TLK1521IPAPG4

       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 Serializer/Deserializer D High-Performance 64-Pin HTQFP Thermally D D D D D D D D D Applications On-chip PLL Provides Clock Synthesis From Low-Speed Reference Receiver Differential Input Thresholds 200 mV Min Rated for Industrial Temperature Range Typical Power: 288 mW at 1.3 Gbps Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link Passive Receive Equalizer TXD2 TXD1 TXD0 GNDA DOUTTXP DOUTTXN GNDA VDDA PREEMPH VDDA DINRXP DINRXN GNDA RXD0 D Enhanced Package (PowerPAD) 2.5-V Power Supply for Low Power Operation Selectable Signal Preemphasis for Serial Output Interfaces to Backplane, Copper Cables, or Optical Converters Lock Indication and Sync Mode for Fast Initialization D 18-Bit Parallel Busses for Flexible Interface 1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 33 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 VDD RXD3 RXD4 RXD5 RXD6 GND RXD7 RX_CLK RXD8 RXD9 VDD RXD10 RXD11 RXD12 RXD13 GND TXD14 GND TXD15 TXD16 LOOPEN TXD17 V DD ENABLE SYNC LOCKB TESTEN GND RXD17 RXD16 RXD15 RXD14 VDD TXD3 TXD4 TXD5 GND TXD6 TXD7 GTX_CLK VDD TXD8 TXD9 TXD10 GND TXD11 TXD12 TXD13 RXD1 RXD2 D Hot Plug Protection D 0.5 to 1.3 Gigabits Per Second (Gbps) Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Copyright  2003 − 2007, Texas Instruments Incorporated 
 
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 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 description The TLK1521 is a member of the WizardLink family of multi-gigabit transceivers, intended for use in high-speed bidirectional point-to-point data transmission systems. The TLK1521 supports an effective serial interface speed of 500 Mbps to 1.3 Gbps, providing up to 1.17 Gbps of data bandwidth. The primary application of the TLK1521 is to provide high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 Ω. The transmission media can be printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment. The TLK1521 can also be used to replace parallel data transmission architectures by providing a reduction in the number of traces, connector pins, and transmit/receive pins. Parallel data loaded into the transmitter is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance backplane, or an optical link. The data is then reconstructed into its original parallel format. It offers significant power and cost savings over current solutions, as well as scalability for higher data rate in the future. The TLK1521 performs the data parallel-to-serial, serial-to-parallel conversion, and clock extraction functions for a physical layer interface device. The serial transceiver interface operates at a maximum speed of 1.3 Gbps. The transmitter latches 18-bit parallel data at a rate based on the supplied reference clock (GTX_CLK). The 18-bit parallel data is internally encoded into 20 bits by framing the 18-bit data with a start and a stop bit. The resulting 20-bit word is then transmitted differentially at 20 times the reference clock (GTX_CLK) rate. The receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit wide parallel data to the recovered clock (RX_CLK). It then extracts the 18 bits of data from the 20-bit wide data resulting in 18 bits of parallel data at the receive data pins (RXD0−17). This results in an effective data payload of 450 Mbps to 1.17 Gbps (18 bits data x GTX_CLK frequency). The TLK1521 is housed in a high performance, thermally enhanced, 64-pin HTQFP PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic, thermal, and electrical conductor. It is strongly recommended that the TLK1521 PowerPAD be soldered to the grounded thermal land on the board, since the PowerPAD also constitutes a major electrical ground connection for the TLK1521. All ac performance specifications in this data sheet are measured with the PowerPAD soldered to the test board. The TLK1521 provides an internal loopback capability for self-test purposes. Serial data from the serializer is passed directly to the deserializer allowing the protocol device a functional self-check of the physical interface. The TLK1521 is designed to be hot plug capable. An on-chip power-on reset circuit holds the RX_CLK low and places the parallel side output signal pins, DOUTTXP and DOUTTXN, into a high-impedance state during power up. The TLK1521 uses a 2.5-V supply. The I/O section is 3-V compatible. The TLK1521 is characterized for operation from −40°C to 85°C. