MPCI-L200-00S

MPCI-L2 series LTE/DC-HSPA+/EGPRS Mini PCIe modules Data Sheet Abstract Technical data sheet describing MPCI-L2 series multi-mode cellular modules. The modules are a complete and cost efficient LTE/3G/2G multi-mode solution offering up to 150 Mb/s download data rate and up to 50 Mb/s upload data rate, covering up to six LTE bands, up to five WCDMA/DC-HSPA+ bands and up to four GSM/EGPRS bands. The modules have the industry standard PCI Express Mini Card form factor, which enables easy integration into an application board and is also ideal for manufacturing of small series. www.u-blox.com UBX-13004749 - R14 MPCI-L2 series - Data Sheet Document Information Title MPCI-L2 series Subtitle LTE/DC-HSPA+/EGPRS Mini PCIe modules Document type Data Sheet Document number UBX-13004749 Revision, date R14 Document status Early Production Information 25-Nov-2016 Document status information Objective Specification Document contains target values. Revised and supplementary data will be published later. Advance Information Document contains data based on early testing. Revised and supplementary data will be published later. Early Production Information Document contains data from product verification. Revised and supplementary data may be published later. Production Information Document contains the final product specification. This document applies to the following products: Name Type number Firmware version Application version PCN / IN MPCI-L200 MPCI-L200-00S-00 09.71 A01.15 UBX-14044437 MPCI-L200-00S-01 09.71 A01.30 UBX-16026448 MPCI-L200-02S-00 15.90 A01.00 UBX-15029946 MPCI-L201-01S-00 09.93 A01.07 UBX-15031360 MPCI-L201-02S-00 09.93 A01.20 UBX-16022569 MPCI-L210-00S-00 09.71 A01.15 UBX-14044437 MPCI-L210-02S-00 15.63 A01.03 UBX-15029946 MPCI-L210-60S-00 09.94 A01.00 UBX-15021694 MPCI-L210-60S-01 09.94 A01.01 UBX-16005471 MPCI-L220 MPCI-L220-02S-00 15.93 A01.00 UBX-16025501 MPCI-L280 MPCI-L280-02S-00 15.63 A01.03 UBX-15029946 MPCI-L201 MPCI-L210 u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of u-blox is strictly prohibited. The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time. For most recent documents, please visit www.u-blox.com. Copyright © 2016, u-blox AG. ® u-blox is a registered trademark of u-blox Holding AG in the EU and other countries. Trademark Notice Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. PCI, PCI Express, PCIe, and PCI-SIG are trademarks or registered trademarks of PCI-SIG. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. UBX-13004749 - R14 Page 2 of 30 MPCI-L2 series - Data Sheet Contents Contents.............................................................................................................................. 3 1 Functional description.................................................................................................. 5 1.1 1.2 1.3 1.4 1.5 1.6 2 Overview .............................................................................................................................................. 5 Product features ................................................................................................................................... 5 Block diagram....................................................................................................................................... 6 Product description ............................................................................................................................... 7 AT command support ........................................................................................................................... 8 Supported features ............................................................................................................................... 9 Interfaces .................................................................................................................... 10 2.1 Module supply input ........................................................................................................................... 10 2.2 Antenna RF interfaces ......................................................................................................................... 10 2.3 System functions ................................................................................................................................ 10 2.3.1 Module power-on ....................................................................................................................... 10 2.3.2 Module power-off ....................................................................................................................... 10 2.3.3 Module reset ............................................................................................................................... 10 2.4 SIM interface ...................................................................................................................................... 11 2.5 USB interface ...................................................................................................................................... 11 2.6 W_DISABLE# ...................................................................................................................................... 12 2.7 LED_WWAN# ..................................................................................................................................... 12 3 Pin definition .............................................................................................................. 13 3.1 4 Pin assignment ................................................................................................................................... 13 Electrical specifications .............................................................................................. 15 4.1 Absolute maximum rating .................................................................................................................. 15 4.1.1 Maximum ESD ............................................................................................................................. 15 4.2 Operating conditions .......................................................................................................................... 16 4.2.1 Operating temperature range ...................................................................................................... 16 4.2.2 Supply/power pins ....................................................................................................................... 16 4.2.3 Current consumption .................................................................................................................. 