MPCI-L2 series
Multi-mode LTE Cat 4 Mini PCIe modules
with HSPA+ and/or 2G fallback
Data Sheet
Abstract
Technical data sheet describing MPCI-L2 series multi-mode cellular
modules. The modules are a complete and cost efficient LTE/3G/2G
multi-mode solution offering up to 150 Mb/s download data rate and
up to 50 Mb/s upload data rate, covering up to six LTE bands, up to
five WCDMA/DC-HSPA+ bands and up to four GSM/EGPRS bands.
The modules have the industry standard PCI Express Mini Card form
factor, which enables easy integration into an application board and
is also ideal for manufacturing of small series.
www.u-blox.com
UBX-13004749 - R19
MPCI-L2 series - Data Sheet
Document Information
Title
MPCI-L2 series
Subtitle
Multi-mode LTE Cat 4 Mini PCIe modules
with HSPA+ and/or 2G fallback
Document type
Data Sheet
Document number
UBX-13004749
Revision and date
R19
03-Jan-2018
Disclosure restriction
Product Status
Corresponding content status
Functional Sample
Draft
For functional testing. Revised and supplementary data will be published later.
In Development /
Prototype
Objective Specification
Target values. Revised and supplementary data will be published later.
Engineering Sample
Advance Information
Data based on early testing. Revised and supplementary data will be published later.
Initial Production
Early Prod. Information
Data from product verification. Revised and supplementary data may be published later.
Mass Production /
End of Life
Production Information
Final product specification.
This document applies to the following products:
Name
Type number
Firmware version
Application version
PCN reference
Product Status
MPCI-L200
MPCI-L200-00S-00
MPCI-L200-00S-01
MPCI-L200-02S-00
MPCI-L200-02S-01
MPCI-L200-03S-00
MPCI-L201-01S-00
MPCI-L201-02S-00
09.71
09.71
15.90
15.90
15.90
09.93
(For AT&T) 09.93
(For VZW) 09.94
09.71
15.63
15.63
15.63
09.94
09.94
15.93
16.04
15.63
15.63
15.63
A01.15
A01.30
A01.00
A01.10
A01.50
A01.07
(For AT&T) A02.50
(For VZW) A01.02
A01.15
A01.03
A01.10
A01.50
A01.00
A01.01
A01.00
A01.00
A01.03
A01.10
A01.50
UBX-14044437
UBX-16026448
UBX-15029946
UBX-16031212
UBX-17022983
UBX-15031360
UBX-17013932
UBX-17013932
UBX-14044437
UBX-15029946
UBX-16031212
UBX-17022983
UBX-15021694
UBX-16005471
UBX-16025501
UBX-17013073
UBX-15029946
UBX-16031212
UBX-17022983
Obsolete
Obsolete
Obsolete
End of Life
Mass Production
Mass Production
Mass Production
Mass Production
Obsolete
Obsolete
End of Life
Mass Production
Obsolete
Mass Production
Initial Production
Initial Production
Obsolete
End of Life
Mass Production
MPCI-L201
MPCI-L210
MPCI-L220
MPCI-L280
MPCI-L210-00S-00
MPCI-L210-02S-00
MPCI-L210-02S-01
MPCI-L210-03S-00
MPCI-L210-60S-00
MPCI-L210-60S-01
MPCI-L220-02S-00
MPCI-L220-62S-00
MPCI-L280-02S-00
MPCI-L280-02S-01
MPCI-L280-03S-00
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in
whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or
any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose
of the information. This document may be revised by u-blox at any time. For most recent documents, please visit www.u-blox.com.
Copyright © 2018, u-blox AG.
u-blox is a registered trademark of u-blox Holding AG in the EU and other countries.
Trademark Notice
Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.
PCI, PCI Express, PCIe, and PCI-SIG are trademarks or registered trademarks of PCI-SIG. All other registered trademarks or trademarks
mentioned in this document are property of their respective owners.
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MPCI-L2 series - Data Sheet
Contents
Contents.............................................................................................................................. 3
1
Functional description.................................................................................................. 5
1.1
1.2
1.3
1.4
1.5
1.6
2
Overview .............................................................................................................................................. 5
Product features ................................................................................................................................... 5
Block diagram....................................................................................................................................... 6
Product description ............................................................................................................................... 7
AT command support ........................................................................................................................... 8
Supported features ............................................................................................................................... 9
Interfaces .................................................................................................................... 10
2.1
Module supply input ........................................................................................................................... 10
2.2
Antenna RF interfaces ......................................................................................................................... 10
2.3
System functions ................................................................................................................................ 10
2.3.1
Module power-on ....................................................................................................................... 10
2.3.2
Module power-off ....................................................................................................................... 10
2.3.3
Module reset ............................................................................................................................... 10
2.4
SIM interface ...................................................................................................................................... 11
2.5
USB interface ...................................................................................................................................... 11
2.6
W_DISABLE# ...................................................................................................................................... 12
2.7
LED_WWAN# ..................................................................................................................................... 12
3
Pin definition .............................................................................................................. 13
3.1
4
Pin assignment ................................................................................................................................... 13
Electrical specifications .............................................................................................. 15
4.1
Absolute maximum rating .................................................................................................................. 15
4.1.1
Maximum ESD ............................................................................................................................. 15
4.2
Operating conditions .......................................................................................................................... 16
4.2.1
Operating temperature range ...................................................................................................... 16
4.2.2
Supply/power pins ....................................................................................................................... 16
4.2.3
Current consumption .................................................................................................................. 17
4.2.4
LTE/3G/2G RF characteristics........................................................................................................ 17
4.2.5
USB pins ...................................................................................................................................... 18
4.2.6
SIM pins ...................................................................................................................................... 18
4.2.7
PERST# pin .................................................................................................................................. 19
4.2.8
W_DISABLE# pin ......................................................................................................................... 19
4.2.9
LED_WWAN# pin ........................................................................................................................ 19
5
Mechanical specifications .......................................................................................... 20
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MPCI-L2 series - Data Sheet
6
Qualification and approvals ...................................................................................... 21
6.1
6.2
7
Reliability tests .................................................................................................................................... 21
Approvals ........................................................................................................................................... 21
Product handling ........................................................................................................ 22
7.1
7.2
Packaging ........................................................................................................................................... 22
ESD precautions.................................................................................................................................. 22
8
Default settings .......................................................................................................... 23
9
Labeling and ordering information........................................................................... 24
9.1
9.2
9.3
Product labeling.................................................................................................................................. 24
Explanation of codes .......................................................................................................................... 25
Ordering information .......................................................................................................................... 26
Appendix .......................................................................................................................... 27
A Glossary ...................................................................................................................... 27
Related documents .......................................................................................................... 28
Revision history ................................................................................................................ 29
Contact .............................................................................................................................. 30
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Contents
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MPCI-L2 series - Data Sheet
1 Functional description
1.1
Overview
The MPCI-L2 series comprises complete and cost efficient LTE/3G/2G multi-mode cellular modules in the industry
standard PCI Express Mini Card form factor, which enables an easy integration into an application board and it is
also ideal for manufacturing of small series.
