TMPF 0703AV-1R0MN-ABD

P2 TAI-TECH SMD Power Inductor TMPF(V)-Series(N)-ABD 1. Features 1. Low loss realized with low DCR. 2. High performance realized by metal dust core. Halogen 3. Ultra low buzz noise, due to composite construction. 4. 100% Lead(Pb)-Free and RoHS compliant. Halogen-free 5. High reliability -Reliability test complied to AEC-Q200. 2. Applications Automotive applications. 3. Dimension E E 　1R2 1R2 2037 2303 Series H L F E B D C G A Recommend PC Board Pattern A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) L(mm) G(mm) H(mm) TMPF0402AV**-ABD 4.4±0.2 4.4±0.2 1.9±0.2 3.4±0.3 0.88±0.2 1.6±0.25 3.4 ref 1.4 ref 3.8 ref TMPF0402LRV**-ABD 4.4±0.2 4.4±0.2 1.9±0.2 3.4±0.3 0.88±0.2 1.6±0.25 3.4 ref 1.4 ref 3.8 ref 1.4 ref 3.8 ref TMPF0403AV**-ABD 4.4±0.2 4.4±0.2 2.8±0.2 3.4±0.3 0.88±0.2 1.6±0.25 3.4 ref TMPF0403LRV**-ABD 4.4±0.2 4.4±0.2 2.8±0.2 3.4±0.3 0.88±0.2 1.6±0.25 3.4 ref 1.4 ref 3.8 ref TMPF0502AV**-ABD 6.0±0.2 5.7±0.2 1.9±0.2 4.3±0.3 1.1±0.2 2.3±0.25 4.5 ref 2.0 ref 4.7 ref TMPF0503AV**-ABD 6.0±0.2 5.7±0.2 2.9±0.2 4.3±0.3 1.1±0.2 2.3±0.25 4.5 ref 2.0 ref 4.7 ref TMPF0505LRV**-ABD 6.0±0.2 5.7±0.2 4.8±0.2 4.3±0.3 1.1±0.2 2.3±0.25 4.5 ref 2.0 ref 4.7 ref TMPF0603AV**-ABD 7.2±0.2 6.9±0.2 See Spec See Spec 1.4±0.2 2.6±0.25 5.6 ref 2.5 ref 5.6 ref TMPF0604AV**-ABD 7.2±0.2 6.9±0.2 3.8±0.2 See Spec 1.4±0.2 2.6±0.25 5.6 ref 2.5 ref 5.6 ref 2.5 ref 5.6 ref TMPF0605AV**-ABD 7.2±0.2 6.9±0.2 4.8±0.2 See Spec 1.4±0.2 2.6±0.25 5.6 ref TMPF0606AV**-ABD 7.2±0.2 6.9±0.2 5.8±0.2 5.3±0.3 1.4±0.2 2.6±0.25 5.6 ref 2.5 ref 5.6 ref 2.5 ref 5.6 ref TMPF0606LRV**-ABD 7.2±0.2 6.9±0.2 5.8±0.2 5.3±0.3 1.4±0.2 2.6±0.25 5.6 ref TMPF0702AV**-ABD 8.4±0.3 8.0±0.3 1.85±0.2 See Spec 1.75±0.2 3.15±0.25 7.4 ref 2.8 ref 7.2 ref 2.8 ref 7.2 ref TMPF0703AV**-ABD 8.4±0.3 8.0±0.3 2.9±0.2 See Spec 1.75±0.2 3.15±0.25 7.4 ref TMPF0705AV**-ABD 8.4±0.3 8.0±0.3 4.8±0.2 See Spec 1.75±0.2 3.15±0.25 7.4 ref 2.8 ref 7.2 ref 7.8 ref 2.8 ref 6.7 ref TMPF0707AV**-ABD 8.4±0.3 8.0±0.3 6.7±0.3 See Spec 1.75±0.2 3.15±0.25 TMPF0808AV**-ABD 8.9±0.3 8.5±0.3 7.7±0.3 See Spec 1.8±0.2 3.5±0.3 8.0 ref 2.7 ref 7.8 ref 3.7ref 11.0 ref TMPF1006AV**-ABD 11.9±0.3 11.0±0.3 5.7±0.3 See Spec 2.4±0.2 4.5±0.3 10.5 ref TMPF1010AV**-ABD 11.9±0.3 11.0±0.3 9.7±0.3 See Spec 2.4±0.2 4.4±0.3 10.5 ref 3.7ref 11.0 ref TMPF1031LRV**-ABD 11.9±0.3 11.0±0.30 2.9±0.2 9.0±0.5 2.4±0.2 4.4±0.3 10.5 ref 3.7ref 11.0 ref TMPF1508AV**-ABD 17.5±0.3 16.5±0.3 7.7±0.3 13.2±0.5 3.2±0.2 7.0±0.3 15.0ref 6.0ref 15.0ref TMPF1510AV**-ABD 17.5±0.3 16.5±0.3 9.7±0.3 13.2±0.5 3.2±0.2 7.0±0.3 15.0ref 6.0ref 15.0ref 7.0±0.3 15.0ref 6.0ref 15.0ref TMPF1513AV**-ABD 17.5±0.3 16.5±0.3 12.7±0.3 13.2±0.5 3.2±0.2 P3 TAI-TECH 4. Part Numbering TMPF 0402 AV A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code 5. Specification - 1R2 MN D E - ABD F BxC Material. 1R2=1.20uH M=±20% Marking: Black.1R2 and 2303(23YY,03 WW,follow production date). AB:oversize I rms ( A ) Typ I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ rise Typ TMPF0402AV-R10MN-ABD 0.10 13.5 18.0 TMPF0402AV-R22MN-ABD 0.22 13.0 TMPF0402AV-R33MN-ABD 0.33 12.0 TMPF0402AV-R36MN-ABD 0.36 TMPF0402AV-R40MN-ABD 0.40 TMPF0402AV-R47MN-ABD 0.47 TMPF0402AV-R56MN-ABD 0.56 TMPF0402AV-R60MN-ABD 0.60 TMPF0402AV-R72MN-ABD 0.72 TMPF0402AV-1R0MN-ABD TMPF0402AV-1R2MN-ABD DCR Test Max DCR (mΩ) Typ DCR (mΩ) Max 38.0 33.0 2.2 