LEON-G1 series
quad-band GSM/GPRS data & voice modules
Data Sheet
Abstract
Technical data sheet describing the LEON-G100 quad-band
GSM/GPRS data and voice modules.
The LEON-G1 series modules are complete and cost efficient
solutions, bringing full feature quad-band GSM/GPRS data and
voice transmission technology in a compact form factor.
www.u-blox.com
UBX-13004887 - R02
LEON-G1 series - Data Sheet
Document Information
Title
LEON-G1 series
Subtitle
quad-band GSM/GPRS data & voice modules
Document type
Data Sheet
Document number
UBX-13004887
Revision, date
R02
Document status
Production Information
18-Dec-2014
Document status explanation
Objective Specification
Document contains target values. Revised and supplementary data will be published later.
Advance Information
Document contains data based on early testing. Revised and supplementary data will be published later.
Early Production Information
Document contains data from product verification. Revised and supplementary data may be published later.
Production Information
Document contains the final product specification.
This document applies to the following products:
Name
Type number
Firmware version
PCN / IN
LEON-G100
LEON-G100-06S-02
07.60.17
UBX-13005361
LEON-G100-07S-01
07.92
UBX-13005361
LEON-G100-08S-01
07.92
UBX-13005361
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may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this
document or any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time. For most recent documents, please visit
www.u-blox.com.
Copyright © 2014, u-blox AG
Trademark Notice
Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other
countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.
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LEON-G1 series - Data Sheet
Contents
Contents.............................................................................................................................. 3
1
Functional description.................................................................................................. 5
1.1
1.2
1.3
1.4
1.5
1.6
2
Overview .............................................................................................................................................. 5
Product features ................................................................................................................................... 5
Block diagram....................................................................................................................................... 6
Product description ............................................................................................................................... 7
AT command support ........................................................................................................................... 8
Supported features ............................................................................................................................... 8
Interfaces .................................................................................................................... 10
2.1
Power management ........................................................................................................................... 10
2.1.1
Module supply input (VCC) ......................................................................................................... 10
2.1.2
RTC supply input/output (V_BCKP) .............................................................................................. 10
2.2
RF antenna interface ........................................................................................................................... 10
2.3
System functions ................................................................................................................................ 10
2.3.1
Module power-on (PWR_ON) ...................................................................................................... 10
2.3.2
Module power-off ....................................................................................................................... 10
2.3.3
Module reset (RESET_N) .............................................................................................................. 11
2.4
(U)SIM interface .................................................................................................................................. 11
2.5
Serial communication ......................................................................................................................... 11
2.5.1
Asynchronous serial interface (UART) .......................................................................................... 11
2.5.2
Multiplexer protocol .................................................................................................................... 12
2.6
DDC (I2C compatible) interface ........................................................................................................... 12
2.7
Audio ................................................................................................................................................. 12
2.8
ADC input .......................................................................................................................................... 13
2.9
GPIO................................................................................................................................................... 14
3
Pin definition .............................................................................................................. 15
3.1
4
Pin assignment ................................................................................................................................... 15
Electrical specifications .............................................................................................. 19
4.1
Absolute maximum rating .................................................................................................................. 19
4.1.1
Maximum ESD ............................................................................................................................. 20
4.2
Operating conditions .......................................................................................................................... 20
4.2.1
Operating temperature range ...................................................................................................... 20
4.2.2
Module thermal resistance .......................................................................................................... 20
4.2.3
Supply/power pins ....................................................................................................................... 21
4.2.4
Power consumption .................................................................................................................... 22
4.2.5
RF performance ........................................................................................................................... 22
4.2.6
PWR_ON pin ............................................................................................................................... 23
4.2.7
RESET_N pin ................................................................................................................................ 23
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LEON-G1 series - Data Sheet
4.2.8
4.2.9
4.2.10
4.2.11
4.2.12
SIM pins ...................................................................................................................................... 24
Generic Digital Interfaces pins ..................................................................................................... 25
DDC (I2C) pins ............................................................................................................................. 28
Audio pins ................................................................................................................................... 28
ADC pin ...................................................................................................................................... 30
5
Mechanical specifications .......................................................................................... 31
6
Qualification and approvals ...................................................................................... 32
6.1
6.2
7
Reliability tests .................................................................................................................................... 32
Approvals ........................................................................................................................................... 32
Product handling ........................................................................................................ 34
7.1
Packaging ........................................................................................................................................... 34
7.1.1
Reels ........................................................................................................................................... 34
7.1.2
Tapes .......................................................................................................................................... 35
7.2
Moisture sensitivity levels .................................................................................................................... 36
7.3
Reflow soldering ................................................................................................................................. 36
7.4
ESD precautions.................................................................................................................................. 36
8
Default settings .......................................................................................................... 37
9
Labeling and ordering information........................................................................... 38
9.1
9.2
9.3
Product labeling.................................................................................................................................. 38
Explanation of codes .......................................................................................................................... 38
Ordering information .......................................................................................................................... 39
Appendix .......................................................................................................................... 40
A Glossary ...................................................................................................................... 40
Related documents .......................................................................................................... 41
Revision history ................................................................................................................ 41
Contact .............................................................................................................................. 42
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LEON-G1 series - Data Sheet
1 Functional description
1.1 Overview
LEON-G1 series modules are cost efficient solutions offering full quad-band GSM / GPRS data and voice
functionality in a compact LCC (Leadless Chip Carrier) form factor. Featuring low power consumption and
GSM/GPRS class 10 data transmission with voice capability, LEON-G1 series modules combine baseband, RF
transceiver, power management unit, and power amplifier in a single, easy-to-integrate solution.
LEON-G1 series modules are fully qualified and certified solutions, reducing cost and enabling short time to
market. These modules are ideally suited for M2M and automotive applications such as: Automatic Meter
Reading (AMR), Remote Monitoring Automation and Control (RMAC), surveillance and security, eCall, road
pricing, asset tracking, fleet management, anti theft systems and Point of Sales (PoS) terminals.
LEON-G1 series modules support full access to u-blox GNSS positioning chips and modules via the GSM modem.
GSM and GNSS can be controlled through a single serial port from any host processor. The LEON-G1 compact
form factor and SMT pads allow fully automated assembly with standard pick & place and reflow soldering
equipment for cost-efficient, high-volume production.
1.2 Product features
1
•
•
•
•
•
•
LEON-G100-07S
•
•
•
•
1
1
5
2
1
•
•
•
•
•
•
•
•
LEON-G100-08S
•
•
•
•
1
1
5
2
1
•
•
•
•
•
•
•
•
USB 2.0
SPI
Automotive
2
Professional
FTP, HTTP, SMTP
5
Standard
Embedded TCP/UDP stack
1
DTMF decoder
Jamming detection
1
Battery charging
Antenna supervisor
•
eCall / ERA Glonass
Network indication
•
SSL
Digital Audio
•
®
•
GNSS receiver
LEON-G100-06S
GSM/GPRS quad-band
Analog Audio
FW update over the air (FOTA)
Grade
GPIO
FW update over AT (FOAT)
Functions
DDC for u-blox GNSS
Audio
UART
Interfaces
CellLocate
Positioning
Assist Now Software
Bands
GNSS via modem
Module
Table 1: LEON-G1 series main features summary
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LEON-G1 series - Data Sheet
1.3 Block diagram
32.768 kHz
26 MHz
Power-On
PA
ANT
Reset
SAW
Filter
Switch
RF
Transceiver
GPIO
DDC (for GNSS)
SIM Card
Memory
UART
Baseband
2 Analog Audio
Headset Detection
Vcc
Power
Management
Digital Audio
V_BCKP
ADC
Figure 1: LEON-G100 block diagram
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LEON-G1 series - Data Sheet
1.4 Product description
Item
LEON-G100
GSM/GPRS Protocol Stack
3GPP Release 99
Mobile Station Class
Class B
GSM/GPRS Bands
GSM 850 MHz
E-GSM 900 MHz
DCS 1800 MHz
PCS 1900 MHz
GSM/GPRS Power Class
Class 4 (33 dBm) for 850/900
Class 1 (30 dBm) for 1800/1900
Packet Switched Data Rate
GPRS multi-slot class 10
Coding scheme CS1-CS4
3
Up to 85.6 kb/s DL
3
Up to 42.8 kb/s UL
Circuit Switched Data Rate
Up to 9.6 kb/s DL/UL
Transparent mode
Non transparent mode
Network Operation Modes
I to III
1
2
3
Table 2: LEON-G1 series GSM/GPRS characteristics summary
Encryption algorithms A5/1 for GSM and GPRS as well as the bearer service fax Group 3 Class 2.0 are supported.
With correct configuration via AT commands the module can also function as GPRS multislot class 8 device.
The network will automatically configure the number of timeslots available for usage by the module.
The network automatically configures the channel encoding used by the module, depending on the conditions
of the quality of the radio link between cell phone and base station. If the channel is very noisy, the network
may use the most robust coding scheme (CS-1) to ensure higher reliability. If the channel provides good
conditions, the network can use the least robust but fastest coding scheme (CS-4) to obtain optimum speed.
Direct Link mode is supported for TCP sockets.
