HPC 8040NC-3R3M

TAI-TECH P2 Power Inductor HPC-BM/NF/NC-SERIES 1、Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. Halogen Halogen-free 2、Applications Commercial applications Recommended Land pattern 3、Dimension C L E A H D B G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC201608BM 2.0±0.2 1.6±0.2 0.7±0.1 0.7±0.3 1.8±0.3 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C G(mm) H(mm) 2.5 0.5 2.1 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. L E A H D B L(mm) G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC201610BM 2.0±0.2 1.6±0.2 0.9±0.1 0.7±0.3 1.6±0.2 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C G(mm) H(mm) 2.5 0.5 2.1 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. L E A H D B L(mm) G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC201612BM 2.0±0.2 1.6±0.2 1.0±0.2 0.7±0.3 1.6±0.2 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. www.tai-tech.com.tw L(mm) G(mm) H(mm) 2.5 0.5 2.1 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. TAI-TECH P3 C E L A H D B G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC252008BM 2.5±0.2 2.0±0.2 0.7±0.1 0.9±0.3 2.0±0.2 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C G(mm) H(mm) 3.0 0.7 2.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. E L A H D B L(mm) G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC252010BM 2.5±0.2 2.0±0.2 0.9±0.1 0.9±0.3 2.0±0.2 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C G(mm) H(mm) 3.0 0.7 2.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. L E A H D B L(mm) G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC252012BM 2.5±0.2 2.0±0.2 1.0±0.2 0.9±0.3 2.0±0.2 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C G(mm) H(mm) 3.0 0.7 2.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. L E A H D B L(mm) G Series HPC322512BM *A(mm) 3.2±0.2 *B(mm) 2.5±0.2 *C(mm) 1.0±0.2 D(mm) 1.0±0.3 E(mm) L(mm) G(mm) H(mm) 2.5±0.2 3.5 1.0 3.0 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. www.tai-tech.com.tw Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. TAI-TECH P4 C L E A H D B G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC3010BM 3.0±0.2 3.0±0.2 0.9±0.1 0.9±0.3 2.7±0.3 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C G(mm) H(mm) 3.5 0.9 3.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. L E A H D B L(mm) G Series *A(mm) HPC3012BM 3.0±0.2 *B(mm) 3.0±0.2 *C(mm) 1.0±0.2 D(mm) 0.9±0.3 E(mm) L(mm) G(mm) H(mm) 2.7±0.3 3.5 0.9 3.5 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C L E A H D B Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC3015BM 3.0±0.2 3.0±0.2 1.3±0.2 0.9±0.3 2.7±0.3 C G(mm) H(mm) 3.5 0.9 3.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. L E D B L(mm) A H 100 G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC3612BM 3.6±0.2 3.6±0.2 1.0±0.2 1.2±0.3 3.2±0.3 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm www.tai-tech.com.tw L(mm) G(mm) H(mm) 3.8 2.0 3.7 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. TAI-TECH P5 C L E A H 1R0 D B G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC4010BM 4.0±0.2 4.0±0.2 0.9±0.1 1.2±0.3 3.5±0.3 C G(mm) H(mm) 4.5 1.5 4.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. E L A H 1R0 D B L(mm) G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC4012BM 4.0±0.2 4.0±0.2 1.0±0.2 1.2±0.3 3.5±0.3 C G(mm) H(mm) 4.5 1.5 4.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. E L H 1R0 A D B L(mm) G Series A(mm) B(mm) C(mm) D(mm) E(mm) HPC4018BM 4.0±0.2 4.0±0.2 1.6±0.2 1.1±0.2 3.5±0.3 C G(mm) H(mm) 4.5 1.5 4.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. *Dimensions are not iNVluding the termination. For maximum overall dimensions with termination, add 0.1mm. L E H 1R0 A D B L(mm) G Series A(mm) B(mm) C(mm) D(mm) E(mm) HPC4020BM 4.0±0.2 4.0±0.2 1.8±0.2 1.2±0.3 3.4±0.3 *Dimensions are not iNVluding the termination. For maximum overall dimensions with termination, add 0.1mm. www.tai-tech.com.tw L(mm) G(mm) H(mm) 4.5 1.5 4.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. TAI-TECH P6 C B E H A 1R0 D L G Series *A(mm) *B(mm) C(mm) D(mm) E(mm) HPC4030NF 4.0±0.2 4.0±0.2 2.8±0.2 1.35±0.3 3.4±0.3 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C B E L(mm) G(mm) H(mm) 4.5 1.5 4.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. H A 1R0 D L G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC5010NF 5.0±0.2 5.0±0.2 0.9±0.1 1.5±0.3 4.0±0.3 C G(mm) H(mm) 5.5 1.8 5.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. E L A H 1R0 D B L(mm) G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC5012NF 5.0±0.2 5.0±0.2 1.0±0.2 1.5±0.3 4.0±0.3 C G(mm) H(mm) 5.5 1.8 5.