17 4.2.4 LTE/3G/2G RF characteristics........................................................................................................ 17 4.2.5 USB pins ...................................................................................................................................... 18 4.2.6 SIM pins ...................................................................................................................................... 18 4.2.7 PERST# pin .................................................................................................................................. 19 4.2.8 W_DISABLE# pin ......................................................................................................................... 19 4.2.9 LED_WWAN# pin ........................................................................................................................ 19 5 Mechanical specifications .......................................................................................... 20 UBX-13004749 - R14 Early Production Information Contents Page 3 of 30 MPCI-L2 series - Data Sheet 6 Qualification and approvals ...................................................................................... 21 6.1 6.2 7 Reliability tests .................................................................................................................................... 21 Approvals ........................................................................................................................................... 21 Product handling ........................................................................................................ 22 7.1 7.2 Packaging ........................................................................................................................................... 22 ESD precautions.................................................................................................................................. 22 8 Default settings .......................................................................................................... 23 9 Labeling and ordering information........................................................................... 24 9.1 9.2 9.3 Product labeling.................................................................................................................................. 24 Explanation of codes .......................................................................................................................... 25 Ordering information .......................................................................................................................... 26 Appendix .......................................................................................................................... 27 A Glossary ...................................................................................................................... 27 Related documents .......................................................................................................... 28 Revision history ................................................................................................................ 29 Contact .............................................................................................................................. 30 UBX-13004749 - R14 Early Production Information Contents Page 4 of 30 MPCI-L2 series - Data Sheet 1 Functional description 1.1 Overview The MPCI-L2 series comprises complete and cost efficient LTE/3G/2G multi-mode cellular modules in the industry standard PCI Express Mini Card form factor, which enables an easy integration into an application board and it is also ideal for manufacturing of small series. MPCI-L2modules support up to six LTE bands, up to five UMTS/DC-HSPA+ bands and up to four GSM/(E)GPRS bands for data transmission over different regions and network operators. With LTE Category 4 data rates of 150 Mb/s (downlink) and 50 Mb/s (uplink), the modules are ideal for applications requiring the highest data-rates and high-speed internet access. Typical applications are industrial computing, ruggedized terminals, video communications, wireless routers, alarm panels and surveillance, digital signage and payment systems. Product features 24 6 850/900 2100 MPCI-L280 4 1,3,5 24 7,8,28 6 850/900 1900/2100 ● = supported by all product versions 12 Quad ● ● ● ● ● ● ● ● ■ ■ ■ ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● Automotive 1,3,5 8,19 ● Professional 4 ● Standard MPCI-L220 12 Quad Dual stack IPv4/IPv6 850/900 1900/2100 FOTA 6 Embedded HTTP,FTP 1,3,5 24 7,8,20 Embedded TCP/UDP stack 4 ● Jamming detection MPCI-L210 ■ MIMO 2x2 / Rx Diversity 850/1900 ■ Antenna supervisor 6 ■ Network indication 24 ● Digital audio 2,4,5 13,17 Grade ● Analog audio 4 Features ● GPIOs MPCI-L201 12 Quad Audio 2 850/900 AWS 1900/2100 DDC (I C) 6 SDIO (Master) 24 Interfaces USB 2.0 2,4,5 7,17 GSM UART 4 Bands HSUPA category MPCI-L200 Bands HSDPA category UMTS Bands LTE LTE FDD category Module GPRS/EDGE multi-slot class 1.2 ■ = supported by all product versions except versions “00”,”60” Table 1: MPCI-L2 series main features summary UBX-13004749 - R14 Early Production Information Functional description Page 5 of 30 MPCI-L2 series - Data Sheet 1.3 Block diagram As described Figure 1, each MPCI-L2 series module integrates one TOBY-L2 series module, which represents the core of the device, providing the related LTE/3G/2G modem and processing functionalities. Additional signal conditioning circuitry is implemented for PCI Express Mini Card compliance, and two U.FL connectors are available for easy antennas integration. PERST# U.FL Signal conditioning ANT1 TOBY-L2 series U.FL LED_WWAN# W_DISABLE# SIM ANT2 USB VCC Boost converter 3.3Vaux (Supply) Figure 1: MPCI-L2 series block diagram UBX-13004749 - R14 Early Production Information Functional description Page 6 of 30 MPCI-L2 series - Data Sheet 1.4 Product description MPCI-L2 series modules provide 4G LTE, 3G WCDMA/DC-HSPA+, 2G GSM/(E)GPRS multi-mode technology:  MPCI-L200 and MPCI-L201 are mainly designed for operation in America  MPCI-L210 is mainly designed for operation in Europe, Asia and other countries  MPCI-L220 is mainly designed for operation in Japan  MPCI-L280 is mainly designed for operation in south-east Asia and Oceania 4G LTE 3G UMTS/HSDPA/HSUPA 2G GSM/GPRS/EDGE 3GPP Release 9 Long Term Evolution (LTE) Evolved Uni.Terrestrial Radio Access (E-UTRA) Frequency Division Duplex (FDD) DL Multi-Input Multi-Output (MIMO) 2 x 2 3GPP Release 8 Dual-Cell HS Packet Access (DC-HSPA+) UMTS Terrestrial Radio Access (UTRA) Frequency Division Duplex (FDD) DL Rx diversity 3GPP Release 8 Enhanced Data rate GSM Evolution (EDGE) GSM EGPRS Radio Access (GERA) Time Division Multiple Access (TDMA) DL Advanced Rx Performance Phase 1 Band support :  MPCI-L200:  Band 17 (700 MHz)  Band 5 (850 MHz)  Band 4 (1700 MHz)  Band 2 (1900 MHz)  Band 7 (2600 MHz) Band support:  MPCI-L200:  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 4 (AWS, i.e. 1700 MHz)  Band 2 (1900 MHz)  Band 1 (2100 MHz) Band support:  MPCI-L200:  GSM 850 MHz  E-GSM 900 MHz  DCS 1800 MHz  PCS 1900 MHz  MPCI-L201:  Band 17 (700 MHz)  Band 13 (750 MHz)  Band 5 (850 MHz)  Band 4 (1700 MHz)  Band 2 (1900 MHz)  MPCI-L201:  Band 5 (850 MHz)  Band 2 (1900 MHz)  MPCI-L210:  Band 20 (800 MHz)  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 3 (1800 MHz)  Band 1 (2100 MHz)  Band 7 (2600 MHz)  MPCI-L210:  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 2 (1900 MHz)  Band 1 (2100 MHz)  MPCI-L220:  Band 19 (850 MHz)  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 3 (1800 MHz)  Band 1 (2100 MHz)  MPCI-L220:  Band 19 (850 MHz)  Band 8 (900 MHz)  Band 1 (2100 MHz)  MPCI-L280:  Band 28 (750 MHz)  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 3 (1800 MHz)  Band 1 (2100 MHz)  Band 7 (2600 MHz)  MPCI-L280:  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 2 (1900 MHz)  Band 1 (2100 MHz) 1 1  MPCI-L210:  GSM 850 MHz  E-GSM 900 MHz  DCS 1800 MHz  PCS 1900 MHz  MPCI-L280:  GSM 850 MHz  E-GSM 900 MHz  DCS 1800 MHz  PCS 1900 MHz MPCI-L2 series modules support all the E-UTRA channel bandwidths for each operating band according to 3GPP TS 36.521-1 [11]. UBX-13004749 - R14 Early Production Information Functional description Page 7 of 30 MPCI-L2 series - Data Sheet 4G LTE 3G UMTS/HSDPA/HSUPA 2G GSM/GPRS/EDGE LTE Power Class  Class 3 (23 dBm) for LTE mode WCDMA/HSDPA/HSUPA Power Class  Class 3 (24 dBm) for UMTS/HSDPA/HSUPA mode GSM/GPRS (GMSK) Power Class  Class 4 (33 dBm) for GSM/E-GSM band  Class 1 (30 dBm) for DCS/PCS band EDGE (8-PSK) Power Class  Class E2 (27 dBm) for GSM/E-GSM band  Class E2 (26 dBm) for DCS/PCS band Data rate  LTE category 4: up to 150 Mb/s DL, 50 Mb/s UL Data rate  MPCI-L200, MPCI-L201: 2  HSDPA cat.14, up to 21 Mb/s DL  HSUPA cat.6, up to 5.6 Mb/s UL  MPCI-L210, MPCI-L220, MPCI-L280:  HSDPA cat.24, up to 42 Mb/s DL  HSUPA cat.6, up to 5.6 Mb/s UL Data rate 4  GPRS multi-slot class 12 , CS1-CS4, up to 85.6 kb/s DL/UL 4  EDGE multi-slot class 12 , MCS1-MCS9 up to 236.8 kb/s DL/UL 3 Table 2: MPCI-L2 series LTE, 3G and 2G characteristics 1.5 AT command support The MPCI-L2 series modules support AT commands according to 3GPP standards TS 27.007 [1], 27.005 [2] and the u-blox AT command extension. For the complete list of all the supported AT commands and their syntax, see the u-blox AT Commands Manual [3]. RIL (Radio Interface Layer) software for Android is available for MPCI-L2 series modules free of charge. See the Android RIL Production delivery [4] application note for the supported software deliveries and more information. 2 HSDPA category 24 capable GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at which data can be transmitted and received, with higher classes typically allowing faster data transfer rates. 4 GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total. 3 UBX-13004749 - R14 Early Production Information Functional description Page 8 of 30 MPCI-L2 series - Data Sheet 1.6 Supported features Table 3 lists some of the main features supported by MPCI-L2 series modules. For more details see the TOBY-L2 / MPCI-L2 System Integration Manual [5] and u-blox AT Commands Manual [3]. Feature Description Network Indication LED_WWAN# signal provides the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card Electromechanical Specification [9]. Embedded TCP and UDP 5 stack Embedded TCP/IP and UDP/IP stack including the Direct Link mode for TCP and UDP sockets. Sockets can be set in Direct Link mode to establish a transparent end to end communication with an already connected TCP or UDP socket via serial interface. 5 6 FTP , FTPS File Transfer Protocol as well as Secure File Transfer Protocol (SSL encryption of FTP control channel) functionalities are supported via AT commands. 5 HTTP , HTTPS 6 Embedded TLS 1.2 DNS Hyper-Text Transfer Protocol as well as Secure Hyper-Text Transfer Protocol (SSL encryption) functionalities are supported via AT commands. 6 5 Support for DNS functionality. Dual stack IPv4/IPv6 BIP With the support of X.509 certificates, Embedded TLS 1.2 provides server and client authentication, data encryption, data signature and enables TCP/IP applications communicate over a secured and trusted connection. The feature can be configured and enabled by +USECMNG and +USECPRF AT commands. 5 Both Internet Protocol version 4 and Internet Protocol version 6 are supported in parallel. Bearer Independent Protocol for Over-the-Air SIM provisioning. The data transfer to/from the SIM uses either an already active PDP context or a new PDP context established with the APN provided by the SIM card. Multiple PDP contexts 7 Up to 8 PDP contexts can be activated, and multi secondary PDP contexts be associated to a primary PDP context SMS via IMS Allows SMS via embedded IP Multimedia Subsystem (IMS) Firmware update Over AT commands (FOAT) Firmware module upgrade over AT command interface (USB). The feature can be enabled and configured through the +UFWUPD AT command. Firmware update Over 5 The Air (FOTA) Firmware module update over the LTE/3G/2G air interface. The feature can be enabled and configured through the +UFWINSTALL AT command. LTE DL MIMO 2x2 and 3G DL Rx Diversity Improved cellular link quality and reliability on all operating bands. Smart Temperature 8 Supervisor Constant monitoring of the module board temperature:  Warning notification when the temperature approaches an upper or lower predefined threshold  Shutdown notified and forced when the temperature value is outside the specified range (shutdown suspended in case of an emergency call in progress) The Smart Temperature Supervisor feature can be enabled and configured through the +USTS AT command. The sensor measures board temperature, which can differ from ambient temperature. Power saving The power saving configuration is by default disabled, but it can be configured using the +UPSV AT command. When power saving is enabled, the module automatically enters the low power idle-mode whenever possible, reducing current consumption. During idle-mode, the module processor core runs with the internal RTC 32 kHz reference clock. Fast Dormancy The Fast Dormancy feature, defined in 3GPP Rel.8, allows reduction of current consumption and network utilization during periods of data inactivity. It can be activated by +UFDAC and +UDCONF=61 AT commands. Table 3: Some of the main features supported by MPCI-L2 series modules 5 Not supported by “00” and “60” product versions Not supported by “00”, “01”, “60” and MPCI-L201-02S product versions. 