TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
D 1.6 to 2.7 Gigabits Per Second (Gbps)
D
D
D
D
D
D
Serializer/Deserializer
Hot-Plug Protection
High-Performance 64-Pin VQFP Thermally
Enhanced Package (PowerPAD)
2.5-V Power Supply for Low Power
Operation
Programmable Voltage Output Swing on
Serial Output
Interfaces to Backplane, Copper Cables, or
Optical Converters
On-Chip 8-Bit/10-Bit Encoding/Decoding,
Comma Detect
D On-Chip PLL Provides Clock Synthesis
From Low-Speed Reference
D Receiver Differential Input Thresholds
D
D
D
D
D
D
200 mV Minimum
Low Power: < 500 mW
3 V Tolerance on Parallel Data Input Signals
16-Bit Parallel TTL Compatible Data
Interface
Ideal for High-Speed Backplane
Interconnect and Point-to-Point Data Link
Industrial Temperature Range (−40°C to
85°C)
Loss of Signal (LOS) Detection
description
The TLK2701 is a member of the transceiver family of multigigabit transceivers, intended for use in
ultrahigh-speed bidirectional point-to-point data transmission systems. The TLK2701 supports an effective
serial interface speed of 1.6 Gbps to 2.7 Gbps, providing up to 2.16 Gbps of data bandwidth.
The primary application of this chip is to provide very high-speed I/O data channels for point-to-point baseband
data transmission over controlled impedance media of approximately 50 Ω. The transmission media can be
printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is
dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
This device can also be used to replace parallel data transmission architectures by providing a reduction in the
number of traces, connector terminals, and transmit/receive terminals. Parallel data loaded into the transmitter
is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance
backplane, or an optical link. It is then reconstructed into its original parallel format. It offers significant power
and cost savings over current solutions, as well as scalability for higher data rate in the future.
The TLK2701 performs data conversion parallel-to-serial and serial-to-parallel. The clock extraction functions
as a physical layer interface device. The serial transceiver interface operates at a maximum speed of 2.7 Gbps.
The transmitter latches 16-bit parallel data at a rate based on the supplied reference clock (GTX_CLK). The
16-bit parallel data is internally encoded into 20 bits using an 8-bit/10-bit (8B/10B) encoding format. The
resulting 20-bit word is then transmitted differentially at 20 times the reference clock (GTX_CLK) rate. The
receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit
wide parallel data to the extracted reference clock (RX_CLK). It then decodes the 20 bit wide data using
8-bit/10-bit decoding format resulting in 16 bits of parallel data at the receive data terminals (RXD0-15). The
outcome is an effective data payload of 1.28 Gbps to 2.16 Gbps (16 bits data x the GTX_CLK frequency).
The TLK2701 is housed in a high performance, thermally enhanced, 64-pin VQFP PowerPAD package. Use
of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which
is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is
recommended that the TLK2701 PowerPAD be soldered to the thermal land on the board. All ac performance
specifications in this data sheet are measured with the PowerPAD soldered to the test board.
The TLK2701 provides an internal loopback capability for self-test purposes. Serial data from the serializer is
passed directly to the deserializer, allowing the protocol device a functional self-check of the physical interface.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
Copyright 2000 − 2008, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
description (continued)
The TLK2701 has a loss of signal detection circuit for conditions where the incoming signal no longer has a
sufficient voltage amplitude to keep the clock recovery circuit in lock.
The TLK2701 allows users to implement redundant ports by connecting receive data bus terminals from two
TLK2701 devices together. Asserting the LCKREFN to a low state will cause the receive data bus terminals,
RXD[0:15], RX_CLK, and RKLSB, RKMSB/PRBS_PASS to go to a high-impedance state. This places the
device in a transmit-only mode since the receiver is not tracking the data.
The TLK2701 uses a 2.5 V supply. The I/O section is 3 V compatible. With the 2.5-V supply the chipset is very
power efficient consuming less than 350 mW typically. The TLK2701 is characterized for operation from −40°C
to 85°C.
The TLK2701 is designed to be hot plug capable. An on-chip power-on reset circuit holds the RX_CLK low and
goes to high impedance to the parallel side output signal terminals during power up as well as goes to DOUTTXP
and DOUTTXN.
