VPFEM5128GZIBMTL

SATA 6Gb/s M.2 SATA Manual M.2 SATA is a non-volatile, solid-state storage device delivering Serial ATA performance, reliability and ruggedness for environmentally challenging applications. Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 1 of 41 Revision History Date Revision 3/10/17 A 3/13/17 B 3/21/17 C 5/18/17 D 7/24/17 E Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com Description Initial Release. Revised based on PSFEM6XXXGSXXX_D with new PN’s performance, block diagram, TBW, power consumption. Add VPFEM6030GZCDMTL. Add Industrial Temperature PN’s Add VPFEM6030GZCDMTL. Add Industrial Temperature PN’s. Revise note 2 on Extended SMART Attribute Actual Data table. Add 8GB and 16GB info. Add section on Flash Management Add PN’s VPFEM5008GZCWMTL and VPFEM5016GZCDMTL. Remove I.T. from page1. Add 8GB LBA Checked By Add IOPS and MB/s performance based on IOMETER06 7/24/2017 Viking Technology Page 2 of 41 Legal Information Legal Information Copyright© 2017 Sanmina Corporation. All rights reserved. The information in this document is proprietary and confidential to Sanmina Corporation. No part of this document may be reproduced in any form or by any means or used to make any derivative work (such as translation, transformation, or adaptation) without written permission from Sanmina. Sanmina reserves the right to revise this documentation and to make changes in content from time to time without obligation on the part of Sanmina to provide notification of such revision or change. Sanmina provides this documentation without warranty, term or condition of any kind, either expressed or implied, including, but not limited to, expressed and implied warranties of merchantability, fitness for a particular purpose, and noninfringement. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made. In no event will Sanmina be liable for damages arising directly or indirectly from any use of or reliance upon the information contained in this document. Sanmina may make improvements or changes in the product(s) and/or the program(s) described in this documentation at any time. Sanmina, Viking Technology, Viking Modular Solutions, and Element logo are trademarks of Sanmina Corporation. Other company, product or service names mentioned herein may be trademarks or service marks of their respective owners. Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 3 of 41 Ordering Information: M.2 SATA SSD Solid-State Drive Length (mm) Interface Application User Capacity (GB) Temperature (C) NAND VPFEM5008GZCWMTL 80 SATA 6GB Client 8 0 to 70 TSB 15nm MLC VPFEM5016GZCDMTL VPFEM5032GZCDMTL VPFEM5060GZCDMTL VPFEM5256GZCAMTL VPFEM5008GZIWMTL VPFEM5016GZIDMTL VPFEM5032GZIDMTL VPFEM5064GZIDMTL VPFEM5128GZIBMTL VPFEM5256GZIAMTL VPFEM5512GZIZMTL 80 80 80 80 80 80 80 80 80 80 80 SATA 6GB SATA 6GB SATA 6GB SATA 6GB SATA 6GB SATA 6GB SATA 6GB SATA 6GB SATA 6GB SATA 6GB SATA 6GB Client Client Client Client Client Client Client Client Client Client Client 16 32 60 256 8 16 32 64 128 256 512 0 to 70 0 to 70 0 to 70 0 to 70 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 TSB 15nm MLC TSB 15nm MLC TSB 15nm MLC TSB 15nm MLC TSB 15nm MLC TSB 15nm MLC TSB 15nm MLC TSB 15nm MLC TSB 15nm MLC TSB 15nm MLC TSB 15nm MLC Part Number Notes:  Refer to Product Specifications for Capacity and LBA count  Lower case “x” is the NAND device code Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 4 of 41 Client SSD’s – Viking’s client SSD contains sophisticated provisions to protect firmware and data from corruption due to unexpected power loss. However, should power fail unexpectedly, “in-flight” write data may be lost if the SSD power is not managed at the system level for these power fail events. Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 5 of 41 Table of Contents 1 INTRODUCTION 9 1.1 Features 1.2 Block Diagram 10 1.3 SATA Interface 11 2 PRODUCT SPECIFICATIONS 9 12 2.1 Capacity and LBA count 12 2.2 Performance 13 2.3 Timing 2.3.1 STANDBY IMMEDIATE Command 14 14 2.4 Flash Management 2.4.1 Error Correction Code (ECC) 2.4.2 Wear Leveling 2.4.3 Bad Block Management 2.4.4 TRIM 2.4.5 SMART 2.4.6 Over-Provision 2.4.7 Firmware Upgrade 15 15 15 15 15 16 16 16 2.5 Low Power Management 2.5.1 DEVSLP Mode (Optional) 2.5.2 DIPM/HIPM Mode 16 16 16 2.6 17 Power Loss Protection: Flushing Mechanism (Optional) 2.7 Advanced Device Security Features 2.7.1 Secure Erase 2.7.2 Write Protect 17 17 17 