7 Not supported by “00”, “60”, MPCI-L200-02S, MPCI-L210-02S, MPCI-L220-02S and MPCI-L280-02S product versions. 8 Not supported by “00”, “01” and “60” product versions. 6 UBX-13004749 - R14 Early Production Information Functional description Page 9 of 30 MPCI-L2 series - Data Sheet 2 Interfaces 2.1 Module supply input MPCI-L2 series modules must be supplied through the 3.3Vaux pins by a DC power supply. The voltage must be stable, because during this operation the current drawn from 3.3Vaux can vary significantly, based on the power consumption profile of the LTE/3G/2G systems (see TOBY-L2 / MPCI-L2 System Integration Manual [5]). 2.2 Antenna RF interfaces The modules have two RF interfaces over two standard U.FL connectors (Hirose U.FL-R-SMT) with a characteristic impedance of 50 . The primary RF port (ANT1) supports both Tx and Rx, providing the main antenna interface, while the secondary RF port (ANT2) supports Rx only for the LTE MIMO 2x2 and 3G Rx diversity configurations. 2.3 System functions 2.3.1 Module power-on MPCI-L2 series can be switched on by:  Rising edge on the 3.3Vaux pin to a valid voltage for module supply, i.e. applying module supply. 2.3.2 Module power-off MPCI-L2 series can be properly switched off by:  Sending the AT+CFUN=127 command (see the u-blox AT Commands Manual [3]) to configure the module in the halt mode, and then removing the 3.3Vaux supply. In this way, the current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed. An abrupt under-voltage shutdown occurs on MPCI-L2 modules when the 3.3Vaux supply is suddenly removed. If this is done without previously configuring the module in the halt mode, the storage of the current parameter settings in the module’s non-volatile memory and the proper network detach are not performed. An over-temperature or an under-temperature shutdown occurs on MPCI-L2 modules when the temperature measured within the cellular module reaches the dangerous area, if the optional Smart Temperature Supervisor feature (not supported by the “00”, “01” and “60” product versions) is enabled and configured by the AT+USTS command. For more details see the TOBY-L2 / MPCI-L2 System integration Manual [5] and the u-blox AT Commands Manual [3]. 2.3.3 Module reset MPCI-L2 series can be reset (rebooted) by:  AT+CFUN command (see the u-blox AT Commands Manual [3]).  AT+CPWROFF command (see the u-blox AT Commands Manual [3]): this behavior differs than TOBY-L2 modules, where MPCI-L2 series modules will boot back up, rather than remain powered off, due to the MPCI-L2 series module’s internal configuration. In both cases, an “internal” or “software” reset of the module is executed: the current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed. An abrupt “external” or “hardware” reset of MPCI-L2 series modules occurs when a low level is applied on the PERST# pin (which is normally set high by an internal pull-up) for a valid time period (see section 4.2.7). In this case the current parameter settings are not saved in the module’s non-volatile memory and a proper network detach is not performed. PERST# line should be driven by open drain, open collector or contact switch. UBX-13004749 - R14 Early Production Information Interfaces Page 10 of 30 MPCI-L2 series - Data Sheet 2.4 SIM interface A SIM card interface is provided on the UIM_PWR, UIM_DATA, UIM_CLK, UIM_RESET pins of the system connector as well as on a micro-SIM (3FF) card holder solderable on the back side of the board: the high-speed SIM/ME interface is implemented as well as the automatic detection of the required SIM supporting voltage. Both 1.8 V and 3 V SIM types are supported (1.8 V and 3 V ME). Activation and deactivation with automatic voltage switch from 1.8 V to 3 V is implemented, according to ISO-IEC 7816-3 specifications. The SIM driver supports the PPS procedure for baud-rate selection, according to the values proposed by the SIM card/chip. 2.5 USB interface MPCI-L2 series modules include a high-speed USB 2.0 compliant interface with maximum 480 Mb/s data rate, representing the interface for any communication with an external host application processor. The module itself acts as a USB device and can be connected to any USB host equipped with compatible drivers. The USB_D+ / USB_D- lines carry the USB serial bus data and signaling, providing all the functionalities for the bus attachment, configuration, enumeration, suspension or remote wakeup according to the Universal Serial Bus Revision 2.0 specification [6]. MPCI-L2 series modules provide by default the following set of USB functions:  CDC-ACM modem: AT commands interface is available over this modem COM port  RNDIS network adapter: Ethernet-over-USB connection is available over this network adapter The USB of MPCI-L2 series modules can be configured by the AT+UUSBCONF command to select different sets of USB functions available in a mutually exclusive way. The configured USB profile can thus consist of a specific set of functions with various capabilities and purposes, such as:  CDC-ACM for AT commands and data  CDC-ACM for diagnostic  RNDIS for Ethernet-over-USB  CDC-ECM for Ethernet-over-USB For more details regarding USB configurations and capabilities, see the TOBY-L2 / MPCI-L2 System integration Manual [5] and the u-blox AT Commands Manual [3], +UUSBCONF AT command. USB drivers are available for the following operating system platforms:  Windows Vista  Windows 7  Windows 8  Windows 8.1  Windows 10  Windows Embedded CE 6.09  Windows Embedded Compact 79  Windows Embedded Compact 20139 MPCI-L2 series modules are compatible with standard Linux/Android USB kernel drivers. 9 For more details see the Windows Embedded OS USB Driver Installation Application Note [7] UBX-13004749 - R14 Early Production Information Interfaces Page 11 of 30 MPCI-L2 series - Data Sheet 2.6 W_DISABLE# MPCI-L2 series includes the W_DISABLE# active-low input signal to disable the radio operations as specified by the PCI Express Mini Card Electromechanical Specification [9]. 2.7 LED_WWAN# MPCI-L2 series includes the LED_WWAN# active-low open drain output to provide the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card Electromechanical Specification [9]. UBX-13004749 - R14 Early Production Information Interfaces Page 12 of 30 MPCI-L2 series - Data Sheet 3 Pin definition 3.1 Pin assignment No PCI Express Mini Card E.M. Spec. Rev. 2.0 MPCI-L2 1 WAKE# NC 2 3.3Vaux 3.3Vaux 3 COEX1 NC 4 GND GND 5 COEX2 NC N/A Internally not connected 6 1.5V NC N/A Internally not connected 7 CLKREQ# NC N/A Internally not connected 8 UIM_PWR UIM_PWR SIM O SIM supply output 1.8 V or 3.0 V output according to the SIM card/chip voltage type. See 4.2.6 for detailed electrical specs. 