INDUSTRIAL MEMORY SOLUTIONS
NAND FLASH PRODUCTS & DRAM MODULES
In more detail Swissbit offers to it‘s customers the following areas of service:
Product Depth
Customization
Compliance to
- Complete line of DRAM modules
and NAND Flash Solid State Drives
available in a variety of interfaces
and form factors
- Both leading edge technology
and legacy product offerings
- Extended and industrial
temperature grade products
- Unique Chip-On-Board (COB)
technology
- Small form factor removable
NAND Flash cards
- Memory In Package Solutions
- Custom DRAM module and
FLASH designs
- Security features
- Individual labeling
- Design In support
- JEDEC, SDA, CFA, USB-IF, SATA-IO
- RoHS, REACH, WEEE
- UL
- FCC, CE
Sales Service and
Engineering Support
- Fast, effective and experienced sales
staff on hand to serve your needs
- Our expert technical staff is
available for quick response
- Joint product qualification service
- In-House manufacturing in Germany
- Worlds only COB DRAM memory
module manufacturer
2
Quality Standard
OEM Services
- Controlled Bill of Materials (BOM)
- Serialization and Lot Code Tracking
- Support of long life cycles
- Stringent PCN and ECN process
Test for Reliability
- Advantest, King Tiger Technology
and Tanisys Technology test equipment
- World class application testing
- System Level Test During Burn-In
(TDBI)
- Extended and industrial temperature
testing
- Environmental testing
- ISO 9001:2008
Associations
- Member of CompactFlash
Association (CFA)
- Member of SATA-IO
- Member of USB
Implementers Forum
- Member of SecureDigital
Association (SDA)
- Member of Memory
Implementers Forum
- Member of JEDEC
- Member of Small Form
Factor Special Interest
Group SFF-SIG
Intro
Why Choose Swissbit................. 4
Product Features...................... 5
NAND Flash Products
SD / microSD & MMC Cards........... 6
CompactFlash™ Cards................ 8
PATA / SATA SSD 2.5“................... 10
SLIM / mSATA & CFast™ Cards........ 12
USB Flash Drives / Modules.......... 14
DRAM Modules
Unbuffered DIMM..................... 17
SODIMM.................................. 17
Mini / Micro DIMM..................... 17
Registered DIMM....................... 19
Mini RDIMM............................. 19
SORDIMM................................ 19
TECHNOLOGY
COB...................................... 20
Technology Capabilities.............. 21
Part Numbers
NAND Flash Part Numbers........... 22
DRAM Module Part Numbers........ 23
3
Why choose Swissbit
Swissbit, the largest independent
industrial DRAM module and Flash
storage product manufacturer in
Europe, was created through a
management buy-out from Siemens
Memory Products in 2001. With over
20 years of experience in the memory
industry Swissbit has become a
world class leader in technology
supplying high quality, high relia
bility memory storage solutions in
all of the established DRAM and
Flash interfaces. Swissbit’s primary
focus is on the demanding applications in the industrial Computer
markets including Embedded Computing, Automation, Measurement,
Communication, Network, Military,
Aerospace, Transportation, Casino
Gaming and Medical Equipment.
Swissbit customers can rely on longterm availability due to a dedicated
controlled Bill of Material (BOM)
process that results in products with
long lifecycles, reliability, endurance
and longevity, even when running
24 hour / 7 day service cycles. Swissbit
products feature exceptional resistance to shock and vibration and are
available in commercial, extended and
industrial temperature grades along
with Conformal Coating if required.
4
High Quality products “Made in
Germany” and designed with Swiss
Precision result in outstanding
industrial memory solutions. Swissbit
develops all of its products in Switzer
land with manufacturing and test
facilities utilizing state-of-the-art
equipment, processes and production methods which are based in
Germany. Swissbit uses the latest
technology and techniques in order
to offer optimal products for all
customer needs, such as System in
Package (SiP), Flip-Chip and SMT
technology. As the world’s only
manufacturer, Swissbit utilizes the
Chip-On-Board (COB) technology to
produce a line of very robust and
highly integrated DRAM memory
modules.
Swissbit carefully selects premium
materials and subassemblies, conducts
rigorous quality inspections and utilizes
internal and external test laboratories
and simulation systems along with
extensive certified ISO 9001:2008
quality management processes to
ensure innovative memory solutions
that meet even the highest demands
of today and into tomorrow. To guar
antee competitive pricing, Swissbit
focuses on lean company structures,
efficient processes and long-term
relationships with all major semiconductor manufacturers. Because
applications differ, Swissbit also
offers extensive customer service
and will individually tailor memory
solutions to meet specific requirements of system manufacturers and
integrators regarding performance
and cost.
Wide Temperature Support
The storage solutions from Swissbit are designed and approved to operate reliably over a
wide temperature range. The products are verified at temperature corners and pre-stressed
with a burn-in operating functional test (Test During Burn-In - TDBI).
ESD and EMI safe
The product designs are in-line with the latest regulations for electrostatic discharge and
electromagnetic interference. Swissbit aims to exceed these limits with their own in house
technology and production capabilities, for example with System in Package (SiP) competence.
Shock and Vibration
Robustness is one of our key specification targets. The design, assembly and selected
materials guarantee an extremely solid design which has been validated by intense testing.
Life Time Monitoring (LTM)
The Swissbit LifeTimeMonitoring (SBLTM) feature enables users to access the device‘s detailed life
time status and allows predicting imminent failure and thus avoiding unexpected data loss. This
feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology)
interface or vendor specific commands to retrieve the Flash product information.
Zone Protection
The device allows configuring multiple zones with either no protection, write protection or
access protected settings. Each zone is secured with a separate password. A Windows tool or
a programming library is available, the latter allowing easy integration of the SBZoneProtection
functionality into customer applications.
Fast Erase
This feature uses an uninterruptable sequence of single block erase commands for fastest
possible destruction of user data. Even a power-off cannot stop the process which will continue
after power restoration.
Conformal Coating
For selected products Swissbit offers a special protective coating with a thin polyurethane
film against aggressive environmental conditions such as dust, moisture or corrosive gas.
S-300u
1)
S-200u
1)
S-200 / 220
M-100
1)
C-300
C-320
C-400
P-120
X-200
X-200m
X-200s
F-100
F-200
miniTWIST II
unitedCONTRAST II
USB Flash
Module U-110
default implemented; 1) inherently protected by molding process;
on request;
not available;
Nand Flash Products
5
Flash Management
Mechanism
- Optimized Error Correction Code
- Efficient Algorithms for Bad
Block Management
- Real Life Time Monitoring
- Sophisticated Wear Leveling &
Bad Block Management
- Power Fail Robustness
MMC / MicroSD / SDHC
Swissbit’s INDUSTRIAL product lines of SecureDigital (SD) &
Multimedia cards are specifically designed, manufactured
and tested to withstand extreme environmental conditions.