MPCI-L2modules support up to six LTE bands, up to five UMTS/DC-HSPA+ bands and up to four GSM/(E)GPRS
bands for data transmission over different regions and network operators.
With LTE Category 4 data rates of 150 Mb/s (downlink) and 50 Mb/s (uplink), the modules are ideal for
applications requiring the highest data-rates and high-speed internet access.
Typical applications are industrial computing, ruggedized terminals, video communications, wireless routers,
alarm panels and surveillance, digital signage and payment systems.
Product features
1,3,5
8,19
24
6
850/900
2100
4
1,3,5
7,8,28
24
6
850/900
1900/2100
MPCI-L280
1
● = supported by all product versions
12
Quad
Quad
●
●
●
●
●
●
●
●
●
●
●
■
■
■
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
Automotive
4
MPCI-L220
12
■
Professional
850/900
1900/2100
■
Standard
6
Dual stack IPv4/IPv6
24
FOTA
1,3,5
7,8,20
Embedded HTTP,FTP
4
Embedded TCP/UDP stack
MPCI-L210
MIMO 2x2 / Rx Diversity
850/1900
■
Antenna supervisor
6
●
Network indication
24
Grade
●
Digital audio
2,4,5
13,17
Features
●
Analog audio
4
Quad
GPIOs
MPCI-L201
12
Audio
2
850/900
AWS
1900/2100
DDC (I C)
6
SDIO (Master)
24
USB 2.0
2,4,5
7,17
Interfaces
UART
4
Bands
MPCI-L200
Bands
HSUPA category
GSM
HSDPA category
UMTS
Bands
LTE
LTE FDD category
Module
GPRS/EDGE multi-slot class
1.2
■ = supported by all product versions except versions “00”,”60”
Table 1: MPCI-L2 series main features summary
1
MPCI-L220-62S product version does not support UMTS Radio Access Technology
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Functional description
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MPCI-L2 series - Data Sheet
1.3
Block diagram
As described Figure 1, each MPCI-L2 series module integrates one TOBY-L2 series module, which represents the
core of the device, providing the related LTE/3G/2G modem and processing functionalities. Additional signal
conditioning circuitry is implemented for PCI Express Mini Card compliance, and two U.FL connectors are
available for easy antennas integration.
PERST#
U.FL
Signal
conditioning
ANT1
TOBY-L2
series
U.FL
LED_WWAN#
W_DISABLE#
SIM
ANT2
USB
VCC
Boost
converter
3.3Vaux (Supply)
Figure 1: MPCI-L2 series block diagram
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MPCI-L2 series - Data Sheet
1.4
Product description
MPCI-L2 series modules provide 4G LTE, 3G WCDMA/DC-HSPA+, 2G GSM/(E)GPRS multi-mode technology:
MPCI-L200 and MPCI-L201 are mainly designed for operation in America
MPCI-L210 is mainly designed for operation in Europe, Asia and other countries
MPCI-L220 is mainly designed for operation in Japan
MPCI-L280 is mainly designed for operation in south-east Asia and Oceania
4G LTE
3G UMTS/HSDPA/HSUPA
2G GSM/GPRS/EDGE
3GPP Release 9
Long Term Evolution (LTE)
Evolved Uni.Terrestrial Radio Access (E-UTRA)
Frequency Division Duplex (FDD)
DL Multi-Input Multi-Output (MIMO) 2 x 2
3GPP Release 8
Dual-Cell HS Packet Access (DC-HSPA+)
UMTS Terrestrial Radio Access (UTRA)
Frequency Division Duplex (FDD)
DL Rx diversity
3GPP Release 8
Enhanced Data rate GSM Evolution (EDGE)
GSM EGPRS Radio Access (GERA)
Time Division Multiple Access (TDMA)
DL Advanced Rx Performance Phase 1
Band support :
MPCI-L200:
Band 17 (700 MHz)
Band 5 (850 MHz)
Band 4 (1700 MHz)
Band 2 (1900 MHz)
Band 7 (2600 MHz)
Band support:
MPCI-L200:
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 4 (AWS, i.e. 1700 MHz)
Band 2 (1900 MHz)
Band 1 (2100 MHz)
Band support:
MPCI-L200:
GSM 850 MHz
E-GSM 900 MHz
DCS 1800 MHz
PCS 1900 MHz
MPCI-L201:
Band 17 (700 MHz)
Band 13 (750 MHz)
Band 5 (850 MHz)
Band 4 (1700 MHz)
Band 2 (1900 MHz)
MPCI-L201:
Band 5 (850 MHz)
Band 2 (1900 MHz)
MPCI-L210:
Band 20 (800 MHz)
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 3 (1800 MHz)
Band 1 (2100 MHz)
Band 7 (2600 MHz)
MPCI-L210:
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 2 (1900 MHz)
Band 1 (2100 MHz)
MPCI-L220:
Band 19 (850 MHz)
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 3 (1800 MHz)
Band 1 (2100 MHz)
MPCI-L220 :
Band 19 (850 MHz)
Band 8 (900 MHz)
Band 1 (2100 MHz)
MPCI-L280:
Band 28 (750 MHz)
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 3 (1800 MHz)
Band 1 (2100 MHz)
Band 7 (2600 MHz)
MPCI-L280:
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 2 (1900 MHz)
Band 1 (2100 MHz)
2
2
3
MPCI-L210:
GSM 850 MHz
E-GSM 900 MHz
DCS 1800 MHz
PCS 1900 MHz
MPCI-L280:
GSM 850 MHz
E-GSM 900 MHz
DCS 1800 MHz
PCS 1900 MHz
3
MPCI-L2 series modules support all the E-UTRA channel bandwidths for each operating band according to 3GPP TS 36.521-1 [11].
MPCI-L220-62S product version does not support 3G Radio Access Technology
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MPCI-L2 series - Data Sheet
4G LTE
3G UMTS/HSDPA/HSUPA
2G GSM/GPRS/EDGE
LTE Power Class
Class 3 (23 dBm)
for LTE mode
WCDMA/HSDPA/HSUPA Power Class
Class 3 (24 dBm)
for UMTS/HSDPA/HSUPA mode
GSM/GPRS (GMSK) Power Class
Class 4 (33 dBm) for GSM/E-GSM band
Class 1 (30 dBm) for DCS/PCS band
EDGE (8-PSK) Power Class
Class E2 (27 dBm) for GSM/E-GSM band
Class E2 (26 dBm) for DCS/PCS band
Data rate
LTE category 4:
up to 150 Mb/s DL, 50 Mb/s UL
Data rate
MPCI-L200, MPCI-L201:
4
HSDPA cat.14, up to 21 Mb/s DL
HSUPA cat.6, up to 5.6 Mb/s UL
MPCI-L210, MPCI-L220, MPCI-L280:
HSDPA cat.24, up to 42 Mb/s DL
HSUPA cat.6, up to 5.6 Mb/s UL
Data rate
6
GPRS multi-slot class 12 , CS1-CS4,
up to 85.6 kb/s DL/UL
EDGE multi-slot class 126, MCS1-MCS9
up to 236.8 kb/s DL/UL
5
Table 2: MPCI-L2 series LTE, 3G and 2G characteristics
1.5
AT command support
The MPCI-L2 series modules support AT commands according to 3GPP standards TS 27.007 [1], 27.005 [2] and
the u-blox AT command extension.