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.12mm and above. *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. L E A H 1R0 D B L(mm) G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC5020NF 5.0±0.2 5.0±0.2 1.8±0.2 1.3±0.2 4.7±0.2 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. www.tai-tech.com.tw L(mm) G(mm) H(mm) 5.5 1.8 5.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. TAI-TECH P7 C L E A H 1R0 D B G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC5030NF 5.0±0.2 5.0±0.2 2.8±0.2 1.3±0.3 4.7±0.3 C G(mm) H(mm) 5.5 1.8 5.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. E L H 1R0 A D B L(mm) G Series InductaNVe HPC5040NF ≤10 uH ＞10 uH A(mm) B(mm) 4.95±0.2 4.95±0.2 C(mm) D(mm) E (mm) 3.9±0.2 1.3±0.3 4.2±0.2 3.8±0.2 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C G(mm) H(mm) 5.5 1.8 5.5 Note: 1.PCB layout is referred to standard IPC-7351B 2. The above PCB layout refereNVe only. 3. Recommend solder paste thickness at 0.15mm and above. L E A H 1R0 D B L(mm) G Series *A(mm) *B(mm) *C(mm) D(mm) E(mm) HPC6020NF 6.0±0.2 6.0±0.2 1.8±0.2 1.6±0.3 5.8±0.3 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. C G(mm) H(mm) 6.5 2.5 6.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. L E H 1R0 A D B L(mm) G Series HPC6028NF *A(mm) 6.0±0.2 *B(mm) 6.0±0.2 *C(mm) 2.6±0.2 D(mm) 1.6±0.3 E(mm) 5.8±0.3 *Dimensions are not iNVluding the termination. For maximum overall dimensions with ternmination , add 0.1mm. www.tai-tech.com.tw L(mm) G(mm) H(mm) 6.5 2.5 6.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. TAI-TECH P8 2R2 Series A(mm) B(mm) C(mm) D(mm) E(mm) HPC6045NC 6.0±0.3 6.0±0.3 4.2±0.3 1.9±0.3 4.8±0.3 L(mm) G(mm) H(mm) 6.5 2.2 6.5 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. 2R2 Series InductaNVe HPC8040NC ＜10uH A(mm) B(mm) C(mm) 4.2Max 8.0±0.3 8.0±0.3 ≥10uH 3.7±0.3 D(mm) E(mm) 2.4±0.3 6.3±0.3 4、Part Numbering HPC L(mm) G(mm) H(mm) 8.5 2.8 6.6 Note: 1. The above PCB layout refereNVe only. 2. Recommend solder paste thickness at 0.15mm and above. 201610 BM - 2R2 M A B C A：Series B：Dimension C：Lead Free D：InductaNVe E：InductaNVe ToleraNVe HPC D E 2R2=2.20uH K=±10%, L=±15%,M=±20%,Y=±30%. 5010 NF - 1R0 A B A：Series B：Dimension C：Lead Free D：Inductance E：InductaNVe ToleraNVe C D M E 1R0=1.00uH K=±10%, L=±15%,M=±20%,Y=±30%. marking direction cannot decide polarity. Color: Black, unidirectional. magnetic shielding HPC 6045 NC A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance - 2R2 M D E A/B*C C=for commercial 2R2=2.20uH K=±10%, L=±15%,M=±20%,Y=±30%. marking direction cannot decide polarity. Color: Black, unidirectional. magnetic shielding www.tai-tech.com.tw TAI-TECH P9 5、Specification I rms( A ) I sat (A) DCR (mΩ) Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC201608BM-R33M 0.33 3.00 2.80 2.40 2.20 33 39.6 HPC201608BM-R47M 0.47 2.80 2.60 2.05 1.90 42 50.4 HPC201608BM-R68M 0.68 2.40 2.20 1.65 1.50 56 67.2 HPC201608BM-R82M 0.82 2.20 2.00 1.55 1.40 69 82.2 HPC201608BM-1R0M 1.00 2.10 1.90 1.40 1.30 75 90 HPC201608BM-1R5M 1.50 2.00 1.80 1.20 1.10 110 132 HPC201608BM-2R2M 2.20 1.70 1.50 1.00 0.90 160 196 HPC201608BM-3R3M 3.30 1.50 1.30 0.85 0.75 230 276 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC201610BM-R24M 0.24 5.20 4.80 4.10 3.80 20 24 HPC201610BM-R33M 0.33 4.60 4.00 3.30 3.00 29 34.8 HPC201610BM-R47M 0.47 4.00 3.70 2.90 2.70 37 45 HPC201610BM-R68M 0.68 3.60 3.30 2.50 2.30 50 60 HPC201610BM-1R0M 1.00 3.10 2.80 2.00 1.80 67 80.4 HPC201610BM-1R5M 1.50 2.50 2.10 1.60 1.40 98 118 HPC201610BM-2R2M 2.20 2.10 1.90 1.30 1.10 140 168 HPC201610BM-3R3M 3.30 1.70 1.40 1.10 0.95 210 252 HPC201610BM-4R7M 4.70 1.30 1.10 0.90 0.80 395 474 HPC201610BM-5R6M 5.60 1.10 0.90 0.85 0.77 415 498 HPC201610BM-6R8M 6.80 0.90 0.80 0.80 0.75 480 576 HPC201610BM-8R2M 8.20 0.80 0.70 0.70 0.65 630 756 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC201612BM-R33M 0.33 4.80 4.30 3.50 3.20 25 30 HPC201612BM-R47M 0.47 4.20 3.90 3.10 2.90 35 42 HPC201612BM-R68M 0.68 3.80 3.50 2.60 2.40 45 54 HPC201612BM-1R0M 1.00 3.20 2.90 2.10 1.90 60 72 HPC201612BM-1R5M 1.50 2.60 2.20 1.70 1.50 90 108 HPC201612BM-2R2M 2.20 2.20 2.00 1.40 1.20 130 156 HPC201612BM-3R3M 3.30 1.80 1.50 1.15 1.00 190 228 HPC201612BM-4R7M 4.70 1.40 1.20 0.95 0.85 350 420 HPC201612BM-5R6M 5.60 1.20 1.00 0.90 0.80 365 438 HPC201612BM-6R8M 6.80 1.00 0.90 0.82 0.76 460 552 HPC201612BM-8R2M 8.20 0.85 0.75 0.70 0.65 610 732 HPC201612BM-100M 10.0 0.78 0.70 0.65 0.60 650 780 I rms( A ) I sat (A) I rms( A ) DCR (mΩ) I sat (A) www.tai-tech.com.tw