Basic features
Supplementary services
Short Message Service (SMS)
Display of Called Number
Call Hold/Resume (HOLD)
Text and PDU mode supported
Indication of Call Progress Signals
Call Waiting (CW)
Mobile-Originating SMS (MO SMS)
Country/PLMN Indication
Call Forwarding (CFU, CFB, CFNRy, CFNRc)
Mobile-Terminating SMS (MT SMS)
Country/PLMN Selection
Call Barring (BAOC, BOIC, BOIC-exHC, BAIC, BIC_Roam) SMS indication and acknowledgement
International Access Function
Call Deflection (CD)
SMS Cell Broadcast (SMS CB)
Service Indicator
Explicit Call Transfer (ECT)
SMS during circuit-switched calls
Emergency Calls Capabilities
Multi-Party (MTPY)
SMS over CSD
Dual Tone Multi Frequency (DTMF)
Calling Line Identification Presentation (CLIP)
SMS over PSD
Subscription Identity Management
Calling Line Identification Restriction (CLIR)
SMS storage on SIM
Service Provider Indication
Connected Line Identification Presentation (COLP)
SMS storage on module memory
Abbreviated Dialing
Connected Line Identification Restriction (COLR)
Concatenated SMS
Fixed Number Dialing
Unstructured Supplementary Services Data (USSD)
Barring of Dialed Numbers
Advice of Charge Charging (AoCC, AoCI)
SIM Application Toolkit
Calling Name Presentation (CNAP)
ME-SIM lock
Network Identify and Time Zone (NITZ)
Table 3: LEON-G1 Mobile Station basic features, supplementary services and SMS services summary
4
1
Device can be attached to both GPRS and GSM services (i.e. Packet Switch and Circuit Switch mode) using one service at a time.
GPRS multi-slot class 10 implies a maximum of 4 slots in DL (reception) and 2 slots in UL (transmission) with 5 slots in total.
3
The maximum bit rate of the module depends on the current network settings.
4
These functionalities are supported via AT commands (for more details see the u-blox AT Commands Manual [4]).
2
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LEON-G1 series - Data Sheet
1.5 AT command support
The module supports AT commands according to 3GPP standards: TS 27.007 [1], 27.005 [2], 27.010 [3], and the
u-blox AT command extension.
For the complete list of the supported AT commands and their syntax see the u-blox AT Commands
Manual [4].
RIL (Radio Interface Layer) drivers for Windows and Android are available for LEON-G1 series.
1.6 Supported features
Table 4 describes the main features supported by LEON-G1 series modules. For more details, see the LEON-G1
series System Integration Manual [6] and u-blox AT commands manual [4].
Feature
Module
Description
Network Indication
All
GPIO configured to indicate the network status: registered home network, registered
roaming, voice or data call enabled, no service.
The feature can be enabled through the +UGPIOC AT command.
Antenna Detection
All
Antenna presence detection capability is provided, evaluating the resistance from the ANT
pin to GND by means of an internal antenna detection circuit.
The antenna detection feature can be enabled through the +UANTR AT command.
Jamming detection
All
Detects “artificial” interference that obscures the operator’s carriers providing access to
the GSM service and reports the start and stop of such conditions to the application
processor (AP). The AP can react appropriately, e.g. by switching off the radio transceiver
to reduce power consumption and monitoring the environment at constant periods.
The feature can be enabled and configured through the +UCD AT command.
Embedded TCP and
UDP stack
All
Embedded TCP/IP and UDP/IP stack for TCP and UDP sockets.
Sockets can be configured in Direct Link mode to establish a transparent end-to-end
communication with an already connected TCP socket via serial interface.
FTP
All
File Transfer Protocol functionalities are supported via AT commands.
HTTP
All
HTTP protocols are supported. HEAD, GET, POST, DELETE and PUT operations are
available. Up to 4 client contexts can be simultaneously used.
SMTP
All
SMTP protocol is implemented. It is possible to specify the common parameters (e.g.
server data, authentication method, etc.), send an email to a SMTP server. E-mails can be
sent with or without attachment. Attachments are stored in the module local file system.
GNSS via Modem
All
Full access to u-blox positioning chips and modules is available through a dedicated DDC
2
(I C) interface. This means that wireless module and positioning chips / modules can be
controlled through a single serial port from any host processor.
For more details see the GNSS Implementation Application Note [7].
AssistNow Software
All
Embedded AssistNow Online and AssistNow Offline clients to provide full developed to
provide better GNSS performance and faster Time-to-First-Fix. The clients can be enabled /
disabled with an AT command.
All
Enables the estimation of device position based on the parameters of the mobile network
®
cells visible to the specific device based on the CellLocate database:
Normal scan: parameters of the visible home network cells are only sent
Deep scan: parameters of all surrounding cells of all mobile operators are sent
®
®
CellLocate is implemented using a set of AT commands for CellLocate service
configuration and position request.
®
CellLocate
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LEON-G1 series - Data Sheet
Feature
Module
Description
Hybrid Positioning
All
The module’s current position is provided using a u-blox positioning chip or module or the
®
estimated position from CellLocate , depending on which positioning method provides the
best and fastest solution according to the user configuration.
Hybrid positioning is implemented through a set of AT commands that allow the
configuration and the position request.
Firmware update Over
AT commands (FOAT)
All
Firmware module upgrade over UART interface using AT command.
eCall / ERA Glonass
LEON-G100-07S
LEON-G100-08S
In-Band modem solution for eCall and ERA-GLONASS emergency call applications over
cellular networks is implemented according to the 3GPP TS 26.267 specification [9].
When activated, the in-vehicle eCall / ERA-GLONASS system (IVS) creates an emergency
call carrying both voice and data (including vehicle position data) directly to the nearest
Public Safety Answering Point (PSAP) to determine whether rescue services should be
dispatched to the known position.
DTMF decoder
LEON-G100-07S
LEON-G100-08S
During a voice call, the Dual-Tone Multi-Frequency detector analyses the RX speech
(coming from the remote party). The detected DTMF symbols can be output via URC.
For more details, see the u-blox AT commands manual [4], +UDTMFD AT command.
Smart Temperature
Supervisor
All
Constant monitoring of the module board temperature:
Warning notification when the temperature approaches an upper or lower
predefined threshold
Shutdown notified and forced when the temperature value is outside the
specified range (shutdown suspended in case of an emergency call in progress)
The feature can be enabled or disabled through the +USTS AT command.
The sensor measures board temperature inside the shields, which can differ
from ambient temperature.
Power saving
All
The power saving configuration is by default disabled, but it can be configured using AT
command. When power saving is enabled, the module automatically enters the low power
idle-mode whenever possible, reducing current consumption.
During idle-mode, the module processor core runs with the RTC 32 kHz reference clock,
which is generated by the internal 32 kHz oscillator,
For more details, see the LEON-G1 series System Integration Manual [6] and u-blox AT
commands manual [4], +UPSV AT command.
Table 4: LEON-G1 series’ main supported features
u-blox is extremely mindful of user privacy. When a position is sent to the CellLocate® server, u-blox is
unable to track the SIM used or the specific device.
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LEON-G1 series - Data Sheet
2 Interfaces
2.1 Power management
2.1.1 Module supply input (VCC)
LEON-G1 series modules must be supplied through the VCC pin by a DC power supply. Voltages must be stable:
during operation, the current drawn from VCC can vary by some order of magnitude, especially due to the
surging consumption profile of the GSM system (described in the LEON-G1 series System Integration
Manual [6]). It is important that the system power supply circuit is able to support peak power.
2.1.2 RTC supply input/output (V_BCKP)
V_BCKP is the Real Time Clock (RTC) supply. When VCC voltage is within the valid operating range, the internal
Power Management Unit (PMU) supplies the RTC and the same supply voltage is available on the V_BCKP pin. If
the VCC voltage is under the minimum operating limit (e.g. during not powered mode), the V_BCKP pin can
externally supply the RTC.
2.2 RF antenna interface
The ANT pad has an impedance of 50 Ω and represents the RF antenna interface.
2.3 System functions
2.3.1 Module power-on (PWR_ON)
LEON-G1 series modules can be switched on in one of the following ways:
Rising edge on the VCC pin to a valid voltage for module supply, i.e. applying module supply
Shorting PWR_ON pin to ground: the PWR_ON pin requires an external pull-up resistor to set its value to
logic high and must not be left floating. Internal circuitry is low level sensitive
RTC alarm, i.e. pre-programmed scheduled time (see the u-blox AT Commands Manual [4], AT+CALA)
2.3.2 Module power-off
LEON-G1 series modules can be switched off, with proper storage of current parameter settings and network
detach, by:
AT+CPWROFF command
An under-voltage shutdown occurs when the VCC supply drops below the extended operating range minimum
limit. In this case it is not possible to store the current parameter settings in the module’s non-volatile memory
and it is not possible to perform the proper network detach.
An over-temperature or an under-temperature shutdown occurs when the temperature measured within the
wireless module reaches the dangerous area, if the optional Smart Temperature Supervisor feature is enabled
and configured by the dedicated AT command. For more details see the LEON-G1 series System Integration
Manual [6] and u-blox AT commands manual [4], +USTS AT command.
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LEON-G1 series - Data Sheet
2.3.3 Module reset (RESET_N)
LEON-G1 series modules can be reset in one of these ways:
Low level on the RESET_N pin, normally high with internal pull-up. This causes an “external” or “hardware”
reset of the module. The current parameter settings are not saved in the module’s non-volatile memory and
a proper network detach is not performed
AT+CFUN command (see the u-blox AT commands manual [4]). This causes an “internal” or “software”
reset of the module. The current parameter settings are saved in the module’s non-volatile memory and a
proper network detach is performed
RESET_N is pulled low by the module itself when the module is in power-off mode or an internal reset occurs.
