PAS 4420F-352K-F10

TAI-TECH P2 Telecoil-antennas Inductors PAS4420F-SERIES 1. Features 1. Hearing Aid Compatibility-/Telecoil-antennas; Halogen 2. PAS4420F-series realizes small size and low profile. 4.4x2.0x2.0 mm. 3. 100% Lead (Pb) & Halogen-Free and RoHS compliant. Halogen-free 4. Meets the T3 FCC requirements (HAC-Act) acc. ANSI C63.19 5. Operating temperature -40~+125℃ (Including self - temperature rise) 2. Applications 1. T-coil/HAC-coil for hearing and aid compatible cell phones. 2. 3. Decoupling in RF and IF-circuit. Transponder antenna. 3. Dimensions Size PAS4420F A(mm) A’(mm) B(mm) B’(mm) C(mm) C’(mm) D(mm) 4.75±0.20 4.40±0.20 2.25±0.20 2.00±0.20 1.80±0.30 1.80±0.20 0.80 ref. Recommend PC Board Pattern Units : mm H L G L(mm) G(mm) H(mm) 4.8 3.2 2.3 4. Part Numbering PAS 4420 F A B C A: Series B: Dimension C: Lead Free Code D: Inductance E: Inductance Tolerance F: Test Frequency - Lx 252 M D E - F10 F H 252=2500 uH K=±10%, M=±20% 10 KHZ 5. Specification Inductance Part Number Tolerance (uH) fL0 (kHz) SRF RDC Rated current MHz(min) (Ω)Max. (mA) max. PAS4420F-301□-F10 300 K,M 10 2.0 14 70 PAS4420F-401□-F10 400 K,M 10 1.5 17 50 PAS4420F-252□-F10 2500 K,M 10 1.0 82 40 PAS4420F-352□-F10 3500 K,M 10 1.0 85 20 www.tai-tech.com.tw TAI-TECH P3 6. Material List No. Description Specification a. Upper Plate UV Glue b. Core Ferrite Core c Termination Ag/Ni/Sn d Wire Enameled Copper Wire 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test Agilent E4991A , Keysight E4991B ,Keysight 4980AL Inductance L Agilent-4287, Agilent-4285 SRF Agilent E4991A , Keysight E4991B Refer to standard electrical characteristic list DC Resistance Agilent-34420A Agilent-4338B Applied the current to coils, the inductance change shall be less Rated Current than 20% to initial value. Reliability Test Preconditioning: Run through reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Temperature： 125±2℃ Life Test Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24 hrs. Load Humidity Preconditioning: Run through reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Humidity：85±3% R.H, Temperature：85℃±2℃ Duration ： 1000hrs Min. Bead ： with 100% rated current ， Inductance: with 10% rated current Measured at room temperature after placing for 24 hrs. Moisture Resistance Preconditioning: Run through reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Appearance：No damage. Inductance：within±10% of initial value RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Thermal shock Step2：125±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24 hrs. Oscillation Frequency: 10Hz～2KHz～10Hz for 20 minute Equipment： Vibration checker Total Amplitude:10g Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Vibration www.tai-tech.com.tw TAI-TECH P4 Item Performance Test Condition Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm):40x100x1.2mm =0805 inch(2012mm):1.2mm 0805:1kg , B≒D. 8-2. Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-2.1 Soldering Reflow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. Table 1.1&1.2 (J-STD-020E) 8-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. (Figure 2.) ‧Preheat circuit and products to 150℃ ‧350℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5sec. Fig.1 Soldering Reflow Fig.2 Iron soldering temperature profiles Iron Soldering PRE-HEATING SOLDERING TEMPERATURE(°C) within 4~5s NATURAL COO LING 350 150 Over 60s Gradual cooling TIM E(sec.) Iron Soldering times：1 times max Reflow times: 3 times max www.tai-tech.com.tw TAI-TECH P6 Table (1.1): Reflow Profiles Profile Type: Pb-Free Assembly Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(ts)from(Tsmin to Tsmax) 150℃ 200℃ 60-120seconds Ramp-up rate(TLto Tp) 3℃/second max. Liquidus temperature(TL) Time(tL)maintained above TL 217℃ 60-150 seconds Classification temperature(Tc) See Table (1.2) Time(tp) at Tc- 5℃ (Tp should be equal to or less than Tc.) < 30 seconds Ramp-down rate(Tp to TL) 6℃ /second max. Time 25℃ to peak temperature 8 minutes max. Tp: maximum peak package body temperature, Tc: the classification temperature. For user (customer) Tp should be equal to or less than Tc. Table (1.2) Package Thickness/Volume and Classification Temperature (Tc) PB-Free Assembly Package Thickness Volume mm3 2000