9 GND GND GND N/A Ground Connect to ground 10 UIM_DATA UIM_DATA SIM I/O SIM data input/output Internal 4.7 k pull-up to UIM_PWR. See 4.2.6 for detailed electrical specs. 11 REFCLK- NC 12 UIM_CLK UIM_CLK 13 REFCLK+ NC 14 UIM_RESET UIM_RESET SIM O SIM reset output Reset output for SIM card/chip. See 4.2.6 for detailed electrical specs. 15 GND GND GND N/A Ground Connect to ground 16 UIM_SPU NC N/A Internally not connected 17 UIM_IC_DM NC N/A Internally not connected 18 GND GND 19 UIM_IC_DP NC N/A 20 W_DISABLE1# W_DISABLE# I Wireless disable input Internal 22 k pull-up to 3.3Vaux. See 4.2.8 for detailed electrical specs. 21 GND GND N/A Ground Connect to ground 22 PERST# PERST# I MPCI reset input Internal 45 k active pull-up to 3.3 V. See 4.2.7 for detailed electrical specs. 23 PERn0 NC N/A 24 3.3Vaux 3.3Vaux 25 PERp0 NC 26 GND GND GND N/A 27 GND GND GND N/A Connect to ground 28 1.5V NC N/A Internally not connected 29 GND GND 30 SMB_CLK NC UBX-13004749 - R14 Voltage domain I/O Description N/A 3.3Vaux I Internally not connected MPCI supply input N/A GND N/A O Ground GND 3.3Vaux N/A I SIM clock output N/A 3.25 MHz output for SIM card/chip. See 4.2.6 for detailed electrical specs. Internally not connected Ground Connect to ground Internally not connected Internally not connected MPCI supply input N/A GND Connect to ground Internally not connected N/A GND Connect to external 3.3 V supply. See 4.2.2 for detailed electrical specs. Internally not connected N/A SIM Remarks Connect to external 3.3 V supply. See 4.2.2 for detailed electrical specs. Internally not connected Ground Ground N/A Early Production Information Connect to ground Connect to ground Internally not connected Pin definition Page 13 of 30 MPCI-L2 series - Data Sheet No PCI Express Mini Card E.M. Spec. Rev. 2.0 MPCI-L2 Voltage domain 31 PETn0 NC N/A Internally not connected 32 SMB_DATA NC N/A Internally not connected 33 PETp0 NC N/A Internally not connected 34 GND GND GND N/A Ground Connect to ground 35 GND GND GND N/A Ground Connect to ground 36 USB_D- USB_D- USB I/O USB Data Line D- 90  nominal differential impedance. Pull-up, pull-down and series resistors as required by USB 2.0 specifications [6] are part of the USB pin driver and need not be provided externally. See 4.2.5 for detailed electrical specs. 37 GND GND GND N/A Ground Connect to ground 38 USB_D+ USB_D+ USB I/O USB Data Line D+ 90  nominal differential impedance. Pull-up, pull-down and series resistors as required by USB 2.0 specifications [6] are part of the USB pin driver and need not be provided externally. See 4.2.5 for detailed electrical specs. 39 3.3Vaux 3.3Vaux 3.3Vaux I MPCI supply input Connect to external 3.3 V supply. See 4.2.2 for detailed electrical specs. 40 GND GND GND N/A Ground Connect to ground 41 3.3Vaux 3.3Vaux 3.3Vaux I MPCI supply input Connect to external 3.3 V supply. See 4.2.2 for detailed electrical specs. 42 LED_WWAN# LED_WWAN# O LED indicator output Open drain active low output. See 4.2.9 for detailed electrical specs. 43 GND GND N/A Ground Connect to ground 44 LED_WLAN# NC N/A Internally not connected 45 Reserved NC N/A Internally not connected 46 LED_WPAN# NC N/A Internally not connected 47 Reserved NC N/A Internally not connected 48 1.5V NC N/A Internally not connected 49 Reserved NC N/A Internally not connected 50 GND GND 51 W_DISABLE2# NC 52 3.3Vaux 3.3Vaux I/O GND GND N/A Description Ground N/A 3.3Vaux I Remarks Connect to ground Internally not connected MPCI supply input Connect to external 3.3 V supply. See 4.2.2 for detailed electrical specs. Table 4: MPCI-L2 series system connector pin assignment UBX-13004749 - R14 Early Production Information Pin definition Page 14 of 30 MPCI-L2 series - Data Sheet 4 Electrical specifications Stressing the device above one or more of the ratings listed in the Absolute Maximum Rating section may cause permanent damage. These are stress ratings only. Operating the module at these or at any conditions other than those specified in the Operating Conditions sections (chapter 4.1) of the specification should be avoided. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Operating condition ranges define those limits within which the functionality of the device is guaranteed. Where application information is given, it is advisory only and does not form part of the specification. 4.1 Absolute maximum rating Limiting values given below are in accordance with the Absolute Maximum Rating System (IEC 134). Symbol Description Condition Min. Max. Unit 3.3Vaux Module supply voltage Input DC voltage at 3.3Vaux pins –0.3 6.3 V USB USB D+/D- pins Input DC voltage at USB interface pins 3.6 V SIM SIM interface Input DC voltage at SIM interface pins –0.3 3.6 V PERST# MPCI reset input Input DC voltage at PERST# input pin –0.3 6.0 V W_DISABLE# Wireless disable input Input DC voltage at W_DISABLE# input pin –0.3 3.6 V LED_WWAN# LED indicator output Input DC voltage at LED_WWAN# output pin –0.3 6.0 V Rho_ANT Antenna ruggedness Output RF load mismatch ruggedness at ANT1 / ANT2 10:1 VSWR Tstg Storage Temperature 85 °C –40 Table 5: Absolute maximum ratings The product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes exceeding the power supply voltage specification, given in table above, must be limited to values within the specified boundaries by using appropriate protection devices. 4.1.1 Maximum ESD Parameter Min Typical Max Unit Remarks ESD sensitivity for all pins except ANT1 / ANT2 1000 V Human Body Model according to JESD22-A114 ESD sensitivity for ANT1 / ANT2 1000 V Human Body Model according to JESD22-A114 ESD immunity for ANT1 / ANT2 4000 V Contact Discharge according to IEC 61000-4-2 8000 V Air Discharge according to IEC 61000-4-2 Table 6: Maximum ESD ratings u-blox cellular modules are Electrostatic Sensitive Devices and require special precautions when handling. See section 7.2 for ESD handling instructions. UBX-13004749 - R14 Early Production Information Electrical specifications Page 15 of 30 MPCI-L2 series - Data Sheet 4.2 Operating conditions Unless otherwise indicated, all operating condition specifications are at an ambient temperature of 25°C. Operation beyond the operating conditions is not recommended and extended exposure beyond them may affect device reliability. 