TTMP 1008N4V-100MN-D

TAI-TECH P2 SMD Power Inductor TTMP1008N4V-Series(N)-D 1. Features 1. Low loss realized with low DCR. 2. High performance realized by metal dust core. Halogen 3. Ultra low buzz noise, due to composite construction. 4. 100% Lead(Pb)-Free and RoHS compliant. Halogen-free 5. High reliability -Reliability test complied to AEC-Q200. 6. 2. Applications Automotive applications. 3. Dimensions Recommend PC Board Pattern 100 2234 Series A(mm) B(mm) C(mm) D(mm) E(mm) P(mm) TTMP1008N4V 11.4±0.3 10.2±0.3 7.7±0.3 2.4±0.3 3.1±0.2 1.6±0.25 4. Part Numbering 1008 N4V A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code J(mm) K(mm) L(mm) 5.0 1.20 3.8 4.0 Note: 1.PCB layout is referred to standard IPC-7351B 2. The above PCB layout reference only. 3. Recommend solder paste thickness at 0.15mm and above. Coplanarity of the 4 terminals ≤ 100 um TTMP I(mm) - 100 MN D E - D F BxC Standard. 100=10.0uH M=±20% Marking: Black.100 and 2234(22 YY, 33WW,follow production date). 5. Specification I rms ( A ) I sat ( A ) Inductance L0 (uH)±20% Pin1-3，Pin2-4 Typ Max Typ Max TTMP1008N4V-100MN-D 10.0 6.5 5.8 12.5 TTMP1008N4V-150MN-D 15.0 5.6 4.8 TTMP1008N4V-220MN-D 22.0 4.5 TTMP1008N4V-330MN-D 33.0 TTMP1008N4V-470MN-D 47.0 Part Number DCR (mΩ)Typ DCR (mΩ)Max 10.6 31.0 37.2 10.8 9.3 39.0 46.8 3.8 8.5 7.5 83.0 99.0 4.1 3.3 7.3 6.5 95.0 114.0 3.6 3.0 6.3 5.4 108.0 130.0 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : Agilent 4284A,E4991A,4339B,KEYSIGHT E4980A/AL,chroma3302,3250,16502. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Irms Testing : Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 8.Rated DC current: The lower value of Irms and Isat. TAI-TECH P3 6.Material List 4 NO Items 1 Core Alloy Powder 2 Wire Polyester Wire or equivalent. 3 Clip 100% Pb free solder(Ni+Sn---Plating) 4 Ink Halogen-free ketone 1 3 Materials 2 7. Packaging Information (1) Reel Dimension COVER TAPE Type A(mm) B(mm) C(mm) D(mm) 13”x24mm 24.4+2/-0 100±2 13+0.5/-0.2 330 C B D 2.0∮0.5 A EMBOSSED CARRIER (2) Tape Dimension Blank portions D Blank portions Chip cavity P0 P2 T W Marking D/C Marking D/C Marking D/C B0 F E D P 200mm or more K0 400mm or more Direction of tape A0 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) P0(mm) P2(mm) W(mm) F(mm) TTMP 1008 12.0±0.1 10.6±0.1 8.4±0.1 16.0±0.1 4.0±0.1 2.0±0.1 24±0.3 11.5±0.1 E(mm) T(mm) D(mm) 1.75±0.1 0.5±0.1 1.5±0.1 (3) Packaging Quantity TTMP 1008 Chip / Reel 400 (4) Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-C-2003 of 4.11 stadnard). 165¢Xto180¢X Base tape Tearing Speed mm Room Temp. (℃) Room Humidity (%) Room atm (hPa) 300±10 5~35 45~85 860~1060 TAI-TECH P4 8. Reliability and Test Condition Item Performance Operating temperature -55~+155℃(Including self - temperature rise) Storage temperature and Humidity range 1. -10~+40℃,50~60%RH (Product with taping) 2. -55~+155℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Heat Rated Current (Irms) Approximately △L30% Saturation DC Current (Isat) will cause L0 to drop △L(%) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △ T(℃). 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Temperature：155±2℃(Inductor) Duration ：1000hrs Min. Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 30min Min.(Inductor) Step2：155±2℃ transition time 1min MAX. Step3：155±2℃ 30min Min. Step4：Low temp. transition time 1min MAX. Number of cycles： 1000 Measured at room temperature after placing for 24±2 hrs t=24 hours/cycle. Note:Steps 7a & 7b Unpowered. High Temperature Exposure(Storage) AEC-Q200 Temperature Cycling AEC-Q200 Moisture Resistance (AEC-Q200) Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC ： within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 3 times. ( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Humidity ：85±3﹪R.H, Temperature：85℃±2℃ Duration : 1000hrs Min Measured at room temperature after placing for24±2hrs Biased Humidity (AEC-Q200) Preconditioning: Run through IR reflow for 3 times. ( IPC/JEDECJ-STD-020E Classification Reflow Profiles Temperature：155±2℃(Inductor) Duration ：1000hrs Min. With 100% rated current. Measured at room temperature after placing for24±2hrs High Temperature Operational Life (AEC-Q200) External Visual Physical Dimension Resistance to Solvents Appearance：No damage. Inspect device construction, marking and workmanship. Electrical Test not required. According to the product specification size measurement According to the product specification size measurement Appearance：No damage. Add aqueous wash chemical - OKEM clean or equivalent. Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Test condition Mechanical Shock Appearance：No damage. Peak value Normal Wave Velocity Type Inductance：within±10% of initial value (g’s) duration (D) (ms) form change (Vi)ft/sec Q：Shall not exceed the specification value. 100 6 Half-sine 12.3 RDC ： within ±15% of initial value and shall not exceed the SMD specification value Lead 100 6 Half-sine 12.3 3 shocks in each direction along 3 perpendicular axes(18 shocks). TAI-TECH P5 Item Performance Vibration Resistance to Soldering Heat Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Temperature(℃) Time(s) 260±5 (solder temp) Temperature ramp/immersion and emersion rate 10±1 25mm/s±6mm/s Depth: completely cover the termination Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 15±1min(Inductor) Step2：155±2℃ within 20Sec. Step3：155±2℃ 15±1min Number of cycles： 300 Measured at room fempraturc after placing fo24±2hrs Thermal shock (AEC-Q200) ESD Test Condition Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Oscillation Frequency: 10Hz～2KHz～10Hz for 20 minute Equipment： Vibration checker Total Amplitude: 5g Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Test condition:(MIL-STD-202 Condition B) Number of heat cycles:1 Appearance：No damage. Direct Contact and Air Discharge PASSIVE COMPONENT HBM ESD Discharge Waveform to a Coaxial Target Test method: AEC-Q200-002 Test mode：Contact Discharge Discharge level：4 KV (Level: 2 ) a. Method B1, 4 hrs @155°C dry heat @255°C±5°C Test time:5 +0/-0.5 seconds. Solderability a. Method B1：More than 95% of the terminal electrode should be covered with solder b. Method D category 3. (steam aging 8hours ± 15 min)@ b. Method D：in noodles can not be destroyed more than 5%. 260°C±5°C Test time: 30 +0/-0.5 seconds. Electrical Characterization Flammability Refer Specification for Approval Summary to show Min, Max, Mean and Standard deviation . Electrical Test not required. V-0 or V-1 are acceptable. Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. The duration of the applied forces shall be 60 (+ 5) sec. The force is to be applied only once to the board. Board Flex Appearance：No damage Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. Terminal Strength(SMD) Appearance：No damage Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard condition TAI-TECH P6 9. Soldering Specifications (1) Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. (2) Soldering Reflow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. Table 1.1&1.2 (J-STD-020E) (3) Iron Reflow: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended.(Fig. 2) ‧Preheat circuit and products to 150℃ ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧355℃ tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 4~5sec. Fig.1 Soldering Reflow Fig.2 Iron soldering temperature profiles Soldering iron Method : 350± 5℃ max Reflow times: 3 times max Table (1.1): Reflow Profiles Profile Type: Pb-Free Assembly Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(ts)from(Tsmin to Tsmax) 150℃ 200℃ 60-120seconds Ramp-up rate(TLto Tp) 3℃/second max. Liquidus temperature(TL) Time(tL)maintained above TL 217℃ 60-150 seconds Classification temperature(Tc) See Table (1.2) Time(tp) at Tc- 5℃ (Tp should be equal to or less than Tc.) *< 30 seconds Ramp-down rate(Tp to TL) 6℃ /second max. Time 25℃ to peak temperature 8 minutes max. Tp: maximum peak package body temperature, Tc: the classification temperature. For user (customer) Tp should be equal to or less than Tc. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Table (1.2) Package Thickness/Volume and Classification Temperature (Tc) PB-Free Assembly Package Thickness Volume mm3