TG-NSP-60 4OZ

TG-NSP-60 Ultra conformable silicone-free putty type gap filler Description TG-NSP-60 is an ultra conformable silicone-free putty type gap filler. It is designed for when heat transfer is needed between delicate components where the pressure must be minimised and silicone contamination cannot be tolerated. TG-NSP-60 is designed to fill gaps from 0.25 – 8mm with little or n o s tress generated. The nonsilicone formulation will adhere to all surfaces, such as metal housings, ceramic and plastic IC packages and FR4 boards to give a low thermal resistance path for heat transfer. TG-NSP-60 is available in 30cc syringes, 6 and 12oz cartridges and 5 gallon pails. REACH Compliant Properties RoHS Compliant Thermal Conductivity: 5.9 W/mK (W/mK - Z Axis) Property TG-NSP-60 Unit Test Method Colour Grey - Visual Thermal Conductivity 5.9 W/mK ASTM D5470 Weight Loss ‹0.5 % ASTM E595 Working Temperature -55 to 200 ˚C - Volume Resistivity 2.15 x 10 Ohm-cm ASTM D-257 PPM GC / MS D4-10 15 0 Tel: +44 20 8133 2062 Email: sales@tglobaltechnology.com Web: www.tglobaltechnology.com Skype: tglobal.technology