2.4 (U)SIM interface
A (U)SIM card interface is provided on the VSIM, SIM_IO, SIM_CLK, SIM_RST pins of the LEON-G1 series
modules: the high-speed SIM/ME interface is implemented as well as the automatic detection of the required
SIM supporting voltage.
Both 1.8 V and 3 V SIM types are supported: activation and deactivation with automatic voltage switch from
1.8 V to 3 V are implemented, according to ISO-IEC 7816-3 specifications. The SIM driver supports the PPS
(Protocol and Parameter Selection) procedure for baud-rate selection, according to the values proposed by the
connected UICC / SIM card or chip.
2.5 Serial communication
LEON-G1 series modules provide the following serial communication interface, which can be concurrently used
for AT command interface and Packet-Switched / Circuit-Switched Data communication:
One asynchronous serial interface (UART)
When used as an AT command interface, this serial communication interface can be used for firmware upgrade
using the AT command +UFWUPD (for more details see the u-blox AT Commands Manual [4]).
Only the following serial communication interface can be used for firmware upgrade using the u-blox EasyFlash
tool:
The UART interface, using the RxD and TxD lines only (the other UART lines are not needed)
2.5.1 Asynchronous serial interface (UART)
The UART interface is a 9-wire unbalanced asynchronous serial interface provided for all communications with
LEON-G1 series modules: AT commands interface, data communication, software upgrades.
UART features are:
Complete serial port with RS-232 functionality conforming to the ITU-T V.24 Recommendation [5], with
CMOS compatible signal levels (0 V for low data bit or ON state and 2.85 V for high data bit or OFF state)
Data lines (RxD as output, TxD as input), hardware flow control lines (CTS as output, RTS as input), modem
status and control lines (DTR as input, DSR as output, DCD as output, RI as output) are provided
Hardware flow control (default value), software flow control, or no flow control are supported
Power saving indication available5 on the hardware flow control output (CTS line): the line is driven to the
OFF state when the module is not prepared to accept data signals
5
If enabled
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LEON-G1 series - Data Sheet
1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400 b/s baud rates are supported for the AT
interface; note that 1200 and 230400 b/s are available in conjunction only with autobauding
Auto baud rate detection (autobauding) is the default configuration
Frame format can be:
o 8N2 (8 data bits, no parity, 2 stop bits)
o 8E1 (8 data bits, even parity, 1 stop bit)
o 8O1 (8 data bits, odd parity, 1 stop bit)
o 8N1 (8 data bits, no parity, 1 stop bit)
o 7E1 (7 data bits, even parity, 1 stop bit)
o 7O1 (7 data bits, odd parity, 1 stop bit)
Default frame configuration is 8N1
Automatic frame recognition is supported: this feature is enabled in conjunction with the auto baud rate
detection only
2.5.2 Multiplexer protocol
LEON-G1 series modules have a software layer with MUX functionality, 3GPP TS 27.010 multiplexer protocol [3].
It is a data link protocol (layer 2 of OSI model) which uses HDLC-like framing and operates between the module
(DCE) and the application processor (DTE), allowing different simultaneous sessions over the physical link (UART).
This allows, for example, an SMS transfer to the DTE when a data connection is in progress.
The following channels are defined:
Channel 0: control channel
Channel 1 – 5: AT commands / data connection
Channel 6: GNSS tunneling
For more details see the Mux Implementation Application Note [8].
2
2.6 DDC (I C compatible) interface
LEON-G1 series modules provide an I2C compatible DDC interface on the SCL and SDA pins exclusively for
communication with u-blox GNSS positioning chips / modules.
2.7 Audio
LEON-G1 series modules provide analog and digital audio interfaces:
Two analog audio inputs:
o First analog audio input (MIC_BIAS1, MIC_GND1) can be used for direct connection of the electret
condenser microphone of a handset. This audio input is used when the audio uplink path is set as
“Handset Microphone“ (for more details see the u-blox AT Commands Manual [4], AT+USPM
command)
o Second analog audio input (MIC_BIAS2, MIC_GND2) can be used for direct connection of the
electret condenser microphone of a headset. This audio input is used when the audio uplink path is
set as “Headset Microphone“ (for more details see the u-blox AT Commands Manual [4], AT+USPM
command)
Two analog audio outputs:
o First analog audio output (HS_P), a single ended low power audio output, can be used to directly
connect the receiver (earpiece) of a handset or an headset. This audio output is used when the
audio downlink path is “Normal earpiece“ or “Mono headset“ (for more details see the u-blox AT
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LEON-G1 series - Data Sheet
o
Commands Manual [4]; AT+USPM command). These two downlink path profiles use the same
physical output but have different sets of audio parameters (for more details see the u-blox AT
Commands Manual [4], AT+USGC, +UDBF, +USTN commands)
Second analog audio output (SPK_P, SPK_N), a differential high power audio output, can be used
to directly connect a speaker or a loudspeaker used for ring-tones or for speech in hands-free mode.
This audio output is used when the audio downlink path is “Loudspeaker“ (for more details see the
u-blox AT Commands Manual [4], AT+USPM command, and
parameters)
Headset detection input (HS_DET):
o The headset detection, if enabled, causes the automatic switch of the uplink audio path to
“Headset Microphone“ and downlink audio path to “Mono headset“. Enabling or disabling of
detection can be controlled by the parameter in AT+USPM command (for
more details see the u-blox AT Commands Manual [4])
I2S digital audio interface (I2S_TX, I2S_RX, I2S_CLK, I2S_WA)
o This audio path is selected when parameters and in +USPM
command (for more details see the u-blox AT Commands Manual [4]) are respectively “I2S input
line“ and “I2S output line“
Not all the Input-Output audio path combinations are allowed. Check audio command +USPM in u-blox
AT Commands Manual [4] for allowed combinations of audio path and for their switching during different
use cases (speech/alert tones).
The default values for audio parameters (for more details see the u-blox AT Commands Manual [4];
+UMGC,+UUBF, +UHFP, +USGC, +UDBF, +USTN AT commands) are tuned for audio device connected as
suggested above (i.e. handset microphone connected on first microphone input, headset microphone on
second microphone input). For a different use case (i.e. connection of a hands-free microphone) these
parameters should be changed on the audio path corresponding to the connection chosen.
For the default values related to the uplink, downlink path and headset detection see the u-blox AT
Commands Manual [4].
2.8 ADC input
One Analog to Digital Converter input (ADC1) can be configured via u-blox AT commands. The ADC resolution
is 11-bit, single ended input range of 0-2.0 V. For more details, see the the u-blox AT Commands Manual [4],
+UADC AT command.
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LEON-G1 series - Data Sheet
2.9 GPIO
LEON-G1 series modules provide some pins which can be configured as general purpose input or output, or to
provide special functions via u-blox AT commands (for further details see the LEON-G1 System Integration
Manual [6] and to u-blox AT Commands Manual [4], +UGPIOC, +UGPIOR, +UGPIOW, +UGPS, +UGPRF, +USPM).
LEON-G1 series modules provide five general purpose input/output pins: GPIO1, GPIO2, GPIO3, GPIO4 and
HS_DET, with the available functions described below:
Function
Description
Default GPIO
Configurable GPIOs
GNSS supply enable
Enable/disable the supply of u-blox GNSS receiver
connected to wireless module
GPIO2
GPIO1, GPIO2, GPIO3,
GPIO4, HS_DET
GNSS data ready
Sense when u-blox GNSS receiver connected to
wireless module is ready for sending data by the DDC
2
(I C)
GPIO3
GPIO3
GNSS RTC sharing
RTC (Real Time Clock) synchronization signal to u-blox
GNSS receiver connected to wireless module
GPIO4
GPIO4
Headset detection
Sense when the headset is connected to wireless
module
HS_DET
HS_DET
Network status indication
Network status: registered home network, registered
roaming, data transmission, no service
--
GPIO1, GPIO2, GPIO3,
GPIO4, HS_DET
General purpose input
Input to sense high or low digital level
--
GPIO1, GPIO2, GPIO3,
GPIO4, HS_DET
General purpose output
Output to set the high or the low digital level
--
GPIO1, GPIO2, GPIO3,
GPIO4, HS_DET
Pad disabled
Tri-state with an internal active pull-down enabled
GPIO1
GPIO1, GPIO2, GPIO3,
GPIO4, HS_DET
Table 5: GPIO custom functions configuration
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LEON-G1 series - Data Sheet
3 Pin definition
3.1 Pin assignment
1
GND
VCC
50
2
V_BCKP
GND
49
3
GND
GND
48
4
Reserved
ANT 47
5
ADC1
GND
46
6
GND
GND
45
7
GND
MIC_BIAS1
44
8
GND
MIC_GND1
43
9
DSR
MIC_GND2
42
10
RI
MIC_BIAS2
41
11
DCD
Reserved
40
12
DTR
SPK_N
39
13
RTS
SPK_P
38
14
CTS
HS_P
37
15
TXD
GND
36
16
RXD
VSIM 35
17
GND
SIM_RST 34
18
HS_DET
19
PWR_ON
20
GPIO1
SDA
31
21
GPIO2
SCL
30
22
RESET_N
I2S_RXD
29
23
GPIO3
I2S_CLK
28
24
GPIO4
I2S_TXD
27
25
GND
I2S_WA
26
LEON-G100
Top View
SIM_IO 33
SIM_CLK 32
Figure
2: LEON-G1 series modules pin assignment
No
Name
1
2
Power
domain
I/O
Description
Remarks
GND
N/A
Ground
All GND pads must be connected to ground.
V_BCKP
I/O
Real Time Clock supply
V_BCKP = 2.0 V (typical) generated by the module to
supply the Real Time Clock when VCC supply voltage is
within valid operating range.