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 functional block diagram TD(0−17) 18-Bit Register LOOPEN DOUTTXP 18 Start/Stop Encoder Parallel to Serial 20 DOUTTXN Bit Clock PREEMPH Multiplying Clock Synthesizer GTX_CLK TESTEN Controls: PLL,Bias,Rx, Tx ENABLE Bit Clock Interpolator and Clock Recovery MUX Recovered Clock LOCKB RD(0−17) 18-Bit Register RX_CLK 18 Start/Stop Decoder 20 Serial to Parallel MUX DINRXP DINRXN transmit interface The transmitter portion registers valid incoming 18-bit wide data (TXD[0:17]) on the rising edge of GTX_CLK. The data is then framed with a start and a stop bit, serialized and transmitted sequentially over the differential high-speed I/O channel. The clock multiplier multiplies the reference clock (GTX_CLK) by a factor of 10 times creating a bit clock. This internal bit clock is fed to the parallel-to-serial shift register, which transmits data on both the rising and falling edges of the bit clock providing a serial data rate that is 20 times the reference clock. Data is transmitted LSB (D0) first. transmit data bus The transmit bus interface accepts 18-bit wide single-ended TTL parallel data at the TXD[0:17] pins. Data is valid on the rising edge of GTX_CLK. The GTX_CLK is used as the word clock. The data and clock signals must be properly aligned as shown in Figure 1. Detailed timing information can be found in the TTL input electrical characteristics table. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 GTX_CLK TXDn tsu th Figure 1. Transmit Timing Waveform transmission latency The data transmission latency of the TLK1521 is defined as the delay from the initial 18-bit word load to the serial transmission of bit 0. The transmit latency is fixed once the link is established. However, due to silicon process variations and implementation variables such as supply voltage and temperature, the exact delay varies slightly. Figure 2 illustrates the timing relationship between the transmit data bus, GTX_CLK, and serial transmit pins. Transmitted 20-Bit Word DOUTTXP, DOUTTXN td(Tx latency) TXD(0−17) 16-Bit Word to Transmit GTX_CLK Figure 2. Transmitter Latency start/stop framing logic All true serial interfaces require a method of encoding to insure minimum transition density so that the receiving PLL has a minimal number of transitions in which to stay locked onto the data stream. The signal coding also provides a mechanism for the receiver to identify the byte boundary for correct deserialization. The TLK1521 wraps a start bit (1) and a stop bit (0) around the 18-bit data payload as shown in Figure 3. This is transparent to the user, as the TLK1521 internally adds the framing bits to the data such that the user reads and writes actual 18-bit data. start/stop framing logic (continued) Stop Start Bit Bit TD0 TD1 ... TD16 TD17 Stop Bit Start Bit Figure 3. Serial Output Data Stream With Start and Stop Bit 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 parallel-to-serial The parallel-to-serial shift register takes in the 20-bit wide data word multiplexed from the framing logic and converts it to a serial stream. The shift register is clocked on both the rising and falling edge of the internally generated bit clock, which is 10 times the GTX_CLK input frequency. The LSB (TD0) is transmitted first as shown in Figure 3. high-speed data output The high-speed data output driver consists of a PECL-compatible differential pair that can be optimized for a particular transmission line impedance and length. The line can be directly coupled or ac coupled. See Figure 11 and Figure 12 for termination details. No external pullup or pulldown resistors are required. The TLK1521 provides a selectable signal preemphasis option for driving lossy media. When signal preemphasis is enabled, the first bit of a run length of same-value bits is driven to a larger output swing, which precompensates for signal inter-symbol interference (ISI) in lossy media, such as copper cables or printed circuit board traces. receive interface The receiver portion of the TLK1521 accepts 20-bit framed differential serial data. The interpolator and clock recovery circuit locks to the data stream and extracts the bit rate clock. This recovered clock is used to retime the input data stream. The serial data is then aligned to the 20-bit word boundary by finding the start/stop bits and the 18-bit data is output on a 18-bit wide parallel bus synchronized to the extracted receive clock. receive data bus The receive bus interface drives 18-bit wide single-ended TTL parallel data at