NVMe PCIe SSD
M.2 2280 Manual
NVMe PCIe SSD is a non-volatile, solid-state storage device delivering
uncompromising performance, reliability and ruggedness for
environmentally challenging applications.
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Revision History
Date
Revision
5/12/19
A
7/24/19
B
8/19/19
C
Description
Initial Release from modified
PSFN22xxxx5xxx_A revise PN table,
mechanical and pin out(add 4 lanes) and
supply voltage. Add IT and CT PNs, LBA,
power, performance endurance.
Checked By
Add VPFNP5002T5C4WT3
VPFNP5002T5I4WT3
VPFNP5960G5IFWT3
Add section for “Data Integrity Assurance
After Unexpected Power Loss” and a
reference to whitepaper AN00025
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Legal Information
Legal Information
Copyright© 2019 Sanmina Corporation. All rights reserved. The information in
this document is proprietary and confidential to Sanmina Corporation. No part of
this document may be reproduced in any form or by any means or used to make
any derivative work (such as translation, transformation, or adaptation) without
written permission from Sanmina. Sanmina reserves the right to revise this
documentation and to make changes in content from time to time without
obligation on the part of Sanmina to provide notification of such revision or
change.
Sanmina provides this documentation without warranty, term or condition of any
kind, either expressed or implied, including, but not limited to, expressed and
implied warranties of merchantability, fitness for a particular purpose, and noninfringement. While the information contained herein is believed to be accurate,
such information is preliminary, and should not be relied upon for accuracy or
completeness, and no representations or warranties of accuracy or
completeness are made. In no event will Sanmina be liable for damages arising
directly or indirectly from any use of or reliance upon the information contained in
this document. Sanmina may make improvements or changes in the product(s)
and/or the program(s) described in this documentation at any time.
Sanmina, Viking Technology, Viking Modular Solutions, and Element logo are
trademarks of Sanmina Corporation. Other company, product or service names
mentioned herein may be trademarks or service marks of their respective
owners.
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Ordering Information: M.2 2280 PCIe SSD Solid-State Drive
Part Number
Interface
Application
User
Capacity
(GB)
Encryption
Temperature
VPFNP5240G5C5WT3
PCIe/NVMe
Enterprise
240
Pyrite/AES256 OPAL 2.0
(0to+70ºC)
VPFNP5480G5CHWT3 PCIe/NVMe
Enterprise
480
Pyrite/AES256 OPAL 2.0
(0to+70ºC)
VPFNP5960G5CFWT3
PCIe/NVMe
Enterprise
960
Pyrite/AES256 OPAL 2.0
(0to+70ºC)
VPFNP5240G5I5WT3
PCIe/NVMe
Industrial
240
Pyrite/AES256 OPAL 2.0
(-40to+85ºC)
VPFNP5480G5IHWT3
PCIe/NVMe
Industrial
480
Pyrite/AES256 OPAL 2.0
(-40to+85ºC)
VPFNP5960G5IFWT3
PCIe/NVMe
Industrial
960
Pyrite/AES256 OPAL 2.0
(-40to+85ºC)
VPFNP5002T5C4WT3
PCIe/NVMe
Enterprise
2048
Pyrite/AES256 OPAL 2.0
(0to+70ºC)
VPFNP5002T5I4WT3
PCIe/NVMe
Industrial
2048
Pyrite/AES256 OPAL 2.0
(-40to+85ºC)
Notes:
1. Usable capacity based on a level of over-provisioning applied to wear leveling, bad sectors, index tables etc.
2. SSD’s ship unformatted from the factory unless otherwise requested.
3. 1 GB = 1,000,000,000 Byte
4. One Sector = 512 Byte.
5. Lowercase x is a wildcard character that represents the device code for Flash device capacity
NAND
TSB BiCS TLC 3D
TSB BiCS TLC 3D
TSB BiCS TLC 3D
TSB BiCS TLC 3D
TSB BiCS TLC 3D
TSB BiCS TLC 3D
TSB BiCS TLC 3D
TSB BiCS TLC 3D
.