DCR (mΩ) TAI-TECH P10 I rms( A ) I sat (A) DCR (mΩ) Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC252008BM-R47M 0.47 2.60 2.40 2.40 2.20 46 55 HPC252008BM-R68M 0.68 2.40 2.20 2.20 2.05 61 73 HPC252008BM-R82M 0.82 2.30 2.10 2.10 2.00 77 92 HPC252008BM-1R0M 1.00 2.15 1.95 1.90 1.70 80 96 HPC252008BM-1R2M 1.20 2.10 1.90 1.85 1.65 100 120 HPC252008BM-1R5M 1.50 2.00 1.80 1.70 1.55 130 156 HPC252008BM-2R2M 2.20 1.80 1.60 1.40 1.25 175 210 HPC252008BM-3R3M 3.30 1.50 1.30 1.10 1.00 245 294 HPC252008BM-4R7M 4.70 1.25 1.05 1.00 0.90 350 420 HPC252008BM-5R6M 5.60 1.10 1.00 0.85 0.80 385 462 HPC252008BM-6R8M 6.80 1.00 0.90 0.80 0.75 530 636 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC252010BM-R47M 0.47 3.00 2.80 3.30 3.00 29 35 HPC252010BM-R68M 0.68 2.80 2.60 2.80 2.60 39 47 HPC252010BM-1R0M 1.00 2.60 2.40 2.50 2.30 60 72 HPC252010BM-1R5M 1.50 2.40 2.20 2.10 1.90 80 96 HPC252010BM-2R2M 2.20 2.00 1.80 1.50 1.30 110 132 HPC252010BM-3R3M 3.30 1.70 1.50 1.30 1.10 170 204 HPC252010BM-4R7M 4.70 1.40 1.20 1.20 1.10 250 300 HPC252010BM-6R8M 6.80 1.20 1.00 0.95 0.85 370 444 HPC252010BM-100M 10.0 1.00 0.80 0.75 0.65 460 552 HPC252010BM-150M 15.0 0.80 0.65 0.62 0.57 770 924 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC252012BM-R22Y 0.22±30% 6.00 5.50 5.50 5.00 15 18 HPC252012BM-R33M 0.33 5.20 4.80 4.80 4.40 20 24 HPC252012BM-R47M 0.47 4.80 4.50 4.30 4.00 26 32 HPC252012BM-R68M 0.68 4.40 4.00 3.70 3.50 37 45 HPC252012BM-1R0M 1.00 3.60 3.30 3.00 2.80 50 60 HPC252012BM-1R2M 1.20 3.40 3.10 2.90 2.70 61 74 HPC252012BM-1R5M 1.50 3.10 2.80 2.70 2.50 70 84 HPC252012BM-2R2M 2.20 2.70 2.30 2.10 1.90 94 113 HPC252012BM-3R3M 3.30 2.20 1.90 1.70 1.50 126 152 HPC252012BM-4R7M 4.70 1.80 1.60 1.50 1.30 225 270 HPC252012BM-6R8M 6.80 1.50 1.30 1.20 1.10 310 372 HPC252012BM-100M 10.0 1.30 1.10 1.00 0.90 495 594 HPC252012BM-150M 15.0 1.00 0.90 0.80 0.70 650 780 HPC252012BM-220M 22.0 0.80 0.60 0.63 0.58 908 1090 I rms( A ) I sat (A) I rms( A ) DCR (mΩ) I sat (A) www.tai-tech.com.tw DCR (mΩ) TAI-TECH P11 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC322512BM-R33M 0.33 5.00 4.50 4.50 4.20 19 22.8 HPC322512BM-R47M 0.47 4.50 4.10 4.00 3.80 25 30 HPC322512BM-R68M 0.68 4.10 3.60 3.70 3.40 32 38 HPC322512BM-1R0M 1.00 3.50 3.20 3.00 2.80 39 47 HPC322512BM-1R5M 1.50 3.20 3.00 2.40 2.20 48 58 HPC322512BM-2R2M 2.20 2.90 2.70 2.10 1.90 72 86 HPC322512BM-3R3M 3.30 2.50 2.20 1.80 1.60 105 126 HPC322512BM-4R7M 4.70 2.20 2.00 1.50 1.30 148 177 HPC322512BM-5R6M 5.60 1.90 1.70 1.25 1.15 170 204 HPC322512BM-6R8M 6.80 1.70 1.40 1.15 1.05 200 240 HPC322512BM-8R2M 8.20 1.50 1.30 1.00 0.90 260 312 HPC322512BM-100M 10.0 1.30 1.10 0.92 0.82 350 420 HPC322512BM-150M 15.0 1.00 0.90 0.70 0.65 460 552 HPC322512BM-220M 22.0 0.80 0.70 0.60 0.55 660 792 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC3010BM-1R0M 1.00 3.40 3.00 2.40 2.20 56 67 HPC3010BM-1R2M 1.20 3.10 2.70 2.10 1.90 60 72 HPC3010BM-1R5M 1.50 2.80 2.50 1.90 1.70 75 90 HPC3010BM-2R2M 2.20 2.60 2.30 1.80 1.60 100 120 HPC3010BM-3R3M 3.30 2.20 1.90 1.40 1.20 130 156 HPC3010BM-4R7M 4.70 1.80 1.50 1.30 1.20 190 228 HPC3010BM-6R8M 6.80 1.50 1.30 1.10 1.00 260 312 HPC3010BM-8R2M 8.20 1.30 1.10 1.00 0.90 330 396 HPC3010BM-100M 10.0 1.10 1.00 0.80 0.70 420 504 HPC3010BM-150M 15.0 0.90 0.80 0.65 0.60 565 678 HPC3010BM-220M 22.0 0.70 0.60 0.50 0.45 760 912 HPC3010BM-330M 33.0 0.60 0.50 0.45 0.40 1270 1524 I rms( A ) I sat (A) I rms( A ) DCR (mΩ) I sat (A) www.tai-tech.com.tw DCR (mΩ) TAI-TECH P12 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC3012BM-R22M 0.22 6.20 5.70 8.00 7.00 15 19 HPC3012BM-R47M 0.47 5.20 4.80 4.80 4.40 24 29 HPC3012BM-R68M 0.68 4.80 4.50 4.30 4.00 31 37 HPC3012BM-1R0M 1.00 4.20 3.80 3.60 3.30 40 48 HPC3012BM-1R2M 1.20 4.00 3.50 3.30 3.00 47 56 HPC3012BM-1R5M 1.50 3.60 3.30 3.00 2.60 52 62 HPC3012BM-2R2M 2.20 2.90 2.50 2.40 2.10 75 90 HPC3012BM-2R7M 2.70 2.60 2.30 2.10 1.90 95 114 HPC3012BM-3R3M 3.30 2.40 2.10 1.80 1.60 108 130 HPC3012BM-4R7M 4.70 2.10 1.70 1.50 1.30 140 168 HPC3012BM-5R6M 5.60 1.90 1.60 1.40 1.20 200 240 HPC3012BM-6R8M 6.80 1.70 1.40 1.30 1.10 210 252 HPC3012BM-100M 10.0 1.50 1.20 1.10 0.90 288 345 HPC3012BM-150M 15.0 1.20 1.00 0.80 0.70 400 480 HPC3012BM-220M 22.0 0.90 0.80 0.70 0.63 700 840 HPC3012BM-330M 33.0 0.80 0.70 0.61 0.56 1100 1320 HPC3012BM-470M 47.0 0.65 0.60 0.52 0.47 1500 1800 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC3015BM-R24M 0.24 5.00 4.50 6.00 5.50 13 16 HPC3015BM-R47M 0.47 3.70 3.30 4.30 4.00 18 22 HPC3015BM-R68M 0.68 3.50 3.20 3.80 3.50 23 28 HPC3015BM-1R0M 1.00 3.00 2.70 3.00 2.70 30 36 