2.8 SSD Lifetime Management 2.8.1 Terabytes Written (TBW) 2.8.2 Thermal Monitor (Optional) 18 18 18 2.9 An Adaptive Approach to Performance Tuning 2.9.1 Throughput 2.9.2 Predict & Fetch 18 18 18 Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 6 of 41 2.9.3 Compression 19 2.10 Electrical Characteristics 2.10.1 Absolute Maximum Ratings 2.10.2 Supply Voltage 2.10.3 Power Consumption 20 20 20 20 2.11 Environmental Conditions 2.11.1 Temperature and Altitude 2.11.2 Shock and Vibration 2.11.3 Electromagnetic Immunity 21 21 21 21 2.12 21 3 Reliability MECHANICAL INFORMATION 22 3.1 Dimensions 22 3.2 Card Edge Detail 24 3.3 M.2 SSD Weight 26 4 PIN AND SIGNAL DESCRIPTIONS 26 4.1 Signal and Power Description Tables 26 4.2 Hot Plug Support 27 5 COMMAND SETS 27 5.1 ATA Commands 5.1.1 48-Bit Address Command Set 5.1.2 ATA General Feature Command Set 5.1.3 Device Configuration Overlay Command Set 5.1.4 General Purpose Log Command Set 5.1.5 Host Protected Area Command Set 5.1.6 Power Management Command Set 5.1.7 Security Mode Feature Set 5.1.8 Identify Device Data 5.1.1 S.M.A.R.T. Support 5.1.2 SATA 3.0 S.M.A.R.T. Command Set 27 28 29 29 29 29 30 30 31 35 36 5.2 SATA Commands 5.2.1 Native Command Queuing (NCQ) 40 40 6 REFERENCES 40 7 GLOSSARY 41 Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 7 of 41 Table of Tables Table 2-1: Maximum Sustained Read and Write Bandwidth ____________________________ 13 Table 2-2: Sequential Read and Write Bandwidth (Iometer 06) _________________________ 13 Table 2-3: Random Read/ Write Input/Output Operations per Second (IOPS) (Iometer 06) ____ 14 Table 2-3: Timing Specifications _________________________________________________ 14 Table 2-4: STANDBY IMMEDIATE Timing _________________________________________ 15 Table 2-5: Absolute Maximum Ratings ____________________________________________ 20 Table 2-6: Operating Voltage ____________________________________________________ 20 Table 2-7: Typical Power Consumption at 3.3V ______________________________________ 20 Table 2-8: Temperature and Altitude Related Specifications ____________________________ 21 Table 2-9: Shock and Vibration Specifications _______________________________________ 21 Table 2-10: Reliability Specifications ______________________________________________ 21 Table 3-1: M.2 SSD weight ______________________________________________________ 26 Table 4-1: M.2 SATA Connector Pin Signal Definitions ________________________________ 26 Table 5-1: Supported ATA Commands ____________________________________________ 27 Table 5-2: List of Device Identification _____________________________________________ 31 Table 5-3: S.M.A.R.T. Command Set ______________________________________________ 36 Table 5-4: Extended SMART Attribute Table ________________________________________ 36 Table 5-5: Extended SMART Attribute Actual Data ___________________________________ 37 Table 5-6: Supported S.M.A.R.T. EXECUTE OFF-LINE IMMEDIATE Subcommands ________ 40 Table of Figures Figure 1-1: High-Level Block Diagram _____________________________________________ 10 Figure 3-1: Dimensions ________________________________________________________ 22 Figure 3-2: Dimension Details for M.2 80mm length __________________________________ 23 Figure 3-3: Dimension Details for M.2 card edge _____________________________________ 24 Figure 3-4: Dimension Details for M.2 connector and notch ____________________________ 25 Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 8 of 41 1 Introduction Viking’s rugged industrial designed SSD’s offer the highest flash storage reliability and performance in harsh environments such as shock, vibration, humidity, altitude, ESD, and extreme temperatures. 1.1 Features The SSD delivers the following features:  Offers seamless SATA Revision 3.0 interface support for SATA up to 6Gb/s  Low overall SSD power consumption  Supports Native Command Queuing (NCQ) to 32 commands  Compatible with all major SLC and MLC flash technologies  S.M.A.R.T.  