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Table of Contents
1
INTRODUCTION
8
1.1
Features
8
1.2
PCIE Interface
9
2
PRODUCT SPECIFICATIONS
10
2.1
Capacity and LBA count
10
2.2
Performance
10
2.1
Power Consumption
2.1.1 Throughput
2.1.2 Predict & Fetch
11
11
11
2.2
Electrical Characteristics
2.2.1 Absolute Maximum Ratings
2.2.2 Supply Voltage
11
11
12
2.3
Environmental Conditions
2.3.1 Temperature and Altitude
2.3.2 Shock and Vibration
2.3.3 Electromagnetic Immunity
12
12
12
13
2.4
13
Reliability
2.5
Data Security
2.5.1 Secure Erase
2.5.2 Write Protect
2.5.3 Encryption OPTIONAL
2.5.4 Data Integrity Assurance After Unexpected Power Loss*
13
13
13
14
14
2.6
Flash Management
2.6.1 Error Correction Code (ECC)
2.6.2 Wear Leveling
2.6.3 Bad Block Management
2.6.4 TRIM
15
15
16
16
16
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2.6.5
2.6.6
2.6.7
3
3.1
SMART
Over-Provision
Firmware Upgrade
17
17
17
MECHANICAL INFORMATION
Signal and Power Description Tables
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Table of Tables
Table 2-1: Maximum Sustained Read and Write Bandwidth ____________________________ 10
Table 2-2: Power Consumption __________________________________________________ 11
Table 2-3: Operating Voltage ____________________________________________________ 12
Table 2-4: Temperature and Altitude Related Specifications ____________________________ 12
Table 2-5: Shock and Vibration Specifications _______________________________________ 12
Table 2-6: Reliability Specifications _______________________________________________ 13
Table 3-1: M.2 PCIE Connector Pinouts ___________________________________________ 21
Table of Figures
Figure 3-1: Dimension Details for M.2 2280 _________________________________________ 18
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1 Introduction
This document describes the specification of Viking SSD which uses PCIe
interface. The Viking SSD is fully consist of semiconductor device and using
NAND Flash Memory which has a high reliability and a high technology in a small
form factor for using a SSD and supporting Peripheral Component Interconnect
Express (PCIe) 3.0 interface standard up to 4 lanes shows much faster
performance than previous SATA SSDs It could also provide rugged features
with an extreme environment with a high MTBF.
1.1 Features
The SSD delivers the following features:
Native-PCIe SSD for enterprise application
PCI Express Gen3: Single port X4 lanes
Compliant with PCI Express Base Specification Rev. 3.1
Compliant with NVM Express Specification Rev.1.3
Static and Dynamic Wear Leveling and Bad Block Management
RoHS / Halogen-Free Compliant
Support up to queue depth 64K
Support Power Management: ASPM/PCI-PM L0s, L1, L1.1 and L1.2
Support SMART and TRIM commands
Support 48-bit addressing mode
Firmware update
Firmware support for encryption
Advanced Flash Management
Advanced Wear Leveling
Bad Block Management
TRIM
SMART
Over-Provision
Firmware Update
Power Management
Support APST
Support ASPM
Support L1.2
Power Consumption2
Idle < 910 mW
L1.2 < 2 mW
Temperature Range3
Industrial temperature: -40°C ~ 85°C
Storage: -40°C ~ 85°C
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RoHS compliant
Features Support List4:
End to end data path protection
Thermal throttling
SmartECCTM
SmartRefreshTM
Drive log
Support of TCG OPAL4
Support TCG Pyrite4
Notes:
1. Refer to Chapter 2 for more details
2. Refer to section on Power Consumption for more details.
3. Operational temperature is measured by device temperature sensor.
4. Supported by a separate firmware version. Further information available upon request.
1.2 PCIE Interface
PCI Express Gen3: Single port X4 lanes
Compliant with PCI Express Base Specification Rev. 3.1
Compliant with NVM Express Specification Rev.1.3
For a list of supported commands and other specifics, refer to PCI and NVME
specifications.