HPC3015BM-1R5M 1.50 2.70 2.50 2.40 2.10 36 43 HPC3015BM-2R2M 2.20 2.50 2.30 2.10 1.90 60 72 HPC3015BM-3R3M 3.30 2.20 2.00 1.70 1.50 80 96 HPC3015BM-4R7M 4.70 1.90 1.70 1.50 1.30 112 134 HPC3015BM-5R6M 5.60 1.80 1.60 1.40 1.20 135 162 HPC3015BM-6R8M 6.80 1.70 1.50 1.30 1.10 172 206 HPC3015BM-100M 10.0 1.50 1.30 1.00 0.90 220 264 HPC3015BM-150M 15.0 1.20 1.00 0.85 0.72 310 372 HPC3015BM-180M 18.0 1.10 0.92 0.73 0.65 380 456 HPC3015BM-220M 22.0 1.00 0.85 0.68 0.59 450 540 HPC3015BM-330M 33.0 0.85 0.75 0.57 0.51 780 940 HPC3015BM-470M 47.0 0.70 0.60 0.46 0.41 1200 1440 Part Number Inductance (uH)±20% @0A Typ Max Typ Max HPC3612BM-100M 10.0 1.20 1.00 1.10 1.00 I rms (A) I sat (A) I rms( A ) DCR (mΩ) I sat (A) Irms( A ) DCR (mΩ) I sat (A) www.tai-tech.com.tw DCR (mΩ) ±30% 290 TAI-TECH P13 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC4010BM-1R0M 1.00 3.50 3.00 2.80 2.60 60 72 HPC4010BM-2R2M 2.20 2.80 2.50 1.80 1.60 93 112 HPC4010BM-3R3M 3.30 2.50 2.30 1.40 1.30 110 132 HPC4010BM-4R7M 4.70 2.30 2.10 1.30 1.20 150 180 HPC4010BM-6R8M 6.80 1.80 1.60 1.00 0.90 200 240 HPC4010BM-100M 10.0 1.40 1.20 0.88 0.80 300 360 HPC4010BM-150M 15.0 1.20 1.00 0.65 0.60 430 516 HPC4010BM-220M 22.0 0.80 0.70 0.53 0.46 600 720 I rms( A ) I sat (A) DCR (mΩ) Part Number Inductance (uH)±20% @0A Test FrequeNVy (Hz) I rms (A) I sat (A) Typ Typ HPC4018BM-1R0Y 1.00±30% 1V100K 3.20 4.00 0.027 HPC4018BM-1R5Y 1.50±30% 1V100K 2.40 3.30 0.037 HPC4018BM-2R2M 2.20 1V100K 2.20 3.00 0.042 HPC4018BM-3R3M 3.30 1V100K 2.00 2.30 0.055 HPC4018BM-4R7M 4.70 1V100K 1.70 2.00 0.070 HPC4018BM-6R8M 6.80 1V100K 1.45 1.60 0.098 HPC4018BM-100M 10.0 1V100K 1.20 1.30 0.150 HPC4018BM-150M 15.0 1V100K 0.85 1.10 0.210 HPC4018BM-220M 22.0 1V100K 0.72 0.90 0.290 HPC4018BM-330M 33.0 1V100K 0.55 0.70 0.460 HPC4018BM-470M 47.0 1V100K 0.44 0.60 0.650 HPC4018BM-680M 68.0 1V100K 0.32 0.52 1.000 DCR (Ω) ±20% Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC4012BM-R47M 0.47 5.50 5.00 5.00 4.50 25 30 HPC4012BM-R68M 0.68 5.00 4.60 4.60 4.30 36 43 HPC4012BM-1R0M 1.00 4.40 4.20 4.00 3.60 43 52 HPC4012BM-1R2M 1.20 4.20 4.00 3.80 3.40 44 53 HPC4012BM-1R5M 1.50 3.90 3.60 3.30 3.00 52 62.4 HPC4012BM-2R2M 2.20 3.30 3.00 2.50 2.30 66 79.2 HPC4012BM-3R3M 3.30 2.80 2.60 1.90 1.70 81.6 98 HPC4012BM-4R7M 4.70 2.50 2.30 1.60 1.40 112 134 HPC4012BM-5R6M 5.60 2.10 1.90 1.40 1.30 135 162 HPC4012BM-6R8M 6.80 1.80 1.60 1.25 1.15 165 198 HPC4012BM-100M 10.0 1.40 1.20 1.00 0.90 230 276 HPC4012BM-150M 15.0 1.20 1.10 0.90 0.80 320 384 HPC4012BM-220M 22.0 1.00 0.90 0.70 0.60 470 564 HPC4012BM-330M 33.0 0.80 0.70 0.60 0.55 850 1020 HPC4012BM-470M 47.0 0.65 0.55 0.48 0.43 1100 1320 I rms( A ) I sat (A) www.tai-tech.com.tw DCR (mΩ) TAI-TECH P14 Part Number Inductance (uH)±20% @0A Test FrequeNVy (Hz) I rms (A) I sat (A) Typ Typ Typ Max HPC4020BM-1R0M 1.00 1V100K 3.80 4.60 20 24 HPC4020BM-1R5M 1.50 1V100K 3.00 4.00 26 32 HPC4020BM-2R2M 2.20 1V100K 2.60 3.50 35 42 HPC4020BM-3R3M 3.30 1V100K 2.30 2.80 52 63 HPC4020BM-4R7M 4.70 1V100K 1.90 2.20 67 80 HPC4020BM-5R6M 5.60 1V100K 1.80 2.10 82 99 HPC4020BM-6R8M 6.80 1V100K 1.70 2.00 92 110 HPC4020BM-8R2M 8.20 1V100K 1.50 1.70 110 132 HPC4020BM-100M 10.0 1V100K 1.40 1.60 140 168 HPC4020BM-150M 15.0 1V100K 1.00 1.30 200 240 HPC4020BM-180M 18.0 1V100K 0.90 1.20 240 288 HPC4020BM-220M 22.0 1V100K 0.90 1.10 265 318 HPC4020BM-270M 27.0 1V100K 0.80 0.90 345 414 HPC4020BM-330M 33.0 1V100K 0.75 0.90 412 495 HPC4020BM-470M 47.0 1V100K 0.55 0.67 580 696 HPC4020BM-680M 68.0 1V100K 0.47 0.60 950 1140 HPC4020BM-101M 100 1V100K 0.35 0.50 1400 1680 Part Number Inductance (uH)±20% @0A I rms (A) I sat (A) Typ Typ HPC4030NF-R47M 0.47 6.00 7.50 8.5 HPC4030NF-R68M 0.68 4.60 6.80 10 HPC4030NF-1R0M 1.00 4.20 5.30 14 HPC4030NF-1R5M 1.50 3.40 4.90 20 HPC4030NF-2R2M 2.20 3.00 4.90 30 HPC4030NF-3R3M 3.30 2.40 3.30 40 HPC4030NF-3R6M 3.60 2.30 3.20 47 HPC4030NF-3R9M 3.90 2.20 3.10 53 HPC4030NF-4R7M 4.70 2.05 2.90 60 HPC4030NF-5R6M 5.60 1.95 2.60 65 HPC4030NF-6R8M 6.80 1.80 2.75 90 HPC4030NF-8R2M 8.20 1.60 2.10 95 HPC4030NF-100M 10.0 1.50 2.00 100 HPC4030NF-120M 12.0 1.30 1.80 135 HPC4030NF-150M 15.0 1.20 1.70 190 HPC4030NF-180M 18.0 1.10 1.50 200 HPC4030NF-220M 22.0 1.00 1.30 225 HPC4030NF-330M 33.0 0.85 1.10 330 HPC4030NF-470M 47.0 0.72 0.95 445 HPC4030NF-221M 220 0.35 0.45 2250 HPC4030NF-331M 330 0.30 0.40 3800 www.tai-tech.com.tw DCR (mΩ) DCR (mΩ) ±20% TAI-TECH P15 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC5010NF-1R0M 1.00 3.50 3.00 2.60 2.40 54 64.8 HPC5010NF-2R2M 2.20 2.80 2.50 2.30 2.10 90 108 HPC5010NF-3R3M 3.30 2.50 2.30 1.80 1.60 108 130 