Superior wear-leveling algorithm  Efficient error recovery  Compliant with ONFI 4.0 interface: o SDR up to mode 5 o NV-DDR up to mode 5 o NV-DDR2 up to mode 7 o NV-DDR3 up to mode 8 Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 9 of 41 1.2 Block Diagram Figure 1-1: High-Level Block Diagram Notes: 1. Support for up to 2-channels and 2 CE in the NAND Flash interface Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 10 of 41 1.3 SATA Interface    The Serial ATA (SATA) interface is compliant with the SATA IO Serial ATA specification, revision 3.0 that supports SATA up to 6 Gbps. The SATA interface connects the host computer to the SSD subsystem. The SATA interface runs at a maximum speed of 6 Gbps (Giga-bits per second). If the host computer is unable to negotiate a speed of 6 Gbps, the SATA interface automatically renegotiates to a speed of 3 Gbps or 1.5 Gbps. For a list of supported commands and other specifics, please see Chapter 5. Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 11 of 41 2 Product Specifications 2.1 Capacity and LBA count Raw Capacity (GB) User Capacity (GB) LBA Count 8 8 15,649,200 16 14 27,370,224 16 16 31,277,232 32 30 58,626,288 32 32 62,533,296 64 60 117,231,408 64 64 125,045,424 128 120 234,441,648 128 128 250,069,680 256 240 468,862,128 256 256 500,118,192 512 480 937,703,088 512 512 1,000,215,216 Notes: 1. Per www.idema.org, LBA1-03 spec, LBA counts = (97,696,368) + (1,953,504 * (Advertised Capacity in GBytes – 50)) 2. GB capacities based on power of 10, GiB capacities are based on powers of 2 Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 12 of 41 2.2 Performance Table 2-1: Maximum Sustained Read and Write Bandwidth Capacity 8GB 16GB 30/32GB 60/64GB 120/128GB 240/256GB 480/512GB Flash Structure 8GBx1, TSOP, TSB 15nm 16GBx1, TSOP, TSB 15nm 32GBx1, BGA, TSB 15nm 32GBx2, BGA, TSB 15nm 64GBx2, BGA, TSB 15nm 128GBx2, BGA, TSB 15nm 256GBx2, BGA, TSB 15nm Performance CrystalDiskMark ATTO Read Write Read Write (MB/s) (MB/s) (MB/s) (MB/s) 320 105 560 540 320 85 560 540 550 175 550 540 550 335 550 540 550 465 550 540 550 465 550 540 550 470 550 540 Notes: 1. Performance measured using CrystalDiskMark. 2. Performance may vary from flash configuration, SDR configuration, and platform. 3. Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology. 4. Data is based on SSD’s using Toshiba A15nm Toggle NAND devices 5. L95A data not currently available Table 2-2: Sequential Read and Write Bandwidth (Iometer 06) Read MB/s (256K) Capacity Flash Type 8GB 15nm 537 16GB 15nm 537 32GB 537 64GB 15nm 15nm 128GB 15nm 256GB 512GB Notes: 1. 2. 3. Write MB/s (256K) 1 366 1 1 366 1 1 366 1 1 366 1 537 1 366 1 15nm 537 366 15nm 1 366 537 537 1 Estimated Performance measured using Iometer 06 with queue depth set to 32. Write Cache enabled with DDR cache. Tested with VPFEM5256GZIAMTL (Toshiba MLC L die) Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 13 of 41 Table 2-3: Random Read/ Write Input/Output Operations per Second (IOPS) (Iometer 06) Capacity Flash Type 8GB 15nm Random Read IOPS (4K) 1 14200 16GB 15nm 14200 32GB 14200 64GB 15nm 15nm 128GB 256GB 512GB Notes: 1. 2. 3. 4. 5. 6. 7. 8. Random Write IOPS (4K) 1 1100 1 1100 1 1 1100 1 14200 1 1100 1 15nm 14200 1 1100 1 15nm 14200 1100 15nm 1 1100 14200 1 Estimated Performance measured using Iometer 06 with queue depth set to 32. Write Cache enabled with DDR cache. Tested with VPFEM5256GZIAMTL (Toshiba MLC L die) Random IOPS cover the entire range of legal logical block addresses (LBA’s). Measurements are performed on a full drive (all LBA’s have valid content). Performance may vary by NAND type and host. Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology. Data is based on SSD’s using Toshiba A15nm NAND devices L95A data not currently available 2.3 Timing Table 2-4: Timing Specifications Type Power-On-to-Ready (POR) Command to DRQ Time to Erase (ATA Secure Erase) Average Latency TBD TBD TBD Notes: 1. Device measured using Drivemaster. 2. Sector Read/Write latency measured up to 2048 block transfers (512B/sector = 1 Block) 3. Queue depth set to 32 for NCQ 4. Sequential IOPS cover the entire range of legal logical block addresses (LBA’s). Measurements are performed on a full drive (all LBA’s have valid content 5. DRQ (Data Transfer Requested) bit being asserted 2.3.1 STANDBY IMMEDIATE Command The Power-On-to-Ready time assumes a proper shutdown (power removal preceded by STANDBY IMMEDIATE command. A STANDBY IMMEDIATE before power down always performs a graceful shutdown and does not require the use of the hold-up circuit. Note that SMART attribute 174 "Unexpected Power Loss" records the number of non-graceful power cycle events. Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 14 of 41 Table 2-5: STANDBY IMMEDIATE Timing Power Cycle Endurance STANDBY IMMEDIATE to WE completed Min - Max 72.9 Unit Ms Notes: 1. From Standby Immediate command to NAND Write Protect enable. 