AVAILABLE OPTIONS
PACKAGE
TA
PowerPAD QUAD FLATPACK
(VQFP)
−40°C to 85°C
TLK2701IRCP
1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
33
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
TXD14
GND
TXD15
TKMSB
LOOPEN
TKLSB
V DD
ENABLE
LCKREFN
PRBSEN
TESTEN
GND
RKLSB/PRBS_PASS
RKMSB
RXD15
RXD14
VDD
TXD3
TXD4
TXD5
GND
TXD6
TXD7
GTX_CLK
VDD
TXD8
TXD9
TXD10
GND
TXD11
TXD12
TXD13
RXD1
RXD2
TXD2
TXD1
TXD0
GNDA
DOUTTXP
DOUTTXN
GNDA
VDDA
RREF
VDDA
DINRXP
DINRXN
GNDA
RXD0
RCP PACKAGE
(TOP VIEW)
2
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VDD
RXD3
RXD4
RXD5
RXD6
GND
RXD7
RX_CLK
RXD8
RXD9
VDD
RXD10
RXD11
RXD12
RXD13
GND
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
block diagram
LOOPEN
PRBSEN
PRBSEN
PRBS
Generator
DOUTTXP
10
DOUTTXN
10
Parallel to
Serial
BIAS
10
RREF
MUX
TKLSB
9
TKMSB
8B/10B
Encoder
TD0−TD15
18 Bit
Register
9
8B/10B
Encoder
2:1
10
MUX
10
Clock
Synthesizer
GTX_CLK
TESTEN
Controls:
PLL,Bias,Rx,
Tx
ENABLE
PRBSEN
2:1
MUX
RKLSB/
PRBS_PASS
18 Bit
Register
9
RKMSB
PRBS
Verification
PRBSEN
RX_CLK
RDO−RD15
Interpolator and
Clock Recovery
9
Comma
Detect
and 8B/10B
Decoding
Comma
Detect
and 8B/10B
Decoding
Clock
2:1
MUX
Recovered
Clock
10
1:2
MUX
10
Serial to
Parallel
2:1
MUX
Data
DINRXP
DINRXN
10
Signal Detect
(LOS)
Figure 1. TLK2701 Block Diagram
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3
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
DINRXN
DINRXP
53
54
I
Serial receive inputs. DINRXP and DINRXN together are the differential serial input interface from a
copper or an optical I/F module.
DOUTTXN
DOUTTXP
59
60
O
Serial transmit outputs. DOUTTXP and DOUTTXN are differential serial outputs that interface to copper
or an optical I/F module. These terminals transmit NRZ data at a rate of 20 times the GTX_CLK value.
DOUTTXP and DOUTTXN are put in a high-impedance state when LOOPEN is high and are active when
LOOPEN is low. During power-on reset these terminals are high impedance.
ENABLE
24
I
Device enable. When this terminal is held low, the device is placed in power-down mode. Only the signal
detect circuit on the serial receive pair is active. When asserted high while the device is in power-down
mode, the transceiver will go into power-on reset before beginning normal operation.
GND
5, 13, 18,
28, 33, 43
GNDA
52, 58, 61
Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers.
Analog ground. GNDA provides a ground reference for the high-speed analog circuits, RX and TX.
GTX_CLK
8
I
Reference clock. GTX_CLK is a continuous external input clock that synchronizes the transmitter
interface signals TKMSB, TKLSB and TXD. The frequency range of GTX_CLK is 80 MHz to 135 MHz.
The transmitter uses the rising edge of this clock to register the 16-bit input data (TXD) for serialization.
LCKREFN
25
I
Lock to reference. When LCKREFN is low, the receiver clock is frequency locked to GTX_CLK. This
places the device in a transmit only mode since the receiver is not tracking the data. When LCKREFN
is asserted low, the receive data bus terminals, RXD[0:15], RX_CLK and RKLSB, RKMSB/LOS are in a
high-impedance state.
When LCKREFN is deasserted high, the receiver is locked to the received data stream.
LOOPEN
21
I
Loop enable. When LOOPEN is active high, the internal loop-back path is activated. The transmitted serial
data is directly routed internally to the inputs of the receiver. This provides a self-test capability in
conjunction with the protocol device. The DOUTTXP and DOUTTXN outputs are held in a high-impedance
state during the loop-back test. LOOPEN is held low during standard operational state with external serial
outputs and inputs active.
PRBSEN
26
I
PRBS test enable. When asserted high results of pseudo random bit stream (PRBS) tests can be
monitored on the RKLSB/PRBS_PASS terminal. A high on PRBS_PASS indicates that valid PRBS is
being received.
RREF
56
I
Reference resistor. The RREF terminal is used to connect to an external reference resistor. The other side
of the resistor is connected to analog VDD. The resistor is used to provide an accurate current reference
to the transmitter circuitry.
RXD0
RXD1
RXD2
RXD3
RXD4
RXD5
RXD6
RXD7
RXD8
RXD9
RXD10
RXD11
RXD12
RXD13
RXD14
RXD15
51
50
49
47
46
45
44
42
40
39
37
36
35
34
32
31
O
Receive data bus. These outputs carry 16-bit parallel data output from the transceiver to the protocol
device, synchronized to RX_CLK. The data is valid on the rising edge of RX_CLK as shown in Figure 11.
These terminals are in high-impedance state during power-on reset.
