Note: Pin assignments are provided by the SDA Physical Layer Specification, Version 3.01 and associated addendums (microSD). For more details, refer to Section 3.7 of the SDA Physical Layer Specification, Version 3.01 Table 4: SD Bus Mode Pin Assignment Pin No. SD Mode Name 1 DAT2 Type 2,5 1 I/O/PP 2 2 CD/DAT3 3 CMD PP 4 VDD 5 Data Line [bit 2] Name RSV Type 3 1 Description Reserved Card Detect/Data Line [bit 3] CS I Command/Response DataIn I Data In S Supply Voltage VDD S Supply Voltage CLK I Clock SCLK I Clock 6 VSS S Supply voltage ground VSS S Supply voltage ground 7 DAT0 Data Line [bit 1] DataOUT O/PP Data Out Data Line [bit 2] 4 - Reserved 8 DAT1 I/O/PP 3 Description SPI mode I/O/PP 2,4 I/O/PP RSV Chip select (active low) Notes: 1. Type Key: S=power supply; I=input; O=output using push-pull drivers; PP=I/O using push-pull drivers. 2. The extended DAT lines (DAT1-DAT3) are input on power up. They start to operate as DAT lines after the SET_BUS_WIDTH command. It is the responsibility of the host designer to connect external pull-up resistors to all data lines even if only DAT0 is to be used. If not, there may be unexpected high current consumption due to the floating inputs of DAT1 & DAT2 (if they are not used). 3. At power up this line has a 50 kilohm pull-up enabled in the card. This resistor serves two functions: Card Detection and Mode Selection. For Mode Selection, the host can drive the line high or let it be pulled high to select SD mode. If the host wants to select SPI mode, it should drive the line low. For Card Detection, the host detects that the line is pulled high. The user should disconnect this pull-up with SET_CLR_CARD_DETECT (ACMD42) command during regular data transfer. 4. DAT1 line may be used as Interrupt Output (from the Card) in SDIO mode during all the times that it is not in use for data transfer operations. 5. DAT2 line may be used as Read Wait signal in SDIO mode. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 10 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Each card has a set of information registers. Register descriptions and SDA references are provided in Section 5.0 of the SDA Physical Layer Specification, Version 3.01. Table 5: microSD Card Product Family Register Overview Register Abbreviation Width (in bits) CID 128 Card identification number RCA 16 Relative card address CSD 128 Card specific data SCR 64 SD configuration register OCR 32 Operation condition register SSR 512 SD status register CSR 32 Card status register Register Name 3.2 Bus Topology The family of microSD products supports two communication protocols: SD and SPI. For more details, refer to Section 3.5 of the SDA Physical Layer Specification, Version 3.01. Section 6 of the specification contains a bus circuitry diagram for reference. 3.2.1 SD Bus For more details, refer to Section 3.5.1 of the SDA Physical Layer Specification, Version 3.01. 3.2.2 SPI Bus For more details, refer to Section 3.5.2 of the SDA Physical Layer Specification, Version 3.01. 3.3 Hot Insertion and Power Protection Refer to Section 6.1 and Section 6.2 of the SDA Physical Layer Specification, Version 3.01. 3.4 Electrical Interface The power scheme of microSD products is handled locally in each card and in the bus master. Refer to Section 6.4 of the SDA Physical Layer Specification, Version 3.01. 3.4.1 Power Up Power must be applied to the VDD pin before any I/O pin is set to logic HIGH. In other words, CMD, CLK, and DAT0-3 must be at zero (0) volts when power is applied to the VDD pin. For more information, refer to Section 6.4.1 of the SDA Physical Layer Specification, Version 3.01. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 11 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Card VDD Figure 4: Recommended Power Control Scheme The recommended power control scheme for microSD cards is illustrated in Figure 4. Most card connectors have a card detect switch that signals the SD host when the card is inserted. After the host is aware of the card insertion, it turns on the FET switch to apply power to card's VDD pin. Once the card is inserted and all card pins are making contact, there should be a delay before the FET switch is turned on. Note: Because there are clamping diodes on the CMD, CLK, and DAT0-3 pins, it is crucial to ensure that CLK, CMD, and DAT0-3 are at zero (0) volts during the delay and before the FET switch is turned on. If any I/O pin, (CMD, CLK, or DAT0-3) goes above zero volts during the delay and before power reaches the card VDD pin, it will forward bias the clamping diodes and can cause the card to go into an unknown state. It is the host's responsibility to make sure power gets to VDD before CMD, CLK, or DAT0-3 go above zero volts. 3.4.2 Bus Operating Conditions SPI Mode bus operating conditions are identical to SD Card Bus Mode operating conditions. For details, see Section 6.6 of the SDA Physical Layer Specification, Version 3.01. 3.4.3 Bus Timing See SDA Physical Layer Specification, Version 3.01. 3.5 microSD Card Product Family Registers There is a set of eight registers within the card interface. However, the DSR Register is optional and is not used in the SanDisk microSD Card Product Family. For specific information about all registers, refer to Section 5 of the SDA Physical Layer Specification, Version 3.01. 3.5.1 Operation Conditions Register The Operation Conditions Register (OCR) stores a card's VDD voltage profile. Refer to Section 5.1 of the SDA Physical Layer Specification, Version 3.01 for more information. 3.5.2 Card Identification Register The Card Identification (CID) Register is 16 bytes long and contains the unique card identification number. It is programmed during card manufacturing and cannot be changed by card hosts. See Table 8. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 12 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Table 6: CID Register Definitions Name Type Width CID Value Comments Manufacturer ID (MID) Binary 8 0x03 Manufacturer IDs are controlled and assigned by the SD-3C, LLC OEM/Application ID (OID) ASCII 16 SD ASCII Code 0x53, 0x44 Identifies the card OEM and/or the card contents. The OID is controlled and assigned by the SD-3C, LLC Product Name (PNM) ASCII Product Revision PRV) 40 BCD 8 SKU prefix Value1 Value2 SDSDQAB SUXXG SSXXG SDSDQAD SUXXG SLXXG SDSDQAE SUXXG SEXXG Product Revision xx Five-character ASCII string. Product Name could be either Value1 or Value2. XXG = 04G,08G,16G,32G,64G, or 128, 200 referring to capacity (note: 128 and 200 are 128GB and 200GB card, respectively) See Section 5.2 in the SDA Physical Layer Specification, Version 3.01. Serial Number (PSN) Binary 32 Product serial number 32-bit unsigned integer Reserved - 4 - - Manufacturer Date Code (MDT) BCD 12 Manufacture date (for example, April 2001=0x014) Manufacturing date– yym (offset from 2000) CRC7 Checksum (CRC) Binary 7 CRC7 Calculated Not used, always 1 - 1 - - 3.5.3 Card Specific Data Register The Card Specific Data (CSD) Register configuration information is required to access card data. The CSD defines the data format, error correction type, maximum data access time, etc. The field structures of the CSD Register vary depending on the physical specifications and card capacity. The CSD_STRUCTURE field in the CSD Register indicates which structure version is used. Table 9 shows the version number as it relates to the CSD structure. Refer to Section 5.3.1 of the SDA Physical Layer Specification, Version 3.01 for more information. Table 7: CSD Register Structure CSD_Structure CSD Structure Version 0 CSD Version 1.0 Valid for SD Card Physical Specification / Card Capacity Version 1.01 to 1.10 Version 2.00/Standard Capacity 1 CSD Version 2.0 Version 2.00/High Capacity and Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 13 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Extended