See section 4.2.3 for detailed electrical specs.
3
GND
N/A
Ground
All GND pads must be connected to ground.
4
Reserved
N/A
Reserved
Leave unconnected.
5
ADC1
I
ADC input
Resolution: 11 bits
Input operating voltage range: 0 V – 2.0 V
See section 4.2.12 for detailed electrical specs.
6
GND
N/A
Ground
All GND pads must be connected to ground.
7
GND
N/A
Ground
All GND pads must be connected to ground.
8
GND
N/A
Ground
All GND pads must be connected to ground.
9
DSR
O
UART data set ready
Circuit 107 (DSR) in ITU-T V.24.
Output driver class B slow.
PU/PD class A. Value at reset: T/PU.
See section 4.2.9 for detailed electrical specs.
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LEON-G1 series - Data Sheet
No
Name
Power
domain
I/O
Description
Remarks
10
RI
GDI
O
UART ring indicator
Circuit 125 (RI) in ITU-T V.24.
Output driver class D.
PU/PD class B. Value at reset: T/PD.
See section 4.2.9 for detailed electrical specs.
11
DCD
GDI
O
UART data carrier detect
Circuit 109 (DCD) in ITU-T V.24.
Output driver class B.
PU/PD class B. Value at reset: T/PD.
See section 4.2.9 for detailed electrical specs.
12
DTR
GDI
I
UART data terminal ready
Circuit 108/2 (DTR) in ITU-T V.24.
Internal active pull-up to 2.85 V enabled.
PU/PD class B. Value at reset: T/PD.
See section 4.2.9 for detailed electrical specs.
13
RTS
GDI
I
UART ready to send
Circuit 105 (RTS) in ITU-T V.24.
Internal active pull-up to 2.85 V enabled.
PU/PD class C. Value at reset: T/PU.
See section 4.2.9 for detailed electrical specs.
14
CTS
GDI
O
UART clear to send
Circuit 106 (CTS) in ITU-T V.24.
Output driver class E.
PU/PD class C. Value at reset: T.
See section 4.2.9 for detailed electrical specs.
15
TxD
GDI
I
UART transmitted data
Circuit 103 (TxD) in ITU-T V.24.
Internal active pull-up to 2.85 V enabled.
PU/PD class C. Value at reset: T.
See section 4.2.9 for detailed electrical specs.
16
RxD
GDI
O
UART received data
Circuit 104 (RxD) in ITU-T V.24.
Output driver class E.
PU/PD class C. Value at reset: T.
See section 4.2.9 for detailed electrical specs.
17
GND
N/A
Ground
All GND pads must be connected to ground.
18
HS_DET
GDI
I
GPIO
By default, the pin is configured to provide the headset
detection function.
Internal active pull-up to 2.85 V enabled when the pin is
configured for headset detection.
Output driver class E.
PU/PD class B. Value at reset: T/PD.
See section 4.2.9 for detailed electrical specs.
19
PWR_ON
POS
I
Power-on input
The PWR_ON pin has high input impedance:
don’t leave it floating in noisy environment
(an external pull-up resistor is required).
See section 4.2.6 for detailed electrical specs.
20
GPIO1
GDI
I/O
GPIO
The pin can be configured to provide the network status
indication function.
Output driver class C.
PU/PD class B. Value at reset: T/PD.
See section 4.2.9 for detailed electrical specs.
21
GPIO2
GDI
I/O
GPIO
By default, the pin is configured to provide the GNSS
Supply Enable function.
Output driver class C.
PU/PD class B. Value at reset: T/PD.
See section 4.2.9 for detailed electrical specs.
22
RESET_N
ERS
I/O
External reset signal
A series Schottky diode is integrated in the module as
protection. An internal 12.6 kΩ pull-up resistor pulls the
line to 1.88 V when the module is not in the reset state.
An internal open drain FET pulls the line low when an
internal reset occurs and when the module is in power
down mode.
See section 4.2.7 for detailed electrical specs.
For more details regarding module reset, see [6].
23
GPIO3
GDI
I/O
GPIO
By default, the pin is configured to provide the GNSS data
ready function.
Output driver class F.
PU/PD class B. Value at reset: T.
See section 4.2.9 for detailed electrical specs.
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LEON-G1 series - Data Sheet
No
Name
Power
domain
I/O
Description
Remarks
24
GPIO4
GDI
I/O
GPIO
By default, the pin is configured to provide the GNSS RTC
sharing function.
Output driver class F.
PU/PD class B. Value at reset: T/PD.
See section 4.2.9 for detailed electrical specs.
25
GND
N/A
Ground
All GND pads must be connected to ground.
26
I2S_WA
GDI
O
I S word alignment
27
I2S_TXD
GDI
O
I S transmit data
28
I2S_CLK
GDI
O
I S clock
29
I2S_RXD
GDI
I
I S receive data
30
SCL
DDC
O
I C bus clock line
31
SDA
DDC
I/O
32
SIM_CLK
SIM
33
SIM_IO
34
SIM_RST
35
VSIM
36
GND
37
HS_P
AUDIO
38
SPK_P
39
SPK_N
40
Reserved
41
MIC_BIAS2
AUDIO
42
MIC_GND2
43
2
Output driver class D.
PU/PD class B. Value at reset: T.
See section 4.2.9 for detailed electrical specs.
2
Output driver class D.
PU/PD class B. Value at reset: T.
See section 4.2.9 for detailed electrical specs.
2
Output driver class D.
PU/PD class B. Value at reset: T.
See section 4.2.9 for detailed electrical specs.
2
Internal active pull-up to 2.85 V enabled.
PU/PD class B. Value at reset: T.
See section 4.2.9 for detailed electrical specs.
2
Fixed open drain. No internal pull-up.
Value at reset: T/OD.
See section 4.2.10 for detailed electrical specs.
I C bus data line
2
Fixed open drain. No internal pull-up.
Value at reset: T/OD.
See section 4.2.10 for detailed electrical specs.
O
SIM clock
Output driver class E.
Value at reset: L.
See section 4.2.8 for detailed electrical specs.
SIM
I/O
SIM data
Internal 4.7k pull-up to VSIM.
Output driver class E.
Value at reset: OD/L.
See section 4.2.8 for detailed electrical specs.
SIM
O
SIM reset
Output driver class E.
Value at reset: L.
See section 4.2.8 for detailed electrical specs.
O
SIM supply output
VSIM = 1.80 V typical if SIM card = 1.8V type
or VSIM = 2.85 V typical if SIM card = 3.0V type
See section 4.2.3 for detailed electrical specs.
N/A
Ground
All GND pads must be connected to ground.
O
First speaker output with low
power single-ended analog audio
This audio output is used when audio downlink path is
“Normal earpiece“ or “Mono headset“
See section 4.2.11 for detailed electrical specs.
AUDIO
O
Second speaker output with high
power differential analog audio
This audio output is used when audio downlink path is
“Loudspeaker“
See section 4.2.11 for detailed electrical specs.
AUDIO
O
Second speaker output with
power differential analog audio
output
This audio output is used when audio downlink path is
“Loudspeaker“
See section 4.2.11 for detailed electrical specs.
N/A
Reserved
Leave unconnected.
I
Second microphone analog
signal input and bias output
This audio input is used when audio uplink path is set as
“Headset Microphone“
See section 4.2.11 for detailed electrical specs.
AUDIO
I
Second microphone analog
reference
Local ground of the second microphone
See section 4.2.11 for detailed electrical specs.
MIC_GND1
AUDIO
I
First microphone analog
reference
Local ground of the first microphone
See section 4.2.11 for detailed electrical specs.
44
MIC_BIAS1
AUDIO
I
First microphone analog signal
input and bias output
This audio input is used when audio uplink path is set as
“Handset Microphone“
See section 4.2.11 for detailed electrical specs.
45
GND
N/A
Ground
All GND pads must be connected to ground.
46
GND
N/A
Ground
All GND pads must be connected to ground.
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LEON-G1 series - Data Sheet
No
Name
47
Power
domain
I/O
Description
Remarks
ANT
I/O
RF antenna
50 Ω nominal impedance
See section 4.2.5 for detailed electrical specs.
48
GND
N/A
Ground
All GND pads must be connected to ground.
49
GND
N/A
Ground
All GND pads must be connected to ground.
50
VCC
I
Module supply input
See section 4.2.3 for detailed electrical specs.
Table 6: Pinout
Pins designated Reserved should not be used. For more information about the pinout see the LEON-G1
series System Integration Manual [6].
Explanation of abbreviations and terms used is reported in Appendix A.
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LEON-G1 series - Data Sheet
4 Electrical specifications
Stressing the device above one or more of the ratings listed in the Absolute maximum rating
section may cause permanent damage. These are stress ratings only. Operating the module at
these or at any conditions other than those specified in Operating conditions (section 4.2)
should be avoided. Exposure to Absolute Maximum Rating conditions for extended periods may
affect device reliability.
Operating condition ranges define those limits within which the functionality of the device is guaranteed.
Where application information is given, it is advisory only and does not form part of the specification.
4.1 Absolute maximum rating
Limiting values given below are in accordance with the Absolute Maximum Rating System (IEC 134).
Symbol
Description
Condition
Min.
Max.