The use of SLC (Single Level Cell) Flash combined with an
optimized Flash controller provides a number of enhanced
product features such as built-in error correction, bad
block management, sophisticated wear leveling & bad
block management algorithms, power loss protection and
power saving modes. Special attention is dedicated to the
mechanical stability and enhanced ESD protection. A high
reliability housing with special connector support provides
resistance against bending and torque. Furthermore, the
gold plated SD connectors will last a minimum of 10,000
insertions.
S-300u
1)
S-200u
1)
S-200 / 220
M-100
1)
default implemented; 1) inherently protected by molding process;
6
NanD Flash Products
on request;
not available;
World‘s
most
reliable
SLC Flash
fitting
microSD
microSD
microSD
Secure Digital
(SD / SDHC)
Multimedia Card
(SD / SDHC)
Series
S-300µ
S-200µ
S-200 / 220
M-100
Interface Compliance
SDA 2.0, SDHC class 6 / 10
SDA 2.0 class 6
SDA 2.0, SDHC class 6 (10)
MMC 3.31, 4.1 & 4.2
Connector
microSD
microSD
SD
MMC
Physical Form
15.0 x 11.0 x (0.7) 1 mm
15.0 x 11.0 x (0.7) 1 mm
32.0 x 24.0 x 2.1 mm
32.0 x 24.0 x 1.4 mm
Flash Type
SLC 2x nm
SLC 4x nm
SLC
SLC
Density
2 GB - 8 GB
512 MB - 2 GB
512 MB - 8 GB
128 MB
Extended: -25°C to +85°C
Extended: -25°C to +85°C
Industrial: -40°C to +85°C
Extended: -25°C to +85°C
Industrial: -40°C to +85°C
Extended: -25°C to +90°C
Industrial: -40°C to +90°C
Storage Temperature
-40°C to +85°C
-40°C to +100°C
-40°C to +100°C
-40°C to +100°C
Shock
50 G
1 000 G
1 000 G
1 000 G
Vibration
2 G
15 G
15 G
15 G
Humidity
93 % RH 40°C, 500 hrs
85 % RH 85°C, 1 000 hrs
85 % RH 85°C, 1 000 hrs
85 % RH 85°C, 1 000 hrs
Data Transfer Mode
SD, SPI
SD, SPI
SD, SPI
1 bit MMC, SPI
Performance
Burst Rate
Read Seq.
Write Seq.
Burst Rate up to 25 MB/s
Read Seq. up to 21 MB/s
Write Seq. up to 13 MB/s
Burst Rate
Read Seq.
Write Seq.
Voltage
2.7 - 3.6 V Normal
2.7 - 3.6 V Normal
2.7 - 3.6 V Normal
2.7 - 3.6 V Normal
2.0 - 3.6 V Basic Communication 2.0 - 3.6 V Basic Communication 2.0 - 3.6 V Basic Communication 2.0 - 3.6 V Basic Communication
Power Consumption
Read typ
50 mA
Write typ
50 mA
Sleep max 0.4 mA
RW typ
30 mA
Write typ
40 mA
Sleep max 0.4 mA
RW typ
28 mA (max 60 mA) Read typ
9 mA (max 15mA)
Write typ
55 mA (max 90 mA) Write typ
15 mA (max 20mA)
Sleep max 0.3 mA
Sleep max 0.2 mA
Swissbit, Part Number, Lot
Code, Mfg. Date
Swissbit, Part Number,
Lot Code, Mfg. Date
Swissbit, Density, CE, Pb free,
Part Number, Lot Code,
Mfg. Date
Operating Temperature
Marking
Target Application
Tools
Part Number
up to 25 MB/s
up to 24 MB/s
up to 22 MB/s
(2 GB - 12 MB/s)
up to 25 MB/s
up to 21 MB/s
up to 18 MB/s
(512 MB - 13 MB/s)
Burst Rate up to 6.5 MB/s
Read Seq. up to 5.7 MB/s
Write Seq. up to 5.9 MB/s
Swissbit, Density, CE, Pb free,
Part Number, Lot Code,
Mfg. Date
Networking, Telecommunication,
Enterprise Computing, Measurement, Point-of-Sale, etc.
Industrial Embedded Systems, Medical Solutions, Point-of-Sale, Gaming Industry,
Automation Solutions, etc.
–
Life Time Monitoring with SD / SPI command set
SFSDxxxxNvBWxss-t-dd-1r1-STD SFSDxxxxNxBNxss-t-dd-1r1-STD
- Compliant with SDA2.0
Specification
- Advanced Wear Leveling &
Block Management
- Power Fail Protection
SFSDxxxxLvBNxss-t-dd-1r1-STD
- Compliant with SDA2.0 Specification
- Sophisticated Wear Leveling & Bad Block Management
- Life Time Monitoring over extended command set
- Intelligent Power Fail Protection & Recovery
SFMMxxxxOvBNxss-t-dd-1r1-STD
- Compliant with MMC
Specification
- Sophisticated Wear Leveling
& Bad Block Management
- Life Time Monitoring with
extended command set
- Intelligent Power Fail
Protection & Recovery
NanD Flash Products
7
COMPACTFLASHTM CARD
CompactFlashTM (CF) cards are still the most popular Flash-based storage
solution used in the embedded and industrial markets. The form factor
as well as the connector is well established. With strong focus on quality,
reliability, robustness and longevity, Swissbit designs its cards with no
compromise.
We only select components and apply design rules which fit the stringent
requirements of our industrial customers. Our hardware and firmware has
been tested and qualified by our experienced team and proved in many
challenging customer applications.
Swissbit‘s CF Series C-3x0 and C-4x0 come in both, commercial (0°C to 70°C)
and industrial temperature (-40°C to 85°C) ranges, providing rugged and
reliable memory for a wide range of demanding applications. They are
designed to solve a broad spectrum of concerns from compatibility, booting
and power fail safety issues to long-term supply, controlled BOM and outstanding Flash protocol handling techniques to ensure industry leading data
integrity. In contrast to commonly promoted sequential performance values,
Swissbit is especially focusing on optimized random access values, being
one of the key factors in industrial applications.