4
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TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
Terminal Functions (Continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
RX_CLK
41
O
Recovered clock. Output clock that is synchronized to RXD, RKLSB, RKMSB/LOS. RX_CLK is
the recovered serial data rate clock divided by 20. RX_CLK is held low during power-on reset.
RKLSB/
PRBS_PASS
29
O
K-Code indicator/PRBS test results. When RKLSB is active, an 8-bit/10-bit K code was received
and is indicated by data bits RXD0 −RXD7. When RKLSB is inactive an 8-bit/10-bit D code is
received and is presented on data bits RXD0 − RXD7.
When PRBSEN is asserted high then this pin is used to indicate status of the PRBS test results
(high = pass).
RKMSB
30
O
K-code indicator. When RKMSB is active an 8-bit/10-bit K code was received and is indicated
by data bits RXD8 −RXD15. When RKMSB is inactive an 8-bit/10-bit D code was received and
is presented on data bits RXD8 − RXD15.
TESTEN
27
I
Test mode enable. This terminal should be left unconnected or tied low.
TXD0
TXD1
TXD2
TXD3
TXD4
TXD5
TXD6
TXD7
TXD8
TXD9
TXD10
TXD11
TXD12
TXD13
TXD14
TXD15
62
63
64
2
3
4
6
7
10
11
12
14
15
16
17
19
I
Transmit data bus. These inputs carry the 16-bit parallel data output from a protocol device to
the transceiver for encoding, serialization, and transmission. This 16-bit parallel data is clocked
into the transceiver on the rising edge of GTX_CLK as shown in Figure 10.
TKMSB
20
I
K-code generator (MSB). When TKMSB is active an 8-bit/10-bit K code is transmitted as
controlled by data bits TXD8 −TXD15. When TKMSB is inactive an 8-bit/10-bit D code is
transmitted as controlled by data bits TXD8 − TXD15.
TKLSB
22
I
K-code generator (LSB). When TKLSB is active an 8-bit/10-bit K code is transmitted as
controlled by data bits TXD0 −TXD7. When TKLSB is inactive an8-bit/10-bit D code is
transmitted as controlled by data bits TXD0 − TXD7.
VDD
1, 9, 23,
38, 48
VDDA
55, 57
Digital logic power. Provides power for all digital circuitry and digital I/O buffers.
Analog power. VDDA provides a supply reference for the high-speed analog circuits, receiver and
transmitter
detailed description
transmit interface
The transmitter portion registers valid incoming 16-bit wide data (TXD[0:15]) on the rising edge of the GTX_CLK.
The data is then 8-bit/10-bit encoded, serialized, and transmitted sequentially over the differential high-speed
I/O channel. The clock multiplier multiplies the reference clock (GTX_CLK) by a factor of 10 times, creating a
bit clock. This internal bit clock is fed to the parallel-to-serial shift register which transmits data on both the rising
and falling edges of the bit clock, providing a serial data rate that is 20 times the reference clock. Data is
transmitted LSB (D0) first.
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TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
detailed description (continued)
transmit data bus
The transmit bus interface accepts 16-bit single-ended TTL parallel data at the TXD[0:15] terminals. Data and
k-code control is valid on the rising edge of the GTX_CLK. The GTX_CLK is used as the word clock. The data,
k-code, and clock signals must be properly aligned as shown in Figure 2. Detailed timing information can be
found in the electrical characteristics table.
GTX_CLK
TXD[0−15]
tsu
th
TXLSB, TXMSB
Figure 2. Transmit Timing Waveform
transmission latency
The data transmission latency of the TLK2701 is defined as the delay from the initial 16-bit word load to the serial
transmission of bit 0. The transmit latency is fixed once the link is established. However, due to silicon process
variations and implementation variables such as supply voltage and temperature, the exact delay will vary
slightly. The minimum transmit latency (Tlatency ) is 34 bit times; the maximum is 38 bit times. Figure 3 illustrates
the timing relationship between the transmit data bus, the GTX_CLK and serial transmit terminals.
Transmitted 20 bit Word
DOUTTXP,
DOUTTXN
(Tlatency)†
TXD[0−15]
16 bit Word to Transmit
GTX_CLK
Figure 3. Transmitter Latency
8-bit/10-bit encoder
All true serial interfaces require a method of encoding to insure minimum transition density so that the receiving
PLL has a minimal number of transitions to stay locked on. The encoding scheme maintains the signal dc
balance by keeping the number of ones and zeros the same. This provides good transition density for clock
recovery and improves error checking. The TLK2701 uses the 8-bit/10-bit encoding algorithm that is used by
fibre channel and gigabit ethernet. This is transparent to the user, as the TLK2701 internally encodes and
decodes the data such that the user reads and writes actual 16-bit data.