2.42 16.8 19.5 18.8 4.1 4.6 15.5 18.0 16.5 5.0 5.5 11.0 14.5 17.0 15.0 5.6 6.3 10.0 14.0 15.5 13.5 6.9 7.73 9.0 12.5 14.5 13.0 7.8 8.58 8.5 12.0 14.0 12.6 8.4 9.3 8.0 11.7 13.7 12.3 8.6 9.52 7.6 10.5 12.0 10.6 10.4 11.6 1.00 6.8 9.6 9.6 8.8 13.3 14.6 1.20 6.6 9.0 9.0 7.8 16.2 17.9 TMPF0402AV-1R5MN-ABD 1.50 5.8 7.6 8.0 7.4 21.0 23.5 TMPF0402AV-1R8MN-ABD 1.80 5.2 7.0 7.5 7.0 25.0 28.0 Part Number Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 15V ref（1.5uH and above）. Rated operating voltage(across inductor) 40V ref ( 1.2uH and below). P4 TAI-TECH I rms ( A ) Typ I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ rise 1 2 3 3 TMPF0402LRV-R47MN-ABD 0.47 9.8 13.2 7.0 10.0 14.0 TMPF0402LRV-R56MN-ABD 0..56 9.5 12.6 6.0 9.0 TMPF0402LRV-R60MN-ABD 0.60 9.4 12.4 5.8 8.8 TMPF0402LRV-R68MN-ABD 0.68 9.2 12.0 5.2 TMPF0402LRV-R82MN-ABD 0.82 8.5 11.5 4.8 TMPF0402LRV-1R0MN-ABD 1.00 8.0 11.0 TMPF0402LRV-1R2MN-ABD 1.20 7.2 9.5 TMPF0402LRV-1R5MN-ABD 1.50 6.7 TMPF0402LRV-2R0MN-ABD 2.00 6.2 TMPF0402LRV-2R2MN-ABD 2.20 6.0 Part Number Note: DCR (mΩ) Typ. DCR (mΩ) Max. 12.5 6.0 6.8 13.0 11.3 6.9 7.8 12.8 11.1 6.9 7.8 8.0 11.6 10.0 7.3 8.2 6.5 10.2 9.0 8.6 9.5 4.5 5.4 9.2 8.0 10.6 11.7 4.3 5.0 8.6 7.5 12.2 13.4 9.1 4.1 4.5 7.5 6.7 14.4 15.8 8.2 3.2 4.0 6.2 5.0 21.15 23.3 8.0 3.1 3.8 6.0 4.8 21.35 23.5 Typ Max 1. 2. 3. 4. 5. Test frequency : L : 100KHz /0.1V. All test data referenced to 25℃ ambient. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. Current that causes the specified temperature rise from 25°C ambient. Saturation Current (Isat 1) will cause L0 to drop approximately 10%. Saturation Current (Isat 2) will cause L0 to drop approximately 20%. Saturation Current (Isat 3) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor)15V Ref. Part Number Inductance (uH) ±20% @0A TMPF0403AV-R47MN-ABD I rms ( A ) Typ I sat ( A ) Max DCR (mΩ) Typ. DCR (mΩ) Max. 17.0 15.0 6.6 7.26 10.0 10.0 9.0 11.6 12.76 7.2 7.0 6.2 18.9 20.8 20℃ rise 40℃ rise Typ 0.47 10.0 14.0 TMPF0403AV-1R0MN-ABD 1.00 7.0 TMPF0403AV-2R2MN-ABD 2.20 5.5 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Rated operating voltage(across inductor) 40V ref. I rms ( A ) Typ I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ rise 1 2 3 3 TMPF0403LRV-R90MN-ABD 0.90 8.2 11.2 5.2 7.0 10.0 TMPF0403LRV-1R0MN-ABD 1.00 8.0 11.0 5.0 6.8 9.8 TMPF0403LRV-1R2MN-ABD 1.20 7.8 9.8 4.6 6.4 TMPF0403LRV-1R5MN-ABD 1.50 7.0 9.0 4.1 5.6 TMPF0403LRV-1R8MN-ABD 1.80 6.5 8.2 3.8 TMPF0403LRV-2R2MN-ABD 2.20 6.0 7.8 3.6 TMPF0403LRV-3R3MN-ABD 3.30 5.0 6.6 3.3 Part Number Note: 1. 2. 3. 4. 5. DCR (mΩ) Typ. DCR (mΩ) Max. 9.2 9.1 10.1 9.0 9.1 10.1 9.2 8.7 10.4 11.5 8.0 7.0 12.0 13.2 5.3 7.5 6.6 17.4 19.2 5.1 7.0 6.1 20.5 22.6 4.8 6.2 5.3 26.0 28.6 Typ Max Test frequency : L : 100KHz /0.1V. All test data referenced to 25℃ ambient. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. Current that causes the specified temperature rise from 25°C ambient. Saturation Current (Isat 1) will cause L0 to drop approximately 10%. Saturation Current (Isat 2) will cause L0 to drop approximately 20%. Saturation Current (Isat 3) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 15Vref. P5 TAI-TECH I rms ( A ) Typ I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ rise Max DCR (mΩ) Typ. DCR (mΩ) Max. Typ TMPF0502AV-R15MN-ABD 0.15 13.9 18.8 TMPF0502AV-R16MN-ABD 0.16 13.9 