C-300
C-320
C-400
P-120
Power Fail Protection
Power Fail Recovery
SLC NAND Flash
Controlled BOM / PCN Process
Standard S.M.A.R.T. Support
Security Erase / Security Feature Set
Read Disturb Management
Trim support
Feature Comparison
default implemented;
on request;
not available;
C-300
C-320
C-400
default implemented; 1) inherently protected by molding process;
8
NanD Flash Products
on request;
not available;
UDMA6 CF
CompactFlash™
CompactFlash™
CompactFlash™
Card
Card
Card
Series
C-300
C-320
C-400
Interface Compliance
CFA4.1 / CFA3.0
True IDE / PC card
CFA4.1 / CFA3.0
True IDE / PC card
CFA5.0 / CFA4.1 & 3.0 compliant
True IDE / PC card
Connector
CFC Type I
CFC Type I
CFC Type I
Physical Form
36.4 x 42.8 x 3.3 mm
36.4 x 42.8 x 3.3 mm
36.4 x 42.8 x 3.3 mm
Flash Type
SLC
SLC
SLC
Density
128 MB to 8 GB
2 GB to 32 GB
2 GB to 64 GB
Operating Temperature
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature
-50°C to +100°C
-50°C to +100°C
-50°C to +100°C
Shock
1 500 G
1 500 G
1 500 G
Vibration
20 G
20 G
20 G
Humidity
85 % RH 85°C, 1 000 hrs
85 % RH 85°C, 1 000 hrs
85 % RH 85°C, 1 000 hrs
Data Transfer Mode
Up to UDMA4, MDMA4 & PIO6
Up to UDMA4, MDMA4 & PIO6
Up to UDMA6, MDMA4 & PIO6
Performance
Burst Rate
up to 66 MB/s
Read Seq. 1ch up to 24 MB/s
2ch up to 37 MB/s
Write Seq. 1ch up to 10 MB/s
2ch up to 20 MB/s
Burst Rate
Read Seq.
Write Seq.
Voltage
3.3 V +/- 5 %, 5 V +/- 10 %
3.3 V +/- 5 %, 5 V +/- 10 %
3.3 V +/- 5 %, 5 V +/- 10 %
Power Consumption
PIO typ 50 mA @ 3.3 V
DMA typ 70 mA @ 3.3 V
DMA typ 110 mA @ 5 V
PIO typ 60 mA @ 3.3 V
DMA typ 90 mA @ 3.3 V
DMA typ 130 mA @ 5 V
PIO typ 60 mA @ 3.3 V
DMA typ 80 mA @ 3.3 V
DMA typ 90 mA @ 5 V
Marking
Target Application
Tools
Part Number
up to 66 MB/s
up to 45 MB/s
up to 35 MB/s
(512 MB-13 MB/s)
Burst Rate
up to 133 MB/s
Read Seq.
up to 65 MB/s
Write Seq.
up to 40 MB/s
Write Rand. 4k up to 300 IOPS
WEEE, Swissbit, Density, CE, Part Number, Lot Code, RoHS
Industrial Embedded Systems, Medical Solutions, Point-of-Sale, Gaming Industry,
Automation Solutions, etc.
Windows / Linux Application, API/DLL for extended S.M.A.R.T. option
Security & SBZoneProtection option
SFCFxxxxHxBK1ss-t-xx-5r3-SMA 1ch
SFCFxxxxHxBOxss-t-dd-5r3-SMA
SFCFxxxxHxBKxss-t-xx-5r3-SMA 2ch
- Sophisticated Wear Leveling & Bad Block Management
- S.M.A.R.T. support with extended command set
- Intelligent Power Fail Protection & Recovery
- Security Features available C-320 2 - 16GB:
ZoneProtection option, Fast Erase option
SFCFxxxxHvBUxss-t-dd-5r7-SMA
- Low power consumption
- High IOPS performance
for 4k write (no DRAM)
- Sophisticated Wear Leveling
& Bad Block Management
- Read Disturb Management
- Intelligent Power Fail
Protection & Recovery
- S.M.A.R.T. support with
extended command set
- Trim support
- SBZoneProtection option
- Fast Erase option
NanD Flash Products
9
2.5“ SSD SATA & PATA / IDE
Swissbit‘s Solid-State Drive (SSD) line are drop-in replace
ments for traditional 2.5“ hard disk drives (HDD). These
SSDs are offered in both, Parallel ATA (PATA) and Serial
ATA (SATA) interfaces. This line is designed for industrial
usage and does not support dedicated optimization techniques commonly used in „Enterprise SSDs“.
Critical factors like long data retention, no compromise
power fail safety and and long product lifecycles are
key for our industrial customers. For that reason our SSD
line uses the most reliable SLC Flash combined with
rugged hardware design and state-of-the-art firmware
technologies to provide the best performance in quality,
reliability and data integrity. For many applications,
especially in the lower and middle densities Swissbit‘s
SSDs are the HDD replacement of choice.
SLC
MLC
TLC
High Density
Total Cost Per Bit
Reliability & Durability
Industrial Temperature
Low Power Consumption
Write Performance
Partial Programming
ECC Requirement
Data Retention
Longevity
NAND Flash Technology
Comparision
best;
average;
worst
P-120
X-200
default implemented; 1) inherently protected by molding process;
10
NanD Flash Products
on request;
not available;
PATA SSD 2.5“
SATA SSD 2.5"
Solid State Drive
Solid State Drive
Series
P-120
X-200
Interface Compliance
IDE / ATA 133
SATA II - 3 GBit/s
Connector
ATA 44 pin, 2 mm pitch
15 + 7 pin serial ATA
Physical Form
100.2 x 69.85 x 9.0 mm
100.2 x 69.85 x 9.0 mm
Flash Type
SLC
SLC
Density
4 GB - 32 GB
4 GB - 128 GB
Operating Temperature
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature
-50°C to +100°C
-50°C to +100°C
Shock
1 500 G
1 500 G
Vibration
20 G
20 G
Humidity
85 % RH 85°C, 1 000 hrs
85 % RH 85°C, 1 000 hrs
Data Transfer Mode
up to PIO4, MDMA4, UDMA4
PIO, MDMA, up to UDMA6
Performance
Burst Rate up to 66 MB/s
Read Seq. up to 45 MB/s
Write Seq. up to 35 MB/s
Burst Rate up to 300 MB/s
Read Seq. up to 120 MB/s
Write Seq. up to 95 MB/s
Voltage
5 V +/- 10 %
5 V +/- 10 %
Power Consumption
PIO typ 55 mA
UDMA typ 135 mA
Idle
5 mA
Marking
Swissbit, Density, CE, Pb free, Part
Number, Lot Code, Mfg. Date, Pin
Mode
Target Application
Tools
Part Number
UDMA6 typ 260mA, max 320mA
Idle 140mA
Swissbit, Density, CE, Pb free, Part
Number, Lot Code, Mfg. Date
Industrial Embedded Systems, Medical Solutions, Point-of-Sale,
Gaming Industry, Automation Solutions, etc.