HPC5010NF-4R7M 4.70 2.30 2.10 1.60 1.50 150 180 HPC5010NF-6R8M 6.80 1.90 1.70 1.40 1.30 195 234 HPC5010NF-100M 10.0 1.50 1.40 1.10 1.00 245 294 HPC5010NF-150M 15.0 1.30 1.20 0.90 0.80 400 480 HPC5010NF-220M 22.0 0.90 0.80 0.80 0.70 590 708 Part Number Inductance (uH)±20% @0A Typ Max Typ Max Typ Max HPC5012NF-1R0M 1.00 4.00 3.50 4.50 4.00 57 68.4 HPC5012NF-1R5M 1.50 3.60 3.30 4.00 3.70 73 87.6 HPC5012NF-2R2M 2.20 3.30 3.00 3.40 3.20 88 105.6 HPC5012NF-3R3M 3.30 2.70 2.40 2.90 2.60 145 174 HPC5012NF-4R7M 4.70 2.30 2.10 2.40 2.20 180 216 HPC5012NF-5R6M 5.60 2.00 1.80 2.10 1.90 215 258 HPC5012NF-6R8M 6.80 1.80 1.70 1.85 1.73 255 306 HPC5012NF-8R2M 8.20 1.70 1.60 1.65 1.55 278 334 HPC5012NF-100M 10.0 1.50 1.40 1.45 1.37 400 480 HPC5012NF-150M 15.0 1.35 1.27 1.30 1.22 600 720 I rms( A ) I sat (A) I rms (A) DCR (mΩ) I sat (A) DCR (mΩ) Part Number Inductance (uH)±20% @0A Typ Max Typ Max DCR (mΩ) @25℃ ±20% HPC5020NF-1R0Y 1.00±30% 4.10 3.60 5.00 4.50 20 HPC5020NF-1R2Y 1.20±30% 3.80 3.30 4.80 4.20 20 HPC5020NF-1R5Y 1.50±30% 3.50 3.00 4.50 4.00 25 HPC5020NF-2R2M 2.20 3.30 2.80 4.10 3.50 32 HPC5020NF-3R3M 3.30 2.80 2.50 3.50 3.00 43 HPC5020NF-4R7M 4.70 2.40 2.10 2.70 2.30 60 HPC5020NF-5R6M 5.60 2.10 1.80 2.40 2.00 69 HPC5020NF-6R8M 6.80 1.90 1.60 2.10 1.70 90 HPC5020NF-8R2M 8.20 1.75 1.40 1.90 1.40 98 HPC5020NF-100M 10.0 1.60 1.30 1.70 1.20 110 HPC5020NF-120M 12.0 1.40 1.10 1.40 1.00 135 HPC5020NF-150M 15.0 1.25 0.90 1.30 0.80 165 HPC5020NF-180M 18.0 1.17 0.80 1.20 0.70 190 HPC5020NF-220M 22.0 1.10 0.70 1.10 0.60 225 HPC5020NF-330M 33.0 0.80 0.60 0.80 0.50 335 HPC5020NF-470M 47.0 0.70 0.50 0.70 0.40 460 I rms (A) I sat (A) www.tai-tech.com.tw TAI-TECH P16 I rms (A) I sat (A) Part Number Inductance (uH)±20% @0A Typ Max Typ Max HPC5030NF-R47M 0.47 8.00 7.00 10.00 9.00 10 HPC5030NF-R68M 0.68 6.50 5.50 8.00 7.00 13 HPC5030NF-1R0M 1.00 4.80 4.30 6.50 6.00 16 HPC5030NF-1R5M 1.50 4.20 3.80 6.10 5.60 20 HPC5030NF-2R2M 2.20 3.60 3.30 5.20 4.80 25 HPC5030NF-3R3M 3.30 3.20 2.90 4.20 3.90 34 HPC5030NF-4R7M 4.70 3.00 2.70 3.70 3.50 45 HPC5030NF-6R8M 6.80 2.30 2.10 3.00 2.80 62 HPC5030NF-100M 10.0 2.00 1.80 2.30 2.10 88 HPC5030NF-150M 15.0 1.60 1.40 1.80 1.60 107 HPC5030NF-220M 22.0 1.40 1.20 1.55 1.30 156 HPC5030NF-330M 33.0 1.10 1.00 1.20 1.05 210 HPC5030NF-470M 47.0 0.90 0.80 1.00 0.90 345 DCR (mΩ) ±20% Part Number Inductance (uH)±20% @0A I rms (A) I sat (A) Typ Typ HPC5040NF-R60M 0.60 8.00 11.0 8 HPC5040NF-1R0M 1.00 5.00 7.50 12 HPC5040NF-1R5M 1.50 4.50 6.50 15 HPC5040NF-1R8M 1.80 4.20 6.10 18 HPC5040NF-2R2M 2.20 3.80 5.70 21 HPC5040NF-3R3M 3.30 3.50 4.40 24 HPC5040NF-4R7M 4.70 3.20 3.90 32 HPC5040NF-6R8M 6.80 2.50 3.30 43 HPC5040NF-100M 10.0 2.20 2.52 56 HPC5040NF-150M 15.0 1.80 2.00 80 HPC5040NF-220M 22.0 1.50 1.62 123 HPC5040NF-330M 33.0 1.20 1.30 180 HPC5040NF-470M 47.0 1.00 1.10 270 HPC5040NF-680M 68.0 0.80 0.90 400 HPC5040NF-820M 82.0 0.75 0.78 490 HPC5040NF-101M 100 0.72 0.75 560 www.tai-tech.com.tw DCR (mΩ) ±20% TAI-TECH P17 Part Number Inductance (uH)±20% @0A Typ Max Typ Max HPC6020NF-1R0M 1.00 4.50 4.00 6.20 5.70 19.0 HPC6020NF-1R5M 1.50 3.80 3.30 5.50 5.00 22.5 HPC6020NF-2R0M 2.00 3.65 3.30 5.30 4.90 25.0 HPC6020NF-2R2M 2.20 3.50 3.20 5.00 4.60 29.0 HPC6020NF-3R3M 3.30 3.30 3.00 4.00 3.60 35.0 HPC6020NF-4R7M 4.70 2.80 2.50 3.00 2.70 54.0 HPC6020NF-5R6M 5.60 2.60 2.30 2.70 2.40 59.0 HPC6020NF-6R8M 6.80 2.50 2.20 2.60 2.30 78.0 HPC6020NF-8R2M 8.20 2.30 2.00 2.40 2.10 103 HPC6020NF-100M 10.0 2.10 1.90 2.10 1.90 106 HPC6020NF-150M 15.0 1.60 1.40 1.50 1.30 138 HPC6020NF-220M 22.0 1.40 1.10 1.30 1.10 204 Part Number Inductance (uH)±20% @0A I rms (A) I sat (A) Typ Typ HPC6028NF-R82M 0.82 8.00 8.20 8.0 HPC6028NF-R90M 0.90 7.80 8.00 8.2 HPC6028NF-1R0Y 1.00±30% 5.20 5.75 10 HPC6028NF-1R2M 1.20 5.10 5.50 12 HPC6028NF-1R5Y 1.50±30% 4.95 5.30 14 HPC6028NF-2R2M 2.20 4.50 5.00 18 HPC6028NF-3R0M 3.00 3.90 4.50 22.5 HPC6028NF-3R3M 3.30 3.60 4.30 24 HPC6028NF-3R9M 3.90 3.30 3.90 28 HPC6028NF-4R7M 4.70 3.10 3.20 30 HPC6028NF-6R0M 6.00 2.80 3.00 42 HPC6028NF-6R2M 6.20 2.80 3.00 42 HPC6028NF-6R8M 6.80 2.50 2.85 47 HPC6028NF-8R2M 8.20 2.30 2.50 57 HPC6028NF-100M 10.0 2.00 2.10 65 HPC6028NF-150M 15.0 1.80 2.00 98 HPC6028NF-220M 22.0 1.50 1.60 138 HPC6028NF-330M 33.0 1.30 1.40 200 HPC6028NF-470M 47.0 1.06 1.15 280 HPC6028NF-680M 68.0 0.81 1.00 420 HPC6028NF-101M 100 0.72 0.80 605 HPC6028NF-221M 220 0.52 0.58 1320 HPC6028NF-471M 470 0.32 0.32 2250 Note: I rms (A) I sat (A) 1. 2. 3. 4. 5. DCR (mΩ) ±20% DCR (mΩ) ±20% All test data referenced to 25℃ ambient , Ls:100KHz/1V. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ Saturation Current (Isat) will cause L0 to drop approximately 30%. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6. Special inquiries besides the above common used types can be met on your requirement. 7. Rated DC current: The lower value of Irms and Isat. www.tai-tech.com.tw TAI-TECH P18 Part Number Inductance (uH)±20% @0A Typ Max Typ Max HPC6045NC-R36M 0.36 9.00 8.50 18.00 16.50 4.80 HPC6045NC-R47M 0.47 8.60 8.00 17.00 16.00 6.80 HPC6045NC-R82M 0.82 8.20 7.50 14.50 13.50 8.50 HPC6045NC-1R0M 1.00 8.00 7.30 13.50 12.50 10.0 HPC6045NC-1R2M 1.20 7.50 7.00 12.50 11.50 10.5 HPC6045NC-1R3M 1.30 7.50 7.00 12.50 11.50 10.5 HPC6045NC-1R5M 1.50 7.00 6.60 12.00 11.00 11.7 HPC6045NC-1R8M 1.80 6.80 6.20 11.00 10.00 12.0 HPC6045NC-2R0M 2.00 6.50 5.80 10.50 9.50 13.5 HPC6045NC-2R2M 2.20 6.00 5.30 9.50 8.55 15.0 HPC6045NC-2R3M 2.30 5.80 5.00 9.30 8.20 16.0 HPC6045NC-3R0M 3.00 5.20 4.60 8.00 7.50 20.0 HPC6045NC-3R3M 3.30 5.00 4.50 7.80 7.30 21.0 HPC6045NC-3R6M 3.60 4.90 4.30 7.40 6.90 22.5 HPC6045NC-4R7M 4.70 4.50 4.00 6.80 6.20 26.0 HPC6045NC-5R6M 5.60 4.10 3.70 6.40 5.70 31.0 HPC6045NC-6R3M 6.30 3.80 3.50 5.90 5.30 33.0 HPC6045NC-6R8M 6.80 3.60 3.30 5.70 5.15 34.0 HPC6045NC-8R2M 8.20 3.40 2.90 5.10 4.50 46.0 HPC6045NC-100M 10.0 3.20 2.60 4.60 4.20 52.0 HPC6045NC-150M 15.0 2.80 2.20 3.80 3.30 71.0 HPC6045NC-180M 18.0 2.60 2.10 3.40 2.90 80.0 HPC6045NC-220M 22.0 2.30 1.90 3.30 2.70 96.0 HPC6045NC-330M 33.0 1.80 1.50 2.50 2.10 145 HPC6045NC-470M 47.0 1.60 1.20 2.00 1.75 200 HPC6045NC-560M 56.0 1.40 1.00 1.80 1.65 230 HPC6045NC-680M 68.0 1.10 0.92 1.60 1.52 305 HPC6045NC-820M 82.0 0.98 0.88 1.50 1.40 365 HPC6045NC-101M 100 0.92 0.82 1.33 1.25 456 HPC6045NC-121M 120 0.85 0.79 1.20 1.10 500 HPC6045NC-151M 150 0.75 0.70 1.10 1.00 626 HPC6045NC-181M 180 0.68 0.60 1.00 0.90 745 HPC6045NC-221M 220 0.60 0.50 0.88 0.77 900 HPC6045NC-331M 330 0.55 0.45 0.60 0.55 1400 HPC6045NC-471M 470 0.40 0.35 0.50 0.45 2050 I rms (A) I sat (A) DCR (mΩ) ±20% Note: 1. All test data referenced to 25℃ ambient , Ls:1MHz/1V. 2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER. 3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ 4. Saturation Current (Isat) will cause L0 to drop approximately 30% 5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6. Special inquiries besides the above common used types can be met on your requirement. 7. Rated DC current: The lower value of Irms and Isat. www.tai-tech.com.tw TAI-TECH P19 Part Number Inductance (uH)±20% @0A FrequeNCy HPC8040NC-R50M 0.50 HPC8040NC-1R0M I rms (A) I sat (A) DCR (mΩ) ±20% Typ Max Typ Max 1MHz/1V 12.00 10.00 17.00 15.00 5.5 1.00 1MHz/1V 8.50 8.00 13.80 13.00 8.2 HPC8040NC-1R4M 1.40 1MHz/1V 8.20 7.80 11.80 11.20 10.0 HPC8040NC-1R5M 1.50 1MHz/1V 8.00 7.70 11.50 11.00 10.0 HPC8040NC-2R2M 2.20 1MHz/1V 7.40 6.90 9.80 9.20 11.5 HPC8040NC-3R3M 3.30 1MHz/1V 6.60 6.20 8.00 7.50 15.0 HPC8040NC-3R6M 3.60 1MHz/1V 6.40 6.00 7.60 7.00 15.0 HPC8040NC-4R7M 4.70 1MHz/1V 5.80 5.30 6.70 6.00 19.5 HPC8040NC-5R6M 5.60 1MHz/1V 5.40 5.20 6.20 5.80 22.0 HPC8040NC-6R8M 6.80 1MHz/1V 5.10 5.00 5.60 5.10 25.0 HPC8040NC-100M 10.0 1MHz/1V 4.60 4.20 5.00 4.30 33.0 HPC8040NC-150M 15.0 1MHz/1V 3.60 3.20 4.00 3.60 50.0 HPC8040NC-220M 22.0 1MHz/1V 2.90 2.45 3.10 2.80 73.0 HPC8040NC-330M 33.0 1MHz/1V 2.30 2.10 2.60 2.10 100 HPC8040NC-470M 47.0 1MHz/1V 2.00 1.70 2.20 1.90 135 HPC8040NC-560M 56.0 1MHz/1V 1.75 1.60 1.90 1.60 160 HPC8040NC-680M 68.0 1MHz/1V 1.65 1.50 1.75 1.50 205 HPC8040NC-820M 82.0 1MHz/1V 1.40 1.30 1.60 1.40 230 HPC8040NC-101M 100 1MHz/1V 1.20 1.10 1.45 1.20 300 HPC8040NC-121M 120 1MHz/1V 1.10 1.00 1.30 1.10 350 HPC8040NC-151M 150 1MHz/1V 0.98 0.90 1.20 1.03 410 HPC8040NC-181M 180 1MHz/1V 0.91 0.83 1.04 0.94 490 HPC8040NC-221M 220 1MHz/1V 0.85 0.76 0.99 0.90 610 HPC8040NC-331M 330 100KHz/1V 0.70 0.66 0.75 0.70 850 HPC8040NC-471M 470 100KHz/1V 0.63 0.58 0.60 0.55 1300 Note: 8. All test data referenced to 25℃. 9. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER. 10. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃. 11. Saturation Current (Isat) will cause L0 to drop approximately 30%. 12. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 13. Special inquiries besides the above common used types can be met on your requirement. 