2.4 Flash Management 2.4.1 Error Correction Code (ECC) Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data. Thus, the Viking M.2 2280 applies the LDPC (Low Density Parity Check) of ECC algorithm, which can detect and correct errors occur during read process, ensure data been read correctly, as well as protect data from corruption. 2.4.2 Wear Leveling NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the flash media are not used evenly. If some areas get updated more frequently than others, the lifetime of the device would be reduced significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND flash by evenly distributing write and erase cycles across the media. Viking SSDs provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage through the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms, the life expectancy of the NAND flash is greatly improved. 2.4.3 Bad Block Management Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks that are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad blocks that are developed during the lifespan of the flash are named “Later Bad Blocks”. Viking SSDs implements an efficient bad block management algorithm to detect the factory-produced bad blocks and manages any bad blocks that appear with use. This practice further prevents data being stored into bad blocks and improves the data reliability. 2.4.4 TRIM TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD). Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually becomes smaller with Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 15 of 41 each use. With the TRIM command, the operating system can inform the SSD which blocks of data are no longer in use and can be removed permanently. Thus, the SSD will perform the erase action, which prevents unused data from occupying blocks all the time. 2.4.5 SMART SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows a hard disk drive to automatically detect its health and report potential failures. When a failure is recorded by SMART, users can choose to replace the drive to prevent unexpected outage or data loss. Moreover, SMART can inform users of impending failures while there is still time to perform proactive actions, such as copy data to another device. 2.4.6 Over-Provision Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which is not visible and cannot be used by users. With Over Provisioning, the performance and IOPS (Input/Output Operations per Second) are improved by providing the controller additional space to manage P/E cycles, which enhances the reliability and endurance as well. Moreover, the write amplification of the SSD becomes lower when the controller writes data to the flash. 2.4.7 Firmware Upgrade Firmware can be considered as a set of instructions on how the device communicates with the host. Firmware will be upgraded when new features are added, compatibility issues are fixed, or read/write performance gets improved. 2.5 Low Power Management 2.5.1 DEVSLP Mode (Optional) With the increasing need of aggressive power/battery life, SATA interfaces include a new feature, Device Sleep (DEVSLP) mode, which helps further reduce the power consumption of the device. DEVSLP enables the device to completely power down the device PHY and other sub-systems, making the device reach a new level of lower power operation. The DEVSLP does not specify the exact power level a device can achieve in the DEVSLP mode, but the power usage can be dropped down to 5mW or less. 2.5.2 DIPM/HIPM Mode SATA interfaces contain two low power management states for power saving: Partial and Slumber modes. For Partial mode, the device has to resume to full Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 16 of 41 operation within 10 microseconds, whereas the device will spend 10 milliseconds to become fully operational in the Slumber mode. SATA interfaces allow low power modes to be initiated by Host (HIPM, Host Initiated Power Management) or Device (DIPM, Device Initiated Power Management). As for HIPM, Partial or Slumber mode can be invoked directly by the software. For DIPM, the device will send requests to enter Partial or Slumber mode. 2.6 Power Loss Protection: Flushing Mechanism (Optional) Power Loss Protection is a mechanism to prevent data loss during unexpected power failure. DRAM is a volatile memory and frequently used as temporary cache or buffer