6
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TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
8-bit/10-bit encoder (continued)
The 8-bit/10-bit encoder converts 8-bit wide data to a 10-bit wide encoded data character to improve its
transmission characteristics. Since the TLK2701 is a 16-bit wide interface, the data is split into two 8-bit wide
bytes for encoding. Each byte is fed into a separate encoder. The encoding is dependant upon two additional
input signals, the TKMSB and TKLSB.
Table 1. Transmit Data Controls
TKLSB
TKMSB
0
0
Valid data on TXD(0−7),
DECODED 20 BIT OUTPUT
0
1
Valid data on TXD(0−7),
K code on TXD(8−15)
1
0
K code on TXD(0−7),
Valid data on TXD(8−15)
1
1
K code on TXD(0−7),
K code on TXD(8−15)
Valid data TXD(8−15)
PRBS generator
The TLK2701 has a built-in 27-1 PRBS (pseudorandom bit stream) function. When the PRBSEN terminal is
forced high, the PRBS test is enabled. A PRBS is generated and fed into the 10-bit parallel-to-serial converter
input register. Data from the normal input source is ignored during the PRBS mode. The PRBS pattern is then
fed through the transmit circuitry as if it were normal data and sent out to the transmitter. The output can be sent
to a BERT (bit error rate tester), the receiver of another TLK2701, or can be looped back to the receive input.
Since the PRBS is not really random but a predetermined sequence of ones and zeroes, the data can be
captured and checked for errors by a BERT.
parallel-to-serial
The parallel-to-serial shift register takes in the 20-bit wide data word multiplexed from the two parallel 8-bit/10-bit
encoders and converts it to a serial stream. The shift register is clocked on both the rising and falling edge of
the internally generated bit clock, which is 10 times the GTX_CLK input frequency. The LSB (D0) is transmitted
first.
high-speed data output
The high-speed data output driver consists of a current-mode logic (CML) differential pair that can be optimized
for a particular transmission line impedance and length. The line can be directly-coupled or ac-coupled. Refer
to Figure 15 and Figure 16 for termination details.
receive interface
The receiver portion of the TLK2701 accepts 8-bit/10-bit encoded differential serial data. The interpolator and
clock recovery circuit will lock to the data stream and extract the bit rate clock. This recovered clock is used to
retime the input data stream. The serial data is then aligned to two separate 10-bit word boundaries, 8-bit/10-bit
decoded and output on a 16-bit wide parallel bus synchronized to the extracted receive clock.
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TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
detailed description (continued)
receive data bus
The receive bus interface drives 16-bit wide single-ended TTL parallel data at the RXD[0:15] terminals. Data
is valid on the rising edge of the RX_CLK The RX_CLK is used as the recovered word clock. The data, enable,
and clock signals are aligned as shown in Figure 4. Detailed timing information can be found in the switching
characteristics table.
RX_CLK
RXD[0−15]
tsu
th
RXLSB, RXMSB
Figure 4. Receive Timing Waveform
data reception latency
The serial-to-parallel data receive latency is the time from when the first bit arrives at the receiver until it is output
in the aligned parallel word with RXD0 received as first bit. The receive latency is fixed once the link is
established. However, due to silicon process variations and implementation variables such as supply voltage
and temperature, the exact delay will vary slightly. The minimum receive latency (Rlatency) is 76 bit times; the
maximum is 107 bit times. Figure 5 illustrates the timing relationship between the serial receive terminals, the
recovered word clock (RX_CLK), and the receive data bus.
20-Bit Encoded Word
DINTXP,
DINTXN
(Rlatency)†
RXD[0−15]
16-Bit Decoded Word
RX_CLK
Figure 5. Receiver Latency
serial-to-parallel
Serial data is received on the DINRXP and DINRXN terminals. The interpolator and clock recovery circuit will
lock to the data stream if the clock to be recovered is within 200 PPM of the internally generated bit rate clock.
The recovered clock is used to retime the input data stream. The serial data is then clocked into the
serial-to-parallel shift registers. The 10-bit wide parallel data is then multiplexed and fed into two separate
8-bit/10-bit decoders where the data is then synchronized to the incoming data steam word boundary by
detection of the comma 8-bit/10-bit synchronization pattern.
8
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TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
detailed description (continued)
comma detect and 8-bit/10-bit decoding
The TLK2701 has two parallel 8-bit/10-bit decode circuits. Each 8-bit/10-bit decoder converts 10 bit encoded
data (half of the 20 bit received word) back into 8-bits. The comma detect circuit is designed to provide for byte
synchronization to an 8-bit/10-bit transmission code. When parallel data is clocked into a parallel to serial
converter, the byte boundary that was associated with the parallel data is now lost in the serialization of the data.