Windows / Linux Application, API/DLL for extended
S.M.A.R.T. option
SFPAxxxxQvBOxss-t-dd-2r3-STD
- ATA 133 compliant
- Sophisticated Wear Leveling
& Bad Block Management
- S.M.A.R.T. support with
extended command set
- Intelligent Power Fail
Protection & Recovery
- Security Features available
SFSAxxxxQvBRxss-t-dd-2r6-STD
- Ideal Replacement for 2.5“
SATA HDDs
- Low Power Consumption
- No Noise or Temperature Issues
- Long Useful Life
- S.M.A.R.T. support
- Advanced Wear Leveling & Block
Management
- Power Fail Protection
- Security Features available
NanD Flash Products
11
MSATA SSD, SLIM SATA & CFASTTM
SLIM SATA SSD (MO-297A)
mSATA SSD (MO-300B)
SLIM SATA SSD
MO-297A
100.2 mm
mSATA SSD
MO-300B
CFastTM Card
69.85 mm
39 mm
36.40 mm
50.8 mm
54 mm
The X-200 Series Slim SATA & mSATA
embedded SSDs standard is ratified
by JEDEC under specification number
MO-297A & MO-300B. These products
are designed as a cost efficient Solid
State Drive alternative to larger size
SSDs in embedded applications.
The Slim SATA X-200s includes the
same standard 22-pin SATA connector
as the 2.5” drives. This allows system
designers to leverage standard SATA
cabling or host connections for their
application.
SATA 2.5“
SOLID STATE DRIVE
29.85 mm
42.80 mm
Product size comparision
CFastTM Card – the next CompactFlashTM Generation
The CFast™ card combines the CompactFlash™ (CF) card form factor with a
Serial ATA (SATA) interface. With this merging of two industry standards, the
CFast™ card specification was created to replace existing hard drives and
CompactFlash™ in applications requiring small form factors, long life endurance and the ability to withstand shock, vibration, extreme temperatures
(-40°C to +85°C), high altitude and other aggressive environments.
Swissbit’s CFast™ is designed to provide rugged storage for embedded and
industrial systems. In these markets, performance, data and system reliability, system downtime, power fail robustness and flexibility are important
design considerations.
The CFast™ card operates with 3.3 Volt low power source and supports three
SATA power management states: Active, Partial and Slumber. This standard is
a perfect choice for both, boot devices and removable applications, where
low to medium storage densities (up to 64GB) are required and the physical
size of conventional mechanical or solid state hard drives are impractical.
Certainly, the Swissbit CFast™ card comes with full engineering and customizing
support and life time monitoring features, like S.M.A.R.T. with our intelligent
flash managing algorithms and error correction, the latest F-200 Series will
continue to provide the same reliability parameters using 32nm Flash instead of
4xnm technology while offering competitive pricing and SLC memory densities.
X-200m
X-200s
F-100
F-200
default implemented; 1) inherently protected by molding process;
12
NanD Flash Products
on request;
not available;
CFastTM Card
CFastTM Card
mSATA SSD
SLIM SATA SSD
MO-300B
MO-297A
Series
X-200m
X-200s
F-100
F-200
Interface Compliance
sATA II - 3 Gbit/s
ATA7
sATA II - 3 Gbit/s
ATA7
CFast™ - sATA II - 3 Gbit/s
ATA7
CFast™ – sATA II - 3 Gbit/s
ATA8/ATA7 compliant
Connector
52 pin PCI Express (PCIe) mini
15 + 7pin Serial ATA
CFast™ Type I
CFast™ Type I
Physical Form
50.8 x 29.85 x 3.3 mm (MO-300B) 54 x 39 x 4.00 mm (MO-297A)
36.4 X 42.8 X 3.6 mm
36.4 X 42.8 X 3.6 mm
Flash Type
SLC
SLC
SLC
SLC
Density
2 GB - 32 GB
2 GB - 32 GB
2 GB - 32 GB
2 GB - 64 GB
Operating Temperature
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature
-50°C to +100°C
-50°C to +100°C
-50°C to +100°C
-50°C to +100°C
Shock
1 500 G
1 500 G
1 500 G
1 500 G
Vibration
20 G
20 G
20 G
20 G
Humidity
85 % RH 85°C, 1 000 hrs
85 % RH 85°C, 1 000 hrs
85% RH 85°C, 1 000 hrs
85 % RH 85°C, 1 000 hrs
Data Transfer Mode
up to PIO4, MDMA2, UDMA6
up to PIO4, MDMA2, UDMA6
up to PIO4, MDMA2, UDMA6
up to PIO4, MDMA2, UDMA6
Performance
Burst Rate up to 300 MB/s
Read Seq. up to 120 MB/s
Write Seq. up to 95 MB/s
Burst Rate up to 300 MB/s
Read Seq. up to 120 MB/s
Write Seq. up to 95 MB/s
Burst Rate up to 300 MB/s
Read Seq. up to 120 MB/s
Write Seq. up to 95 MB/s
Burst Rate
Read Seq.
Write Seq.
Write Rand. 4k
Voltage
3.3 V +/- 5 %
5 V +/- 10 %
3.3 V +/- 5 %
3.3 V +/- 5 %
Power Consumption
Marking
Target Application
Tools
Part Number
typ 300 mA, max 490 mA
Idle 180 mA
typ 260 mA, max 320 mA
Idle 140 mA
Swissbit, Density, Part Number, Lot Code, Mfg. Date
typ 300 mA, max 420 mA
Idle 180 mA
up to 300 MB/s
up to 130 MB/s
up to 100 MB/s
up to 600 IOPS
typ 140 mA, max 250 mA
Idle 80 mA, Sleep 8 mA
WEEE, Swissbit, Density, CE, Part Number, Lot Code,
Mfg. Date, RoHS
Industrial Embedded Systems, Medical Solutions, Point-of-Sale, Gaming Industry, Automation Solutions, etc.