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2 Product Specifications
2.1 Capacity and LBA count
Raw Capacity
(GB)
User Capacity
(GB)
LBA Count
256
240
468,862,128
512
480
937,703,088
1024
960
1,875,385,008
2048
2048
4,000,797,360
Notes:
1. Per www.idema.org, LBA1-03 spec,
LBA counts = (97,696,368) + (1,953,504 * (Advertised Capacity in GBytes – 50))
2.2 Performance
Table 2-1: Maximum Sustained Read and Write Bandwidth
Performance
Capacity
(GB)
Flash Structure
240
CrystalDiskMark
IOMeter
Read
(MB/s)
Write
(MB/s)
Read
IOPS
Write
IOPS
BiCS3, TLC, 8CE
3,100
1,040
187K
245K
480
BiCS3, TLC, 16CE
3,370
2,030
369K
470K
960
BiCS3, TLC, 32CE
3,470
3,000
600K
600K
2048
BiCS3, TLC, 32CE
TBD
TBD
TBD
TBD
Notes:
1. Performance measured under the following conditions:
A. CrystalDiskMark 5.1.2, 1GB range, QD=32, Thread=1
B. IOMeter, 8GB range, 4K data size, QD=32 (3) ATTO, transfer Size 8192 KB
2. Performance may vary from flash configuration and platform.
3. Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology.
4. Data is based on SSD’s using Toshiba TLC BiCS3
5. Typical Power Consumption
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2.1 Power Consumption
Table 2-2: Power Consumption
Power Consumption
Capacity
240GB
480GB
960GB
2048GB
Flash Configuration
BiCS3 TLC, 8CE
BiCS3 TLC, 16CE
BiCS3 TLC, 32CE
BiCS3 TLC, 32CE
Read
(mW)
6,400
7,000
7,200
TBD
Write
(mW)
3,900
5,000
6,100
TBD
1
PS3
(mW)
16
16
16
16
PS4
(mW)
2
2
2
2
NOTES:
1. Power consumption is measured during the sequential read and write operations performed by
CrystalDiskMark 5.1.2, 1GB range, QD=32, Thread=1
2.1.1 Throughput
Based on the available space of the disk, the SSD will regulate the read/write
speed and manage the performance of throughput. When there still remains a lot
of space, the firmware will continuously perform read/write action. There is still no
need to implement garbage collection to allocate and release memory, which will
accelerate the read/write processing to improve the performance. Contrarily,
when the space is going to be used up, the SSD will slow down the read/write
processing, and implement garbage collection to release memory. Hence,
read/write performance will become slower.
2.1.2 Predict & Fetch
Normally, when the Host tries to read data from a PCIe SSD, the PCIe SSD will
only perform one read action after receiving one command. However, the Viking
SSD applies Predict & Fetch to improve the read speed. When the host issues
sequential read commands to the PCIe SSD, the PCIe SSD will automatically
expect that the following will also be read commands. Thus, before receiving the
next command, flash has already prepared the data. Accordingly, this
accelerates the data processing time, and the host does not need to wait so long
to receive data.
2.2 Electrical Characteristics
2.2.1 Absolute Maximum Ratings
Values shown are stress ratings only. Functional operation outside normal
operating values is not implied. Extended exposure to absolute maximum ratings
may affect reliability.
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2.2.2 Supply Voltage
The operating voltage is 3.3V
Table 2-3: Operating Voltage
Description
Operating Voltage for 3.3 V (+/- 5%)
Min
Max
Unit
3.135
3.465
V
2.3 Environmental Conditions
2.3.1 Temperature and Altitude
Table 2-4: Temperature and Altitude Related Specifications
Conditions
CommercialTemperature1
Case
Industrial Temperature1
Case
Humidity (noncondensing)
Operating
0 to 70°C
Shipping
-40 to 85°C
Storage
-40 to 85°C
-40 to 85°C
-40 to 85°C
-40 to 85°C
90% under 40°C
93% under 40°C
93% under 40°C
Notes:
1. Tc is measured at the surface of NAND Flash package
2.3.2 Shock and Vibration
SSD products are tested in accordance with environmental specification for
shock and vibration
Table 2-5: Shock and Vibration Specifications
Stimulus
Shock(non-operating)
Vibration
(non-operating)
Description
1500G ( 0.5ms duration x,y,z with 1/2 sine wave)
(60min /axis on 3 axes)
Displacement: 1.52mm (20 ~ 80 Hz)
Acceleration: 20G (80 ~ 2,000 Hz)
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2.3.3 Electromagnetic Immunity
M.2 is an embedded product for host systems and is designed not to impair with
system functionality or hinder system EMI/FCC compliance.