Unit
VCC
Module supply voltage
Input DC voltage at VCC pin
-0.30
5.5
V
ICC
Module supply current
Input DC current at VCC pin
2.5
A
V_BCKP
RTC supply voltage
Input DC voltage at V_BCKP pin
-0.15
2.50
V
GDI
Generic digital interfaces
Input DC voltage at Generic digital interfaces pins
-0.30
3.60
V
DDC
DDC interface
Input DC voltage at DDC interface pins
-0.30
3.60
V
SIM
SIM interface
Input DC voltage at SIM interface pin
-0.30
3.60
V
ERS
External reset signal
Input DC voltage at External reset signal pin
-0.15
5.50
V
POS
Power-on input
Input DC voltage at Power-on signal pin
-0.15
5.50
V
AUDIO
Audio input pins
Input DC voltage at Audio pins
-0.15
3.00
V
ADC
ADC pins
Input DC voltage at ADC pin
-0.15
3.00
V
V_ANT
Antenna voltage
Input DC voltage at ANT pin
-0.15
3.00
V
P_ANT
Antenna power
Input RF power at ANT pin
-8
dBm
Rho_ANT
Antenna ruggedness
Output RF load mismatch ruggedness at ANT pin
20:1
VSWR
Tstg
Storage temperature
+85
°C
-40
Table 7: Absolute maximum ratings
The product is not protected against overvoltage or reversed voltages. If necessary, voltage
spikes exceeding the power supply voltage specification, given in table above, must be limited
to values within the specified boundaries by using appropriate protection devices.
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LEON-G1 series - Data Sheet
4.1.1 Maximum ESD
Parameter
Min.
Typ.
Max.
Unit
Remarks
ESD sensitivity for all pins except ANT pin
1000
V
Human Body Model according to JESD22-A114F
ESD sensitivity for ANT pin
1000
V
Human Body Model according to JESD22-A114F
ESD immunity for ANT pin
4000
V
Contact Discharge according to IEC 61000-4-2
8000
V
Air Discharge according to IEC 61000-4-2
Table 8: Maximum ESD ratings
GSM modules are Electrostatic Sensitive Devices (ESD) and require special precautions when
handling. See section 7.4 for ESD handling instructions.
4.2 Operating conditions
Unless otherwise specified, all operating condition specifications are at an ambient temperature of 25°C.
Operation beyond the operating conditions is not recommended and extended exposure
beyond them may affect device reliability.
4.2.1 Operating temperature range
Symbol
Parameter
Min.
Typ.
Max.
Units
Topr
Operating temperature range
-40
+25
Remarks
+85
°C
-30
+85
°C
Normal operating range
see section 4.2.1.1
-40
-30
°C
Extended operating range
see section 4.2.1.2
Table 9: Environmental conditions
4.2.1.1 Normal operating temperature range
LEON-G1 series modules are fully functional and meet 3GPP specification across the specified temperature
range.
4.2.1.2 Extended operating temperature range
LEON-G1 series modules are fully functional across the specified temperature range. Occasional deviations from
the 3GPP specification may occur.
4.2.2 Module thermal resistance
Symbol
Parameter
Rth, C-A
Case-to-Ambient thermal
resistance
Min.
Typ.
14
Max.
Units
Remarks
°C/W
Module mounted on a 130
mm x 110 mm x 1.6 mm FR4
PCB with a high coverage of
copper in still air conditions
Table 10: Case-to-Ambient thermal resistance
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LEON-G1 series - Data Sheet
4.2.3 Supply/power pins
Symbol
Parameter
VCC
Module supply normal operating voltage
6
Module supply extended operating voltage
ICC_PEAK
8
7
Min.
Typ.
Max.
Unit
3.35
3.8
4.50
V
4.50
V
2.00
A
2.50
A
2.25
V
3.00
1.80
Module Supply Peak Current: peak of module current
consumption through the VCC pad during a GSM transmit
burst, with a matched antenna
Module Supply Peak Current: peak of module current
consumption through the VCC pad during a GSM transmit
burst, with a mismatched antenna
V_BCKP
Real Time Clock Supply input voltage
I_BCKP
Real Time Clock Supply average current consumption,
at V_BCKP = 2.0 V
1.00
2.00
2.00
µA
Table 11: Input characteristics of Supply/Power pins
Symbol
Parameter
Min.
Typ.
Max.
Unit
VSIM
SIM Supply
1.75
1.80
1.85
V
2.76
2.85
2.94
V
1.86
2.00
2.14
V
3
mA
V_BCKP
Real Time Clock Supply output voltage
I_BCKP
Real Time Clock Supply output current capability
Table 12: Output characteristics of Supply/Power pins
6
Input voltage at VCC must be above the normal operating range minimum limit to switch-on module. Complete functionality of the
module is only guaranteed within the specified range.
7
Ensure that input voltage at VCC never drops below the extended operating range minimum limit during module operation. Module
switches off when the VCC voltage value drops below the extended operating range minimum limit.
8
Use this figure to dimension maximum current capability of power supply.
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LEON-G1 series - Data Sheet
4.2.4 Power consumption
Status
Current Consumption
Power Off Mode
9
< 90 μA
GSM/GPRS Power Saving (Idle) Mode @ DRX = 5
10
GSM/GPRS Power Saving (Idle) Mode @ DRX = 9
11
< 1.60 mA
< 0.99 mA
GSM Talk (Connected) Mode @ 850 / 900 MHz (P = 32.2 dBm typ.)
12
< 300 mA
GSM Talk (Connected) Mode @ 1800 / 1900 MHz (P = 29.2 dBm typ.)
12
< 250 mA
GPRS 2 Tx + 3 Rx slots TBF (Connected) Mode @ 850 MHz (P = 30.5 dBm typ.)
12
< 410 mA
GPRS 2 Tx + 3 Rx slots TBF (Connected) Mode @ 900 MHz (P = 30.5 dBm typ.)
12
< 350 mA
GPRS 2 Tx + 3 Rx slots TBF (Connected) Mode @ 1800 MHz (P = 27.5 dBm typ.)
12
< 330 mA
GPRS 2 Tx + 3 Rx slots TBF (Connected) Mode @ 1900 MHz (P = 27.5 dBm typ.)
12
< 340 mA
Table 13: Power consumption
4.2.5 RF performance
Parameter
Min.
Max.
Unit
Remarks
Frequency range
GSM 850
Uplink
824
849
MHz
Module transmit
Downlink
869
894
MHz
Module receive
Frequency range
E-GSM 900
Uplink
880
915
MHz
Module transmit
Downlink
925
960
MHz
Module receive
Frequency range
DCS 1800
Uplink
1710
1785
MHz
Module transmit
Downlink
1805
1880
MHz
Module receive
Frequency range
PCS 1900
Uplink
1850
1910
MHz
Module transmit
Downlink
1930
1990
MHz
Module receive
Typ.
Max.
Table 14: Operating RF frequency bands
Parameter
Min.
Unit
Remarks
Receiver input sensitivity
GSM 850 / E-GSM 900
-110
dBm
Downlink RF level @ BER Class II < 2.4 %
Condition: 50 Ω source
Receiver input sensitivity
DCS 1800 / PCS 1900
-109
dBm
Downlink RF level @ BER Class II < 2.4 %
Condition: 50 Ω source
Table 15: Receiver sensitivity performance
Parameter
Maximum output power
GSM 850 / E-GSM 900
Maximum output power
DCS 1800 / PCS 1900
Min.
Typ.
Unit
Remarks
32.2
Max.
dBm
Uplink burst RF power for GSM or GPRS 1-slot TCH
at maximum output power control level (PCL 5 or Gamma 3)
30.5
dBm
Uplink burst RF power for GPRS 2-slot TCH
at maximum output power control level (Gamma 3)
29.2
dBm
Uplink burst RF power for GSM or GPRS 1-slot TCH
at maximum output power control level (PCL 0 or Gamma 3)
27.5
dBm
Uplink burst RF power for GPRS 2-slot TCH
at maximum output power control level (Gamma 3)
Condition: 50 Ω output load
Table 16: Transmitter maximum output power
9
Maximum values for module average current consumption through the VCC pad in the listed status/conditions, at 25°C, with VCC = 3.8 V,
with a matched antenna.
10
Module is registered in the network, with a paging period of 1177 ms (GSM network DRX setting of 5) with 16 neighbour cells.
11
Module is registered in the network, with a paging period of 2118 ms (GSM network DRX setting of 9) with none neighbour cell.
12
Module transmits at the maximum power level.
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LEON-G1 series - Data Sheet
4.2.6 PWR_ON pin
Pin Name
Parameter
Min.
Typ.
Max.
Unit
Remarks
PWR_ON
Internal supply for PowerOn Input Signal
1.86
2.00
2.14
V
Real Time Clock supply (V_BCKP)
L-level input
-0.10
0.00
0.86
V
High input impedance (no internal pull-up)
H-level input
1.60
2.00
4.50
V
High input impedance (no internal pull-up)
L-level input current
PWR_ON low time
to switch-on the module
-6
µA
5
ms
Table 17: PWR_ON pin characteristics
4.2.7 RESET_N pin
Pin Name
Parameter
Min.
Typ.
Max.
Unit
Remarks
RESET_N
Internal supply for External
Reset Signal
1.86
2.00
2.14
V
Real Time Clock supply (V_BCKP)
L-level input
-0.10
0.00
0.15
V
A series Schottky diode is integrated in
the module as protection: the module
senses a low level when the RESET_N pin
is forced low.
H-level input
1.60
2.00
4.50
V
A series Schottky diode is integrated in
the module as protection: the module
senses a low level when the RESET_N pin
is forced low.
L-level output
0.00
V
The module has an internal open drain
FET which pulls the RESET_N line low
when an internal reset occurs and when
the module is in power down mode.