the RXD[0:17] pins. Data is valid on the rising edge of RX_CLK. The RX_CLK is used as the recovered word clock. The data and clock signals are aligned as shown in Figure 4. Detailed timing information can be found in the TTL output switching characteristics table. RX_CLK RXDn tsu th Figure 4. Receive Timing Waveform POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 data reception latency The serial-to-parallel data receive latency is the time from when the first bit arrives at the receiver until it is output in the aligned parallel word with RXD0 received as first bit. The receive latency is fixed once the link is established. However, due to silicon process variations and implementation variables such as supply voltage and temperature, the exact delay varies slightly. Figure 5 illustrates the timing relationship between the serial receive pins, the recovered word clock (RX_CLK), and the receive data bus. 20-Bit Encoded Word DINTXP, DINTXN R(latency) RXD(0−17) 18-Bit Decoded Word RX_CLK Figure 5. Receiver Latency serial-to-parallel Serial data is received on the DINRXP and DINRXN pins. The interpolator and clock recovery circuit locks to the data stream if the clock to be recovered is within ±100 PPM of the internally generated bit rate clock. The recovered clock is used to retime the input data stream. The serial data is then clocked into the serial-to-parallel shift registers. synchronization mode The deserializer PLL must synchronize to the serializer in order to receive valid data. Synchronization can be accomplished in one of two ways. rapid synchronization The serializer has the capability to send specific SYNC patterns consisting of nine ones and nine zeros, switching at the input clock rate. The transmission of SYNC patterns enables the deserializer to lock to the serializer signal within a deterministic time frame. The transmission of SYNC patterns is selected via the SYNC input on the serializer. Upon receiving a valid SYNC pulse (wider than 6 clock cycles), 1024 cycles of SYNC pattern are sent. When the deserializer detects edge transitions at the serial input, it attempts to lock to the embedded clock information. The deserializer LOCKB output remains inactive while its clock/data recovery (CDR) locks to the incoming data or SYNC patterns present on the serial input. When the deserializer locks to the serial data, the LOCKB output goes active. When LOCKB is active, the deserializer outputs represent incoming serial data. One approach is to tie the deserializer LOCKB output directly to the SYNC input of the transmitter. This assures that enough SYNC patterns are sent to achieve deserializer lock. random lock synchronization The deserializer can attain lock to a data stream without requiring the serializer to send special SYNC patterns. This allows the TLK1521 to operate in open-loop applications. Equally important is the deserializer’s ability to support hot insertion into a running backplane. In the open-loop or hot-insertion case, it is assumed the data stream is essentially random. Therefore, because lock time varies due to data stream characteristics, the exact lock time cannot be predicted. The primary constraint on the random lock time is the initial phase relation between the incoming data and the GTX_CLK when the deserializer powers up. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 random lock synchronization (continued) The data contained in the data stream can also affect lock time. If a specific pattern is repetitive, the deserializer could enter false lock—falsely recognizing the data pattern as the start/stop bits. This is referred to as repetitive multitransition (RMT). This occurs when more than one low-high transition takes place per clock cycle over multiple clock cycles. In the worst case, the deserializer could become locked to the data pattern rather than the clock. Circuitry within the deserializer can detect that the possibility of false lock exists. Upon detection, the circuitry prevents the LOCKB from becoming active until the potential false-lock pattern changes. Notice that the RMT pattern only affects the deserializer lock time, and once the deserializer is in lock, the RMT pattern does not affect the deserializer state as long as the same data boundary happens each cycle. The deserializer does not go into lock until it finds a unique data boundary that consists of four consecutive start/stop bits at the same position. The deserializer stays in lock until it cannot detect