For the complete list of all the supported AT commands and their syntax, see the u-blox AT Commands
Manual [3].
RIL (Radio Interface Layer) software for Android is available for MPCI-L2 series modules free of charge. See the
Android RIL Production delivery [4] application note for the supported software deliveries and more information.
4
HSDPA category 24 capable
GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at which data can
be transmitted and received, with higher classes typically allowing faster data transfer rates.
6
GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total.
5
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MPCI-L2 series - Data Sheet
1.6
Supported features
Table 3 lists some of the main features supported by MPCI-L2 series modules. For more details see the TOBY-L2 /
MPCI-L2 System Integration Manual [5] and u-blox AT Commands Manual [3].
Feature
Description
Network Indication
LED_WWAN# signal provides the Wireless Wide Area Network status indication as specified by the PCI Express
Mini Card Electromechanical Specification [9].
Embedded TCP and UDP
7
stack
Embedded TCP/IP and UDP/IP stack including the Direct Link mode for TCP and UDP sockets.
Sockets can be set in Direct Link mode to establish a transparent end to end communication with an already
connected TCP or UDP socket via serial interface.
8
FTP7, FTPS
File Transfer Protocol as well as Secure File Transfer Protocol (SSL encryption of FTP control channel)
functionalities are supported via AT commands.
HTTP7, HTTPS8
Hyper-Text Transfer Protocol as well as Secure Hyper-Text Transfer Protocol (SSL encryption) functionalities are
supported via AT commands.
Embedded TLS 1.28
With the support of X.509 certificates, Embedded TLS 1.2 provides server and client authentication, data
encryption, data signature and enables TCP/IP applications communicate over a secured and trusted connection.
The feature can be configured and enabled by +USECMNG and +USECPRF AT commands.
DNS7
Support for DNS functionality.
Dual stack IPv4/IPv6
Both Internet Protocol version 4 and Internet Protocol version 6 are supported in parallel.
BIP7
Bearer Independent Protocol for Over-the-Air SIM provisioning. The data transfer to/from the SIM uses either an
already active PDP context or a new PDP context established with the APN provided by the SIM card.
Multiple PDP contexts
9
Up to 8 PDP contexts can be activated, and multi secondary PDP contexts be associated to a primary PDP context
SMS via IMS
Allows SMS via embedded IP Multimedia Subsystem (IMS)
Firmware update Over AT
commands (FOAT)
Firmware module upgrade over AT command interface (USB).
The feature can be enabled and configured through the +UFWUPD AT command.
Firmware update Over
The Air (FOTA)7
Firmware module update over the LTE/3G/2G air interface.
The feature can be enabled and configured through the +UFWINSTALL AT command.
LTE DL MIMO 2x2 and
3G DL Rx Diversity
Improved cellular link quality and reliability on all operating bands.
Smart Temperature
10
Supervisor
Constant monitoring of the module board temperature:
Warning notification when the temperature approaches an upper or lower predefined threshold
Shutdown notified and forced when the temperature value is outside the specified range (shutdown
suspended in case of an emergency call in progress)
The Smart Temperature Supervisor feature can be enabled and configured through the +USTS AT command.
Remote SIM Access
11
Profile (SAP)
Allows access and use of a remote (U)SIM card instead of the local SIM card directly connected to the module
(U)SIM interface. The module acts as an SAP Client establishing a connection and performing data exchange to a
SAP Server directly connected to the remote SIM. The modules provide a dedicated USB SAP channel and a
dedicated multiplexer SAP channel over UART for communication with the remote (U)SIM card.
The feature can be configured and enabled by +USAPMODE and + USAPIND AT commands.
Power saving
The power saving configuration is by default disabled, but it can be configured using the +UPSV AT command.
When power saving is enabled, the module automatically enters the low power idle-mode whenever possible,
reducing current consumption.
During idle-mode, the module processor core runs with the internal RTC 32 kHz reference clock.
Fast Dormancy
The Fast Dormancy feature, defined in 3GPP Rel.8, allows reduction of current consumption and network
utilization during periods of data inactivity. It can be activated by +UFDAC and +UDCONF=61 AT commands.
The sensor measures board temperature, which can differ from ambient temperature.
Table 3: Some of the main features supported by MPCI-L2 series modules
7
Not supported by “00” and “60” product versions
Not supported by “00”, “01”, “60” and MPCI-L201-02S product versions.
Not supported by “00”, “03”, “60”, “62”, MPCI-L200-02S, MPCI-L210-02S, MPCI-L220-02S and MPCI-L280-02S product versions.
10
Not supported by “00”, “01” and “60” product versions.
11
Not supported by “00”, “01”, “02”, “60”, “62” product versions
8
9
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MPCI-L2 series - Data Sheet
2 Interfaces
2.1
Module supply input
MPCI-L2 series modules must be supplied through the 3.3Vaux pins by a DC power supply. The voltage must be
stable, because during this operation the current drawn from 3.3Vaux can vary significantly, based on the
power consumption profile of the LTE/3G/2G systems (see TOBY-L2 / MPCI-L2 System Integration Manual [5]).
2.2
Antenna RF interfaces
The modules have two RF interfaces over two standard U.FL connectors (Hirose U.FL-R-SMT) with a characteristic
impedance of 50 . The primary RF port (ANT1) supports both Tx and Rx, providing the main antenna interface,
while the secondary RF port (ANT2) supports Rx only for the LTE MIMO 2x2 and 3G Rx diversity configurations.
2.3
System functions
2.3.1 Module power-on
MPCI-L2 series can be switched on by:
Rising edge on the 3.3Vaux pin to a valid voltage for module supply, i.e. applying module supply.
2.3.2 Module power-off
MPCI-L2 series can be properly switched off by:
Sending the AT+CFUN=127 command (see the u-blox AT Commands Manual [3]) to configure the module
in the halt mode, and then removing the 3.3Vaux supply. In this way, the current parameter settings are
saved in the module’s non-volatile memory and a proper network detach is performed.
An abrupt under-voltage shutdown occurs on MPCI-L2 modules when the 3.3Vaux supply is suddenly removed.
