TE0803-03-3BE11-AS

  TE0803-03-3BE11-AS Starter Kit with Zynq UltraScale+ FPGA Module  Order number: TE0803-03-3BE11-AS     Product information "TE0803-03-3BE11-AS Starter Kit with Zynq UltraScale+ FPGA Module" This Starter Kit is the replacement of the TE0803-02-03-1EA-S. The Trenz Electronic Starter Kit consists of a TE0803-03-3BE11-A MPSoC module on a TEBF0808-04 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400W power supply for the enclosure, two mounted XMOD FTDI JTAG Adapter, an 8 GB micro SD card, an USB cable, screws and bolts. The Module: TE0803-03-3BE11-A The Trenz Electronic TE0803-03-3BE11-A is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+. This module is equipped with 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's are provided via rugged high-speed stacking connections. All this on a footprint of 5.2 x 7.6 cm, smaller than a credit card. This product is or has been in development until recently. For this reason it is possible that no complete documentation is stored yet. Key Features               Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E ZU3EG, 784 Pin Packages Dimensions: 5.2 x 7.6 cm Plug-on module with 4 x 160 pin B2B connectors Rugged for shock and high vibration. 3 mm mounting holes for skyline heat spreader 2 GByte 64-Bit width DDR4 SDRAM 128 MByte SPI Boot Flash dual parallel 2 KBit Serial EEPROM for MAC Address 48 High-density (HD) I/O's (2 banks) Graphic Processing Unit (GPU) User I/O o 65 x multi-use I/O's (MIO) o 156 high-performance (HP) I/O's (3 banks) o Serial transceiver: PS GTR 4; PL GTH 4 o Programmable 4-channel PLL clock generator All power supplies on board, single 3.3V power source required Evenly spread supply pins for good signal integrity. Other assembly options for cost or performance optimization plus high volume prices available on request. Recommended Software Vivado Design Suite - HLx Edition Download Vivado Design Suite HLx Editions include Partial Reconfiguration at no additional cost with the Vivado HL Design Edition and HL System Edition. In-warranty users can regenerate their licenses to gain access to this feature. Overview of all Editions of Vivado Design Suite Editions The Base Board: TEBF0808-04 The Trenz Electronic TEBF0808 UltraITX+ base board has been developed individually for the TE0808 UltraSOM+ MPSoC. Key Features                                  Mini-ITX form factor, PC enclosure compatible ATX-24 power supply connector Optional 12V standard power plug Headers Intel 10-pin HDA Audio Intel 9-pin Power-/Reset-Button, Power-/HD-LED PC-BEEPER On-board Power- / Reset-Switches 2 x Configuration 4-bit DIP-switches 2 x Optional 4-wire PWM fan connectors PCIe Slot - one PCIe lane (16 lane connector) CAN FD Transceiver (10 Pin IDC connector and 6-pin header) 4 x On-board configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x Microchip 24AA025E48T-I/OT) Dual SFP+ Connector (2x1 Cage) 1 x DisplayPort (single lane) 1 x SATA Connector 2 x USB3.0 A Connector (Superspeed Host Port (Highspeed at USB2.0)) 1 x USB3.0 on-board connector with two ports FMC HPC Slot (FMC_VADJ max. VCCIO) FMC Fan Gigabit Ethernet RGMII PHY with RJ45 MagJack All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface Quad programmable PLL clock generator SI5338A 2x SMA coaxial connectors for clock signals MicroSD- / MMC-Card Socket (bootable) 32 Gbit (4 GByte) on-board eMMC flash (8 banks a 4 Gbit) 2 x System Controller CPLDs Lattice MachXO2 1200 HC 1 x Samtec FireFly (4 GT lanes bidirectional) 1 x Samtec FireFly connector for reverse loopback 2 pre-assembled TE0790 JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for programming MPSoC and SC CPLDs 20-pin ARM JTAG Connector (PS JTAG0) 3 x Pmod connector (GPIO's and I²C interface to SC CPLDs and MPSoC module) On-board DC-DC PowerSoCs PC Enclosure Accessible I/O          PCIe FMC Dual SFP+ RJ45 Gigabit Ethernet 2x USB3 Host Displayport microSD Two LEDs CAN FD (using DB9 to IDC10 Cable) Core V1 Mini-ITX Enclosure - Technical Features           Dimensions: 260 x 276 x 316 mm (B x H x T) Material: Steel Colour: Black Drive Slots: 2 x 3,5 Zoll (intern, 3,5 Zoll) and 2 x 2,5 Zoll (intern, 2,5 Zoll) Expansion slots: 2 I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each Maximum graphic card lenght: 255 mm (inner enclosure) Maximum graphic card lenght: 285 mm (outer enclosure) Maximum CPU cooler height: 140 mm Maximum lenght power supply: 200 mm Starter Kit - Scope of Delivery            1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls 1 x Power supply Be quiet! Pure Powr, 400 Watt, 12V, ATX 2.3 with fan 1 x TE0803-03-3BE11-A MPSoC module with ZU3EG 1 x TEBF0808-04 base board 1 x mounted Heatspreader MaxiGrip 23 x 23 x 19.5 mm 1 x TE0790-02 XMOD FTDI JTAG adapter, mounted (compatible with Xilinx-Tools) 1 x TE0790-02L XMOD FTDI JTAG adapter, mounted (independent from Xilinx-Tools) 1 x 8 GB Class 4 microSDHC card 1 x USB cable, Type A to Type B Mini, 2 meter length 2 x Phillips screws, M3 x 6, pan head, zinc coated 2 x Spacer bolts, M3, 10 mm Additional Information    Manufacturer's article number: TE0803-02-03-1EA-S Starter Kit Trenz Electronic TE0803 Starter Kit Wiki Support Forum All modules produced by Trenz Electronic are developed and manufactured in Germany.                                                                               https://shop.trenz‐electronic.de/en/TE0803‐03‐3BE11‐AS‐TE0803‐03‐3BE11‐AS‐Starter‐Kit‐with‐Zynq‐UltraScale‐FPGA‐Module?path=Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0803/REV03/Documents/6‐12‐19