H-level output
1.88
V
The module has an internal pull-up
resistor (12.6 kΩ typical) which pulls the
level to 1.88 V (typical) when the module
is not in the reset state.
-150
µA
L-level input current
RESET_N low time
to perform a proper reset
50
ms
Table 18: RESET_N pin characteristics
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LEON-G1 series - Data Sheet
4.2.8 SIM pins
Parameter
Min.
Typ.
Max.
Unit
Remarks
0.00
0.36
V
VSIM = 1.80 V
0.00
0.57
V
VSIM = 2.85 V
1.26
1.80
3.30
V
VSIM = 1.80 V
2.00
2.85
3.30
V
VSIM = 2.85 V
0.00
0.20
V
VSIM = 1.80 V, Max value at IOL = +1.0 mA
0.00
0.35
V
VSIM = 1.80 V, Max value at IOL = +1.5 mA
0.00
0.20
V
VSIM = 2.85 V, Max value at IOL = +1.0 mA
0.00
0.35
V
VSIM = 2.85 V, Max value at IOL = +1.5 mA
Low-level input
High-level input
Low-level output
High-level output
1.60
1.80
V
VSIM = 1.80 V, Min value at IOH = -1.0 mA
1.45
1.80
V
VSIM = 1.80 V, Min value at IOH = -1.5 mA
2.65
2.85
V
VSIM = 2.85 V, Min value at IOH = -1.0 mA
2.50
2.85
V
VSIM = 2.85 V, Min value at IOH = -1.5 mA
µA
0.2 V < VIN < 3.3 V
Input/Output leakage current
0.7
Internal pull-up resistor on
SIM_IO to VSIM
4.7
Clock frequency on SIM_CLK
3.25
kΩ
Pad resistance: Rising edge
130
MHz
Ω
1.0-1.5 mA load
Pad resistance: Falling edge
120
Ω
1.0-1.5 mA load
Table 19: SIM pins characteristics
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Production Information
Electrical specifications
Page 24 of 42
LEON-G1 series - Data Sheet
4.2.9 Generic Digital Interfaces pins
Parameter
Min.
Typ.
Max.
Unit
Internal supply for GDI domain
2.76
2.85
2.94
V
Input characteristic:
L-level input
-0.20
0.00
0.57
V
Input characteristic:
H-level input
2.00
2.85
3.30
V
0.00
0.40
V
Max value at IOL = +10.0 mA for Driver Class B slow
0.00
0.80
V
Max value at IOL = +15.0 mA for Driver Class B slow
0.00
0.20
V
Max value at IOL = +2.5 mA for Driver Class B
0.00
0.35
V
Max value at IOL = +5.0 mA for Driver Class B
0.00
0.20
V
Max value at IOL = +2.0 mA for Driver Class C
0.00
0.35
V
Max value at IOL = +4.0 mA for Driver Class C
0.00
0.20
V
Max value at IOL = +1.0 mA for Driver Class D
0.00
0.35
V
Max value at IOL = +2.0 mA for Driver Class D
0.00
0.20
V
Max value at IOL = +1.0 mA for Driver Class E and F
0.00
0.35
V
Max value at IOL = +1.5 mA for Driver Class E and F
Output characteristics:
L-level output
Output characteristics:
H-level output
Remarks
2.65
2.85
V
Min value at IOH = -10.0 mA for Driver Class B slow
2.50
2.85
V
Min value at IOH = -15.0 mA for Driver Class B slow
2.65
2.85
V
Min value at IOH = -2.5 mA for Driver Class B
2.50
2.85
V
Min value at IOH = -5.0 mA for Driver Class B
2.65
2.85
V
Min value at IOH = -2.0 mA for Driver Class C
2.50
2.85
V
Min value at IOH = -4.0 mA for Driver Class C
2.65
2.85
V
Min value at IOH = -1.0 mA for Driver Class D
2.50
2.85
V
Min value at IOH = -2.0 mA for Driver Class D
2.65
2.85
V
Min value at IOH = -1.0 mA for Driver Class E and F
2.50
2.85
V
Min value at IOH = -1.5 mA for Driver Class E and F
0.2 V < VIN < 3.3 V
Input/Output leakage current
0.7
Pad resistance: Rising edge
50
µA
Ω
70
Ω
2.5-5.0 mA load for Driver Class B
70
Ω
2.0-4.0 mA load for Driver Class C
115
Ω
1.0-2.0 mA load for Driver Class D
130
Ω
1.0-1.5 mA load for Driver Class E
180
Ω
1.0-1.5 mA load for Driver Class F
50
Ω
2.5-5.0 mA load for Driver Class B slow
70
Ω
2.5-5.0 mA load for Driver Class B
70
Ω
2.0-4.0 mA load for Driver Class C
115
Ω
1.0-2.0 mA load for Driver Class D
120
Ω
1.0-1.5 mA load for Driver Class E
180
Ω
1.0-1.5 mA load for Driver Class F
-450
μA
PU/PD Class A
-100
μA
PU/PD Class B
-30
μA
PU/PD Class C
450
μA
PU/PD Class A
100
μA
PU/PD Class B
30
μA
PU/PD Class C
Pad resistance: Falling edge
Pull-up input current
Pull-down input current
2.5-5.0 mA load for Driver Class B slow
Table 20: GDI pins characteristics
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Page 25 of 42
LEON-G1 series - Data Sheet
T1
T2
T3
I2S_CLK
T4
T5
I2S_TX / I2S_WA
T6
T7
I2S_RX
Figure 3: AC characteristics of digital audio interface in normal I2S mode ( = 2,4,6,8,10,12)
T1
T2
T3
I2S_CLK
T4
T5
I2S_TX / I2S_WA
T6
T7
I2S_RX
Figure 4: AC characteristics of digital audio interface in normal I2S mode ( = 3,5,7,9,11,13)
Parameter
Description
T1
I2S_CLK period
1/T1
T2
T3
Min.
I2S_CLK frequency
I2S_CLK high time
I2S_CLK low time
I2S_WA period
I2S_WA frequency
Typ.
Unit
Remarks
3.906
Max.
µs
= 2,4,6,8,10,12
3.906
µs
= 3,5,7,9,11,13
256
kHz
= 2,4,6,8,10,12
256
kHz
= 3,5,7,9,11,13
1.953
µs
= 2,4,6,8,10,12
1.953
µs
= 3,5,7,9,11,13
1.953
µs
= 2,4,6,8,10,12
1.953
µs
= 3,5,7,9,11,13
125.0
µs
= 2,4,6,8,10,12
125.0
µs
= 3,5,7,9,11,13
8
kHz
= 2,4,6,8,10,12
8
T4
T5
T6
T7
kHz
= 3,5,7,9,11,13
I2S_TX invalid before I2S_CLK low end
24
ns
= 2,4,6,8,10,12
I2S_TX invalid before I2S_CLK high end
24
ns
= 3,5,7,9,11,13
I2S_TX valid after I2S_CLK high begin
24
ns
= 2,4,6,8,10,12
I2S_TX valid after I2S_CLK low begin
24
ns
= 3,5,7,9,11,13
I2S_RX setup time before I2S_CLK high end
27
ns
= 2,4,6,8,10,12
I2S_RX setup time before I2S_CLK low end
27
ns
= 3,5,7,9,11,13
I2S_RX hold time after I2S_CLK low begin
0
ns
= 2,4,6,8,10,12
I2S_RX hold time after I2S_CLK high begin
0
ns
= 3,5,7,9,11,13
Table 21: AC characteristics of digital audio interface in normal I2S mode ( = 2,3,4,5,6,7,8,9,10,11,12,13)
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LEON-G1 series - Data Sheet
I2S_WA
T4
T1
T5
I2S_CLK
T2
I2S_TX
T3
T6
LSB
T7
M SB
T8
I2S_RX
LSB
T9
M SB
Figure 5: AC characteristics of digital audio interface in PCM mode ( = 0)
I2S_WA
T4
T5
T1
I2S_CLK
T6
I2S_TX
LSB
T7
T2
M SB
T8
I2S_RX
T3
LSB
T9
M SB
Figure 6: AC characteristics of digital audio interface in PCM mode ( = 1)
Parameter
Description
T1
I2S_CLK period
1/T1
Min.
I2S_CLK frequency
T2
I2S_CLK low time
T3
I2S_CLK high time
I2S_WA period
I2S_WA frequency
T4
T5
T6
T7
T8
T9
I2S_CLK high begin to I2S_WA high begin
I2S_CLK low end to I2S_WA high end
Typ.
Unit
Remarks
6.944
µs
= 0
7.353
µs
= 1
144
kHz
= 0
136
kHz
= 1
3.472
µs
= 0
3.676
µs
= 1
3.472
µs
= 0
3.676
µs
= 1
125.0
µs
= 0
125.0
µs
= 1
8
kHz
= 0
8
kHz
= 1
0
48
ns
= 0
0
48
ns
= 1
0
48
ns
= 0
0
48
ns
= 1
24
ns
= 0
24
ns
= 1
24
ns
= 0
24
ns
= 1
27
ns
= 0
27
ns
= 1
0
ns
= 0
0
ns
= 1
I2S_TX invalid before I2S_CLK low end
I2S_TX valid after I2S_CLK high begin
I2S_RX setup time before I2S_CLK high end
I2S_RX hold time after I2S_CLK low begin
Max.
Table 22: AC characteristics of digital audio interface in PCM mode ( = 0,1)
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Page 27 of 42
LEON-G1 series - Data Sheet
4.2.10 DDC (I2C) pins
Parameter
Min.