4.2.1 Operating temperature range Parameter Min. Typical Max. Unit Remarks Normal operating temperature –20 +25 +65 °C Normal operating temperature range (fully functional and meet 3GPP specifications) Extended operating temperature –40 +85 °C Extended operating temperature range (RF performance may be affected outside normal operating range, though module is fully functional) Table 7: Environmental conditions 4.2.2 Supply/power pins Symbol 3.3Vaux Parameter Module supply operating input voltage 10 Min. Typical Max. Unit 3.00 3.30 3.60 V Table 8: Input characteristics of Supply/Power pins 10 Input voltage at 3.3Vaux must be above the normal operating range minimum limit to switch-on the module. UBX-13004749 - R14 Early Production Information Electrical specifications Page 16 of 30 MPCI-L2 series - Data Sheet 4.2.3 Current consumption Mode Condition Idle-Mode (Power Saving enabled by AT+UPSV, module in low power idle-mode, equivalent to +CFUN=4 or +COPS=2) Averaged current value over a 100-ms period, USB connected and suspended 1.8 mA Cyclic Idle/Active-Mode (Power Saving enabled by AT+UPSV, Module registered with network) Averaged current value over a 10-minute period, USB interface suspended 3.9 mA Active-Mode (Power Saving disabled by AT+UPSV, Module registered with network) Averaged current value over a 10-minute period, USB interface not suspended 59 mA 2G Connected Mode (Tx / Rx call enabled) Pulse current during a 1-slot GMSK Tx burst, 850/900 MHz bands Maximum 2.6 A Averaged current value over a 10-second period, Maximum 2G GMSK call, 1 Tx + 1 Rx slot, 850/900 MHz 380 mA Averaged current value over a 10-second period, Maximum 2G GMSK call, 1 Tx + 1 Rx slot, 1800/1900 MHz 295 mA Averaged current value over a 10-second period, Minimum 3G call with Low data rate 0 dBm 245 mA 265 mA 12 dBm 365 mA 18 dBm 505 mA Maximum 680 mA Averaged current value over a 10-second period, Maximum 3G call with Maximum data rate 790 mA Averaged current value over a 10-second period, Minimum LTE call with Low data rate 0 dBm 395 mA 415 mA 12 dBm 520 mA 18 dBm 650 mA Maximum 815 mA Averaged current value over a 10-second period, Maximum LTE call with Maximum data rate 880 mA 3G Connected Mode (Tx / Rx call enabled) LTE Connected Mode (Tx / Rx call enabled) Tx power Min Typ Max Unit Table 9: Module 3.3Vaux supply current consumption 4.2.4 LTE/3G/2G RF characteristics MPCI-L2 series LTE/3G/2G RF characteristics are specified in the TOBY-L2 series Data Sheet [10]. UBX-13004749 - R14 Early Production Information Electrical specifications Page 17 of 30 MPCI-L2 series - Data Sheet 4.2.5 USB pins USB data lines (USB_D+ / USB_D-) are compliant to the USB 2.0 high-speed specification. The values in Table 10 are for information only. See the USB 2.0 specifications [6] for detailed electrical characteristics. Parameter Min. High-speed squelch detection threshold (input differential signal amplitude) Typical Max. Unit 100 150 mV High speed disconnect detection threshold (input differential signal amplitude) 525 625 mV High-speed data signaling input common mode voltage range –50 500 mV High-speed idle output level –10 10 mV High-speed data signaling output high level 360 440 mV High-speed data signaling output low level –10 10 mV Chirp J level (output differential voltage) 700 1100 mV Chirp K level (output differential voltage) –900 –500 mV Remarks Table 10: USB pins characteristics 4.2.6 SIM pins The SIM pins are a dedicated interface to the external SIM card/chip. The electrical characteristics fulfill regulatory specification requirements. The values in Table 11 are for information only. Parameter Min. Typical Max. Unit Remarks UIM_PWR supply output 1.76 1.80 1.85 V 1.8 V SIM type 2.84 2.90 2.94 V 3.0 V SIM type –0.30 0.63 V 1.8 V SIM type –0.30 0.80 V 3.0 V SIM type 1.17 2.10 V 1.8 V SIM type 2.00 3.30 V 3.0 V SIM type 0.00 0.45 V 1.8 V SIM type, Max value at IOL = +2.0 mA 0.00 0.40 V 3.0 V SIM type, Max value at IOL = +2.0 mA Low-level input High-level input Low-level output High-level output Input / Output leakage current 1.35 1.80 V 1.8 V SIM type, Min value at IOH = –2.0 mA 2.60 2.90 V 3.0 V SIM type, Min value at IOH = –2.0 mA nA 0 V < VIN < 0.63 V or 1.17 V < VIN < 2.10 V 0 V < VIN < 0.80 V or 2.00 V < VIN < 3.30 V –500 500 Clock frequency on UIM_CLK 3.25 MHz Internal pull-up on UIM_DATA 4.7 k Internal pull-up to UIM_PWR supply Table 11: SIM pins characteristics UBX-13004749 - R14 Early Production Information Electrical specifications Page 18 of 30 MPCI-L2 series - Data Sheet 4.2.7 PERST# pin Pin Name Parameter Min. PERST# Low-level input 0.00 High-level input 2.60 L-level input current Pull-up resistance 35 PERST# low time 2.1 Typical Max. Unit 1.10 V 3.70 V Remarks -82 µA 45 k Internal active pull-up to 3.3 V s Low time to reset the module Max. Unit Remarks 0.80 V 3.60 V Table 12: PERST# pin characteristics 4.2.8 W_DISABLE# pin Pin Name Parameter Min. W_DISABLE# Low-level input 0.00 High-level input 2.00 Pull-up resistance Typical 22 k Internal pull-up to 3.3Vaux Table 13: W_DISABLE# pin characteristics 4.2.9 LED_WWAN# pin Pin Name Parameter LED_WWAN# Low-level output Min. Typical Max. Unit Remarks 0.00 0.40 V Open-drain output Max value at IOL = +9.0 mA Table 14: LED_WWAN# pin characteristics UBX-13004749 - R14 Early Production Information Electrical specifications Page 19 of 30 MPCI-L2 series - Data Sheet 5 Mechanical specifications MPCI-L2 series modules are fully compliant to the 52-pin PCI Express Full-Mini Card Type F2 form factor, with top-side and bottom-side keep-out areas, with 50.95 mm nominal length, 30 mm nominal width and all the other dimensions as defined by the PCI Express Mini Card Electromechanical Specification [9] except for the card thickness (nominal value is 3.7 mm), as described in Figure 2. MPCI-L2 series modules weight is about 9.7 g. 45.25 mm Hole Pin 51 GND 11 mm ANT1 Top View 19 mm ANT2 GND Pin 1 Hole Side View 3.7 mm Hole Pin 2 GND Bottom View 30 mm GND Pin 52 Hole 50.95 mm Figure 2: MPCI-L2 series mechanical dimensions (top view, side view, bottom view) For further details regarding mechanical specifications see the PCI Express Mini Card Electromechanical Specification [9]. UBX-13004749 - R14 Early Production Information Mechanical specifications Page 20 of 30 MPCI-L2 series - Data Sheet 6 Qualification and approvals 6.1 Reliability tests Tests for product family qualifications according to ISO 16750 “Road vehicles - Environmental conditions and testing for electrical and electronic equipment“, and appropriate standards. 