If this is done without previously configuring the module in the halt mode, the storage of the current parameter
settings in the module’s non-volatile memory and the proper network detach are not performed.
An over-temperature or an under-temperature shutdown occurs on MPCI-L2 modules when the temperature
measured within the cellular module reaches the dangerous area, if the optional Smart Temperature Supervisor
feature (not supported by the “00”, “01” and “60” product versions) is enabled and configured by the
AT+USTS command. For more details see the TOBY-L2 / MPCI-L2 System integration Manual [5] and the u-blox
AT Commands Manual [3].
2.3.3 Module reset
MPCI-L2 series can be reset (rebooted) by:
AT+CFUN command (see the u-blox AT Commands Manual [3]).
AT+CPWROFF command (see the u-blox AT Commands Manual [3]): this behavior differs than TOBY-L2
modules, where MPCI-L2 series modules will boot back up, rather than remain powered off, due to the
MPCI-L2 series module’s internal configuration.
In both cases, an “internal” or “software” reset of the module is executed: the current parameter settings are
saved in the module’s non-volatile memory and a proper network detach is performed.
An abrupt “external” or “hardware” reset of MPCI-L2 series modules occurs when a low level is applied on the
PERST# pin (which is normally set high by an internal pull-up) for a valid time period (see section 4.2.7). In this
case the current parameter settings are not saved in the module’s non-volatile memory and a proper network
detach is not performed. PERST# line should be driven by open drain, open collector or contact switch.
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MPCI-L2 series - Data Sheet
2.4
SIM interface
A SIM card interface is provided on the UIM_PWR, UIM_DATA, UIM_CLK, UIM_RESET pins of the system
connector as well as on a micro-SIM (3FF) card holder solderable on the back side of the board: the high-speed
SIM/ME interface is implemented as well as the automatic detection of the required SIM supporting voltage.
Both 1.8 V and 3 V SIM types are supported (1.8 V and 3 V ME). Activation and deactivation with automatic
voltage switch from 1.8 V to 3 V is implemented, according to ISO-IEC 7816-3 specifications. The SIM driver
supports the PPS procedure for baud-rate selection, according to the values proposed by the SIM card/chip.
2.5
USB interface
MPCI-L2 series modules include a high-speed USB 2.0 compliant interface with maximum 480 Mb/s data rate,
representing the interface for any communication with an external host application processor. The module itself
acts as a USB device and can be connected to any USB host equipped with compatible drivers.
The USB_D+ / USB_D- lines carry the USB serial bus data and signaling, providing all the functionalities for the
bus attachment, configuration, enumeration, suspension or remote wakeup according to the Universal Serial Bus
Revision 2.0 specification [6].
MPCI-L2 series modules provide by default the following set of USB functions:
CDC-ACM modem: AT commands interface is available over this modem COM port
RNDIS network adapter: Ethernet-over-USB connection is available over this network adapter
The USB of MPCI-L2 series modules can be configured by the AT+UUSBCONF command to select different sets
of USB functions available in a mutually exclusive way. The configured USB profile can thus consist of a specific
set of functions with various capabilities and purposes, such as:
CDC-ACM for AT commands and data
CDC-ACM for remote SIM Access Profile (SAP)12
CDC-ACM for diagnostic
RNDIS for Ethernet-over-USB
CDC-ECM for Ethernet-over-USB
For more details regarding USB configurations and capabilities, see the TOBY-L2 / MPCI-L2 System integration
Manual [5] and the u-blox AT Commands Manual [3], +UUSBCONF AT command.
USB drivers are available for the following operating system platforms:
Windows Vista
Windows 7
Windows 8
Windows 8.1
Windows 10
Windows Embedded CE 6.013
Windows Embedded Compact 713
Windows Embedded Compact 201313
MPCI-L2 series modules are compatible with standard Linux/Android USB kernel drivers.
12
13
Not supported by “00”, “01”, “02”, “60”, “62” product versions
For more details see the Windows Embedded OS USB Driver Installation Application Note [7]
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MPCI-L2 series - Data Sheet
2.6
W_DISABLE#
MPCI-L2 series includes the W_DISABLE# active-low input signal to disable the radio operations as specified by
the PCI Express Mini Card Electromechanical Specification [9].
2.7
LED_WWAN#
MPCI-L2 series includes the LED_WWAN# active-low open drain output to provide the Wireless Wide Area
Network status indication as specified by the PCI Express Mini Card Electromechanical Specification [9].
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MPCI-L2 series - Data Sheet
3 Pin definition
3.1
Pin assignment
No
PCI Express Mini Card
E.M. Spec. Rev. 2.0
MPCI-L2
1
WAKE#
NC
2
3.3Vaux
3.3Vaux
3
COEX1
NC
4
GND
GND
5
COEX2
NC
N/A
Internally not connected
6
1.5V
NC
N/A
Internally not connected
7
CLKREQ#
NC
N/A
Internally not connected
8
UIM_PWR
UIM_PWR
SIM
O
SIM supply output
1.8 V or 3.0 V output according to the
SIM card/chip voltage type.
See 4.2.6 for detailed electrical specs.
9
GND
GND
GND
N/A
Ground
Connect to ground
10
UIM_DATA
UIM_DATA
SIM
I/O
SIM data input/output
Internal 4.7 k pull-up to UIM_PWR.
See 4.2.6 for detailed electrical specs.
11
REFCLK-
NC
12
UIM_CLK
UIM_CLK
13
REFCLK+
NC
14
UIM_RESET
UIM_RESET
SIM
O
SIM reset output
Reset output for SIM card/chip.
See 4.2.6 for detailed electrical specs.
15
GND
GND
GND
N/A
Ground
Connect to ground
16
UIM_SPU
NC
N/A
Internally not connected
17
UIM_IC_DM
NC
N/A
Internally not connected
18
GND
GND
19
UIM_IC_DP
NC
N/A
20
W_DISABLE1#
W_DISABLE#
I
Wireless disable input
Internal 22 k pull-up to 3.3Vaux.
See 4.2.8 for detailed electrical specs.
21
GND
GND
N/A
Ground
Connect to ground
22
PERST#
PERST#
I
MPCI reset input
Internal 45 k active pull-up to 3.3 V.
See 4.2.7 for detailed electrical specs.
23
PERn0
NC
N/A
24
3.3Vaux
3.3Vaux
25
PERp0
NC
26
GND
GND
GND
N/A
27
GND
GND
GND
N/A
Connect to ground
28
1.5V
NC
N/A
Internally not connected
29
GND
GND
30
SMB_CLK
NC
UBX-13004749 - R19
Voltage
domain
I/O
Description
N/A
3.3Vaux
I
Internally not connected
MPCI supply input
N/A
GND
N/A
O
Ground
GND
3.3Vaux
N/A
I
SIM clock output
N/A
N/A
3.25 MHz output for SIM card/chip.
See 4.2.6 for detailed electrical specs.