18.8 30.0 27.0 4.00 4.60 30.0 27.0 4.00 4.60 TMPF0502AV-R33MN-ABD 0.33 10.5 TMPF0502AV-R47MN-ABD 0.47 10.1 14.4 26.0 24.0 6.10 7.00 14.1 22.0 20.0 7.00 8.05 TMPF0502AV-R56MN-ABD 0.56 TMPF0502AV-R68MN-ABD 0.68 9.9 13.9 19.0 16.0 8.70 9.54 9.6 13.4 16.0 14.0 8.90 10.2 TMPF0502AV-R80MN-ABD TMPF0502AV-R82MN-ABD 0.80 9.4 13.0 15.5 13.5 10.3 11.8 0.82 8.5 12.0 15.0 13.0 11.0 12.7 TMPF0502AV-1R0MN-ABD 1.00 7.5 10.5 14.5 12.8 12.0 13.8 TMPF0502AV-1R2MN-ABD 1.20 6.8 9.40 14.0 12.2 14.2 16.3 TMPF0502AV-1R5MN-ABD 1.50 6.4 8.80 13.3 11.7 16.2 18.7 Part Number Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40Vref. I rms ( A ) Typ I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ rise Max DCR (mΩ) Typ. DCR (mΩ) Max. Typ TMPF0503AV-R15MN-ABD 0.15 14.3 22.2 36.0 32.5 2.10 2.31 TMPF0503AV-R16MN-ABD 0.16 14.2 TMPF0503AV-R28MN-ABD 0.28 14.0 22.2 35.0 32.0 2.12 2.33 19.0 32.0 28.0 3.00 3.30 TMPF0503AV-R33MN-ABD 0.33 13.8 19.2 28.0 26.0 3.20 3.52 TMPF0503AV-R47MN-ABD TMPF0503AV-R56MN-ABD 0.47 13.7 18.4 26.0 24.0 3.75 4.13 0.56 13.6 17.7 22.2 20.2 4.05 4.52 TMPF0503AV-R60MN-ABD 0.60 13.6 17.7 22.0 20.0 4.11 4.52 TMPF0503AV-R80MN-ABD 0.80 10.1 13.1 20.0 18.0 5.14 5.65 TMPF0503AV-R82MN-ABD 0.82 9.90 12.9 19.7 17.6 5.25 5.78 TMPF0503AV-1R0MN-ABD 1.00 9.00 12.2 16.5 14.3 6.90 7.60 TMPF0503AV-1R2MN-ABD 1.20 8.50 11.0 15.0 13.5 8.80 9.70 TMPF0503AV-1R5MN-ABD 1.50 8.00 10.5 14.0 12.5 10.1 11.2 TMPF0503AV-1R8MN-ABD 1.80 7.60 10.1 12.3 11.3 11.5 12.7 TMPF0503AV-2R2MN-ABD 2.20 7.20 9.70 10.0 9.0 13.2 14.5 TMPF0503AV-3R3MN-ABD 3.30 5.90 8.10 9.5 8.7 21.0 23.1 TMPF0503AV-3R6MN-ABD 3.60 4.60 6.50 9.0 7.9 25.0 27.5 TMPF0503AV-4R7MN-ABD 4.70 4.30 5.90 8.2 7.0 33.0 36.3 Part Number Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L/Q: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. P6 TAI-TECH I rms ( A ) Typ I sat ( A ) Part Number Inductance (uH) ±20% @0A 20℃ rise 40℃ rise Typ Max DCR(mΩ) Typ. DCR(mΩ) Max. TMPF0505LRV-4R7MN-ABD 4.70 5.90 8.10 8.80 7.40 19.0 21.0 TMPF0505LRV-5R6MN-ABD 5.60 5.30 7.20 8.60 7.20 22.0 24.2 TMPF0505LRV-6R8MN-ABD 6.80 4.80 6.40 7.80 6.60 26.0 28.6 TMPF0505LRV-8R2MN-ABD 8.20 4.60 6.10 7.20 6.10 29.5 32.5 Note: 1. 2. 3. 4. 5. 6. Test frequency : L : 100KHz /0.1V. All test data referenced to 25℃ ambient. Testing Instrument : L/Q: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. Current that causes the specified temperature rise from 25°C ambient. Saturation Current (Isat) will cause L0 to drop approximately 30%. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 15V ref. Part Number Inductance (uH) ±20% @0A I rms ( A ) Typ I sat ( A ) 20℃ rise 40℃ rise Typ Max DCR (mΩ) Typ. DCR (mΩ) Max. C(mm) ±0.2 D(mm) ±0.3 TMPF0603AV-R18MN-ABD 0.18 24.0 32.0 40.0 36.0 1.60 1.75 2.8 5.30 TMPF0603AV-R33MN-ABD 0.33 20.0 25.0 32.0 28.0 2.25 2.50 2.8 5.55 TMPF0603AV-R56MN-ABD 0.56 17.0 22.0 29.0 25.0 3.00 3.31 2.8 5.30 TMPF0603AV-R68MN-ABD 0.68 15.0 20.0 25.0 21.0 4.7 5.17 2.8 5.30 TMPF0603AV-1R0MN-ABD 1.00 13.0 18.0 23.0 18.0 5.50 6.05 2.8 5.20 TMPF0603AV-1R2MN-ABD 1.20 12.0 16.0 22.0 16.0 6.70 7.40 2.8 5.15 TMPF0603AV-1R5MN-ABD 1.50 11.0 15.0 20.0 15.5 8.30 9.13 2.9 5.15 TMPF0603AV-1R8MN-ABD 1.80 10.0 14.0 18.2 13.0 9.20 10.2 2.9 5.10 TMPF0603AV-2R2MN-ABD 2.20 7.00 10.0 15.9 11.0 11.0 12.2 2.9 5.05 TMPF0603AV-3R3MN-ABD 3.30 6.00 8.00 12.2 9.00 18.8 20.8 2.9 5.00 TMPF0603AV-4R5MN-ABD 4.50 5.00 7.00 10.0 8.00 23.0 25.3 2.9 5.00 TMPF0603AV-4R7MN-ABD 4.70 4.0 6.0 9.0 7.0 26.5 29.2 2.9 5.00 Note: 1. 