6.2 Approvals Products marked with this lead-free symbol on the product label comply with the "Directive 2002/95/EC of the European Parliament and the Council on the Restriction of Use of certain Hazardous Substances in Electrical and Electronic Equipment" (RoHS). MPCI-L2 series modules are RoHS compliant. No natural rubbers, hygroscopic materials, or materials containing asbestos are employed. The following table summarizes the main approvals for MPCI-L2 series modules. Certification scheme MPCI-L200 MPCI-L201 MPCI-L210 MPCI-L220 MPCI-L280 GCF (Global Certification Forum) • • 11 PTCRB (PCS Type Certification Review Board) • • 11 R&TTE (Radio & Telecommunications Terminal Equipment EU Directive) Notified Body number • • • 1588 1588 1588 CE (Conformité Européenne) Notified Body number • 1588 • 1588 • 1588 FCC (United States Federal Communications Commission) FCC identification number ISED (Innovation, Science and 12 Economic Development) ISED certification number • • • • • • • • Contains FCC ID XPYTOBYL200 Contains FCC ID XPYTOBYL201 Contains FCC ID XPYTOBYL210 Contains FCC ID XPYTOBYL280 • • • • Contains IC 8595A-TOBYL200 Contains IC 8595A-TOBYL201 Contains IC 8595A-TOBYL210 Contains IC 8595A-TOBYL280 Anatel (Brazilian Certification) • • RCM (Australian Regulatory Compliance Mark) • • NCC (Taiwanese National Communications Commission) • • KC (Korean Certification) • Giteki Mark (Japanese Certification) • SoftBank (Japanese network operator) • AT&T (US network operator) • Verizon (US network operator) • 11 • 11 • Table 15: MPCI-L2 series main certification approvals summary For the complete list of approvals and for specific details on all country and network operators’ certifications, see our website www.u-blox.com or please contact the u-blox office or sales representative nearest you. 11 12 TOBY-L201 formerly known as IC - Industry Canada UBX-13004749 - R14 Early Production Information Qualification and approvals Page 21 of 30 MPCI-L2 series - Data Sheet 7 Product handling 7.1 Packaging MPCI-L2 modules are delivered as hermetically sealed trays of 32 pieces, 5 trays in 1 package (160 units in total), to enable efficient production, production lot set-up and tear-down. For more information about packaging, see the u-blox Package Information Guide [8]. Quantities of less than 160 pieces are also available. Contact u-blox for more information. 7.2 ESD precautions MPCI-L2 series modules contain highly sensitive electronic circuitry and are Electrostatic Sensitive Devices (ESD). Handling MPCI-L2 series modules without proper ESD protection may destroy or damage them permanently. MPCI-L2 series modules are Electrostatic Sensitive Devices (ESD) and require special ESD precautions typically applied to ESD sensitive components. Table 6 reports the maximum ESD ratings of the MPCI-L2 series modules. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates MPCI-L2 series module. ESD precautions should be implemented on the application board where the module is mounted, as described in the TOBY-L2 / MPCI-L2 System Integration Manual [5]. Failure to observe these recommendations can result in severe damage to the device! UBX-13004749 - R14 Early Production Information Product handling Page 22 of 30 MPCI-L2 series - Data Sheet 8 Default settings Item AT Settings Comments USB interface Enabled MPCI-L2 series modules provide by default the following set of USB functions:  CDC-ACM for AT command and data  RNDIS for Ethernet-over-USB connection The USB can be configured by the AT+UUSBCONF command to select different sets of USB functions available in mutually exclusive way, configuring the active USB profile consisting of a specific set of functions with various capabilities and purposes (for more details, see the TOBY-L2 / MPCI-L2 System Integration Manual [5] and the u-blox AT Commands Manual [3], +UUSBCONF AT command). Power Saving AT+UPSV=0 Disabled Network registration AT+COPS=0 Self network registration Table 16: Default settings UBX-13004749 - R14 Early Production Information Default settings Page 23 of 30 MPCI-L2 series - Data Sheet 9 Labeling and ordering information 9.1 Product labeling The labels of MPCI-L2 series modules include important product information as described in this section. Figure 3, Figure 4 and Figure 5 illustrate the label of MPCI-L2 series modules, which is placed on the bottom side of the modules, including: the u-blox logo, Pb-free marking, product type number, production lot, certification numbers and production country. 1588 Figure 3: Label of MPCI-L2 series modules (except MPCI-L210-60S and MPCI-L220) 60S-xx MPCI-L210 1588 D150057003 003-150063 Figure 4: Label of MPCI-L210-60S modules 02S-xx MPCI-L220 AD160009003 003-160020 Figure 5: Label of MPCI-L220 modules UBX-13004749 - R14 Early Production Information Labeling and ordering information Page 24 of 30 MPCI-L2 series - Data Sheet 9.2 Explanation of codes Three different product code formats are used. The Product Name is used in documentation such as this data sheet and identifies all u-blox products, independent of packaging and quality grade. The Ordering Code includes options and quality, while the Type Number includes the hardware and firmware versions. Table 17 details these 3 different formats: Format Structure Product Name MPCI-TGVV Ordering Code MPCI-TGVV-MMQ Type Number MPCI-TGVV-MMQ-XX Table 17: Product Code Formats Table 18 explains the parts of the product code. Code Meaning Example PPPP Form factor MPCI TG Platform (Technology and Generation) L2  Dominant technology: G: GSM; U: HSUPA; C: CDMA 1xRTT; N: NB-IoT; R: LTE low data rate (Cat 1 and below); L: LTE high data rate (Cat 3 and above)  Generation: 1…9 VV Variant function set based on the same platform [00…99] 00 MM Major product version [00…99] 00 Q Product grade S XX  S = professional  A = automotive Minor product version (not relevant for certification) Default value is 00 Table 18: Part identification code UBX-13004749 - R14 Early Production Information Labeling and ordering information Page 25 of 30 MPCI-L2 series - Data Sheet 9.3 Ordering information Ordering No. Product MPCI-L200-00S LTE bands 2 / 4 / 5 / 7 / 17, DC-HSPA+ bands 1 / 2 / 4 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in America 51 x 30 x 3.7 mm, 160 pcs/package MPCI-L200-02S LTE bands 2 / 4 / 5 / 7 / 17, DC-HSPA+ bands 1 / 2 / 4 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in America, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package MPCI-L201-01S LTE bands 2 / 4 / 5 / 13 / 17, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in America, supporting embedded TCP/UDP, HTTP/FTP 51 x 30 x 3.7 mm, 160 pcs/package MPCI-L201-02S LTE bands 2 / 4 / 5 / 13 / 17, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in America, supporting embedded TCP/UDP, HTTP/FTP, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package MPCI-L210-00S LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in Europe, Asia and other countries 51 x 30 x 3.7 mm, 160 pcs/package MPCI-L210-60S LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module approved by SoftBank Japanese mobile network operator 51 x 30 x 3.7 mm, 160 pcs/package MPCI-L210-02S LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in Europe, Asia and other