Internally not connected
Ground
Connect to ground
Internally not connected
Internally not connected
MPCI supply input
N/A
GND
Connect to ground
Internally not connected
N/A
GND
Connect to external 3.3 V supply.
See 4.2.2 for detailed electrical specs.
Internally not connected
N/A
SIM
Remarks
Connect to external 3.3 V supply.
See 4.2.2 for detailed electrical specs.
Internally not connected
Ground
Ground
Connect to ground
Connect to ground
Internally not connected
Pin definition
Page 13 of 30
MPCI-L2 series - Data Sheet
No
PCI Express Mini Card
E.M. Spec. Rev. 2.0
MPCI-L2
Voltage
domain
31
PETn0
NC
N/A
Internally not connected
32
SMB_DATA
NC
N/A
Internally not connected
33
PETp0
NC
N/A
Internally not connected
34
GND
GND
GND
N/A
Ground
Connect to ground
35
GND
GND
GND
N/A
Ground
Connect to ground
36
USB_D-
USB_D-
USB
I/O
USB Data Line D-
90 nominal differential impedance.
Pull-up, pull-down and series resistors
as required by USB 2.0 specifications [6]
are part of the USB pin driver and need
not be provided externally.
See 4.2.5 for detailed electrical specs.
37
GND
GND
GND
N/A
Ground
Connect to ground
38
USB_D+
USB_D+
USB
I/O
USB Data Line D+
90 nominal differential impedance.
Pull-up, pull-down and series resistors
as required by USB 2.0 specifications [6]
are part of the USB pin driver and need
not be provided externally.
See 4.2.5 for detailed electrical specs.
39
3.3Vaux
3.3Vaux
3.3Vaux
I
MPCI supply input
Connect to external 3.3 V supply.
See 4.2.2 for detailed electrical specs.
40
GND
GND
GND
N/A
Ground
Connect to ground
41
3.3Vaux
3.3Vaux
3.3Vaux
I
MPCI supply input
Connect to external 3.3 V supply.
See 4.2.2 for detailed electrical specs.
42
LED_WWAN#
LED_WWAN#
O
LED indicator output
Open drain active low output.
See 4.2.9 for detailed electrical specs.
43
GND
GND
N/A
Ground
Connect to ground
44
LED_WLAN#
NC
N/A
Internally not connected
45
Reserved
NC
N/A
Internally not connected
46
LED_WPAN#
NC
N/A
Internally not connected
47
Reserved
NC
N/A
Internally not connected
48
1.5V
NC
N/A
Internally not connected
49
Reserved
NC
N/A
Internally not connected
50
GND
GND
51
W_DISABLE2#
NC
52
3.3Vaux
3.3Vaux
GND
GND
I/O
N/A
Description
Ground
N/A
3.3Vaux
I
Remarks
Connect to ground
Internally not connected
MPCI supply input
Connect to external 3.3 V supply.
See 4.2.2 for detailed electrical specs.
Table 4: MPCI-L2 series system connector pin assignment
UBX-13004749 - R19
Pin definition
Page 14 of 30
MPCI-L2 series - Data Sheet
4 Electrical specifications
Stressing the device above one or more of the ratings listed in the Absolute Maximum Rating
section may cause permanent damage. These are stress ratings only. Operating the module at
these or at any conditions other than those specified in the Operating Conditions sections
(chapter 4.1) of the specification should be avoided. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
Operating condition ranges define those limits within which the functionality of the device is guaranteed.
Electrical characteristics are defined according to verification on a representative number of samples or
according to simulation.
Where application information is given, it is advisory only and does not form part of the specification.
4.1 Absolute maximum rating
Limiting values given below are in accordance with the Absolute Maximum Rating System (IEC 134).
Symbol
Description
Condition
Min.
Max.
Unit
3.3Vaux
Module supply voltage
Input DC voltage at 3.3Vaux pins
–0.3
6.3
V
USB
USB D+/D- pins
Input DC voltage at USB interface pins
3.6
V
SIM
SIM interface
Input DC voltage at SIM interface pins
–0.3
3.6
V
PERST#
MPCI reset input
Input DC voltage at PERST# input pin
–0.3
5.0
V
W_DISABLE#
Wireless disable input
Input DC voltage at W_DISABLE# input pin
–0.3
3.6
V
LED_WWAN#
LED indicator output
Input DC voltage at LED_WWAN# output pin
–0.3
6.0
V
Rho_ANT
Antenna ruggedness
Output RF load mismatch ruggedness at ANT1 / ANT2
10:1
VSWR
Tstg
Storage Temperature
85
°C
–40
Table 5: Absolute maximum ratings
The product is not protected against overvoltage or reversed voltages. If necessary, voltage
spikes exceeding the power supply voltage specification, given in table above, must be limited
to values within the specified boundaries by using appropriate protection devices.
4.1.1 Maximum ESD
Parameter
Min
Typical
Max
Unit
Remarks
ESD sensitivity for all pins
except ANT1 / ANT2
1000
V
Human Body Model according to JESD22-A114
ESD sensitivity for ANT1 / ANT2
1000
V
Human Body Model according to JESD22-A114
ESD immunity for ANT1 / ANT2
4000
V
Contact Discharge according to IEC 61000-4-2
8000
V
Air Discharge according to IEC 61000-4-2
Table 6: Maximum ESD ratings
u-blox cellular modules are Electrostatic Sensitive Devices and require special precautions when
handling. See section 7.2 for ESD handling instructions.
UBX-13004749 - R19
Electrical specifications
Page 15 of 30
MPCI-L2 series - Data Sheet
4.2
Operating conditions
Unless otherwise indicated, all operating condition specifications are at an ambient temperature of 25°C.
Operation beyond the operating conditions is not recommended and extended exposure
beyond them may affect device reliability.
4.2.1 Operating temperature range
Parameter
Min.
Typical
Max.
Unit
Remarks
Normal operating temperature
–20
+25
+65
°C
Normal operating temperature range
(fully functional and meet 3GPP specifications)
Extended operating temperature
–40
+85
°C
Extended operating temperature range
(RF performance may be affected outside normal
operating range, though module is fully functional)
Table 7: Environmental conditions
4.2.2 Supply/power pins
Symbol
3.3Vaux
Parameter
Module supply operating input voltage
14
Min.
Typical
Max.
Unit
3.00
3.30
3.60
V
Table 8: Input characteristics of Supply/Power pins
14
Input voltage at 3.3Vaux must be above the normal operating range minimum limit to switch-on the module.