the same data boundary (start/stop bits) for four consecutive cycles. Then the deserializer goes out of lock and hunts for the new data boundary (start/stop bits). In the event of loss of synchronization, the LOCKB pin output goes inactive and the outputs (including RX_CLK) enter a high-impedance state. The user’s system should monitor the LOCKB pin in order to detect a loss of synchronization. Upon detection of loss of lock, sending SYNC patterns for resynchronization is desirable if reestablishing lock within a specific time is critical. However, the deserializer can lock to random data as previously noted. LOCKB is held inactive for at least nine cycles after loss of lock is detected. recommended power-up sequence When powering up the device, it is recommended to first set the ENABLE pin low. Set the ENABLE pin to high once sufficient time has passed to allow the power supply to stabilize. power-down mode When the ENABLE pin is deasserted low, the TLK1521 goes into a power-down mode. In the power-down mode, the serial transmit pins (DOUTTXP, DOUTTXN) and the receive data bus pins (RXD[0:17]) go into a high-impedance state. reference clock input The reference clock (GTX_CLK) is an external input clock that synchronizes the transmitter interface. The reference clock is then multiplied in frequency 10 times to produce the internal serialization bit clock. The internal serialization bit clock is frequency locked to the reference clock and used to clock out the serial transmit data on both its rising and falling edge clock providing a serial data rate that is 20 times the reference clock. The receiver tracking logic uses clock phases from the internal PLL as it aligns the recovered clock phase with the incoming serial data stream; therefore, the input reference clock (GTX_CLK) is needed even if the transmit function of the TLK1521 is not being used. The receiver function has the ability to track an incoming serial data stream that is within ±200 ppm of the data rate that is set by GTX_CLK. This allows the use of clock sources with ±100 ppm frequency tolerance. operating frequency range The TLK1521 may operate at a serial data rate between 500 Mbit/s to 1.3 Gbit/s. GTX_CLK must be within ±100 PPM of the desired parallel data rate clock. testability The TLK1521 has a comprehensive suite of built-in self-tests. The loopback function provides for at-speed testing of the transmit/receive portions of the circuitry. The ENABLE pin allows for all circuitry to be disabled so that an IDDQ test can be performed. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 loop-back testing The transceiver can provide a self-test function by enabling (LOOPEN) the internal loop-back path. Enabling this pin causes serial transmitted data to be routed internally to the receiver. The parallel data output can be compared to the parallel input data for functional verification. (The external differential output is held in a high-impedance state during the loop-back testing.) power-on reset Upon application of minimum valid power, the TLK1521 generates a power-on reset. During the power-on reset, the RXD pins are tri-stated and RX_CLK is held low. The length of the power-on reset cycle is dependent upon the REFCLK frequency, but is less than 1 ms in duration. Terminal Functions TERMINAL NAME NO. TYPE DESCRIPTION SIGNAL PIN DOUTTXP 60 DOUTTXN 59 DINRXP 54 DINRXN 53 GTX_CLK 8 TXD0 62 TXD1 63 TXD2 64 TXD3 2 TXD4 3 TXD5 4 TXD6 6 TXD7 7 TXD8 10 TXD9 11 TXD1 12 TXD11 14 TXD12 15 TXD13 16 TXD14 17 TXD15 19 TXD16 20 TXD17 22 8 Output (High-Z power up) Serial transmit outputs. DOUTTXP and DOUTTXN are differential serial outputs that interface to copper or an optical I/F module. These terminals transmit NRZ data at a rate of 20 times the GTX_CLK value. DOUTTXP and DOUTTXN are put in a high-impedance state when LOOPEN is high and are active when LOOPEN is low. During power-on reset, these pins are high impedance. Input Serial receive inputs. DINRXP and DINRXN together are the differential serial input interface from a copper or an optical I/F module. Input Input Reference clock. GTX_CLK is a continuous external input clock that synchronizes the transmitter interface TXD. The frequency range of GTX_CLK is 25 MHz to 65 MHz. The transmitter uses the rising edge of this clock to register the 18-bit input data (TXD) for serialization. Transmit data bus. These inputs carry the 18-bit parallel data output from a protocol device to the transceiver for encoding, serialization and transmission. This 18-bit parallel data is clocked into the transceiver on the rising edge of GTX_CLK as shown in Figure 6. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 TERMINAL NAME NO. RXD0 51 RXD1 50 RXD2 49 RXD3 47 RXD4 46 RXD5 45 RXD6 44 RXD7 42 RXD8 40 RXD9 39 RXD10 37 RXD11 36 RXD12 35 RXD13 34 RXD14 32 RXD15 31 RXD16 30 RXD17 29 RX_CLK TYPE DESCRIPTION Output (High-Z on power up) Receive data bus. These outputs carry 18-bit parallel data output from the transceiver to the protocol device, synchronized to RX_CLK. The data is valid on the rising edge of RX_CLK as shown in Figure 7. These pins are tri-stated during power-on reset. These pins are also high impedance when enable = 0 41 Output (low on power up) Recovered clock. Output clock that is synchronized to RXD. RX_CLK is the recovered serial data rate clock divided by 20. RX_CLK is held low during power-on reset. These pins are also high impedance when enable = 0 SYNC 25 Input (w/pulldown) Fast synchronization. When asserted high, the transmitter substitutes the 18-bit pattern 111111111000000000, so that when the start/stop bits are framed around the data the receiver can immediately detect the proper deserialization boundary. This is typically used during initialization of the serial link. PREEMPH 56 Input Preemphasis. When asserted, the serial transmit outputs have an extra output swing on the first bit of any run-length of same value bits. If the run-length of output bits is one, then that bit has a larger output swing. ENABLE 24 Input (w/pullup) Device enable. When this pin is held low, the device is placed in power down mode. When asserted high while the device is in power-down mode, the transceiver goes into power-on reset before beginning normal operation. LOOPEN 21 Input (w/pulldown) Loop enable. When LOOPEN is active high, the internal loop-back path is activated. The transmitted serial data is directly routed internally to the inputs of the receiver. This provides a self-test capability in conjunction with the protocol device. The DOUTTXP and DOUTTXN outputs are held in a high-impedance state during the loop-back test. LOOPEN is held low during standard operational state with external serial outputs and inputs active. LOCKB 26 Output Receiver lock. When asserted low, it indicates that the receiver has acquired bit synchronization on the data stream and has located the start/stop bits, so that the deserialized data presented on the parallel receive bus is properly received. This pin is high impedance when enable = 0. TESTEN 27 Input (w/pulldown) Test mode enable. This pin should be left unconnected or tied low. TEST PIN POWER PIN VDD 1, 9, 23, 38, 48 Supply Digital logic power. Provides power for all digital circuitry and digital I/O buffers. VDDA 55, 57 Supply Analog power. VDDA provides a supply reference for the high-speed analog circuits, receiver and transmitter. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 TERMINAL NAME NO. TYPE DESCRIPTION GROUND PIN GNDA GND 52, 58, 61 Ground Analog ground. GNDA provides a ground reference for the high-speed analog circuits, RX and TX. 5, 13, 18, 28, 33, 43 Ground Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers. absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 3 V Voltage range at TXD, ENABLE, GTX_CLK, LOOPEN, SYNC, PREEMPH . . . . . . . . . . . . . . . . . . . −0.3 V to 4 V Voltage range at any other terminal except above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V Package power dissipation, PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HBM:2 kV, CDM:1.5 kV Characterized free-air operating temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Lead Temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground. 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 DISSIPATION RATING TABLE PACKAGE PAP64‡ PAP64§ TA ≤ 25°C POWER RATING DERATING FACTOR† ABOVE TA = 25°C TA = 70°C POWER RATING 3.22 W 32.15 mW/°C 1.77 W 0.94 W 9.46 mW/°C 0.52 W PAP64¶ 0.68 W 6.78 mW/°C † This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA) ‡ High K-board with solder § High K-board without solder ¶ Low K-board NOTE: For more information, see the TI application note PowerPAD Thermally Enhanced Package, TI (SLMA002). 