between the controller and the NAND flash to improve the SSD performance. However, one major concern of the DRAM is that it is not able to keep data during power failure. Accordingly, the SSD requests the controller to transfer data to the cache. SDR performs as a cache, and its size is 32MB. Only when the data is fully committed to the NAND flash will the controller send acknowledgement (ACK) to the host. Such implementation can prevent falsepositive performance and the risk of power cycling issues. Additionally, it is critical for a controller to shorten the time the in-flight data stays in the cache. Thus, the Viking SSD applies an algorithm to reduce the amount of data resides in the cache to provide a better performance. This technology allows incoming data to only have a “pit stop” in the cache and then move to the NAND flash at once. If the flash is jammed due to particular file sizes (such as random 4KB data), the cache will be treated as an “organizer”, consolidating incoming data into groups before written into the flash to improve write amplification. In summary, provide the reliability required by consumer, industrial, and enterprise-level applications. 2.7 Advanced Device Security Features 2.7.1 Secure Erase Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe all the data on hard drives and SSDs. When this command is issued, the SSD controller will erase its storage blocks and return to its factory default settings. 2.7.2 Write Protect When a SSD contains too many bad blocks and data are continuously written in, then the SSD might not be usable anymore. Thus, Write Protect is a mechanism to prevent data from being written in and protect the accuracy of data that are already stored in the SSD. Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 17 of 41 2.8 SSD Lifetime Management 2.8.1 Terabytes Written (TBW) TBW (Terabytes Written) is a measurement of SSDs’ expected lifespan, which represents the amount of data written to the device. To calculate the TBW of a SSD, the following equation is applied: TBW = [(NAND Endurance) x (SSD Capacity) x (WLE)] / WAF NAND Endurance: Refers to the P/E (Program/Erase) cycle of a NAND flash. SSD Capacity: The SSD capacity is the specific capacity in total of a SSD. WLE: Wear Leveling Efficiency (WLE) ratio of the average #of erases on all the blocks to the erases on any block at maximum. WAF: Write Amplification Factor (WAF) is a numerical value representing the ratio between the amount of data that a SSD controller needs to write and the amount of data that the host’s flash controller writes. A better WAF, which is near 1, guarantees better endurance and lower frequency of data written to flash memory. 2.8.2 Thermal Monitor (Optional) Thermal monitors are devices for measuring temperature, and can be found in SSDs in order to issue warnings when SSDs go beyond a certain temperature. The higher temperature the thermal monitor detects, the more power the SSD consumes, causing the SSD to get aging quickly. Hence, the processing speed of a SSD should be under control to prevent temperature from exceeding a certain range. Meanwhile, the SSD can achieve power savings. 2.9 An Adaptive Approach to Performance Tuning 2.9.1 Throughput Based on the available space of the disk, the SSD will regulate the read/write speed and manage the performance of throughput. When there still remains a lot of space, the firmware will continuously perform read/write action. There is still no need to implement garbage collection to allocate and release memory, which will accelerate the read/write processing to improve the performance. Contrarily, when the space is going to be used up, the SSD will slow down the read/write processing, and implement garbage collection to release memory. Hence, read/write performance will become slower. 2.9.2 Predict & Fetch Normally, when the host tries to read data from the SSD, the SSD will only perform one read action after receiving one command. However, the SSD applies “Predict & Fetch” to improve the read speed. When the host issues Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 18 of 41 sequential read commands to the SSD, the SSD will automatically expect that the following will also be read commands. Thus, before receiving the next command, flash has already prepared the data. Accordingly, this accelerates the data processing time, and the host does not need to wait so long to receive data. 2.9.3 Compression Write data to the NAND Flash costs time. To improve the write speed performance, the SSD launches a compression technique. Whether a file could be compressed or not depending on the file type, for file types have redundancy data pattern, through our embedded encode engine, we could reduce the amount of data that is actually written to the Flash. Comparing to the SSD without the compression, write efficiency is raised and the SSD endurance is also improved since Flash could be benefit from less data written for a longer SSD lifetime. Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 19 of 41 2.10 Electrical Characteristics 2.10.1 Absolute Maximum Ratings Values shown are stress ratings only. Functional operation outside normal operating values is not implied. Extended exposure to absolute maximum ratings may affect reliability. Table 2-6: Absolute Maximum Ratings Description Maximum Voltage Range for Vin Maximum Temperature Range 2.10.2 Min -0.2 -40 Max 6 85 Unit V C Min Max Unit 3.135 3.465 V Supply Voltage The operating voltage is 3.3V Table 2-7: Operating Voltage Description Operating Voltage for 3.3 V (+/- 5%) 2.10.3 Power Consumption All onboard power requirements of the SSD are derived from the SATA 3.3V rail. Table 2-8: Typical Power Consumption at 3.3V Power Consumption Read Write Devslp Capacity 8GB Flash Structure 8GBx1, TSOP, TSB 15nm (mW) 830 (mW) 765 (mW) 4.9 16GB 16GBx1, TSOP, TSB 15nm 895 805 4.9 30/32GB 32GBx1, BGA, TSB 15nm 1,190 1,280 4.9 60/64GB 32GBx2, BGA, TSB 15nm 1,190 1,295 4.9 120/128GB 64GBx2, BGA, TSB 15nm 1,170 1,525 4.9 240/256GB 128GBx2, BGA, TSB 15nm 1,250 1,555 4.9 256GBx2, BGA, TSB 15nm 1,455 1,675 4.9 480/512GB Notes: 1. Measured using Toshiba A15 Toggle MLC NAND Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 20 of 41 2.11 Environmental Conditions 2.11.1 Temperature and Altitude Table 2-9: Temperature and Altitude Related Specifications Conditions Commercial Temperature- Ambient Industrial Temperature- Ambient Humidity (noncondensing) 2.11.2 Operating 0 to 70°C Shipping -40 to 85°C Storage -40 to 85°C -40 to 85°C -40 to 85°C -40 to 85°C 95% under 55C 93% under 40C 93% under 40C Shock and Vibration SSD products are tested in accordance with environmental specification for shock and vibration Table 2-10: Shock and Vibration Specifications Stimulus Shock Vibration 2.11.3 Description 500G, 2ms 20 – 80 Hz/1.52mm, 80 – 2000 Hz/20G, (X,Y,Z axis / 30 min for each) Electromagnetic Immunity M.2 is an embedded product for host systems and is designed not to impair with system functionality or hinder system EMI/FCC compliance. 2.12 Reliability Table 2-11: Reliability Specifications Parameter MTBF ECC Read Endurance Write Endurance Data retention Description Over 2,000,000 hours 72-bit per 1KByte Unlimited 8GB 12 TBW 16GB 23 TBW 32GB 45 TBW 64GB 90 TBW 128GB 181 TBW 256GB 262 TBW 512GB 544 TBW > 90 days at NAND expiration NOTES: 1. Tested to JEDEC219A client endurance workloads using Toshiba 15nm Toggle MLC NAND. 2. TBW may differ according to flash configuration and platform. 3. The endurance of SSD could be estimated based on user behavior, NAND endurance cycles, and write amplification factor. It is not guaranteed by flash vendor 4. TBW=(GB capacity x DWPD x 365 x years)/1000 Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 21 of 41 3 Mechanical Information 3.1 Dimensions Figure 3-1: Dimensions d VRFEM6xxx Note2 VRFEM4xxx Note2 VPFEM5xxx Note2 Notes: 1. All dimensions are in millimeter. General tolerance is ± 0.15. PCB thickness 0.8 ± 0.08 2. Refer to Ordering Information table for the complete Viking part number that describes the “xxx”. Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 22 of 41 Figure 3-2: Dimension Details for M.2 80mm length VPFEM5xxx Note2 FOR CARD EDGE DETAIL SEE SECTION 3.2 Notes: 1. All dimensions are in millimeter. General tolerance is ± 0.15. PCB thickness 0.8 ± 0.08 2. Refer to Ordering Information table for the complete Viking part number that describes the “xxx”. Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 23 of 41 3.2 Card Edge Detail Figure 3-3: Dimension Details for M.2 card edge Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 24 of 41 Figure 3-4: Dimension Details for M.2 connector and notch Key notch detail Manual PSFEM5xxxxZxxx Revision E www.vikingtechnology.com 7/24/2017 Viking Technology Page 25 of 41 3.3 M.2 SSD Weight Table 3-1: M.2 SSD weight Weight