UBX-13004749 - R19
Electrical specifications
Page 16 of 30
MPCI-L2 series - Data Sheet
4.2.3 Current consumption
Mode
Condition
Idle-Mode
(Power Saving enabled by AT+UPSV,
module in low power idle-mode,
equivalent to +CFUN=4 or +COPS=2)
Averaged current value over a 100-ms period,
USB connected and suspended
1.8
mA
Cyclic Idle/Active-Mode
(Power Saving enabled by AT+UPSV,
Module registered with network)
Averaged current value over a 10-minute period,
USB interface suspended
3.9
mA
Active-Mode
(Power Saving disabled by AT+UPSV,
Module registered with network)
Averaged current value over a 10-minute period,
USB interface not suspended
59
mA
2G Connected Mode
(Tx / Rx call enabled)
Pulse current during a 1-slot GMSK Tx burst,
850/900 MHz bands
Maximum
2.6
A
Averaged current value over a 10-second period, Maximum
2G GMSK call, 1 Tx + 1 Rx slot, 850/900 MHz
380
mA
Averaged current value over a 10-second period, Maximum
2G GMSK call, 1 Tx + 1 Rx slot, 1800/1900 MHz
295
mA
Averaged current value over a 10-second period, Minimum
3G call with Low data rate
0 dBm
245
mA
265
mA
12 dBm
365
mA
18 dBm
505
mA
Maximum
680
mA
Averaged current value over a 10-second period, Maximum
3G call with Maximum data rate
790
mA
Averaged current value over a 10-second period, Minimum
LTE call with Low data rate
0 dBm
395
mA
415
mA
12 dBm
520
mA
18 dBm
650
mA
Maximum
815
mA
Averaged current value over a 10-second period, Maximum
LTE call with Maximum data rate
880
mA
3G Connected Mode
(Tx / Rx call enabled)
LTE Connected Mode
(Tx / Rx call enabled)
Tx power
Min
Typ
Max
Unit
Table 9: Module 3.3Vaux supply current consumption
4.2.4 LTE/3G/2G RF characteristics
MPCI-L2 series LTE/3G/2G RF characteristics are specified in the TOBY-L2 series Data Sheet [10].
UBX-13004749 - R19
Electrical specifications
Page 17 of 30
MPCI-L2 series - Data Sheet
4.2.5 USB pins
USB data lines (USB_D+ / USB_D-) are compliant to the USB 2.0 high-speed specification. The values in Table 10
are for information only. See the USB 2.0 specifications [6] for detailed electrical characteristics.
Parameter
Min.
High-speed squelch detection threshold
(input differential signal amplitude)
Typical
Max.
Unit
100
150
mV
High speed disconnect detection threshold
(input differential signal amplitude)
525
625
mV
High-speed data signaling input
common mode voltage range
–50
500
mV
High-speed idle output level
–10
10
mV
High-speed data signaling output high level
360
440
mV
High-speed data signaling output low level
–10
10
mV
Chirp J level (output differential voltage)
700
1100
mV
Chirp K level (output differential voltage)
–900
–500
mV
Remarks
Table 10: USB pins characteristics
4.2.6 SIM pins
The SIM pins are a dedicated interface to the external SIM card/chip. The electrical characteristics fulfill regulatory
specification requirements. The values in Table 11 are for information only.
Parameter
Min.
Typical
Max.
Unit
Remarks
UIM_PWR supply output
1.76
1.80
1.85
V
1.8 V SIM type
2.84
2.90
2.94
V
3.0 V SIM type
–0.30
0.63
V
1.8 V SIM type
–0.30
0.80
V
3.0 V SIM type
1.17
2.10
V
1.8 V SIM type
2.00
3.30
V
3.0 V SIM type
0.00
0.45
V
1.8 V SIM type, Max value at IOL = +2.0 mA
0.00
0.40
V
3.0 V SIM type, Max value at IOL = +2.0 mA
Low-level input
High-level input
Low-level output
High-level output
Input / Output leakage current
1.35
1.80
V
1.8 V SIM type, Min value at IOH = –2.0 mA
2.60
2.90
V
3.0 V SIM type, Min value at IOH = –2.0 mA
nA
0 V < VIN < 0.63 V or 1.17 V < VIN < 2.10 V
0 V < VIN < 0.80 V or 2.00 V < VIN < 3.30 V
–500
500
Clock frequency on UIM_CLK
3.25
MHz
Internal pull-up on UIM_DATA
4.7
k
Internal pull-up to UIM_PWR supply
Table 11: SIM pins characteristics
UBX-13004749 - R19
Electrical specifications
Page 18 of 30
MPCI-L2 series - Data Sheet
4.2.7 PERST# pin
Pin Name
Parameter
Min.
PERST#
Low-level input
0.00
High-level input
2.60
L-level input current
Pull-up resistance
35
PERST# low time
2.1
Typical
Max.
Unit
1.10
V
3.70
V
Remarks
-82
µA
45
k
Internal active pull-up to 3.3 V
s
Low time to reset the module
Max.
Unit
Remarks
0.80
V
3.60
V
Table 12: PERST# pin characteristics
4.2.8 W_DISABLE# pin
Pin Name
Parameter
Min.
W_DISABLE#
Low-level input
0.00
High-level input
2.00
Pull-up resistance
Typical
22
k
Internal pull-up to 3.3Vaux
Table 13: W_DISABLE# pin characteristics
4.2.9 LED_WWAN# pin
Pin Name
Parameter
LED_WWAN#
Low-level output
Min.
Typical
Max.
Unit
Remarks
0.00
0.40
V
Open-drain output
Max value at IOL = +9.0 mA
Table 14: LED_WWAN# pin characteristics
UBX-13004749 - R19
Electrical specifications
Page 19 of 30
MPCI-L2 series - Data Sheet
5 Mechanical specifications
MPCI-L2 series modules are fully compliant to the 52-pin PCI Express Full-Mini Card Type F2 form factor, with
top-side and bottom-side keep-out areas, with 50.95 mm nominal length, 30 mm nominal width and all the
other dimensions as defined by the PCI Express Mini Card Electromechanical Specification [9] except for the card
thickness (nominal value is 3.7 mm), as described in Figure 2. MPCI-L2 series modules weight is about 9.7 g.
45.25 mm
Hole
Pin 51
GND
11 mm
ANT1
Top
View
19 mm
ANT2
GND
Pin 1
Hole
Side
View
3.7 mm
Hole
Pin 2
GND
Bottom
View
30 mm
GND
Pin 52
Hole
50.95 mm
Figure 2: MPCI-L2 series mechanical dimensions (top view, side view, bottom view)
For further details regarding mechanical specifications see the PCI Express Mini Card Electromechanical
Specification [9].
UBX-13004749 - R19
Mechanical specifications
Page 20 of 30
MPCI-L2 series - Data Sheet
6 Qualification and approvals
6.1
Reliability tests
Tests for product family qualifications according to ISO 16750 “Road vehicles - Environmental conditions and
testing for electrical and electronic equipment“, and appropriate standards.
6.2
Approvals
Products marked with this lead-free symbol on the product label comply with the
"Directive 2002/95/EC of the European Parliament and the Council on the Restriction of
Use of certain Hazardous Substances in Electrical and Electronic Equipment" (RoHS).