Windows / Linux Application, API/DLL for extended
S.M.A.R.T. optional
Windows / Linux Application,
API/DLL for extended S.M.A.R.T.
optional
Evaluation kit with 2.5” sATA
adapter board available
Windows / Linux Application,
API/DLL for extended S.M.A.R.T.
optional Evaluation kit
with 2.5” sATA adapter board
available Security & SBZoneProtection option
SFSAxxxxUvBRxss-t-dd-2r6-STD SFSAxxxxVvBRxss-t-dd-2r6-STD SFCAxxxxHvBRxss-t-dd-2r6-STD SFCAxxxxHvBVxss-t-dd-2r6-STD
- Ideal Replacement for 2.5“ SATA HDDs
- Cost efficient SATA SSD module
- sATA II Interface compliant
- Advanced Wear Leveling & Block Management
- S.M.A.R.T. support
- Power Fail Protection
- Alternative for expensive
sATA SSD
- Replacement for CFC by
sATA Chipset
- sATA II Interface compliant
- Advanced Wear Leveling &
Block Management
- S.M.A.R.T. support
- Power Fail Protection
- Power modes (slumber, sleep)
- Low Power removable
or fix SATA SSD
- High IOPS performance
for 4k write (no DRAM)
- Sophisticated Wear Leveling
& Bad Block Management
- Read Disturb Management
- Intelligent Power Fail
Protection & Recovery
- S.M.A.R.T. support with
extended command set
- Trim support
- SBZoneProtection option
- Fast Erase option
NanD Flash Products
13
UNIVERSAL SERIAL BUS – USB FLASH DRIVE / MODULE
The Universal Serial Bus (USB) interface is very well established and has completely overtaken other forms of serial or parallel interfaces for computer
peripherals and memory storage devices. Advantages of USB are its flexibility,
reasonably fast sequential data transfer rate and its ability to obtain power
through the connector. Almost every computer or embedded system supports
devices with the standard USB socket and several internal on-board terminal
headers. Swissbit is offering both in different form factors and in commercial
and industrial operating temperature ranges. State of the art NAND Flash
handling algorithms, stringent component selection, product change control
and a 100% implemented final system test at full temperature range (-40° to
+85°C) qualify Swissbit’s USB Flash Drive (UFDs) not only for commercial but
also and especially for embedded and industrial markets.
Swissbit’s U-110 Series (USB Flash Module) offers a no compromise flash based
storage solution for:
• Embedded PCs that need a rugged reliable storage solution
• Servers with backup or recovery functionality
• General industrial computers with needs for easy to use boot mediums
All Swissbit USB solutions combine security features and Life Time Monitoring
tools for product life control.
miniTWIST II
unitedCONTRAST II
USB Flash
Module U-110
default implemented; 1) inherently protected by molding process;
14
NanD Flash Products
on request;
not available;
Series
USB Flash Module
USB FLASH DRIVE
USB FLASH DRIVE
U-110
unitedCONTRAST II
miniTWIST/CAP II
Interface Compliance
USB 2.0 high speed, USB 1.1 compliant
Connector
Standard: 2.54 mm - 10 Pin
Low Profile: 2.00 mm - 10 Pin
USB 2.0 A-Plug
USB 2.0 A-Plug
Physical Form
36.8mm x 26.65 mm x 2.4 mm
68.0 mm x 18.0 mm x 8.0 mm
55.0 mm x 16.0 mm x 7.0-8.0 mm
Flash Type
SLC
SLC
SLC
Density
1 GB to 8 GB
512 MB to 8 GB
128 MB to 4 GB
Operating Temperature
Commercial: 0°C to +70°C
Industrial: -40 to +85°C
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Commercial: 0°C to +70°C
Storage Temperature
-50°C to +100°C
-50°C to +100°C
-50°C to +100°C
Shock
50 G
50 G
50 G
Vibration
15 G
15 G
15 G
Humidity
85 % RH 85°C, 500 hrs
85 % RH 85°C, 500 hrs
85 % RH 85°C, 500 hrs
Data Transfer Mode
full / high speed
full / high speed
full / high speed
Performance
480 Mbit/s USB 2.0 high speed
Read Seq. up to 32 MB/s
Write Seq. up to 23 MB/s
480 Mbit/s USB 2.0 high speed
Read Seq. up to 32 MB/s
Write Seq. up to 23 MB/s
480 Mbit/s USB 2.0 high speed
Read Seq. up to 18 MB/s
Write Seq. up to 12 MB/s
Voltage
5 V +/-10 %
5 V +/- 10 %
5 V +/- 10 %
Power Consumption
Full Speed typ 90 mA
High Speed typ 100 mA
Full Speed typ 90 mA
High Speed typ 100 mA
Full Speed typ 80 mA
High Speed typ 100 mA
Marking
WEEE, Swissbit, Density, CE, FCC, Part
WEEE, Swissbit, Density
Number, Lot Code
Target Application
Industrial Embedded Systems, Medical Solutions, Point-of-Sale, Gaming Industry,
Automation Solutions, etc.
Tools
Part Number
WEEE, Swissbit
Windows / Linux Application
SFUIxxxxJvBPxss-t-dd-2r1-STD - 2.54 mm
SFU2xxxxEvBPxss-t-dd-1r1-STD
SFUIxxxxKvBPxss-t-dd-2r1-STD - 2.00mm
- Bootable USB Drive
- Compliant with USB Specification
2.0 high speed
- Support latest OS as Fixed Drive
- Connector Pitch Variations
- Robust Design and Shock
Vibration Resistant
- Approved USB Host Solution
- Hot Pluggable / Plug & Play
- Optimized Wear Leveling
- Custom Marking Option
- Security Features
- Password Manager available
SFU2xxxxDvBP1ss-t-dd-1r1-STD
- Low Power Consumption
- Small Form Factor
- Optimized Wear Leveling
- Rotating Clip or Cap Option
- Password Manager available
NanD Flash Products
15
DRAM Modules
Swissbit commits to offering the highest quality, JEDEC standard and customized DRAM modules for industrial applications. As a DRAM module manufacturer, we use strategic dual sources of DRAM suppliers to offer our customers a reliable, long term supply of leading edge and legacy memory
module products. Special focus is put into working with suppliers that offer
extended availability of DRAM die revisions, avoiding frequent requalification efforts with our customers.
Swissbit’s quality focus starts with sourcing the highest quality grade DRAMs
and, where defined, with utilizing fully compliant JEDEC module raw cards
either as in-house PCB design or from top quality design partners. For all
modules the passives and other active components selected are of the
highest available quality grade. Using Surface Mount Technology (SMT) and
Chip-On-Board (COB) processes in production on fully certified facilities in
Germany allows Swissbit to sustain a quality focus during the entire assembly
process. Traceability is guaranteed through the complete manufacturing and
testing flow. We ensure the highest quality level for our customers with world
class application testing. Swissbit uses internally developed application software to test 100 % of all modules under real world conditions with diverse
pattern and stress methods and to cover the complete memory array including
ECC components by constantly adapting to the latest memory controller
features. For industrial temperature grade modules the application tests are
performed at -40°C and 85°C T AMBIENT.
With a stringent internal product qualification, fast customer return processing
and the dedication to be an always improving company, Swissbit constantly
works on providing its customers the best DRAM modules available in
the market at a competitive price. Swissbit is committed and able to design,
manufacture and test customer-specific module solutions. With broad
experience from COB technology, we can offer PCB design and layout services,
development of individual test solutions, thermal simulations, DRAM component
sourcing, controlled manufacturing and special coating options.