14. Rated DC current: The lower value of Irms and Isat. www.tai-tech.com.tw TAI-TECH P20 6、Material List （HPC30**及以下） NO Items Materials a Core Ferrite Core b Wire Enameled Copper Wire c Glue Epoxy with magnetic powder d Terminal Ag/Ni/Sn+ Sn Solder e Ink Halogen-free ketone NO Items Materials a Core Ferrite Core b Wire Enameled Copper Wire c Glue Epoxy with magnetic powder d Terminal Ag/Ni/Sn+ Sn Solder e b a c d (HPC4010 及以上) b a c d 7、Packaging INVormation 7-1、Reel Dimension(mm) Reel: 13’’ Reel: 7’’ A COVER TAPE B C C B D D 2.0∮0.5 A EMBOSSED CARRIER Series Type A(mm) B(mm) C(mm) D(mm) 20**/25**/30** 7”x 8mm 8.4±1.5/-0 60.0±1.0 13+0.5/-0.2 178±2.0 40**/50** 13”x12mm 12.4+2.0/-0 100±2.0 13+0.5/-0.2 330±3.0 60** 13”x16mm 16.4+2.0/-0 100±2.0 13+0.5/-0.2 330±3.0 6045 13”x16mm 16.4+2.0/-0 100±2.0 13+0.5/-0.2 330±3.0 8040 13”x16mm 16.4+2.0/-0 100±2.0 13+0.5/-0.2 330±3.0 www.tai-tech.com.tw TAI-TECH P21 7-2、Tape Dimension and Packaging Quantity(mm) Series Reel/PCS B0 ±0.1 A0 ±0.1 K0 ±0.1 P ±0.1 W ±0.3 T ±0.1 E ±0.1 F ±0.1 D ±0.1 P0 ±0.1 P1 ±0.1 HPC201608 3000 2.40 2.0 1.0 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 HPC201610 3000 2.40 2.0 1.2 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 HPC201612 3000 2.40 2.0 1.4 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 HPC252008 3000 3.10 2.4 1.0 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 HPC252010 3000 3.10 2.4 1.2 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 HPC252012 3000 3.10 2.4 1.4 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 HPC322512 3000 3.60 2.9 1.4 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 HPC3010 3000 3.40 3.4 1.2 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 HPC3012 3000 3.40 3.4 1.4 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 HPC3015 2000 3.40 3.4 1.7 4.0 8.0 0.23 1.75 3.50 1.50 4.0 2.0 Chip cavity Blank portions T D P2 200mm or more Direction of tape BO Mark P Mark Mark W F E P0 Blank portions K0 400mm or more AO Reel/PCS B0 ±0.1 A0 ±0.1 K0 ±0.1 P ±0.1 W ±0.3 T ±0.1 E ±0.1 F ±0.1 D ±0.1 P0 ±0.1 P1 ±0.1 HPC5010 4000 5.40 5.4 1.2 8.0 12 0.35 1.75 5.50 1.50 4.0 2.0 HPC5012 4000 5.40 5.4 1.4 8.0 12 0.35 1.75 5.50 1.50 4.0 2.0 HPC5020 2500 5.40 5.4 2.2 8.0 12 0.40 1.75 5.50 1.50 4.0 2.0 HPC6020 2000 6.40 6.4 2.3 12.0 16 0.40 1.75 7.50 1.50 4.0 2.0 HPC6028 1500 6.40 6.4 3.0 12.0 16 0.40 1.75 7.50 1.50 4.0 2.0 Series www.tai-tech.com.tw TAI-TECH P22 Chip cavity Blank portions T D P2 Direction of tape 200mm or more BO Mark P Mark Mark W F E P0 Blank portions K0 400mm or more AO Reel/PCS B0 ±0.1 A0 ±0.1 K0 ±0.1 P ±0.1 W ±0.3 T ±0.1 E ±0.1 F ±0.1 D ±0.1 P0 ±0.1 P1 ±0.1 HPC3612 4000 4.00 4.00 1.40 8.0 12 0.35 1.75 5.5 1.50 4.0 2.0 HPC4010 4000 4.40 4.4 1.2 8.0 12 0.35 1.75 5.50 1.50 4.0 2.0 HPC4012 4000 4.40 4.4 1.4 8.0 12 0.35 1.75 5.50 1.50 4.0 2.0 HPC4018 3500 4.40 4.4 2.0 8.0 12 0.35 1.75 5.50 1.50 4.0 2.0 HPC4020 3000 4.40 4.4 2.0 8.0 12 0.35 1.75 5.50 1.50 4.0 2.0 HPC4030 2000 4.25 4.25 3.2 8.0 12 0.35 1.75 5.50 1.50 4.0 2.0 12 0.40 1.75 5.50 1.50 4.0 2.0 12 0.40 1.75 5.50 1.50 4.0 2.0 Series HPC5030 2000 5.40 5.4 3.2 8.0 HPC5040 1500 5.40 5.4 4.3 8.0 Blank portions Chip cavity P2 Blank portions D T Mark Mark BO W F E P0 Mark P K0 200mm or more Direction of tape 400mm or more A0 Reel/PCS B0 ±0.1 A0 ±0.1 K0 ±0.1 P ±0.1 W ±0.3 T ±0.1 E ±0.1 F ±0.1 D ±0.1 P0 ±0.1 P1 ±0.1 HPC6045 1000 6.4 6.4 4.7 12 16 0.40 1.75 7.50 1.50 4.0 2.0 HPC8040 1000 8.4 8.4 4.3 12 16 0.40 1.75 7.50 1.50 4.0 2.0 Series 7-3、Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-D-2008 of 4.11 standard). 165° to180° Base tape Tearing Speed mm Room Temp. (℃) Room Humidity (%) Room atm (hPa) 300±10% 5~35 45~85 860~1060 www.tai-tech.com.tw TAI-TECH P23 8、Reliability and Test Condition Item Performance Operating temperature -55~+125℃(Including self - temperature rise) Storage temperature and 1. -10~+40℃,50~60%RH (Product with taping) Humidity range 2. -55~+125℃(on board) Test Condition Electrical Performance Test HP4284A,CH11025,CH3302,CH1320,CH1320S Inductance Refer to standard electrical characteristics list. DCR LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Saturation DC Current (Isat) will cause L0 Approximately △L30% to drop △L(%) Heat Rated Current (Irms) will cause the coil temperature rise △T(℃). Heat Rated Current (Irms) Approximately △T40℃ 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test High Temperature Exposure(Storage) AEC-Q200 Temperature Cycling AEC-Q200 Biased Humidity (AEC-Q200) Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Temperature：125±2℃(Inductor) Duration ：1000hrs Min. Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 30min Min.