When the serial data is received and converted to parallel format again, a way is needed to recognize the byte
boundary. Generally this is accomplished through the use of a synchronization pattern. This is generally a
unique pattern of 1s and 0s that either cannot occur as part of valid data or is a pattern that repeats at defined
intervals. The 8-bit/10-bit encoding contains a character called the comma (b0011111 or b1100000), which is
used by the comma detect circuit on the TLK2701 to align the received serial data back to its original byte
boundary. The decoder detects the comma, generating a synchronization signal aligning the data to their 10-bit
boundaries for decoding; the comma is mapped into the LSB. It then converts the data back into 8-bit data. The
output from the two decoders is latched into the 16-bit register synchronized to the recovered parallel data clock
(RX_CLK) and output valid on the rising edge of the RX_CLK.
NOTE:
The TLK2701 only achieves byte alignment on the 0011111 comma.
Decoding provides two additional status signals, RKLSB and RKMSB. When RKLSB is asserted , an 8-bit/10-bit
K code was received and the specific K code is presented on the data bits RXD0 − RXD7, else an 8-bit/10-bit
D code was received. When TKMSB is asserted, an 8-bit/10-bit K code was received and the specific K code
is presented on data bits RXD8 − RXD15, else an 8-bit/10-bit D code was received. The valid K codes the
TLK2701 will decode are provided in Table 3. An error detected on either byte, including K codes not in Table
3, will cause that byte only to indicate a K0.0 code on the RK×SB and associated data pins, where K0.0 is known
to be an invalid 8-bit/10-bit code. A loss of input signal will cause a K31.7 code to be presented on both bytes,
where K31.7 is also known to be an invalid 8-bit/10-bit code.
Table 2. Receive Status Signals
RKLSB
RKMSB
0
0
Valid data on RXD(0−7),
DECODED 20 BIT OUTPUT
Valid data RXD(8−15)
0
1
Valid data on RXD(0−7),
K code on RXD(8−15)
1
0
K code on RXD(0−7),
Valid data on RXD(8−15)
1
1
K code on RXD(0−7),
K code on RXD(8−15)
Table 3. Valid K Characters
K CHARACTER
RECEIVE DATA BUS
(RXD[7−0]) OR
(RXD[15−8])
K28.0
000 11100
K28.1
001 11100
K28.2
010 11100
K28.3
011 11100
K28.4
100 11100
K28.5
101 11100
K28.6
110 11100
K28.7
111 11100
K23.7
111 10111
K27.7
111 11011
K29.7
111 11101
K30.7
111 11110
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TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
detailed description (continued)
power down mode
When the ENABLE pin is deasserted low, the TLK2701 will go into a power down mode. In the power down
mode, the serial transmit pins (DOUTTXP, DOUTTXN), the receive data bus pins (RXD[0:15]), and RKLSB will
go into a high-impedance state. In the power down condition, the signal detection circuit draws less than 15 mW.
When the TLK2701 is in the power-down mode, the clock signal on the GTX_CLK terminal must be provided.
loss of signal detection
The TLK2701 has a loss of signal detection circuit for conditions where the incoming signal no longer has a
sufficient voltage level to keep the clock recovery circuit in lock. The signal detection circuit is intended to be
an indication of gross signal error conditions, such as a detached cable or no signal being transmitted, and not
an indication of signal coding health. The TLK2701 reports this condition by asserting, the RKMSB/LOS, RKLSB
and RXD[0:15] all to a high state. As long as the signal is above 200 mV in differential magnitude, the LOS circuit
will not signal an error condition.
PRBS verification
The TLK2701 also has a built-in BERT function in the receiver side that is enabled by the PRBSEN. It can check
for errors and report the errors by forcing the RKLSB/PRBSPASS terminal low.
reference clock input
The reference clock (GTX_CLK) is an external input clock that synchronizes the transmitter interface. The
reference clock is then multiplied in frequency 10 times to produce the internal serialization bit clock. The internal
serialization bit clock is frequency-locked to the reference clock and used to clock out the serial transmit data
on both its rising and falling edge clock, providing a serial data rate that is 20 times the reference clock.
operating frequency range
The TLK2701 may operate at a serial data rate between 1.6 Gbps to 2.7 Gbps. The GTX_CLK must be within
±100 PPM of the desired parallel data rate clock.
testability
The TLK2701 has a comprehensive suite of built-in self-tests. The loopback function provides for at-speed
testing of the transmit/receive portions of the circuitry. The enable terminal allows for all circuitry to be disabled
so that an IDDQ test can be performed. The PRBS function allows for a BIST (built-in self-test).
loopback testing
The transceiver can provide a self-test function by enabling (LOOPEN) the internal loop-back path. Enabling
this terminal will cause serial-transmitted data to be routed internally to the receiver. The parallel data output
can be compared to the parallel input data for functional verification. (The external differential output is held in
a high-impedance state during the loopback testing.)
built-in self-test (BIST)
The TLK2701 has a BIST function. By combining PRBS with loopback, an effective self-test of all the circuitry
running at full speed can be realized. The successful completion of the BIST is reported on the RKLSB/
PRBS_PASS terminal.
power-on reset
Upon application of minimum valid power, the TLK2701 generates a power-on reset. During the power-on reset
the RXD, RKLSB, and RKMSB/LOS signal terminals go to a high-impedance state. The RX_CLK is held low.