Capacity 2-3 Reserved - Table 8 provides an overview of the CSD Register. More field-specific information can be found in Section 5.3.2 of the SDA Physical Layer Specification, Version 3.01. Table 8: CSD Register (CSD Version 1.0) Field Typical CSD Value Description CSD_STRUCTURE 1.0 CSD Structure - - Reserved TAAC 1.5 msec Data read access-time-1 NSAC 0 Data read access-time-2 in CLK cycles (NSAC*100) TRANS_SPEED Standard Mode 25 MHz High Performance Mode 50MHz Maximum data transfer rate Ultra High Speed Mode-I 104MHz CCC All (inc. WP, lock/unlock) Card command classes READ_BL_LEN 2G = 0xA Up to 1G – 0x9 Maximum read data block length READ_BL_PARTIAL Yes Partial blocks for read allowed WRITE_BLK_MISALIGN No Write block misalignment READ_BLK_MISALIGN No Read block misalignment DSR_IMP No DSR implemented - - Reserved C_SIZE 1 GB 2 GB Secured 0xF22 0xF24 Device size VDD_R_CURR_MIN 100 mA Maximum read current @VDD min VDD_R_CURR_MAX 80 mA Maximum read current @VDD max VDD_W_CURR_MIN 100 mA Maximum write current @VDD min VDD_W_CURR_MAX 80 mA Maximum write current @VDD max C_SIZE_MULT 2G=2048 1G-1024 Device size multiplier ERASE_BLK_EN Yes Erase single block enable SECTOR_SIZZE 31 blocks Erase sector size WP_GRP_SIZE 127 sectors Write protect group size WP_GRP_ENABLE Yes Write protect group enable Reserved - Reserved for MMC compatibility R2W_FACTOR X16 Write speed factor WRITE_BL_LEN 0x9 Maximum write data block length WRITE_BL_PARTIAL No Partial blocks for write allowed - - Reserved FILE_FORMAT_GRP 0 File format group COPY Has been copied Copy flag (OTP) PERM_WRITE_PROTECT Not protected Permanent write protection TMP_WRITE_PROTECT Not protected Temporary write protection Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 14 SanDisk microSD™, microSDHC™ and microSDXC™ cards Field OEM Product Manual 3.7 Typical CSD Value Description FILE_FORMAT HD w/partition File format Reserved - Reserved CRC CRC7 CRC - - Not used, always "1" Refer to Section 5.3.3, Table 5-16 of the SDA Physical Layer Specification, Version 3.01 for more detailed information. Table 9: CSD Register (CSD Version 2.0) Field Typical CSD Value Description CSD_STRUCTURE 2.0 CSD Structure - - Reserved TAAC 1.5 msec Data read access-time NSAC 0 Data read access-time-2 in CLK cycles (NSAC*100) TRANS_SPEED Standard Mode 25 MHz High Performance Mode 50MHz Maximum data transfer rate Ultra High Speed Mode 104MHz CCC All (inc. WP, lock/unlock) Card command classes READ_BL_LEN 9 Maximum read data block length READ_BL_PARTIAL Yes Partial blocks for read allowed WRITE_BLK_MISALIGN No Write block misalignment READ_BLK_MISALIGN No Read block misalignment DSR_IMP No DSR implemented - 0 Reserved C_SIZE See SDA Physical Layer Specification Device size - 0 Reserved ERASE_BLK_EN 1 Erase single block enable SECTOR_SIZE 64 blocks Erase sector size WP_GRP_SIZE 000000b Write protect group size WP_GRP_ENABLE No Write protect group enable Reserved - Reserved for MMC compatibility R2W_FACTOR X4 Write speed factor WRITE_BL_LEN Maximum write data block length WRITE_BL_PARTIAL No Partial blocks for write allowed - - Reserved FILE_FORMAT_GRP 0 File format group COPY Has been copied Copy flag (OTP) PERM_WRITE_PROTECT Not protected Permanent write protection TMP_WRITE_PROTECT Not protected Temporary write protection FILE_FORMAT HD w/partition File format Reserved - Reserved CRC CRC7 CRC Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 15 SanDisk microSD™, microSDHC™ and microSDXC™ cards Field - Typical CSD Value - 3.5.4 OEM Product Manual 3.7 Description Not used, always "1" Card Status Register The Card Status Register (CSR) transmits the card's status information (which may be stored in a local status register) to the host. The CSR is defined in Section 4.10.1 in the SDA Physical Layer Specification, Version 3.01. 