0.37 W electrical characteristics over recommended operating conditions PARAMETER TEST CONDITION MIN TYP MAX 2.5 2.7 V 85 °C VDD TA Supply voltage 2.3 Operating free-air temperature −40 ICC Supply current PD VDD = 2.5 V, Freq = 500 Mb/sec, PRBS pattern VDD = 2.5 V, Freq = 1.3 Gb/sec, PRBS pattern 115 Power dissipation VDD = 2.5 V, Freq = 500 Mb/sec, PRBS pattern VDD = 2.5 V, Freq = 1.3 Gb/sec, PRBS pattern 288 Shutdown current VDD = 2.7 V, Freq = 1.3 Gb/sec, worst case pattern ENABLE = 0, VDDA, VDD pins, VDD = max 130 PLL start-up lock time VDD, VDDA = 2.3 V, EN ↑ to PLL acquire 0.1 UNIT 45 mA 113 mW 475 Data acquisition time µA 0.4 1024 ms bits reference clock (GTX_CLK) timing requirements over recommended operating conditions (unless otherwise noted) PARAMETER Rω Frequency TEST CONDITIONS MIN TYP MAX UNIT Minimum data rate TYP−0.01% 25 TYP+0.01% MHz Maximum data rate TYP−0.01% 65 TYP+0.01% MHz 100 ppm 50% 60% Frequency tolerance −100 Duty cycle Jitter# 40% Peak-to-peak # See the Reference Lock Jitter Analysis For TLK1521 application note for more information. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 40 ps 11 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 TTL input electrical characteristics over recommended operating conditions (unless otherwise noted) TTL Signals: TXD0 ...TXD17, GTX_CLK, LOOPEN, SYNC, PREEMPH PARAMETER TEST CONDITIONS MIN TYP 2 MAX UNIT VIH VIL High-level input voltage See Figure 6 Low-level input voltage See Figure 6 3.6 V 0.8 V IIH IIL High-level input current Low-level input current VDD = MAX, VIN = 2 V VDD = MAX, VIN = 0.4 V 40 µA CIN Input capacitance 0.8 V to 2 V tr tf GTX_CLK, TXD rise time 0.8 V to 2 V, C = 5 pF, See Figure 6 1 ns GTX_CLK, TXD fall time 2 V to 0.8 V, C = 5 pF, See Figure 6 1 ns tsu th TXD setup to ↑ GTX_CLK See Figure 6 1.5 ns TXD hold to ↑ GTX_CLK See Figure 6 0.4 ns µA −40 4 pF 3.6 V 2V GTX_CLK 0.8 V 0V tr tf 3.6 V 2V TXD(0−17) 0.8 V 0V tsu tf tr th Figure 6. TTL Data Input Valid Levels for AC Measurements 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 TTL output switching characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP 2.1 2.3 GND 0.25 MAX UNIT VOH VOL High-level output voltage Low-level output voltage IOH= −1 mA, VDD = MIN IOL= 1 mA, VDD = MIN tr(slew) tf(slew) Magnitude of RX_CLK, RXD slew rate (rising) 0.8 V to 2 V, C = 5 pF, See Figure 10 0.5 V/ns Magnitude of RX_CLK, RXD slew rate (falling) 0.8 V to 2 V, C = 5 pF, See Figure 10 0.5 V/ns 50% voltage swing, GTX_CLK = 25 MHz, See Figure 7 19 ns 50% voltage swing, GTX_CLK = 65 MHz, See Figure 7 6.7 ns 50% voltage swing, GTX_CLK = 25 MHz, See Figure 7 19 ns 50% voltage swing, GTX_CLK = 65 MHz, See Figure 7 6.7 ns tsu th RXD setup to ↑ RX_CLK RXD hold to ↑ RX_CLK V 0.5 V 2V RX_CLK 0.8 V 0V tr(slew) tf(slew) 2V RXD(0−17) 0.8 V 0V tr(slew) tsu tf(slew) th Figure 7. TTL Data Output Valid Levels for AC Measurements POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 transmitter/receiver characteristics PARAMETER TEST CONDITION MIN TYP MAX UNIT VOD(p) VOD(p) = |VTXP-VTXN|, Preemphasis VOD DC-coupled. Preemphasis = high, See Figure 8 730 945 1280 mV VOD(pp−p) Differential, peakĆto-peak output voltage with preemphasis DC-coupled. Preemphasis = high, See Figure 8 1460 1890 2560 mV VOD(d) VD(d) = |VTXP-VTXN|, De-emphasis VOD DC-coupled. Preemphasis = low, See Figure 8 560 750 1100 mV VOD(pp−d) Differential, peak-to-peak output voltage with deemphasis DC-coupled. Preemphasis = low, See Figure 8 1120 1500 2200 mV V(cmt) Transmit termination voltage range, (VTXP + VTXN)/2 1000 1250 1400 mV VID Receiver input voltage differential VID= |RXP – RXN| 200 Vcmr Receiver common-mode voltage range, (VRXP + VRXN)/2 1000 VDD− 350 mV −10 10 µA 2 pF Iin Cin tr, tf Receiver input leakage mV Receiver input capacitance Differential output signal rise and fall time (20% to 80%) RL = 50 Ω, CL = 5 pF, See Figure 9 Serial transmit data total jitter (peak-to-peak) Receive jitter tolerance Tlatency TX latency Rlatency RX latency 100 150 ps Differential output jitter, random + deterministic, 223−1 PRBS pattern at 1.3 Gbps 0.1 UI Total input jitter, PRBS pattern, permitted eye closure at zero crossing 0.5 UI At 500 Mbps 17 19 At 1.3 Gbps 17 20 At 500 Mbps 88 92 At 1.3 Gbps 90 96 Bit times Bit times VOD(p) VOD(d) VOD(pp_d) VOD(pp_p) V(cmt) tf tr VOD(d) Bit Time Bit Time VOD(p) Figure 8. Differential and Common-Mode Output Voltage Definitions 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 80% 50% 20% DOUTXP tr tf 80% 50% 20% DOUTXN tf tr +V DOUTXP DOUTXN 80% 0V 20% −V tr tf Figure 9. Rise and Fall Time Definitions thermal characteristics PARAMETER RθJA Junction-to-free-air thermal resistance RθJC Junction-to-case thermal resistance RθJA Junction-to-free-air thermal