Typ.
Max.
Unit
Internal supply for DDC domain
2.76
2.85
2.94
V
L-level input
-0.30
0.00
0.86
V
In accordance with I C bus specification
H-level input
2.00
2.85
3.30
V
In accordance with I C bus specification
Hysteresis
0.14
V
In accordance with I C bus specification
0.40
V
Max value at IOL = +3.0 mA
0.7
µA
0.2 V < VIN < 3.3 V
L-level output
0.00
Input/Output leakage current
Clock frequency on SCL
100
Remarks
2
2
2
kHz
Table 23: DDC pins characteristics
4.2.11 Audio pins
Pin Name
Parameter
MIC_BIAS1/2
Microphone supply open
circuit voltage output
Min.
Typ.
MIC_GND1/2
Unit
Remarks
V
Open circuit single-ended voltage.
Provided by MIC_BIAS1 with MIC_GND1
as reference, or provided by MIC_BIAS2
with MIC_GND2 as reference.
2.0
mA
Provided by MIC_BIAS1 with MIC_GND1
as reference, or provided by MIC_BIAS2
with MIC_GND2 as reference.
3.15
kΩ
Series resistance of the microphone
voltage supply MIC_BIAS1 or MIC_BIAS2
V
MIC_GND1 and MIC_GND2 pins are
internally connected to GND
Max.
Unit
Remarks
1.03
Vpp
Full scale single-ended voltage.
Signal applied to MIC_BIAS1 with
MIC_GND1 as reference, or applied to
MIC_BIAS2 with MIC_GND2 as reference.
At 1 kHz.
Impedance between MIC_BIAS1 and
MIC_GND1 pins, or between MIC_BIAS2
and MIC_GND2 pins.
2.20
Microphone supply current
Microphone supply output
resistance
Max.
2.85
Microphone ground
3.00
0
Table 24: Microphone supply characteristics
Pin Name
Parameter
MIC_BIAS1/2
Input level range
Min.
Typ.
Input impedance
1.5
kΩ
Internal discrete high-pass
-3dB cutoff frequency
70
Hz
If not specified otherwise, all parameters are measured with a bandwidth of 20 Hz,...,20 kHz.
Table 25: Microphone dynamic characteristics
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Page 28 of 42
LEON-G1 series - Data Sheet
13
Pin Name
Parameter
Min.
Typ.
Max.
Unit
Remarks
HS_P
Maximum single-ended
output voltage
1.65
1.85
2.05
Vpp
Full scale single-ended open circuit
voltage.
Common mode output
voltage
1.25
Internal output resistance
1.7
Output load resistance
16
V
4
Ω
10
Single-ended output load
capacitance
Ω
nF
Signal to noise
70
80
dB
Load = 16 Ω, Gain stage = +0 dB,
Input signal = 0 dBFS, Code 0,
A-weighted
Signal to distortion (THD)
60
70
dB
Load = 16 Ω, Gain stage = +0 dB,
Input signal = 0 dBFS
60
70
dB
Load = 16 Ω, Gain stage = +0 dB,
Input signal = -1 dBFS
dB
Load = 16 Ω, Gain stage = +0 dB,
Input signal = -6 dBFS
dB
Gain stage = +0 dB,
UVDD(t) = 2.5 V+0.15 V•sin(2π•1 kHz•t)
dB
f < 0.45 fs
dB
f > 0.55 fs
%
Variation due to change in supply,
temperature and life time.
60
Power supply rejection
60
66
Passband ripple
Stopband attenuation
0.5
50
Absolute gain drift
±2
If not specified otherwise, all parameters are measured with a bandwidth of 20 Hz,...,20 kHz.
Table 26: Low power single-ended audio receive path (HS_P) output characteristics
Pin Name
Parameter
SPK_P/SPK_N
Maximum differential
output voltage
Min.
Typ.
Max.
13
Unit
Remarks
6.4
Vpp
Overdrive
Gain stage = +9 dB
Common mode output
voltage
1.6
V
Output load resistance
8
Ω
Single-ended output load
capacitance
10
nF
Inductive load
400
μH
Between output pins and GND with series
resistance
dB
Load = 16 Ω, Gain stage = +0 dB,
Input signal = 0 dBFS, Code 0, Aweighted
Signal to noise
70
80
Signal to distortion (THD)
50
dB
Load = 8 Ω, 350 mW
Power supply rejection
60
dB
1 kHz
If not specified otherwise, all parameters are measured with a bandwidth of 20 Hz,...,20 kHz.
Table 27: High power differential audio receive path (SPK_P, SPK_N) output characteristics
13
If not specified otherwise, all parameters are measured with a bandwidth of 20 Hz,...,20 kHz and gain setting gs = 0 dB.
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Page 29 of 42
LEON-G1 series - Data Sheet
4.2.12 ADC pin
Pin Name
Parameter
ADC1
Resolution
Min.
Typ.
Max.
11
Unit
Remarks
Bits
Differential linearity error
±0.5
LSB
Integral linearity error
±4
LSB
Offset error
±10
LSB
ADC input = 0 V
Absolute gain drift
±2
%
Variation due to change in supply,
temperature and life time.
2.00
V
4
Hz
Input voltage span
0
Throughput rate
0.2
Input resistance
1.1
Input resistance in
measurement mode
387
580
Internal voltage
0.46
0.48
Input leakage current
2
MΩ
With respect to GND. If mode OFF is
selected.
773
kΩ
With respect to GND. Variation due to
process tolerances and change in supply,
temperature, and life time.
0.50
V
With respect to GND. Variation due to
process tolerances and change in supply,
temperature, and life time.
0.1
μA
Table 28: ADC pin characteristics
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Page 30 of 42
LEON-G1 series - Data Sheet
5 Mechanical specifications
B
X
D
E
D
N
H
C
M
A
K
X
Figure 7: Dimensions (LEON bottom and sides views)
Parameter
Description
Min.
Typ.
Max.
A
Height (mm)
29.4
[1157.5 mil]
29.5
[1161.4 mil]
30.1
[1185.0 mil]
B
Width (mm)
18.8
[740.2 mil]
18.9
[744.1 mil]
19.0
[748.0 mil]
C
Total Thickness (mm)
2.8
[110.2 mil]
3.0
[118.1 mil]
3.3
[129.9 mil]
D
Edge to Pin Pitch (mm)
1.4
[55.1 mil]
1.55
[61.0 mil]
1.8
[70.9 mil]
E
Pin to Pin Pitch (mm)
1.0
[39.4 mil]
1.1
[43.3 mil]
1.2
[47.2 mil]
H
PCB Thickness (mm)
0.8
[31.5 mil]
0.9
[35.4 mil]
1.0
[39.4 mil]
N
Half-moon Diameter (mm)
0.4
[15.7 mil]
0.5
[19.7 mil]
0.6
[23.6 mil]
M
Pin Height (mm)
0.9
[35.4 mil]
1.0
[39.4 mil]
1.1
[43.3 mil]
K
Pin Width (mm)
0.7
[27.6 mil]
0.8
[31.5 mil]
0.9
[35.4 mil]
Weight
(g)
90% rH
6 cycles of 24 hrs
Vibration in function
IEC60068-2-6
5-500 Hz; 5g
2.5 hrs/axis at –40°C
2.5 hrs/axis at +85°C
3 hrs/axis at RT
Total: 24 hrs, function supervision
Mechanical Shock
IEC60068-2-27 Ea
30 g / 11 ms (halfsine), 3 Shocks/axis, no function
Robustness of terminations of
Surface Mounted Devices
IEC60068-2-21 Ue1
1 mm/s +/- 0.5 mm/s
D>2 mm
1 Bending cycle
Duration on Dmax: 20s +/- 1 s
Table 30: Qualification tests
6.2 Approvals
Products marked with this lead-free symbol on the product label comply with the
“Directive 2002/95/EC of the European Parliament and the Council on the Restriction of
Use of certain Hazardous Substances in Electrical and Electronic Equipment“ RoHS).
LEON-G1 series GSM/GPRS modules are RoHS compliant.
No natural rubbers, hygroscopic materials, or materials containing asbestos are employed.
Table 31 provides the LEON-G1 series modules’ main approvals.
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Production Information
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Page 32 of 42
LEON-G1 series - Data Sheet
Country
Scope
LEON-G100-06S
LEON-G100-07S
LEON-G100-08S
EU
R&TTE
YES
YES
YES
EU
CE (NB ID: 1909)
YES
YES
YES
US
FCC
FCC ID: XPYLEONG100N
FCC ID: XPYLEONG100N
FCC ID: XPYLEONG100N
US
PTCRB
YES
YES
YES
Independent
GCF – CC plus field trials
NO
YES
YES
Canada
Industry Canada (IC)
IC: 8595A-LEONG100N
MODEL: LEONG100N
IC: 8595A-LEONG100N
MODEL: LEONG100N
IC: 8595A-LEONG100N
MODEL: LEONG100N
Table 31: LEON-G100 certification approvals
For the complete list of countries and network operators approvals, see our website www.u-blox.com.
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Production Information
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Page 33 of 42
LEON-G1 series - Data Sheet
7 Product handling
7.1 Packaging
LEON-G1 series modules are delivered as hermetically sealed, reeled tapes to enable efficient production,
production lot set-up and tear-down. For more information about packaging, see the u-blox Package
Information Guide [10].
Figure 8: Reeled LEON-G1 series modules
7.1.1 Reels
LEON-G1 series modules are deliverable in quantities of 250 pieces on a reel. LEON-G1 series modules are
delivered using reel Type B as described in the u-blox Package Information Guide [10].