3.5.5 SD Status Register The SD Status Register (SSR) contains status bits that are related to the microSD Card proprietary features and may be used for future applications. The SD Status structure is described in Section 4.10.2 in the SDA Physical Layer Specification, Version 3.01. 3.5.6 Relative Card Address Register The 16-bit Relative Card Address (RCA) Register carries the card address published by the card during the card identification. Refer to Section 5.4 in the SDA Physical Layer Specification, Version 3.01 for more information. 3.5.7 SD Card Configuration Register The SD Card Configuration Register (SCR) is in addition to the CSD Register. The SCR provides information about special features in the SanDisk SD Card products. For more information, refer to Section 5.6 in the SDA Physical Layer Specification, Version 3.01. 3.5.8 microSD Card Product Family Registers in SPI Mode All card registers are accessible in SPI Mode. Their format is identical to the format in the SD Bus Mode; however a few fields are irrelevant in SPI Mode. In SPI Mode, the Card Status Register also has a different, shorter format. Refer to Section 7.4 in the SDA Physical Layer Specification, Version 3.01 for more details. 3.5.9 Data Interchange Format and Card Sizes In general, a file system provides structure for data in SanDisk microSD Card products. The SD Card File System Specification, published by the SDA, describes the file format system that is implemented in the microSD Card products. In general, each card is divided into two separate DOS-formatted partitions as follows: • User Area–used for secured and non-secured data storage and can be accessed by the user with regular read/write commands. • Security Protected Area–used by content protection applications to save security related data and can be accessed by the host using the secured read/write command after doing authentication as defined in the SD Security Specification. The security protected area size is defined by SanDisk as approximately one percent of the total size of the card. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 16 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 Table 10: Minimum User Area DOS Image Parameters Capacity 1 Total LBAs 2 No. of Partition Total Partition System Area Sectors Sectors 2 User Data Sectors 2 User Data Bytes 2 2 200GB   384503808   32768   384471040   384438272   196832395264   128GB   249736192   32768   249703424   249670656   127831375872   64GB   124735488   32768   124702720   124669952   63831015424   32GB   62333952   8192   62325760   62309376   31902400512   16GB   31116288   8192   31108096   31099904   15923150848   8GB   15523840   8192   15515648   15507456   7939817472   4GB   7744512   8192   7736320   7728128   3956801536   1 1 (GB) = 1 billion bytes. Some capacity not available for data storage. Total LBAs, Number of Partition System Area Sectors, Total Partition Sectors, User Data Sectors and User Data Bytes are minimum values. Actual values may vary depending on flash technology used. 2 4 MICROSD CARD PROTOCOL DESCRIPTION 4.1 General Description SD Protocol information for cards in the SanDisk microSD Card Product Family is contained in this chapter; information includes SD bus protocol, card identification, and a functional description. 4.2 SD Bus Protocol Communication over the SD bus is based on command and data-bit streams initiated by a start bit and terminated by a stop bit. See Section 3.6.1 of the SDA Physical Layer Specification, Version 3.01 for details. 4.3 Functional Description In the SanDisk microSD Card Product Family, the host controls all communication between itself and the cards. This section provides a general overview of the card identification and data transfer modes; commands; card dependencies; various card operation modes and restrictions for controlling the clock signal. For SD Card commands, together with corresponding responses, state transitions, error conditions, and timings refer to Section 4 of the SDA Physical Layer Specification, Version 3.01. 