resistance RθJC Junction-to-case thermal resistance RθJA Junction-to-free-air thermal resistance RθJC Junction-to-case thermal resistance TEST CONDITION MIN TYP Board mounted, no air flow, high conductivity TI recommended test board, chip soldered or greased to thermal land 21.47 Board mounted, no air flow, high conductivity TI recommended test board with thermal land but no solder or grease thermal connection to thermal land 42.2 0.38 0.38 75.83 Board mounted, no air flow, JEDEC test board POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7.8 MAX UNIT °C/W °C/W °C/W 15 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 Recommended use of 0.01-µF capacitor per VDD terminal 0.01 µF 5 Ω at 100 MHz 3 TXD5 4 45 GND 5 44 RXD6 TXD6 6 43 GND TXD7 7 42 RXD7 GTX_CLK 8 41 RX_CLK VDD TXD8 9 40 RXD8 10 39 RXD9 TXD9 11 38 VDD TXD10 12 37 RXD10 GND 13 36 RXD11 TXD11 14 35 RXD12 TXD12 15 34 RXD13 TXD13 33 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 ORDERING INFORMATION Orderable TLK1521 POST OFFICE BOX 655303 TLK1521IPAP • DALLAS, TEXAS 75265 RXD14 RXD15 RXD16 GND 46 RXD17 TESTEN SYNC LOCKB TXD17 V DD ENABLE LOOPEN GND TXD15 TXD16 TXD14 GNDA TXD4 VDD RXD3 RXD4 RXD5 DINRXN 47 DINRXP 2 DOUTTXP 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 DOUTTXN 1 GNDA VDD TXD3 Figure 10. External Component Interconnection 16 RXD1 RXD2 RXD0 TXD0 TXD2 TXD1 0.01 µF 0.01 µF 0.01 µF 0.01 µF GNDA V DDA PREEMPH V DDA VDD GND 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 TXP RXP VDD ZO ZO 5 kΩ ZO 7.5 kΩ ZO TXN Transmitter + _ GND RXN Media Receiver Figure 11. High-Speed I/O Directly Coupled Mode TXP RXP VDD ZO ZO 5 kΩ ZO 7.5 kΩ ZO TXN Transmitter + _ GND RXN Media Receiver Figure 12. High-Speed I/O AC-Coupled Mode AC-coupling is only recommended if the parallel TX data stream is encoded to achieve a dc-balanced data stream. Otherwise, the ac-capicitors can induce common-mode voltage drift due to the dc-unbalanced data stream. designing with PowerPAD The TLK1521 is housed in a high-performance, thermally enhanced, 64-pin HTQFP (PAP64) PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic, thermal, and electrical conductor. Therefore, if not implementing PowerPAD PCB features, the use of solder masks (or other assembly techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection etches or vias under the package. It is strongly recommended that the PowerPAD be soldered to the thermal land. The recommended convention, however, is to not run any etches or signal vias under the device, but to have only a grounded thermal land as explained below. Although the actual size of the exposed die pad may vary, the minimum size required for the keep out area for the 64-pin PAP PowerPAD package is 8 mm × 8 mm. It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the PowerPAD package. The thermal land varies in size depending on the PowerPAD package being used, the PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not contain numerous thermal vias depending on PCB construction. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 17 
       
 SLLS591C− OCTOBER 2003 − REVISED JULY 2007 Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD Thermally Enhanced Package application report, TI (SLMA002), available via the TI Web pages beginning at URL: http://www.ti.com. Figure 13. Example of a Thermal Land For the TLK1521, this thermal land should be grounded to the low-impedance ground plane of the device. This improves not only thermal performance but also the electrical grounding of the device. It is also recommended that the device ground pin landing pads be connected directly to the grounded thermal land. The land size should be as large as possible without shorting device signal pins. The thermal land may be soldered to the exposed PowerPAD using standard reflow soldering techniques. While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is recommended that the thermal land be connected to the low-impedance ground plane for the device. More information may be obtained from the TI application note PHY Layout, TI (SLLA020). 18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 12-Aug-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLK1521IPAP LIFEBUY HTQFP PAP 64 160 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TLK1521 TLK1521IPAPG4 LIFEBUY HTQFP PAP 64 160 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TLK1521 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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