The length of the power-on reset cycle is dependent upon the REFCLK frequency, but is less than 1 ms.
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 3 V
Voltage range at TXD, ENABLE, GTX_CLK, TKLMSB, TKLLSB, LOOPEN, PRBS_PASS . . . . . . . . −0.3 to 4 V
Voltage range at any other terminal except above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to VDD+0.3 V
Package power dissipation, PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HBM:2 kV, CDM:1 kV
Characterized free-air operating temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
†
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 2 5_C
POWER RATING
DERATING FACTOR‡
ABOVE TA = 25_C
TA = 70_C
POWER RATING
RCP64§
5.25 W
46.58 mW/_C
2.89 W
RCP64¶
3.17 W
23.70 mW/_C
1.74 W
RCP64#
2.01 W
13.19 mW/_C
1.11 W
‡
This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).
§ 2 oz. Trace and copper pad with solder.
¶ 2 oz. Trace and copper pad without solder.
# Standard JEDEC High-K board.
For more information, refer to TI application note PowerPAD Thermally Enhanced Package, TI literature number
SLMA002.
electrical characteristics over recommended operating conditions
PARAMETER
TEST CONDITIONS
Supply voltage, VDD
Supply current, ICC
Power dissipation, PD
NOM
MAX
2.3
2.5
2.7
UNIT
V
Frequency = 1.6 Gbps, PRBS pattern
105
Frequency = 2.7 Gbps, PRBS pattern
156
Frequency = 1.6 Gbps, PRBS pattern
262
mW
Frequency = 2.7 Gbps, PRBS pattern
390
mW
Frequency = 2.7 Gbps, worst case
mA
pattern||
Shutdown current
Enable = 0, VDDA, VDD terminals, VDD = MAX
PLL startup lock time
VDD,VDDC = 2.3V
500
3
mW
mA
0.1
Operating free-air temperature, TA
||
MIN
−40
0.4
ms
85
°C
Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.
reference clock (GTX_CLK) timing requirements over recommended operating conditions (unless
otherwise noted)
MAX
UNIT
Frequency
PARAMETER
Minimum data rate
TEST CONDITIONS
Typ −0.01%
80
Typ+0.01%
MHz
Frequency
Maximum data rate
Typ −0.01%
135
Typ+0.01%
MHz
100
ppm
Frequency tolerance
TYP
−100
Duty cycle
Jitter
MIN
40%
Peak-to-peak
POST OFFICE BOX 655303
50%
60%
40
• DALLAS, TEXAS 75265
ps
11
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
TTL input electrical characteristics over recommended operating conditions (unless otherwise
noted), TTL signals: TXDO−TXD15, GTX_CLK, LOOPEN, LCKREFN, PRBS_PASS, TKLSB, TKMSB
PARAMETER
TEST CONDITIONS
MIN
NOM
2
MAX
UNIT
VIH
High-level input voltage
See Figure 10
3.6
VIL
Low-level input voltage
See Figure 10
IIL
Input high current
VDD = MAX, VIN = 2 V
IIH
Input low current
VDD = MAX, VIN = 0.4 V
CI
Receiver input capacitance
tr
Rise time, GTX_CLK, TKMSB, TKLSB, TXD
0.7 V to 1.9 V, C = 5 pF, See Figure 10
tf
Fall time, GTX_CLK, TKMSB, TKLSB, TXD
1.9 V to 0.7 V, C = 5 pF, See Figure 10
tsu
TXD, TKMSB, TKLSB setup to ↑ GTX_CLK
See Figure 10
1.5
ns
th
TXD, TKMSB, TKLSB hold to ↑ GTX_CLK
See Figure 10
0.4
ns
0.80
V
40
µA
µA
−40
4
ns
1
ns
GTX_CLK
0.8 V
0V
tf
3.6 V
2.0 V
TXLSB, TXMSB,
TXD[0−15]
0.8 V
0V
tr
tsu
tf
th
Figure 6. TTL Data Input Valid Levels for AC Measurements
12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
pF
1
3.6 V
2.0 V
tr
V
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
TTL output switching characteristics over recommended operating conditions (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
MIN
NOM
1.7
2.3
GND
0.25
MAX
UNIT
VOH
High-level output voltage
IOH = −1 mA, VDD = MIN
VOL
Low-level output voltage
IOL = 1 mA, VDD = MIN
tr(slew)
Slew rate (rising), magnitude of RX_CLK, RKLSB,
RKMSB/LOS, RXD
0.8 V to 2 V, C = 5 pF, See Figure 11
0.5
V/ns
tf(slew)
Slew rate (falling), magnitude of RX_CLK, RKLSB,
RKMSB/LOS, RXD
0.8 V to 2 V, C = 5 pF, See Figure 11
0.5
V/ns
50% voltage swing,
GTX_CLK = 80 MHz, See Figure 11,
5.4
ns
50% voltage swing,
GTX_CLK = 135 MHz, See Figure 11,
2.7
ns
50% voltage swing,
GTX_CLK = 80 MHz, See Figure 11,
5.4
ns
50% voltage swing,
GTX_CLK = 135 MHz, See Figure 11,
2.7
ns
tsu
th
RXD, RKMSB/LOS, RKLSB setup to ↑ RX_CLK
RXD, RKMSB/LOS, RKLSB hold to ↑ RX_CLK
V
0.5
V
2.7 V
2.0 V
RX_CLK
0.8 V
0V