countries, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package MPCI-L220-02S LTE bands 1 / 3 / 5 / 8 / 19, DC-HSPA+ bands 1 / 8 / 19 module, PCI Express Mini Card module mainly designed for operation in Japan, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package MPCI-L280-02S LTE bands 1 / 3 / 5 / 7 / 8 / 28, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS bands 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in South East-Asia and Oceania, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package Table 19: Product ordering codes UBX-13004749 - R14 Early Production Information Labeling and ordering information Page 26 of 30 MPCI-L2 series - Data Sheet Appendix A Glossary Name Definition 3FF Third Form Factor (micro-SIM card) ACM Abstract Control Model CDC Communications Device Class DDC Display Data Channel (I C compatible) Interface DL Down-link (Reception) DRX Discontinuous Reception ECM Ethernet networking Control Model ERS External Reset Input Signal ESD Electrostatic Discharge FOAT Firmware update Over AT commands FOTA Firmware update Over The Air FW Firmware GMSK Gaussian Minimum-Shift Keying modulation GND Ground GPIO General Purpose Input Output H High HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access I Input (means that this is an input port of the module) IMEI International Mobile Equipment Identity L Low LGA Land Grid Array LTE Long Term Evolution MIMO Multi-Input Multi-Output N/A Not Applicable O Output (means that this is an output port of the module) OD Open Drain PCN / IN Product Change Notification / Information Note PD Pull-Down PU Pull-Up RNDIS Remote Network Driver Interface Specification SDIO Secure Digital Input Output SIM Subscriber Identity Module T Tristate TBD To Be Defined UART Universal Asynchronous Receiver-Transmitter serial interface UL Up-link (Transmission) USB Universal Serial Bus 2 Table 20: Explanation of abbreviations and terms used UBX-13004749 - R14 Early Production Information Appendix Page 27 of 30 MPCI-L2 series - Data Sheet Related documents [1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] 3GPP TS 27.007 - AT command set for User Equipment (UE) 3GPP TS 27.005 - Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) u-blox AT Commands Manual, Docu No UBX-13002752 u-blox Android RIL Production delivery Application note, Docu No UBX-13002041 u-blox TOBY-L2 / MPCI-L2 series System Integration Manual, Docu No UBX-13004618 Universal Serial Bus Revision 2.0 specification, http://www.usb.org/developers/docs/usb20_docs/ u-blox Windows Embedded OS USB Driver Installation Application Note, Docu No UBX-14003263 u-blox Package Information Guide, Docu No UBX-14001652 PCI Express Mini Card Electromechanical Specification, Revision 2.0, April 21, 2012 u-blox TOBY-L2 series Data Sheet, Docu No UBX-13004573 3GPP TS 36.521-1 - Evolved Universal Terrestrial Radio Access; User Equipment conformance specification; Radio transmission and reception; Part 1: Conformance Testing For regular updates to u-blox documentation and to receive product change notifications register on our homepage. UBX-13004749 - R14 Early Production Information Related documents Page 28 of 30 MPCI-L2 series - Data Sheet Revision history Revision Date Name Status / Comments R01 20-Dec-2013 jpod / sses Initial release R02 14-Oct-2014 lpah / sses Advance Information document status Updated module power-on, power-off and reset description Updated module thickness and improved mechanical description Minor corrections in PERST#, W_DISABLE#, LED_WWAN# description Added module current consumption values Added and updated other minor electrical characteristics R03 28-Jan-2015 sses Early Production Information document status R04 19-Aug-2015 sses Objective Specification document status Added description of MPCI-L200-02S, MPCI-L210-02S and MPCI-L210-60S versions. R05 25-Sep-2015 lpah Advance Information status R06 14-Oct-2015 sses Objective Specification document status Added description of MPCI-L280-02S version R07 26-Nov-2015 lpah Document status changed to Early Production Information R08 22-Dec-2015 lpah / sses Added description of MPCI-L201-01S version R09 31-Mar-2016 sses Updated features planned for future product versions. Minor other corrections and description improvements. R10 27-Apr-2016 lpah Extended document applicability to MPCI-L210-60S-01 R11 15-Jul-2016 sses Document status reverted to Objective Specification Added description of MPCI-L201-02S version R12 28-Sep-2016 sses Document status updated to Advance Information Updated support of some minor features in specific product versions R13 21-Oct-2016 lpah Document status updated to Early Production Information. Extended document applicability to MPCI-L220-02S and MPCI-L280-72S R14 25-Nov-2016 lpah Extended document applicability to MPCI-L200-00S-01 and removed document applicability to MPCI-L280-72S UBX-13004749 - R14 Early Production Information Revision history Page 29 of 30 MPCI-L2 series - Data Sheet Contact For complete contact information visit us at www.u-blox.com u-blox Offices North, Central and South America u-blox America, Inc. Phone: +1 703 483 3180 E-mail: info_us@u-blox.com Regional Office West Coast: Phone: +1 408 573 3640 E-mail: info_us@u-blox.com Headquarters Europe, Middle East, Africa u-blox AG Phone: +41 44 722 74 44 E-mail: info@u-blox.com Support: support@u-blox.com Technical Support: Phone: +1 703 483 3185 E-mail: support_us@u-blox.com Asia, Australia, Pacific u-blox Singapore Pte. Ltd. Phone: +65 6734 3811 E-mail: info_ap@u-blox.com Support: support_ap@u-blox.com Regional Office Australia: Phone: +61 2 8448 2016 E-mail: info_anz@u-blox.com Support: support_ap@u-blox.com Regional Office China (Beijing): Phone: +86 10 68 133 545 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com Regional Office China (Chongqing): Phone: +86 23 6815 1588 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com Regional Office China (Shanghai): Phone: +86 21 6090 4832 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com Regional Office China (Shenzhen): Phone: +86 755 8627 1083 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com Regional Office India: Phone: +91 80 4050 9200 E-mail: info_in@u-blox.com Support: support_in@u-blox.com Regional Office Japan (Osaka): Phone: +81 6 6941 3660 E-mail: info_jp@u-blox.com Support: support_jp@u-blox.com Regional Office Japan (Tokyo): Phone: +81 3 5775 3850 E-mail: info_jp@u-blox.com Support: support_jp@u-blox.com Regional Office Korea: Phone: +82 2 542 0861 E-mail: info_kr@u-blox.com Support: support_kr@u-blox.com Regional Office Taiwan: Phone: +886 2 2657 1090 E-mail: info_tw@u-blox.com Support: support_tw@u-blox.com UBX-13004749 - R14 Early Production Information Contact Page 30 of 30