2. 3. 4. 5. 6. Test frequency : L : 100KHz /0.1V. All test data referenced to 25℃ ambient. Testing Instrument : L/Q: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. Current that causes the specified temperature rise from 25°C ambient. Saturation Current (Isat) will cause L0 to drop approximately 30%. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. P7 TAI-TECH Part Number Inductance (uH) ±20% @0A I rms ( A ) Typ I sat ( A ) 20℃ rise 40℃ rise Typ Max DCR (mΩ) Typ. DCR (mΩ) Max. D (mm) ±0.3 TMPF0604AV-R47MN-ABD 0.47 19 24 31 27 2.6 2.86 5.5 TMPF0604AV-R68MN-ABD 0.68 16 20.5 26 22 3.6 3.96 5.5 TMPF0604AV-1R0MN-ABD 1.0 14 19 23 18 4.9 5.39 5.2 TMPF0604AV-1R5MN-ABD 1.5 12 16 17 13 6.4 7.04 5.2 TMPF0604AV-2R2MN-ABD 2.2 8.0 11 15.9 11.5 10.6 11.7 5.0 TMPF0604AV-3R3MN-ABD 3.3 7.0 9.2 12.3 9.6 14.1 15.5 5.0 TMPF0604AV-4R7MN-ABD 4.7 6.0 7.8 10.2 8.0 21 23.1 5.0 TMPF0604AV-5R6MN-ABD 5.6 5.0 6.7 9.8 7.8 25.5 28.1 5.0 Note: 1. 2. 3. 4. 5. 6. Test frequency : L : 100KHz /0.1V. All test data referenced to 25℃ ambient. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. Current that causes the specified temperature rise from 25°C ambient. Saturation Current (Isat) will cause L0 to drop approximately 30%. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. Part Number Inductance (uH) ±20% @0A I rms ( A ) Typ I sat ( A ) 20℃ rise 40℃ rise Typ Max DCR (mΩ) Typ. DCR (mΩ) Max. D (mm) ±0.3 TMPF0605AV-R82MN-ABD 0.82 16.0 21.0 24.0 20.0 3.8 4.18 5.3 TMPF0605AV-1R0MN-ABD 1.00 15.0 20.0 23.0 18.0 4.1 4.52 5.3 TMPF0605AV-1R2MN-ABD 1.20 14.0 18.0 22.0 16.0 5.3 5.83 5.3 TMPF0605AV-1R5MN-ABD 1.50 13.0 17.0 19.5 14.5 5.7 6.3 5.3 TMPF0605AV-1R8MN-ABD 1.80 12.0 16.0 18.5 13.5 6.4 7.1 5.3 TMPF0605AV-2R2MN-ABD 2.20 10.0 13.0 16.0 12.0 7.7 8.5 5.2 TMPF0605AV-3R3MN-ABD 3.30 8.5 11.0 12.5 10.0 11.2 12.5 5.2 TMPF0605AV-4R3MN-ABD 4.30 7.0 9.0 11.0 8.5 15.1 16.2 5.2 TMPF0605AV-4R7MN-ABD 4.70 6.5 8.5 10.5 8.4 16.7 18.4 5.2 TMPF0605AV-5R6MN-ABD 5.60 5.7 7.0 10.0 8.3 20.0 22.0 5.2 TMPF0605AV-6R8MN-ABD 6.80 5.2 6.6 9.0 7.0 23.1 25.4 5.2 TMPF0605AV-8R2MN-ABD 8.20 4.5 6.2 8.0 6.8 28.6 31.5 5.2 Note: 1. 2. 3. 4. 5. 6. Test frequency : L : 100KHz /0.1V. All test data referenced to 25℃ ambient. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. Current that causes the specified temperature rise from 25°C ambient. Saturation Current (Isat) will cause L0 to drop approximately 30%. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. P8 TAI-TECH I rms ( A ) Typ I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ rise Typ TMPF0606AV-1R0MN-ABD 1.00 16.0 21.0 TMPF0606AV-1R5MN-ABD 1.50 13.5 17.5 TMPF0606AV-2R2MN-ABD 2.20 11.0 TMPF0606AV-3R3MN-ABD 3.30 TMPF0606AV-4R7MN-ABD 4.70 TMPF0606AV-5R6MN-ABD 5.60 Part Number Note: Max DCR (mΩ) Typ. DCR (mΩ) Max. 24.0 19.0 4.0 4.4 20.0 15.0 5.5 6.1 14.0 16.5 12.5 7.3 8.1 9.0 12.0 13.0 11.0 11.1 12.3 8.5 11.0 11.5 9.5 15.1 16.2 7.6 10.0 10.6 9.1 18.2 20.0 1. 2. 3. 4. 5. 6. Test frequency : L : 100KHz /0.1V. All test data referenced to 25℃ ambient. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. Current that causes the specified temperature rise from 25°C ambient. Saturation Current (Isat) will cause L0 to drop approximately 30%. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref I rms ( A ) Typ I sat ( A ) Part Number Inductance (uH) ±20% @0A 20℃ rise 40℃ rise Max DCR (mΩ) Typ. DCR (mΩ) Max. Typ TMPF0606LRV-R22MN-ABD 0.22 18.0 25.0 36.0 32.0 1.5 1.65 TMPF0606LRV-1R0MN-ABD 1.0 15.0 19.0 18.0 16.0 3.9 4.29 TMPF0606LRV-1R2MN-ABD 1.2 TMPF0606LRV-1R5MN-ABD 1.50 14.0 17.0 17.0 15.0 4.6 5.06 13.0 16.0 16.0 14.0 5.1 5.61 TMPF0606LRV-2R2MN-ABD TMPF0606LRV-3R3MN-ABD 2.20 11.0 14.0 14.0 12.0 7.0 7.80 3.30 9.0 12.0 11.5 10.5 11.0 12.1 TMPF0606LRV-4R7MN-ABD 4.70 8.0 11.0 10.5 9.5 13.1 14.4 TMPF0606LRV-5R6MN-ABD 5.60 7.5 10.0 10.0 9.0 14.3 15.8 TMPF0606LRV-6R8MN-ABD 6.80 7.0 9.0 9.2 8.7 18.9 20.8 TMPF0606LRV-8R2MN-ABD 8.20 6.0 8.0 8.5 8.0 22.5 24.8 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Ratedoperatingvoltage(acrossinductor)15V ref. P9 TAI-TECH I rms ( A ) Typ I sat ( A ) Part Number Inductance (uH) ±20% @0A Max DCR (mΩ) Typ. DCR (mΩ) Max. D (mm) ±0.3 20℃ rise 40℃ rise Typ TMPF0702AV-R15MN-ABD 0.15 18 24 TMPF0702AV-R27MN-ABD 0.27 16 21 51 46 1.9 2.5 6.6 35 32 2.9 3.5 6.6 TMPF0702AV-R31MN-ABD 0.31 14 TMPF0702AV-R33MN-ABD 0.33 13 20 34 31 4.0 4.8 6.2 19 34 31 4.0 4.8 6.2 TMPF0702AV-R47MN-ABD 0.47 TMPF0702AV-R68MN-ABD 0.68 12 17 28 25 5.1 6.2 6.2 10 13 25 23 7.9 9.2 6.2 TMPF0702AV-1R0MN-ABD 1.00 TMPF0702AV-1R2MN-ABD 1.20 8 11 23 20 9.8 10.8 6.2 7 10 21 18 11.5 12.8 6.2 TMPF0702AV-1R5MN-ABD TMPF0702AV-1R8MN-ABD 1.50 6 9 17 15 16 17.6 6.2 1.80 5.5 8 15 13 18 19.8 6.2 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. I rms ( A ) Typ I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ rise Typ TMPF0703AV-R60MN-ABD 0.60 18.0 23.0 TMPF0703AV-1R0MN-ABD 1.00 16.1 TMPF0703AV-1R5MN-ABD 1.50 12.0 TMPF0703AV-2R2MN-ABD 2.20 10.0 TMPF0703AV-2R7MN-ABD 2.70 TMPF0703AV-3R3MN-ABD 3.30 TMPF0703AV-4R7MN-ABD TMPF0703AV-5R6MN-ABD Part Number Max DCR (mΩ) Typ. DCR (mΩ) Max. D (mm) ±0.3 36.0 32.0 2.90 3.20 6.6 21.8 30.0 28.0 4.55 5.00 6.6 15.3 25.0 23.5 7.50 8.25 6.6 13.0 19.0 17.0 12.4 13.7 6.2 9.20 11.4 16.0 13.5 14.0 15.4 6.2 8.00 10.0 15.0 13.0 16.3 18.0 6.2 4.70 6.90 9.00 13.5 12.2 24.2 26.7 6.2 5.60 5.30 7.30 12.5 11.5 30.1 33.2 6.2 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. P10 TAI-TECH I rms ( A ) Typ Inductance (uH) ±20% @0A 20℃ rise 40℃ rise TMPF0705AV-1R8MN-ABD 1.80 13.0 16.0 TMPF0705AV-2R2MN-ABD 2.20 11.0 14.0 TMPF0705AV-3R3MN-ABD 3.30 10.0 13.0 TMPF0705AV-4R7MN-ABD 4.70 8.5 11.0 TMPF0705AV-5R6MN-ABD 5.60 7.0 10.0 Part Number I sat ( A ) Max DCR (mΩ) Typ. DCR (mΩ) Max. D (mm) ±0.3 25 21 4.20 4.62 6.5 21.0 17.0 5.8 6.4 6.2 17.0 14.0 10.4 11.44 6.2 15.0 13.0 14.0 15.4 6.2 13.0 11.0 15.6 17.2 6.2 Typ Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. I rms( A ) Typ I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ rise Typ TMPF0707AV-2R2MN-ABD 2.20 13.2 17.8 TMPF0707AV-3R3MN-ABD 3.30 11.5 TMPF0707AV-4R7MN-ABD 4.70 TMPF0707AV-5R6MN-ABD 5.60 TMPF0707AV-6R8MN-ABD TMPF0707AV-100MN-ABD Part Number Max DCR (mΩ) Typ. DCR (mΩ) Max. D (mm) ±0.3 19.6 17.6 5.73 6.33 6.70 15.1 19.4 15.1 8.56 9.42 6.70 10.5 13.6 15.5 14.0 12.2 13.5 6.70 8.5 11.4 14.1 12.0 13.67 15.03 6.50 6.80 7.0 9.5 12.8 11.0 17.8 19.6 6.50 10.0 5.0 7.0 10.0 9.0 24.0 26.4 6.50 Note: 1. 2. 3. 4. 5. 6. Test frequency : L : 100KHz /0.1V. All test data referenced to 25℃ ambient. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. Current that causes the specified temperature rise from 25°C ambient. Saturation Current (Isat) will cause L0 to drop approximately 30%. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. I rms( A ) Typ I sat ( A ) Part Number Inductance (uH) ±20% @0A Max DCR (mΩ) Typ. DCR (mΩ) Max. D (mm) ±0.4 20℃ rise 40℃ rise Typ TMPF0808AV-3R3MN-ABD 3.30 13.5 18.0 23.0 20.0 6.6 7.3 6.9 TMPF0808AV-4R7MN-ABD 4.70 10.5 TMPF0808AV-6R8MN-ABD 6.80 8.0 14.6 19.0 17.0 8.9 9.8 6.9 11.3 14.5 12.5 13.0 14.3 6.9 TMPF0808AV-100MN-ABD 10.0 6.6 8.7 11.0 10.0 20.8 22.9 6.9 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref P11 TAI-TECH I rms ( A ) Typ I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ Rise Max DCR (mΩ) Typ. DCR (mΩ) Max. Typ D(mm) ±0.5 TMPF1006AV-2R2MN-ABD 2.20 14.0 20.0 35.0 30.0 4.40 4.84 9.0 TMPF1006AV-3R3MN-ABD 3.30 11.4 16.8 28.0 25.0 7.00 7.70 9.0 TMPF1006AV-4R7MN-ABD 4.70 8.7 14.0 25.0 22.0 9.70 10.72 9.0 TMPF1006AV-5R6MN-ABD 5.60 7.0 12.0 20.0 17.0 10.8 11.9 8.8 TMPF1006AV-6R8MN-ABD 6.80 6.0 10.5 18.0 15.5 11.8 13.0 8.8 TMPF1006AV-8R2MN-ABD 8.20 5.0 9.5 16.5 14.0 15.0 16.5 8.8 TMPF1006AV-100MN-ABD 10.0 4.5 9.0 15.0 13.0 16.5 18.2 8.8 Part Number Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. Part Number Inductance (uH) ±20% @0A I rms ( A ) Typ I sat ( A ) 20℃ rise 40℃ Rise Typ Max DCR (mΩ) Typ. DCR (mΩ) Max. D (mm) ±0.5 TMPF1010AV-3R3MN-ABD 3.30 18.2 25.0 27.4 23.4 3.7 4.1 9.3 TMPF1010AV-4R7MN-ABD 4.70 17.5 24.0 25.4 21.4 5.2 5.7 9.3 TMPF1010AV-5R6MN-ABD 5.60 15.7 21.2 23.6 19.6 6.5 7.2 9.3 TMPF1010AV-6R8MN-ABD 6.80 14.0 18.5 21.8 18.5 8.1 8.9 9.0 TMPF1010AV-8R2MN-ABD 8.20 12.9 17.1 18.3 16.3 10.8 12.4 9.0 TMPF1010AV-100MN-ABD 10.0 11.5 15.5 17.5 14.6 12.5 13.75 9.0 TMPF1010AV-150MN-ABD 15.0 9.9 13.8 15.5 12.5 17.5 19.30 9.0 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. P12 TAI-TECH I rms ( A ) Typ I sat ( A ) Part Number Inductance (uH) ±20% @0A 20℃ rise 40℃ rise Max DCR (mΩ) Typ. DCR (mΩ) Max. Typ TMPF1031LRV-R28MN-ABD 0.28 25.5 35.0 65.0 58.0 1.45 1.60 TMPF1031LRV-R56MN-ABD 0.56 23.0 TMPF1031LRV-R82MN-ABD 0.82 18.0 32.0 44.0 39.0 2.50 2.75 25.0 38.0 32.0 3.70 4.10 TMPF1031LRV-R90MN-ABD 0.90 TMPF1031LRV-1R0MN-ABD 1.00 17.0 24.0 36.0 31.0 3.80 4.20 16.0 23.0 35.0 30.0 4.50 4.95 TMPF1031LRV-1R5MN-ABD 1.50 12.0 18.0 30.0 25.0 6.00 6.60 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 15V ref. Part Number Inductance (uH) ±20% @0A I rms ( A ) Typ I sat ( A ) 20℃ rise 40℃ Rise Typ Max DCR (mΩ) Typ. DCR (mΩ) Max. TMPF1508AV-2R0MN-ABD 2.00 29.5 40.0 57.0 52.0 1.92 2.21 TMPF1508AV-2R2MN-ABD 2.20 28.0 37.0 55.0 49.0 2.15 2.48 TMPF1508AV-3R0MN-ABD 3.00 26.0 34.5 46.0 41.0 2.50 3.00 TMPF1508AV-4R2MN-ABD 4.20 20.5 27.0 38.0 33.0 3.90 4.68 TMPF1508AV-4R7MN-ABD 4.70 20.0 26.5 37.0 32.0 4.30 5.16 TMPF1508AV-5R3MN-ABD 5.30 19.5 26.0 35.0 31.0 4.45 5.34 TMPF1508AV-6R2MN-ABD 6.20 17.0 23.0 34.0 31.0 5.40 6.50 TMPF1508AV-7R2MN-ABD 7.20 15.0 21.0 32.0 29.0 6.00 7.20 TMPF1508AV-8R2MN-ABD 8.20 13.0 19.0 28.0 25.0 6.60 7.92 TMPF1508AV-100MN-ABD 10.0 11.0 16.0 24.0 21.0 8.00 9.60 TMPF1508AV-150MN-ABD 15.0 10.0 13.0 21.0 18.0 12.50 15.00 TMPF1508AV-220MN-ABD 22.0 9.0 12.0 19.0 16.0 19.30 23.20 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. P13 TAI-TECH I rms ( A ) I sat ( A ) Part Number Inductance (uH) ±20% @0A 20℃ rise 40℃ Rise Max DCR (mΩ) Typ. DCR (mΩ) Max. Typ TMPF1510AV-4R7MN-ABD 4.7 22.0 30.0 43.0 