tr(slew)
tf(slew)
2.7 V
2.0 V
RKLSB, RKMSB,
RXD[0−15]
0.8 V
0V
tr(slew)
tsu
tf(slew)
th
Figure 7. TTL Data Output Valid Levels for AC Measurements
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
transmitter/receiver characteristics
MIN
NOM
MAX
UNIT
V(odp)
V(odp) = |VTXP−VTXN|,
Preemphasis VOD, direct
PARAMETER
Rt = 50 Ω, RREF = 200 Ω, dc-coupled,
See Figure 8
TEST CONDITIONS
840
1050
1260
mV
V(odd)
V(odd) = |VTXP−VTXN|,
De-emphasis VOD, direct
Rt = 50 Ω, RREF= 200 Ω, dc-coupled,
See Figure 8
760
950
1140
mV
V(term)
Transmit termination voltage range
V(ID)
Receiver input voltage requirement,
VID=|RXP – RXN|
V(cmv)
Receiver common mode voltage range,
(VRXP + VRXN)/2
Ilkg(R)
Receiver input leakage
CI
Receiver input capacitance
Rt = 50 Ω, dc-coupled, See Figure 11
VDD
Rt = 50 Ω, ac-coupled, See Figure 12
1500
VDD−VID/2
200
mV
mV
1500
VDD−VID/2
mV
−10
10
µA
2
pF
tTJ
Serial data total jitter (peak-to-peak)
Differential output jitter at 2.7 Gbps,
random + deterministic, PRBS pattern
tTJ
Serial data total jitter (peak-to-peak)
Differential output jitter at 1.6 Gbps,
random + deterministic, PRBS pattern
tr, tf
Differential output signal rise, fall time
(20% to 80%)
RL = 50 Ω, CL = 5 pF, See Figure 12
100
Jitter tolerance
Differential input jitter, random +
determinisitc, PRBS pattern at zero
crossing
0.60
0.15
UI
0.15
UI
150
ps
UI
T(latency)
Tx latency
34
38
bits
R(latency)
Rx latency
76
107
bits
MAX
UNIT
VOD(p)
VOD(d)
V(TERM)
tf
VOD(d)
tr
Bit
Time
Bit
Time
VOD(p)
Figure 8. Differential and Common-Mode Output Voltage Definitions
THERMAL INFORMATION
PARAMETER
RθJA
Junction-to-free-air thermal resistance
RθJC
Junction-to-case-thermal resistance
RθJA
Junction-to-free-air thermal resistance
RθJC
Junction-to-case-thermal resistance
RθJA
Junction-to-free-air thermal resistance
RθJC
Junction-to-case-thermal resistance
14
TEST CONDITION
MIN
TYP
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased
to thermal land
21.47
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
42.20
Board-mounted, no air flow, JEDEC test board
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
0.38
0.38
75.83
7.8
°
°C/W
°
°C/W
°
°C/W
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
APPLICATION INFORMATION
VDDA
Vt
1 nF − 10 nF
1 nF − 10 nF
1 nF − 10 nF
Rt
Recommended use of 0.01 µF
Capacitor per VDD terminal
Rt
0.01 µF
5 Ω at 100 MHz
RXD0
RREF
810 Ω
TXD0
TXD2
TXD1
Vt
RXD1
RXD2
0.01 µF
200 Ω
45
5
44
RXD6
TXD6
6
43
GND
TXD7
7
42
RXD7
GTX_CLK
8
41
RX_CLK
VDD
9
40
RXD8
TXD8
10
39
RXD9
TXD9
11
38
VDD
TXD10
12
37
RXD10
GND
13
36
RXD11
TXD11
14
35
RXD12
TXD12
15
34
RXD13
TXD13
33
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
GND
RXD14
RXD15
46
RKMSB/LOS
KLSB/PRBS_PASS
GND
TESTEN
LCKREFN
TKLSB
V DD
ENABLE
LOOPEN
GND
TXD15
TKMSB
GNDA
4
GND
DINRXP
3
TXD5
DINRXN
TXD4
VDD
RXD3
RXD4
RXD5
RREF
V DDA
47
GNDA
V DDA
2
DOUTTXP
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
DOUTTXN
1
GNDA
VDD
TXD3
TXD14
0.01 µF 0.01 µF 0.01 µF
Rt
1 nF − 10 nF
PRBSEN
VDD
Rt
Figure 9. External Component Interconnection
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
APPLICATION INFORMATION
recommended values of external resistors (1% tolerance)
PARAMETER
R(t), Termination resistor
R(REF), Reference resistor
TEST CONDITIONS
RECOMMENDED
50 Ω environment
50
75 Ω environment
75
50 Ω environment
200
75 Ω environment
300
UNIT
Ω
Ω
VOLTAGE
vs
RESISTOR REFERENCE
2.0
1.8
VODD at 75 Ω
VODP or VODD − V
1.6
VODP at 75 Ω
1.4
1.2
1.0
0.8
0.6
100
VODD at 50 Ω
VODP at 50 Ω
150
200
250
300
RREF − Resistor Reference − Ω
Figure 10. Differential Transmitter Voltage
choosing RREF resistor values
TLK2701 offers the flexibility to customize the voltage swing and transmission line termination by adjusting the
reference resistor, RREF, and termination resistor, Rt. By choosing particular resistor values, the system can
be optimized for a particular transmission line impedance, length, and controlling the output swing for EMI and
attenuation concerns. Refer to Figure 10 to determine the nominal voltage swing and driver current as a function