With our Swissbit DRAM modules you can keep the total system cost at a
minimum.
16
DRAM MODULES
unbuffered DIMM products
LONG UDIMM / WITH AND WITHOUT ECC
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR3-UDIMM
1333 / CL9
1 GB - 8 GB
x64
1.18“ (29.97 mm)
1.50 V
240
SGUxxx64xxxxxxx-ssR
BGA
DDR3-UDIMM ECC
1333 / CL9
1 GB - 8 GB
x72
1.18“ (29.97 mm)
1.50 V
240
SGUxxx72xxxxxxx-ssR
BGA
DDR2-UDIMM
800 / CL6
512 MB - 2 GB
x64
1.18“ (29.97 mm)
1.80 V
240
SEUxxx64xxxxxxx-ssR
BGA
DDR2-UDIMM ECC
800 / CL6
1 GB - 2 GB
x72
1.18“ (29.97 mm)
1.80 V
240
SEUxxx72xxxxxxx-ssR
BGA
DDR1-UDIMM
400 / CL3
512 MB - 1 GB
x64
1.25“ (31.75 mm)
2.50 V
184
SDUxxx64xxxxxxx-ssR
TSOP
DDR1-UDIMM LP
400 / CL3
512 MB - 1 GB
x64
1.00“ (25.40 mm)
2.50 V
184
SDUxxx64xxxxxxx-ssR
COB
DDR1-UDIMM ECC
400 / CL3
512 MB - 1 GB
x72
1.25“ (31.75 mm)
2.50 V
184
SDUxxx72xxxxxxx-ssR
TSOP
DDR1-UDIMM ECC LP
400 / CL3
512 MB - 1 GB
x72
1.00“ (25.40 mm)
2.50 V
184
SDUxxx72xxxxxxx-ssR
COB
SO-DIMM / WITH AND WITHOUT ECC / RUGGED XR-DIMM
DDR3-SODIMM
DDR3-SO-UDIMM
DDR3-XR-DIMM
TM
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
1333 / CL9 *)
1 GB - 8 GB
x64
1.18“ (29.97 mm)
1.50 V *)
204
SGNxxx64xxxxxxx-ssRT
BGA
1333 / CL9 *)
1 GB - 8 GB
x72
1.18“ (29.97 mm)
1.50 V *)
204
SGNxxx72xxxxxxx-ssRT
BGA
1333 / CL9
1 GB - 4 GB
x72
38 mm x 67.5 mm
1.50 V *)
240
SGVxxx72xxxxxxx-ssRT
BGA
DDR2-SODIMM
800 / CL6
512 MB - 4 GB
x64
1.18“ (29.97 mm)
1.80 V
200
SENxxx64xxxxxxx-ssR
BGA
DDR2-SODIMM LP
800 / CL6
512 MB - 2 GB
x64
0.94“ / 1.18“
1.80 V
200
SENxxx64xxxxxxx-ssR
COB
DDR1-SODIMM
400 / CL3
256 MB - 1 GB
x64
1.25“ (31.75 mm)
2.50 V
200
SDNxxx64xxxxxxx-ssR
BGA
DDR1-SODIMM LP
400 / CL3
256 MB - 2 GB
x64
1.00“ (25.40 mm)
2.50 V
200
SDNxxx64xxxxxxx-ssR
COB
DDR1-SODIMM ECC
400 / CL3
256 MB - 1 GB
x72
1.00“ (25.40 mm)
2.50 V
200
SDNxxx72xxxxxxx-ssR
COB
SDR-SODIMM
133 / CL3
128 MB - 1 GB
x64
1.00“ (25.40 mm)
3.30 V
144
SSNxxx64xxxxxxx-ssR
COB
SDR-SODIMM ECC
133 / CL3
128 MB - 1 GB
x72
1.00“ (25.40 mm)
3.30 V
144
SSNxxx72xxxxxxx-ssR
COB
*) DDR3-1600 CL11 and / or DDR3L (1.35V) on request
MINI-UDIMM / MICRODIMM / 100PIN-DIMM
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR3-MiniUDIMM
1333 / CL9
1 GB - 4 GB
x72
1.18“ / 0.74“
1.50 V
244
SGLxxx72xxxxxxx-ssRT
BGA
DDR2-MicroDIMM
667 / CL5
1 GB
x64
1.18“ (29.97 mm)
1.80 V
214
SEMxxx64xxxxxxx-ssR
BGA
DDR1-100PIN_DIMM
333 / CL2.5
128 MB - 512 MB
x72
1.00“ (25.40mm)
2.50 V
100
SDUxxx32xxxxxxx-ssR
TSOP
DRAM MODULES
17
RUGGEDIZED DIMMS
Designers of rugged platforms face a difficult decision
when planning their memory layout. Either they use
memory components directly soldered to the system
board, the most rugged but also expensive and inflexible solution, or they take standard SO-DIMMs and try to
ruggedize them by using straps or glue in order to hold
them in their socket.
Swissbit in cooperation with the SFF-SIG consortium
(Small Form Factor – Special Interest Group) has developed
a rugged module called XR-DIMMTM, the abbreviation XR
standing for eXtreme Rugged.
Using special mezzanine connectors and mounting holes
to attach the module to the system board creates a true
rugged system with the easy integration and flexibility
of DIMM solutions and the shock and vibration immunity
of implementations with DRAMs soldered to the board.
The XR-DIMM closely follows the DDR3 72bit SODIMM
standard and makes design in as easy as using a JEDEC
module, unburdening the system designer of memory
channel layout.
With multiple module densities the system integrator
can create different memory populations with one
system platform, avoiding multiple system board SKUs
and taking benefit in perfectly tested modules with a
just in time purchase option.