MPCI-L2 series modules are RoHS compliant.
No natural rubbers, hygroscopic materials, or materials containing asbestos are employed.
The following table summarizes the main approvals for MPCI-L2 series modules.
Certification scheme
MPCI-L200
MPCI-L201
GCF (Global Certification Forum)
•
•
15
•
•
PTCRB (PCS Type Certification
Review Board)
•
•
15
•
•
CE (Conformité Européenne)
•
•
•
FCC (United States Federal
Communications Commission)
FCC identification number
•
•
•
•
Contains FCC ID
XPYTOBYL200
Contains FCC ID
XPYTOBYL201
Contains FCC ID
XPYTOBYL210
Contains FCC ID
XPYTOBYL280
•
•
•
•
Contains IC
8595A-TOBYL200
Contains IC
8595A-TOBYL201
Contains IC
8595A-TOBYL210
Contains IC
8595A-TOBYL280
ISED (Innovation, Science and
16
Economic Development)
ISED certification number
Anatel (Brazilian Certification)
MPCI-L210
MPCI-L220
•
MPCI-L280
•
RCM (Australian Regulatory
Compliance Mark)
•
•
NCC (Taiwanese National
Communications Commission)
•
•
KC (Korean Certification)
•
Giteki Mark (Japanese Certification)
•
NTT DoCoMo (Japanese Certification)
SoftBank (Japanese network operator)
AT&T (US network operator)
•
•
17
•
•
Verizon (US network operator)
•
15
•
15
Table 15: MPCI-L2 series main certification approvals summary
For the complete list of approvals and for specific details on all country and network operators’ certifications, see
our website www.u-blox.com or please contact the u-blox office or sales representative nearest you.
15
TOBY-L201
formerly known as IC - Industry Canada
17
not valid for "02" product version
16
UBX-13004749 - R19
Qualification and approvals
Page 21 of 30
MPCI-L2 series - Data Sheet
7 Product handling
7.1
Packaging
MPCI-L2 modules are delivered as hermetically sealed trays of 32 pieces, 5 trays in 1 package (160 units in total),
to enable efficient production, production lot set-up and tear-down. For more information about packaging, see
the u-blox Package Information Guide [8].
Quantities of less than 160 pieces are also available. Contact u-blox for more information.
7.2
ESD precautions
MPCI-L2 series modules contain highly sensitive electronic circuitry and are Electrostatic
Sensitive Devices (ESD). Handling MPCI-L2 series modules without proper ESD protection may
destroy or damage them permanently.
MPCI-L2 series modules are Electrostatic Sensitive Devices (ESD) and require special ESD precautions typically
applied to ESD sensitive components.
Table 6 reports the maximum ESD ratings of the MPCI-L2 series modules.
Proper ESD handling and packaging procedures must be applied throughout the processing, handling and
operation of any application that incorporates MPCI-L2 series module.
ESD precautions should be implemented on the application board where the module is mounted, as described in
the TOBY-L2 / MPCI-L2 System Integration Manual [5].
Failure to observe these recommendations can result in severe damage to the device!
UBX-13004749 - R19
Product handling
Page 22 of 30
MPCI-L2 series - Data Sheet
8 Default settings
Item
AT Settings
Comments
USB interface
Enabled
MPCI-L2 series modules provide by default the following set of USB functions:
CDC-ACM for AT command and data
RNDIS for Ethernet-over-USB connection
The USB can be configured by the AT+UUSBCONF command to select different sets of
USB functions available in mutually exclusive way, configuring the active USB profile
consisting of a specific set of functions with various capabilities and purposes (for more
details, see the TOBY-L2 / MPCI-L2 System Integration Manual [5] and the u-blox AT
Commands Manual [3], +UUSBCONF AT command).
Power Saving
AT+UPSV=0
Disabled
Network registration
AT+COPS=0
Self network registration
Table 16: Default settings
UBX-13004749 - R19
Default settings
Page 23 of 30
MPCI-L2 series - Data Sheet
9 Labeling and ordering information
9.1
Product labeling
The labels of MPCI-L2 series modules include important product information as described in this section.
Figure 3, Figure 4 and Figure 5 illustrate the label of MPCI-L2 series modules, which is placed on the bottom side
of the modules, including: the u-blox logo, Pb-free marking, product type number, production lot, certification
numbers and production country.
xxS-xx
Figure 3: Label of MPCI-L2 series modules (except MPCI-L210-60S and MPCI-L220)
60S-xx
MPCI-L210
D150057003
003-150063
Figure 4: Label of MPCI-L210-60S modules
xxS-xx
MPCI-L220
AD160009003
003-160020
Figure 5: Label of MPCI-L220 modules
UBX-13004749 - R19
Labeling and ordering information
Page 24 of 30
MPCI-L2 series - Data Sheet
9.2
Explanation of codes
Three different product code formats are used. The Product Name is used in documentation such as this data
sheet and identifies all u-blox products, independent of packaging and quality grade. The Ordering Code
includes options and quality, while the Type Number includes the hardware and firmware versions. Table 17
details these 3 different formats:
Format
Structure
Product Name
MPCI-TGVV
Ordering Code
MPCI-TGVV-MMQ
Type Number
MPCI-TGVV-MMQ-XX
Table 17: Product Code Formats
Table 18 explains the parts of the product code.
Code
Meaning
Example
PPPP
Form factor
MPCI
TG
Platform (Technology and Generation)
L2
Dominant technology: G: GSM; U: HSUPA; C: CDMA 1xRTT; N: NB-IoT;
R: LTE low data rate (Cat 1 and below); L: LTE high data rate (Cat 3 and above)
Generation: 1…9
VV
Variant function set based on the same platform [00…99]
00
MM
Major product version [00…99]
00
Q
Product grade
S
XX
S = professional
A = automotive
Minor product version (not relevant for certification)
Default value is 00
Table 18: Part identification code
UBX-13004749 - R19
Labeling and ordering information
Page 25 of 30
MPCI-L2 series - Data Sheet
9.3
Ordering information
Ordering No.