4.3.1 Card Identification Mode In Card Identification Mode, the host resets all cards, validates operation voltage range, identifies and requests cards to publish a relative card address. For more information see Section 4.2 in the SDA Physical Layer Specification, Version 3.01. 4.3.2 Data Transfer Mode Functionality of the Data Transfer Mode can be found in Section 4.3 of the SDA Physical Layer Specification, Version 3.01. This section includes information about data read and write, erase, write-protect management, card lock/unlock operations, Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 17 SanDisk microSD™, microSDHC™ and microSDXC™ cards OEM Product Manual 3.7 application-specific commands, switch function command, high-speed mode, command system, and the Send Interface Condition command (CMD8). CMD8 is part of identification mode and command functional differences in microSD cards. 4.3.3 Clock Control The host can use the bus clock signal in SanDisk microSD cards to switch them to energy saving mode or to control data flow on the bus. See Section 4.4 of the SDA Physical Layer Specification, Version 3.01. Cyclic Redundancy Codes The Cyclic Redundancy Check (CRC) protects against transmission errors that may occur on the bus in SanDisk microSD Card Product Family cards. Detailed information and examples for CRC7 and CRC16 are provided in Section 4.5 of the SDA Physical Layer Specification, Version 3.01. 4.3.4 Error Conditions See Section 4.6 of the SDA Physical Layer Specification, Version 3.01. 4.3.5 Commands See Section 4.7 of the SDA Physical Layer Specification, Version 3.01 for detailed information about card commands in the SanDisk microSD Card Product Family. 4.3.6 Card State Transition In microSD cards, the state transition is dependent on the received command. The transition is defined in Section 4.8 of the SDA Physical Layer Specification, Version 3.01 along with responses sent on the command line. 4.3.7 Timing Diagrams and Values See Section 4.12 of the SDA Physical Layer Specification, Version 3.01. 4.3.8 Speed Class Specification SDA speed class specification classifies card minimum write performance by speed class number and offers the method to test performance. For more information, refer to Section 4.13 of the SDA Physical Layer Specification, Version 3.01. 4.3.9 Erase Timeout Calculation See Section 4.14 of the SDA Physical Layer Specification, Version 3.01. Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 18 SanDisk microSD™, microSDHC™ and microSDXC™ cards 5 OEM Product Manual 3.7 MARKING Performance microSD Cards Premier microSD Cards Superior microSD Cards Figure 5: Marking Specs for microSD, microSDHC, microSDXC Cards Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 19 SanDisk microSD™, microSDHC™ and microSDXC™ cards 6 OEM Product Manual 3.7 ORDERING INFORMATION To order SanDisk products directly from SanDisk, please contact your local sales office. Part Number Capacity2 SDSDQAB-004G 4 GB SDSDQAB-008G 8 GB SDSDQAB-016G 16 GB SDSDQAB-032G 32 GB SDSDQAB-064G 64 GB SDSDQAD-008G 8 GB SDSDQAD-016G 16 GB Interface Sequential Write: 5 MB/s UHS-I 50 32 GB SDSDQAD-064G 64 GB SDSDQAD-128G 128 GB Sequential Read: 20 MB/s SC4 UHS-I 50 SDSDQAD-032G Speed Class1 Sequential Write: 10 MB/s Sequential Read: 40 MB/s U1/SC10 Sequential Write: 10 MB/s SDSDQAD-200G 200GB UHS-I 104 Sequential Read: 80 MB/s U1/SC10 SDSDQAE-032G 32 GB SDSDQAE-064G 64 GB Sequential Write: 50 MB/s UHS-I 104 Sequential Read: 80 MB/s U3/SC10 1.  Based  on  SanDisk  internal  testing;  performance  may  be  lower  depending  upon  host  device.  1  megabyte  (MB)  =  1  million  bytes.     2.  1  gigabyte  (GB)  =  1  billion  bytes.  Some  capacity  not  available  for  data  storage.     Sep 2015 Version 3.7 © 2015 SanDisk Corporation. All rights reserved. SanDisk Confidential, subject to all applicable non-disclosure agreements. 20