Memory down
SODIMM with fixture
XR-DIMM
Design in / Layout
Difficult
Easy
Easy
Flexibility of memory population
Difficult
Easy
Easy
Testability after soldering
Medium
Easy
Easy
Upgrade / Repair
Difficult
Easy
Easy
Small to Medium
Medium to Small
Medium to Small
No
Yes
Yes
Good
Medium (with glue / strap)
Good
Required board space
Stackable solution
Protection against shock
Protection against Vibration
Prize
18
DRAM MODULES
Good
Bad
Good
Low to Medium
Low
Medium
Registered DIMM products
Long RDIMM / standard height / with ECC and C/A Parity
DDR3-RDIMM
ECC+Parity
DDR2-RDIMM
ECC+Parity
DDR1-RDIMM
ECC
SDR-RDIMM
ECC
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
1333 / CL9
1 GB - 8 GB
x72
1.18“ (29.97 mm)
1.50 V
240
SGPxxx72xxxxxx-ssR
BGA
800 / CL6
1 GB - 4 GB
x72
1.18“ (29.97 mm)
1.80 V
240
SEPxxx72xxxxxxx-ssR
BGA
400 / CL3
512 MB - 2 GB
x72
1.20“ (30.48 mm)
2.50 V
184
SDRxxx72xxxxxxx-ssR
TSOP / BGA
133 / CL3
256 MB - 512 MB x72
1.20“ (30.48 mm)
3.30 V
168
SSRxxx72xxxxxxx-ssR
TSOP
Low Profile Long RDIMM, UDIMM / with ECC
DDR3-RDIMM
ECC+Parity
DDR3-UDIMM
ECC
DDR2-RDIMM
ECC+Parity
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
1333 / CL9
2 GB - 8 GB
x72
0.70“ (17.78 mm)
1.50 V
240
SGPxxx72xxxxxxx-ssR
BGA
1333 / CL9
2 GB - 4 GB
x72
0.70“ (17.78 mm)
1.50 V
240
SGUxxx72xxxxxxx-ssR
BGA
800 / CL6
1 GB - 2 GB
x72
0.72“ (18.29 mm)
1.80 V
240
SEPxxx72xxxxxxx-ssR
BGA
VLP MiniRDIMM with ECC, Registered SO-RDIMM with ECC
DDR2-MiniRDIMM
DDR2-SO-RDIMM
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
667 / CL5
1 GB
x72
0.72“ (18.29 mm)
1.80 V
244
SEHxxx72xxxxxxx-ssR
BGA
667 / CL5
1 GB - 2 GB
x72
1.18“ (29.97 mm)
1.80 V
200
SEGxxx72xxxxxxx-ssR
BGA
DRAM MODULES
19
Chip on board (cob)
Chip-On-board (COB) technology involves mounting DRAM or Flash semiconductor dies directly on a substrate and connect them by bond wires to the
PCB without the need of packaged component. A coating of an Epoxy encapsulent (or Glob Top) is then applied that hermetically seals and protects the
die and the wire bonded interconnections. The Glob Top also acts like a heat
spreader between the dies and improves the heat emission together with
the low thermal resistance between the die and the PCB.
A COB memory module as offered by Swissbit provides customers with the
following advantages:
- The COB process allows DRAM modules with only 1.00” (25.4 mm)
height and 3.0 mm thickness
- The thermal properties of Swissbit modules are superior to standard SMT
modules. COB modules dissipate heat more efficiently and will run lower
die junction temperatures in demanding convective cooling conditions.
- Swissbit COB modules and Flash products like the SD card are inherently
ruggedized for shock and vibration due to the COB technology and the
Glob Top encapsulation process.
System in Package (SIP)
System in Package (SiP) is the processing of sensitive
bare dies or chips into robust finished modules or components.With 20 years of experience, Swissbit successfully uses advanced packaging technologies in order to
achieve smallest form factors and to build Multi-ChipPackages. With this microelectronic integration approach
our products provide more functionality or highest
memory densities inside one package, various functional
blocks (RF, digital, sensors, security and memory) are
combined, as well as passive components. Beginning
with the wafer and bare die handling, Swissbit utilizes
a flexible chip on board (COB) assembly and packaging
line. Processes like SMT assembly, die bonding, Au and Al
wire bonding, glob top dispensing, precise separation
with laser technology, housing, labeling, laser marking
etc. are very well established. Die stacking, especially for
20
Technology Competence
Flash and DRAM, is one of our expertise besides the
integration of additional hardware features and an
experienced team of testing and quality engineers. Our
own Memory-In-Package line qualifies (but not limits)
Swissbit as the development and production partner for
any dedicated or customized memory–related product
with challenging integration or reliability requirement.
If you cannot achieve the special demands regarding
space and performance using traditional components and
processes, Swissbit offers feasibility studies, manages or
supports your development project and produces prototypes, small and mid-size volumes (up to 50’000 pieces/
month). We will aid you from the time of inception of your
project: from the design phase, prototyping, determining
the circuit layout and material selection, to preparing the
appropriate packaging for transport.
Industrial Temperature Range
In addition to modules for commercial temperature range 0°C to 70°C,
Swissbit also offers products for an
extended temperature range of 0°C
to 85°C T AMBIENT as well as full industrial
temperature range -40°C to 85°C T AMBIENT.
With intensive application testing of
each individual module at low and
high temperature, Swissbit ensures
the highest quality and reliability of
their products.
HEAT SPREADER
The critical condition for DRAMs is
a high die temperature, because it
leads to loss of cell information.
With die sizes continually shrinking
the power dissipation is concentrated
on only a few square millimeters.
Adding a heat spreader to a module
allows the hot spots to easier dissipate the temperature over a bigger
surface. This heat spreader levels out
the module heat dissipation, thus
reducing the hot spot temperature
and improving the module reliability.
Swissbit offers heat spreader solutions
for some of its industrial temperature
grade SODIMMs.
CONFORMAL COATING
Industrial DRAM modules are often
not operated in a clean air environment as compared to standard office
or home conditions. A heavy industry
environment with hot or humid air,
aggressive chloride of sulfite loaded
gas or dust can reduce the life span
of a DRAM module by corroding the
PCB lines or solder contacts. Swissbit
offers a full module surface coating
with a thin film of polyurethane which
effectively protects against most
hazardous environmental conditions.
With this protection the endurance
of the module is greatly improved,
thus reducing maintenance periods
and avoiding sudden breakdown of
a system. This option is currently
available for SODIMMs as well as for
several Flash products.
MINIATURIZATION
One of Swissbit‘s main capabilities
is miniaturization. This is not just
limited to the design and production
of small form factors but also provides
e.g. DRAM test or flash handling
algorithms which achieve highest
reliability and life times by dealing
with the power, temperature and
space restrictions of small and smallest
devices. Our portfolio reaches from
ultra low profile DIMMs or highest
integration wire-bonded modules to
highly integrated uSD-Cards, Chip Card
Inlays or custom Multi-Chip-Packages.