39.0 3.40 3.80 TMPF1510AV-5R6MN-ABD 5.6 21.0 TMPF1510AV-6R8MN-ABD 6.8 20.0 28.0 38.0 34.0 3.82 4.20 26.0 36.0 31.0 4.18 4.60 TMPF1510AV-8R2MN-ABD 8.2 TMPF1510AV-100MN-ABD 10.0 19.0 25.0 32.0 28.0 6.00 7.20 18.0 24.0 29.0 26.0 7.10 8.60 TMPF1510AV-150MN-ABD TMPF1510AV-220MN-ABD 15.0 14.0 18.0 23.0 20.0 9.20 11.50 22.0 11.0 16.0 20.0 18.0 13.2 15.8 TMPF1510AV-330MN-ABD 33.0 9.0 13.0 18.7 16.7 18.7 20.0 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. I rms ( A ) I sat ( A ) Inductance (uH) ±20% @0A 20℃ rise 40℃ Rise Max DCR (mΩ) Typ. DCR (mΩ) Max. Typ TMPF1513AV-4R7MN-ABD 4.70 23.0 31.0 44.0 40.0 3.0 3.3 TMPF1513AV-5R6MN-ABD 5.60 22.0 29.0 40.0 35.0 3.5 3.9 TMPF1513AV-6R8MN-ABD 6.80 21.0 27.0 37.0 32.0 3.8 4.2 TMPF1513AV-8R2MN-ABD 8.20 20.0 26.0 33.0 29.0 5.1 5.74 TMPF1513AV-100MN-ABD 10.0 19.0 25.0 30.0 27.0 6.3 7.0 TMPF1513AV-150MN-ABD 15.0 16.0 22.0 25.5 21.0 6.8 7.5 TMPF1513AV-220MN-ABD 22.0 12.0 17.0 22.0 19.0 12.6 13.86 TMPF1513AV-330MN-ABD 33.0 9.0 14.0 19.0 16.0 18.5 22.2 Part Number Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 9. Rated operating voltage(across inductor) 40V ref. 6. Material List 2 4 1 2 3 NO Items Materials 1 Core Alloy powder. 2 Wire Polyester Wire or equivalent. 3 Solder 100% Pb free solder 4 Ink Halogen-free ketone P14 TAI-TECH 7. Reliability and Test Condition Item Performance Operating temperature -55~+155℃(Including self - temperature rise) Storage temperature and 1. -10~+40℃,50~60%RH (Product with taping) Humidity range 2. -55~+155℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30% Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) will cause the coil temperature rise △ Heat Rated Current (Irms) Approximately △T40℃ T(℃). 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Temperature：155±2℃(Inductor) Duration ：1000hrs Min. Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 30min Min.(Inductor) Step2：155±2℃ transition time 1min MAX. Step3：155±2℃ 30min Min. Step4：Low temp. transition time 1min MAX. Number of cycles： 1000 Measured at room temperature after placing for 24±2 hrs High Temperature Exposure(Storage) AEC-Q200 Temperature Cycling AEC-Q200 t=24 hours/cycle. Note:Steps 7a & 7b Unpowered. Moisture Resistance (AEC-Q200) Appearance：No damage. Inductance：within±10% of initial value RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 3 times. ( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Humidity ：85±3﹪R.H, Temperature：85℃±2℃ Duration : 1000hrs Min Measured at room temperature after placing for24±2hrs Biased Humidity (AEC-Q200) Preconditioning: Run through IR reflow for 3 times. ( IPC/JEDECJ-STD-020E Classification Reflow Profiles Temperature：155±2℃(Inductor) Duration ：1000hrs Min. With 100% rated current. Measured at room temperature after placing for24±2hrs High Temperature Operational Life (AEC-Q200) External Visual Physical Dimension Resistance to Solvents Appearance：No damage. Inspect device construction, marking and workmanship. Electrical Test not required. According to the product specification size measurement According to the product specification size measurement Appearance：No damage. Add aqueous wash chemical - OKEM clean or equivalent. Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Appearance：No damage. Mechanical Shock Test condition Peak value Normal (g’s) duration (D) (ms) Inductance：within±10% of initial value Type RDC：within ±15% of initial value and shall not exceed SMD 100 Lead 100 the specification value Wave form Velocity change (Vi)ft/sec 6 Half-sine 12.3 6 Half-sine 12.3 3 shocks in each direction along 3 perpendicular axes(18 shocks). P15 TAI-TECH Item Performance Vibration Appearance：No damage. Resistance to Soldering Heat Inductance：within±10% of initial value RDC：within ±15% of initial value and shall not exceed the specification value Temperature(℃) Time(s) Temperature ramp/immersion and emersion rate 260±5 (solder temp) 10±1 25mm/s±6mm/s Depth: completely cover the termination Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 15±1min(Inductor) Step2：155±2℃ within 20Sec. Step3：155±2℃ 15±1min Number of cycles： 300 Measured at room fempraturc after placing fo24±2hrs Thermal shock (AEC-Q200) ESD Test Condition Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Oscillation Frequency: 10Hz～2KHz～10Hz for 20 minute Equipment： Vibration checker Total Amplitude: 5g Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Test condition:(MIL-STD-202 Condition B) Number of heat cycles:1 Appearance：No damage. Direct Contact and Air Discharge PASSIVE COMPONENT HBM ESD Discharge Waveform to a Coaxial Target Test method: AEC-Q200-002 Test mode：Contact Discharge Discharge level：4 KV (Level: 2 ) More than 95% of the terminal electrode should be covered Solderability Electrical Characterization Flammability with solder。 a. Method B1, 4 hrs @155°C dry heat @255°C±5°C Test time:5 +0/-0.5 seconds. b. Method D category 3. (steam aging 8hours ± 15 min)@ 260°C±5°C Test time: 30 +0/-0.5 seconds. Refer Specification for Approval Summary to show Min, Max, Mean and Standard deviation . Electrical Test not required. V-0 or V-1 are acceptable. Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. The duration of the applied forces shall be 60 (+ 5) sec. The force is to be applied only once to the board. Board Flex Appearance：No damage Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. Terminal Strength(SMD) Appearance：No damage Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard condition. P16 TAI-TECH 8.Soldering Specifications (1) Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. (2) Soldering Reflow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. Table 1.1&1.2 (J-STD-020E) (3) Iron Reflow: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended.(Fig. 2) ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5sec. Fig.1 Soldering Reflow Fig.2 Iron soldering temperature profiles Soldering iron Method : 350± 5℃ max Reflow times: 3 times max Table (1.1): Reflow Profiles Profile Type: Pb-Free Assembly Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(ts)from(Tsmin to Tsmax) 150℃ 200℃ 60-120seconds Ramp-up rate(TLto Tp) 3℃/second max. Liquidus temperature(TL) Time(tL)maintained above TL 217℃ 60-150 seconds Classification temperature(Tc) See Table (1.2) Time(tp) at Tc- 5℃ (Tp should be equal to or less than Tc.) < 30 seconds Ramp-down rate(Tp to TL) 6℃ /second max. Time 25℃ to peak temperature 8 minutes max. Tp: maximum peak package body temperature, Tc: the classification temperature. For user (customer) Tp should be equal to or less than Tc. Table (1.2) Package Thickness/Volume and Classification Temperature (Tc) PB-Free Assembly Package Volume mm3 Volume mm3 Thickness