FPGA Cloud Connectivity Kit 2.0
P0737
The FPGA Cloud Connectivity Kit combines the rich versatility of an Intel® Cyclone® V SoC FPGA
with the benefits of cloud connectivity.
Nowadays, it is easy to develop your own FPGA based application that can collect, anal yze and
react to data from IoT equipment. This development kit is certified with key cloud service
providers (CSPs) such as Microsoft Azure and comes with open-source design examples that will
take new users through the process of connecting an FPGA-based edge device to the cloud for
the first time.
The kit is based on the extremely popular Terasic DE10-Nano Kit and adds Wi-Fi and Bluetooth
wireless communication as well as a wide range of sensors such as an ambient light, temperature
and humidity sensors, accelerometer and gyroscope. The FPGA Cloud Connectivity Kit will enable
users to put a flexible and reconfigurable FPGA at the heart of their next smart IoT edge design.
Specifications
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DE10-Nano Cyclone V SoC FPGA Board
Wi-Fi, using ESP32-WROOM-32E module
9-axis sensor: accelerometer, gyroscope,
magnetometer
Ambient light sensor
Humidity and temperature sensor
UART to USB
2x6 TMD GPIO Header
Classic Bluetooth (BT) and Bluetooth Low Energy(BLE), using ESP32-WROOM-32E module
https://www.terasic.com.tw/cgibin/page/archive.pl?Language=English&CategoryNo=162&No=1314&PartNo=2#heading 5-23-2023
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