21
Flash Part number Decoder
S
1
F
2
CF
3
2048
4
H
5
4
6
B
7
o
8
2
9
TO - I - M
10
11
12
S
13
-
*
14
-
*
15
Swissbit
Memory (1)
Design Option (15)
Memory Type (2)
F: Flash Products
Configuration (14)
PIN Mode (13)
0: 1 nCE & R/nB
Product Type (3)
1: 2 nCE & R/nB
U2: USB 2.0 Drive
2: 4 nCE & R/nB
CA: CFast™
A: LGA 1 nCE & R/nB
CF: CompactFlash™
B: LGA 2 nCE & R/nB
UI: UFD internal / Module
C: LGA 4 nCE & R/nB
SD: SecureDigital card
S: TSOP 1 nCE & R/nB
MM: Multimedia card
T: TSOP 2 nCE & R/nB
PA: PATA/IDE
U: TSOP 4 nCE & R/nB
SA: SATA
E: COB 1 nCE
F: COB 2 nCE
Density (4)
0016: 16 MByte
4096: 4 GByte
Flash Package Classification (12)
0032: 32 MByte
8192: 8 GByte
M: SLC SDP (single die package)
0064: 64 MByte
016G: 16 GByte
D: SLC DDP (dual die package)
0128: 128 MByte
032G: 32 GByte
Q: SLC QDP (quad die package)
0256: 256 MByte
064G: 64 GByte
N: SLC ODP (octal die package)
0512: 512 MByte
128G: 128 GByte
G: MLC SDP (single die package)
1024: 1 GByte
256G: 256 Gbyte
L: MLC DDP (dual die package)
2048: 2 GByte
512G: 512 Gbyte
H: MLC QDP (quad die package)
Product Dimension (5)
H: CompactFlashTM / CFastTM
O: MLC ODP (octal die package)
Temperature Rating (11)
J: UFD Module 2.54 mm terminal header
I: Industrial Temp. (-40°C to + 85°C)
K: UFD Module 2.00 mm terminal header
E: Extended Temp. (-25°C to +85/90°C)
L: SD card
C: Commercial Temp. (0°C to + 70°C)
N: microSD card
O: Multimedia card
Flash Supplier (10 )
Q: SSD 2.5”
SA: Samsung
U: mSATA (MO-300B)
MT: Micron Technology
V: SLIM SATA (MO-297A)
HY: Hynix
Product Generation (6)
Memory Organization (7)
Technology (8)
22
Part Numbers
TO: Toshiba
Chips / Channels (9)
DRAM Part Number Decoder
S
1
G
N
08G
72
G1
B
B
2
2
3
4
5
6
7
8
9
SA - CC
10
11
*
12
R
T
13
14
Swissbit
Thermal Sensor /
Memory (1)
Heat Spreader (14)
RoHs/ Lead Free (13)
Product Group (2)
Temperature Rating (12)
S: SDRAM SDR
D: SDRAM DDR
C: (or blank) (0°C to +70°C)
E: SDRAM DDR2
E: Ext. Temp.(0°C to +85°C)
G: SDRAM DDR3
I: Ext. Temp.(-25°C to +85°C)
L: SDRAM DDR3L
W: Ind. Temp.(-40°C to +85°C)
Module Type (3)
Speed (11)
SDR
U: 168 Pin UDIMM 3.3 V
R: 168 Pin RDIMM 3.3 V
N: 144 Pin SODIMM 3.3 V
DDR
DDR3 AA: DDR3-800 CL5
AB: DDR3-800 CL6
BA: DDR3-1066 CL6
BB: DDR3-1066 CL7
CA: DDR3-1333 CL7
CB: DDR3-1333 CL8
U: 184 Pin UDIMM 2.5 V
CC: DDR3-1333 CL9
R: 184 Pin RDIMM 2.5 V
DA: DDR3-1600 CL9
N: 200 Pin SODIMM 2.5 V
DC: DDR3-1600 CL11
M: 172 Pin Micro-DIMM 2.5 V
DB: DDR3-1600 CL10
DDR2 50: DDR2-400 CL3
37: DDR2-533 CL4
DDR2 U: 240 Pin UDIMM 1.8 V
30: DDR2-667 CL5
3A: DDR2-667 CL4
R: 240 Pin RDIMM 1.8 V, w/o Parity
25: DDR2-800 CL6
2A: DDR2-800 CL5
P: 240 Pin RDIMM 1.8 V, w/ Parity
BB: DDR2-1066 CL7
F: 240 Pin FBDIMM
N: 200 Pin SODIMM 1.8 V
DDR
08: DDR-200 CL2
75: DDR-266B CL2.5
G: 200 Pin SO-RDIMM 1.8 V
70: DDR-266A CL2
7A: DDR-266A CL2
H: 244 Pin Mini RDIMM 1.8 V, w/ Parity
60: DDR-333B CL2.5 6A: DDR-333A CL2
M: 214 Pin MicroDIMM 1.8 V
50: DDR-400B CL3
5A: DDR-400A CL2.5
SDR
10: PC-100 CL3
08: PC-100 CL2
75: PC-133 CL3
70: PC-133 CL2
DDR3 U: 240 Pin UDIMM 1.5 V
P: 240 Pin RDIMM 1.5 V
N: 204 Pin SODIMM/SOUDIMM 1.5 V
G: 204 Pin SO-RDIMM
MT: Micron Technology
M: 214 Pin MicroDIMM 1.5 V
EP: Elpida
L: 244 Pin MiniUDIMM
QI: Qimonda
V: 240 Pin XR-DIMM
SA: Samsung
DRAM Manufacturer (10 )
HY: Hynix
Data Depth (4)
008: 64 MB
256: 2 GB
016: 128 MB
512: 4 GB
032: 256 MB
01G: 8 GB
064: 512 MB
02G: 16 GB
128: 1 GB
04G: 32 GB
WI: Winbond
08G: 8 GB
Module Ranks (9)
1: 1 Rank Module
2: 2 Rank Module
DRAM Revision (8)
Data Width (5)
32: w/o Parity
DRAM Organization (7)
36: w/ Parity
A: x4
E: x8 TSOP Stack
64: w/o ECC
D: x4 TSOP Stack
C: x16
72: w/ ECC
B: x8
G: x4 BGA Stack
Printed Circuit Board with Revision (6)
Part Numbers
23
EMEA / APAC
North & South America
Japan
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit NA
1117 E Plaza Drive Unit E Suite 105 / 205
Eagle, Idaho 83616
USA
Swissbit Japan Inc.
4F, 2-40-16 Umesato
Suginami-ku, Tokyo 166-0011
Japan
Tel. +41 71 913 03 03
Fax +41 71 913 03 15
industrial@swissbit.com
Tel. +1 208 938 4525
Fax +1 914 935 9865
sales@swissbitna.com
Tel. +81 3 33 17 12 11
Fax +81 3 33 17 12 22
industrial@swissbit.co.jp
Headquarter
Production Plant
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit Germany AG
Wolfener Strasse 36
D-12681 Berlin
Germany
Tel. +41 71 913 03 03
Fax +41 71 913 03 15
info@swissbit.com
Tel. +49 30 936 954 0
Fax +49 30 936 954 55
www.swissbit.com
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Version 2.0
Swissbit Sales locations worldwide
工商网监
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