(Inductor) Step2：125±2℃ transition time 1min MAX. Step3：125±2℃ 30min Min. Appearance：No damage. Step4：Low temp. transition time 1min MAX. Inductance：with in±10% of initial value Number of cycles： 1000 Q：Shall not exceed the specification value. Measured at room temperature after placing for 24±2 hrs RDC：within ±15% of initial value and shall not exceed Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification the specification value Reflow Profiles Humidity ：85±3﹪R.H, Temperature：85℃±2℃ Duration : 1000hrs Min Measured at room temperature after placing for24±4hrs High Temperature Operational Life (AEC-Q200) External Visual Physical Dimension Resistance to Solvents Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Temperature：125±2℃(Inductor) Duration ：1000hrs Min. with 100% rated current. Measured at room temperature after placing for24±2hrs Appearance：No damage. Inspect device construction, marking and workmanship. Electrical Test not required. According to the product specification size measurement According to the product specification size measurement Appearance：No damage. Add aqueous wash chemical - OKEM clean or equivalent. Appearance：No damage. Inductance：with in±10% of initial value Mechanical Shock Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed Type Peak value Normal (g’s) duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 100 6 Half-sine 12.3 Lead 100 6 Half-sine 12.3 shocks in each direction along 3 perpendicular axes.(18 shocks). the specification value www.tai-tech.com.tw TAI-TECH P24 Item Performance Test Condition IPC/JEDEC J-STD-020DClassification Reflow Profiles Oscillation Frequency: 10～2K～10Hz for 20 minute Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Vibration Test condition:(MIL-STD-202 Condition B) Number of heat cycles:1 Resistance to Soldering Heat Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC ： within ± 15% of initial value and shall not exceed the specification valueResistance to Soldering Heat Time(s) Temperature ramp/immersion and emersion rate 260±5 (solder temp) 10±1 25mm/s±6mm/s Depth: completely cover the termination Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 15±1min(Inductor) Step2：125±2℃ within 20Sec. Step3：125±2℃ 15±1min Number of cycles： 300 Measured at room fempraturc after placing fo24±2hrs Thermal shock (AEC-Q200) ESD Temperature(℃) Appearance：No damage. Direct Contact and Air Discharge PASSIVE COMPONENT HBM ESD Discharge Waveform to a Coaxial Target Test method: AEC-Q200-002 Test mode：Contact Discharge Discharge level：4 KV (Level: 2 ) Solderability a. Method B1, 4 hrs @155°C dry heat @255°C±5°C More than 95% of the terminal electrode should be covered with Test time:5 +0/-0.5 seconds. solder。 b. Method D category 3. (steam aging 8hours ± 15 min)@ 260°C±5°C Test time: 30 +0/-0.5 seconds. Electrical Characterization Refer Specification for Approval Summary to show Min, Max, Mean and Standard deviation . Flammability Electrical Test not required. V-0 or V-1 are acceptable. Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. The duration of the applied forces shall be 60 (+ 5) sec. The force is to be applied only once to the board. Board Flex Appearance：No damage Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. Terminal Strength(SMD) Appearance：No damage Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard condition. www.tai-tech.com.tw TAI-TECH P25 9、Soldering Specifications (1) Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. (2) Soldering Reflow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. Table 1.1&1.2 (J-STD-020E) (3) Iron Reflow: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended.(Fig. 2) ‧ Preheat circuit and products to 150℃ ‧ Never contact the ceramic with the iron tip ‧ Use a 20 watt soldering iron with tip diameter of 1.0mm ‧ 355℃ tip temperature (max) ‧ 1.0mm tip diameter (max) ‧ Limit soldering time to 4~5sec. Fig.1 Soldering Reflow Fig.2 Iron soldering temperature profiles Soldering iron Method : 350± 5℃ max Reflow times: 3 times max Table (1.1): Reflow Profiles Profile Type: Pb-Free Assembly Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(ts)from(Tsmin to Tsmax) 150℃ 200℃ 60-120seconds Ramp-up rate(TLto Tp) 3℃/second max. Liquidus temperature(TL) Time(tL)maintained above TL 217℃ 60-150 seconds Classification temperature(Tc) See Table (1.2) Time(tp) at Tc- 5℃ (Tp should be equal to or less than Tc.) *< 30 seconds Ramp-down rate(Tp to TL) 6℃ /second max. Time 25℃ to peak temperature 8 minutes max. Tp: maximum peak package body temperature, Tc: the classification temperature. For user (customer) Tp should be equal to or less than Tc. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Table (1.2) Package Thickness/Volume and Classification Temperature (Tc) PB-Free Assembly Package Thickness Volume mm3 2000