of resistor values. It is recommended that 1% tolerance resistors be used. Refer to Figure 11 for high-speed
I/O directly coupled mode and Figure 12 for high-speed I/O ac-coupled mode.
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
APPLICATION INFORMATION
VTERM
Rt
TXP
RXP
+
_
VTERM
Rt
TXN
Data
RXN
Data
VTERM = VDD
Preemphasis = 21 mA
(See Note A)
De-Emphasis = 19 mA
TRANSMITTER
MEDIA
RECEIVER
NOTE A: This assumes RREF = 200 Ω and termination resistance = 50 Ω. See Figure 10 and section choosing RREF resistor values for more
information.
Figure 11. High-Speed I/O Directly-Coupled Mode
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
APPLICATION INFORMATION
VDD
VTERM
Rt
Rt
RXP
TXP
VDD
Rt
TXN
Data
0.01 µF
0.01 µF
+
_
VTERM
RXN
Rt
VDD
Data
200 Ω
VTERM
820 Ω
Preemphasis = 21 mA
(See Note A)
De-Emphasis = 19 mA
TRANSMITTER
MEDIA
RECEIVER
NOTE A: This assumes RREF = 200 Ω and termination resistance = 50 Ω. See Figure 10 and section choosing RREF resistor values for more
information.
Figure 12. High-Speed I/O AC-Coupled Mode
18
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429D − AUGUST 2000 − REVISED MARCH 2008
APPLICATION INFORMATION
designing with PowerPAD
The TLK2701 is housed in a high-performance, thermally enhanced, 64-pin VQFP (RCP64) PowerPAD
package. Use of the PowerPAD package does not require any special considerations except to note that the
PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical
conductor. Therefore, if not implementing PowerPAD PCB features, the use of solder masks (or other assembly
techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection
etches or vias under the package. It is strongly recommended that the PowerPAD be soldered to the thermal
land. The recommended convention, however, is to not run any etches or signal vias under the device, but to
have only a grounded thermal land as explained below. Although the actual size of the exposed die pad may
vary, the minimum size required for the keep-out area for the 64-pin PFP PowerPAD package is 8 mm X 8 mm.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land will vary in size depending on the PowerPAD package being used, the
PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may
not contain numerous thermal vias depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD
Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI Web
pages beginning at URL: http://www.ti.com.
Figure 13. Example of a Thermal Land
For the TLK2701, this thermal land should be grounded to the low-impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground terminal landing pads be connected directly to the grounded thermal land. The land size
should be as large as possible without shorting device signal terminals. The thermal land may be soldered to
the exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low impedance ground plane for the device. More
information may be obtained from the TI application note PHY Layout, TI literature number SLLA020.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
19
PACKAGE OPTION ADDENDUM
www.ti.com
12-Aug-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLK2701IRCP
LIFEBUY
HVQFP
RCP
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TLK2701
TLK2701IRCPG4
LIFEBUY
HVQFP
RCP
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TLK2701
TLK2701IRCPR
LIFEBUY
HVQFP
RCP
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TLK2701
TLK2701IRCPRG4
LIFEBUY
HVQFP
RCP
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TLK2701
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Aug-2016
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TLK2701IRCPR
Package Package Pins
Type Drawing
HVQFP
RCP
64
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
13.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.0
1.5
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLK2701IRCPR
HVQFP
RCP
64
1000
367.0
367.0
45.0
Pack Materials-Page 2
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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