Parameter
Specification
Reel Type
B
Delivery Quantity
250
Table 32: Reel information for LEON-G1 series modules
Quantities of less than 250 pieces are also available. Contact u-blox for more information.
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Production Information
Product handling
Page 34 of 42
LEON-G1 series - Data Sheet
7.1.2 Tapes
Figure 9 shows the position and orientation of LEON-G1 series modules as they are delivered on tape. Figure 10
specifies the tape dimensions.
Pin 1
Sprocket hole
Feed direction
Figure 9: Orientation for LEON-G1 series modules on tape
Figure 10: Dimensions for LEON-G1 series modules on tape
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Production Information
Product handling
Page 35 of 42
LEON-G1 series - Data Sheet
Parameter
Value
A0
19.7
B0
30.3
K0
3.2
Table 33: LEON-G1 series tape dimensions (mm)
Note 1: 10 sprocket hole pitch cumulative tolerance ± 0.2.
Note 2: the camber is compliant with EIA 481.
Note 3: the pocket position relative to sprocket hole is measured as true position of pocket, not pocket
hole.
Note 4: A0 and B0 are calculated on a plane at a distance “R” above the bottom of the pocket.
7.2 Moisture sensitivity levels
LEON-G1 series modules are Moisture Sensitive Devices (MSD) in accordance to the IPC/JEDEC
specification.
The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required. LEON-G1 series
modules are rated at MSL level 4. For more information regarding moisture sensitivity levels, labeling, storage
and drying see the u-blox Package Information Guide [10].
For MSL standard see IPC/JEDEC J-STD-020 (can be downloaded from www.jedec.org).
7.3 Reflow soldering
Reflow profiles are to be selected according to u-blox recommendations (see LEON-G1 series System Integration
Manual [6]).
Failure to observe these precautions can result in severe damage to the device!
7.4 ESD precautions
LEON-G1 series modules contain highly sensitive electronic circuitry and are Electrostatic
Sensitive Devices (ESD). Handling LEON-G1 series modules without proper ESD protection may
destroy or damage them permanently.
LEON-G1 series modules are Electrostatic Sensitive Devices (ESD) and require special ESD precautions typically
applied to ESD sensitive components.
Table 8 reports the maximum ESD ratings of the LEON-G1 series modules.
Proper ESD handling and packaging procedures must be applied throughout the processing, handling and
operation of any application that incorporates LEON-G1 series modules.
ESD precautions should be implemented on the application board where the module is mounted, as described in
the LEON-G1 series System Integration Manual [6].
Failure to observe these precautions can result in severe damage to the device!
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Page 36 of 42
LEON-G1 series - Data Sheet
8 Default settings
Interface
Settings
Comments
UART interface
AT interface: enabled
AT command interface is by default enabled on the UART physical interface
AT+IPR=0
Automatic baud rate detection enabled by default
AT+ICF=0
Automatic frame format recognition enabled by default
AT&K3
HW flow control enabled
AT&S1
DSR line sets to ON in connected mode (GPRS data transfer only) and to OFF in command
mode
AT&D1
Upon an ON-to-OFF transition of DTR, the DCE enters online command state and issues
an OK result code
AT&C1
Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is
detected, OFF otherwise
MUX protocol: disabled
Multiplexing mode is by default disabled and it can be configured by AT+CMUX
command.
LEON-G1 series modules define the following virtual channels:
Channel 0: control channel
Channel 1 – 5: AT commands / data connection
Channel 6: GNSS tunneling
Power Saving
AT+UPSV=0
Disabled
Network registration
AT+COPS=0
Self network registration
Table 34: Available Protocols
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Production Information
Default settings
Page 37 of 42
LEON-G1 series - Data Sheet
9 Labeling and ordering information
9.1 Product labeling
The LEON-G1 series module labels include important product information as described in this section.
Figure 11 illustrates the label for all LEON-G1 series modules, and includes: u-blox logo, production lot, Pb-free
marking, product Type Number, module IMEI number, FCC, IC certification numbers, model, CE marking with
the Notified Body number, and production country.
®©
PP
LEON-G100 xxS-YY
8XXXXX.XXXX.000 YY/WW
IMEI: XXXXXXXXXXXXXXX
XXXX
FCC ID: XPYLEONG100N
IC: 8595A-LEONG100N
MODEL: LEONG100N
Made in Austria
Figure 11: Location of product type number on LEON-G1 series module label
For information about approvals, see the section 6.2.
9.2 Explanation of codes
Three different product code formats are used. The Product Name is used in documentation such as this data
sheet and identifies all u-blox products, independent of packaging and quality grade. The Ordering Code
includes options and quality, while the Type Number includes the hardware and firmware versions. Table 35
below details these 3 different formats:
Format
Structure
Product Name
LEON-CDVV
Ordering Code
LEON-CDVV-TTQ
Type Number
LEON-CDVV-TTQ-XX
Table 35: Product Code Formats
Table 36 explains the parts of the product code.
Code
Meaning
Example
C
Cellular standard (i.e. G: GSM; E: EDGE; W: WEDGE;
H: HSDPA; U:HSUPA, L: LTE; C: CDMA; D: EV-DO)
G: GSM
D
Generation, e.g. chip or function set; range: [0…9]
1
VV
Variant based on the same cellular chip
TT
Major Product Version
00
Q
Quality grade
S = professional / made in Austria
A = automotive / made in Austria
B = standard / made in Brazil
S
XX
HW version plus GNSS SW (not relevant for certification)
00
Table 36: Part identification code
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Labeling and ordering information
Page 38 of 42
LEON-G1 series - Data Sheet
9.3 Ordering information
Ordering No.
Product
LEON-G100-06S
Quad-band GSM/GPRS Module, 29.5 x 18.9 x 3.0 mm, 250 pcs/reel
LEON-G100-07S
Quad-band GSM/GPRS Module, 29.5 x 18.9 x 3.0 mm, 250 pcs/reel
LEON-G100-08S
Quad-band GSM/GPRS Module, 29.5 x 18.9 x 3.0 mm, 250 pcs/reel
Table 37: Product ordering codes
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Production Information
Labeling and ordering information
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LEON-G1 series - Data Sheet
Appendix
A Glossary
Name
Definition
ADC
Analog to Digital Converter
AT
AT Command Interpreter Software Subsystem, or attention
BER
Bit Error Rate
DCE
Data Communication Equipment
DDC
Display Data Channel (I C compatible) Interface
DL
Down-link (Reception)
Driver Class
Output Driver Class: see Table 20 for definition
DRX
Discontinuous Reception
DTE
Data Terminal Equipment
DTMF
Dual-Tone Multi-Frequency
ERS
External Reset Input Signal
GDI
Generic Digital Interfaces (power domain)
GND
Ground
GNSS
Global Navigation Satellite System
GPIO
General Purpose Input Output
GPRS
General Packet Radio Service
GSM
Global System for Mobile Communication
H
High logic digital level
HBM
Human Body Model
2
2
Inter-Integrated Circuit Interface
IS
2
Inter-IC Sound Interface
L
Low logic digital level
LGA
Land Grid Array
N/A
Not Applicable
OD
Open Drain
PCN / IN
Product Change Notification / Information Note
PD
Pull-Down
POS
Power-On Input Signal
PU
Pull-Up
PU/PD Class
Pull-Up / Pull-Down Class: see Table 20 for definition
RMC
Reference Measurement Channel
SIM
Subscriber Identity Module
SPI
Serial Peripheral Interface
T
Tristate (Output of the pin set to tri-state, i.e. high impedance state)
T/PD
Tristate with internal active Pull-Down enabled
T/PU
Tristate with internal active Pull-Up enabled
TBD
To Be Defined
UART
Universal Asynchronous Receiver-Transmitter serial interface
UICC
Universal Integrated Circuit Card
UL
Up-link (Transmission)
USB
Universal Serial Bus interface
IC
Table 38: Explanation of abbreviations and terms used
UBX-13004887 - R02
Production Information
Appendix
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LEON-G1 series - Data Sheet
Related documents
[1]
3GPP TS 27.007 Technical Specification Group Core Network and Terminals; AT command set for User
Equipment (UE)
3GPP TS 27.005 - Technical Specification Group Terminals; Use of Data Terminal Equipment - Data
Circuit terminating Equipment (DTE-DCE) interface for Short Message Services (SMS) and Cell
Broadcast Service (CBS)
3GPP TS 27.010 - Terminal Equipment to User Equipment (TE-UE) multiplexer protocol (Release 1999)
u-blox AT Commands Manual, Docu No UBX-13002752
ITU-T Recommendation V24, 02-2000. List of definitions for interchange circuits between Data
Terminal Equipment (DTE) and Data Connection Equipment (DCE)
LEON-G1 series System Integration Manual, Docu No UBX-13004888
GNSS Implementation Application Note, Docu No UBX-13001849
Mux Implementation Application Note Docu No UBX-13001887
3GPP TS 26.267 V10.0.0 - Technical Specification Group Services and System Aspects; eCall Data
Transfer; In-band modem solution; General description (Release 10)
u-blox Package Information Guide, Docu No UBX-14001652
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
For regular updates to u-blox documentation and to receive product change notifications, register on our
homepage.
Revision history
Revision
Date
Name
Status / Comments
R01
23-Jan-2014
lpah
Initial release
R02
18-Dec-2014
lpah
Changed status to Production Information
UBX-13004887 - R02
Production Information
Related documents
Page 41 of 42
LEON-G1 series - Data Sheet
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