Product
MPCI-L200-00S
LTE bands 2 / 4 / 5 / 7 / 17, DC-HSPA+ bands 1 / 2 / 4 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in America
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L200-02S
LTE bands 2 / 4 / 5 / 7 / 17, DC-HSPA+ bands 1 / 2 / 4 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in America,
supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L200-03S
LTE bands 2 / 4 / 5 / 7 / 17, DC-HSPA+ bands 1 / 2 / 4 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in America,
supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor, SAP
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L201-01S
LTE bands 2 / 4 / 5 / 13 / 17, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in America,
supporting embedded TCP/UDP, HTTP/FTP
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L201-02S
LTE bands 2 / 4 / 5 / 13 / 17, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in America,
supporting embedded TCP/UDP, HTTP/FTP, smart temperature supervisor
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L210-00S
LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in Europe, Asia and other countries
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L210-60S
LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900,
PCI Express Mini Card module approved by SoftBank Japanese mobile network operator
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L210-02S
LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in Europe, Asia and other countries,
supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L210-03S
LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in Europe, Asia and other countries,
supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor, SAP
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L220-02S
LTE bands 1 / 3 / 5 / 8 / 19, DC-HSPA+ bands 1 / 8 / 19,
PCI Express Mini Card module mainly designed for operation in Japan,
supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L220-62S
LTE bands 1 / 3 / 5 / 8 / 19,
PCI Express Mini Card module approved by NTT DoCoMo Japanese mobile network operator,
supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L280-02S
LTE bands 1 / 3 / 5 / 7 / 8 / 28, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS bands 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in South East-Asia and Oceania,
supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor
51 x 30 x 3.7 mm, 160 pcs/package
MPCI-L280-03S
LTE bands 1 / 3 / 5 / 7 / 8 / 28, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS bands 850 / 900 / 1800 / 1900,
PCI Express Mini Card module mainly designed for operation in South East-Asia and Oceania,
supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor, SAP
51 x 30 x 3.7 mm, 160 pcs/package
Table 19: Product ordering codes
UBX-13004749 - R19
Labeling and ordering information
Page 26 of 30
MPCI-L2 series - Data Sheet
Appendix
A Glossary
Name
Definition
3FF
Third Form Factor (micro-SIM card)
ACM
Abstract Control Model
CDC
Communications Device Class
DDC
Display Data Channel (I C compatible) Interface
DL
Down-link (Reception)
DRX
Discontinuous Reception
ECM
Ethernet networking Control Model
ERS
External Reset Input Signal
ESD
Electrostatic Discharge
FOAT
Firmware update Over AT commands
FOTA
Firmware update Over The Air
FW
Firmware
GMSK
Gaussian Minimum-Shift Keying modulation
GND
Ground
GPIO
General Purpose Input Output
H
High
HSDPA
High Speed Downlink Packet Access
HSUPA
High Speed Uplink Packet Access
I
Input (means that this is an input port of the module)
IMEI
International Mobile Equipment Identity
L
Low
LGA
Land Grid Array
LTE
Long Term Evolution
MIMO
Multi-Input Multi-Output
N/A
Not Applicable
O
Output (means that this is an output port of the module)
OD
Open Drain
PCN / IN
Product Change Notification / Information Note
PD
Pull-Down
PU
Pull-Up
RNDIS
Remote Network Driver Interface Specification
SDIO
Secure Digital Input Output
SIM
Subscriber Identity Module
T
Tristate
TBD
To Be Defined
UART
Universal Asynchronous Receiver-Transmitter serial interface
UL
Up-link (Transmission)
USB
Universal Serial Bus
2
Table 20: Explanation of abbreviations and terms used
UBX-13004749 - R19
Appendix
Page 27 of 30
MPCI-L2 series - Data Sheet
Related documents
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
3GPP TS 27.007 - AT command set for User Equipment (UE)
3GPP TS 27.005 - Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE - DCE)
interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
u-blox AT Commands Manual, Docu No UBX-13002752
u-blox Android RIL Production delivery Application note, Docu No UBX-13002041
u-blox TOBY-L2 / MPCI-L2 series System Integration Manual, Docu No UBX-13004618
Universal Serial Bus Revision 2.0 specification, http://www.usb.org/developers/docs/usb20_docs/
u-blox Windows Embedded OS USB Driver Installation Application Note, Docu No UBX-14003263
u-blox Package Information Guide, Docu No UBX-14001652
PCI Express Mini Card Electromechanical Specification, Revision 2.0, April 21, 2012
u-blox TOBY-L2 series Data Sheet, Docu No UBX-13004573
3GPP TS 36.521-1 - Evolved Universal Terrestrial Radio Access; User Equipment conformance specification;
Radio transmission and reception; Part 1: Conformance Testing
For regular updates to u-blox documentation and to receive product change notifications register on our
homepage.
UBX-13004749 - R19
Related documents
Page 28 of 30
MPCI-L2 series - Data Sheet
Revision history
Revision
Date
Name
Comments
R01
20-Dec-2013
jpod / sses
Initial release
R02
14-Oct-2014
lpah / sses
Advance Information document status
Updated module power-on, power-off and reset description
Updated module thickness and improved mechanical description
Minor corrections in PERST#, W_DISABLE#, LED_WWAN# description
Added module current consumption values
Added and updated other minor electrical characteristics
R03
28-Jan-2015
sses
Early Production Information document status
R04
19-Aug-2015
sses
Objective Specification document status
Added description of MPCI-L200-02S, MPCI-L210-02S and MPCI-L210-60S versions.
R05
25-Sep-2015
lpah
Advance Information status
R06
14-Oct-2015
sses
Objective Specification document status
Added description of MPCI-L280-02S version
R07
26-Nov-2015
lpah
Document status changed to Early Production Information
R08
22-Dec-2015
lpah / sses
Added description of MPCI-L201-01S version
R09
31-Mar-2016
sses
Updated features planned for future product versions.
Minor other corrections and description improvements.
R10
27-Apr-2016
lpah
Extended document applicability to MPCI-L210-60S-01
R11
15-Jul-2016
sses
Document status reverted to Objective Specification
Added description of MPCI-L201-02S version
R12
28-Sep-2016
sses
Document status updated to Advance Information
Updated support of some minor features in specific product versions
R13
21-Oct-2016
lpah
Document status updated to Early Production Information.
Extended document applicability to MPCI-L220-02S and MPCI-L280-72S
R14
25-Nov-2016
lpah
Extended document applicability
applicability to MPCI-L280-72S
R15
19-Apr-2017
lpah
"Disclosure restriction" replaces "Document status" on page 2 and document footer
Extended document applicability to the MPCI-L200-02S-01, MPCI-L210-02S-01,
MPCI-L220-62S and MPCI-L280-02S-01
R16
06-Jun-2017
lpah / sses
Updated MPCI-L201-02S product status to Intial Production
R17
23-Jun-2017
lpah / sses
Extended document applicability to MPCI-L200-03S, MPCI-L210-03S, MPCI-L280-03S
R18
27-Jul-2017
lpah
Updated MPCI-L200-00S-01, MPCI-L210-00S-00 product status to End of Life
R19
03-Jan-2018
lpah / sses
Updated MPCI-L200-02S-01, MPCI-L210-02S-01, MPCI-L280-02S-01 product status to EOL
Updated absolute maximum rating of PERST# pin
UBX-13004749 - R19
to
MPCI-L200-00S-01
and
removed
document
Revision history
Page 29 of 30
MPCI-L2 series - Data Sheet
Contact
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UBX-13004749 - R19
Contact
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