2.4 Reliability
Table 2-6: Reliability Specifications
Parameter
Description
ECC
Correct up to 120 bits error in 2K Byte data
MTBF
2,000,000 hours
Write
Endurance
(BiCS3
TLC)
Capacity
TBW
120GB
170
240GB
380
480GB
960GB
1920GB
2048GB
3845GB
800
Data
Retention
1665
TBD
TBD
TBD
> 90 days at NAND expiration
Notes:
1. The reliability specification follows JEDEC standards JESD218A and JESD219A
2. Based on 0.8 DWPD based with 3,000 PE for TLC (TBW = DWPD * CAPACITY * 365 (days) * 3 years of
Warranty/1000
2.5 Data Security
2.5.1 Secure Erase
Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe
all the data on hard drives and SSDs. When this command is issued, the SSD
controller will empty its storage blocks and return to its factory default settings.
2.5.2 Write Protect
When a SSD contains too many bad blocks and data are continuously written in,
then the SSD might not be usable anymore. Thus, Write Protect is a mechanism
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to prevent data from being written in and protect the accuracy of data that are
already stored in the SSD.
2.5.3 Encryption OPTIONAL
Pyrite
AES256
OPAL 2.0
Note: Encryption is optional requiring a special firmware support
2.5.4 Data Integrity Assurance After Unexpected Power Loss*
Enterprise SSD – An Enterprise SSD contains optional PFAIL hardware and
firmware that detect and manage power failures. This allows the drive to flush the
controller cache and harden data to NAND flash. No data is lost or corrupted.
Refer to Viking Application Note AN0025 for details.
Industrial/Client SSD’s – Viking’s Industrial/Client SSD contains sophisticated
provisions to protect firmware and data from corruption due to unexpected power
loss. Refer to Viking Application Note AN0025 for details.
*Refer to Viking Application Note AN0025 for details.
Pfail function is optional for Enterprise SSDs only
Industrial/Client SSDs use special firmware algorithms
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2.6 Flash Management
2.6.1 Error Correction Code (ECC)
Flash memory cells will deteriorate with use, which might generate random bit
errors in the stored data. The SSD applies a BCH ECC algorithm, which can
detect and correct errors occur during read process, ensure data been read
correctly, as well as protect data from corruption.
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2.6.2 Wear Leveling
NAND flash devices can only undergo a limited number of program/erase cycles,
and in most cases, the flash media are not used evenly. If some areas get
updated more frequently than others, the lifetime of the device would be reduced
significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND
Flash by evenly distributing write and erase cycles across the media.
Advanced Wear Leveling algorithm, can efficiently spread out the flash usage
through the whole flash media area. Moreover, by implementing both dynamic
and static Wear Leveling algorithms, the life expectancy of the NAND flash is
greatly improved.
2.6.3 Bad Block Management
Bad blocks are blocks that include one or more invalid bits, and their reliability is
not guaranteed. Blocks that are identified and marked as bad by the
manufacturer are referred to as “Initial Bad Blocks”. Bad blocks that are
developed during the lifespan of the flash are named “Later Bad Blocks”. Viking
implements an efficient bad block management algorithm to detect the factoryproduced bad blocks and manages any bad blocks that appear with use. This
practice further prevents data being stored into bad blocks and improves the data
reliability.
2.6.4 TRIM
TRIM is a feature which helps improve the read/write performance and speed of
solid-state drives (SSD). Unlike hard disk drives (HDD), SSDs are not able to
overwrite existing data, so the available space gradually becomes smaller with
each use. With the TRIM command, the operating system can inform the SSD
which blocks of data are no longer in use and can be removed permanently.
Thus, the SSD will perform the erase action, which prevents unused data from
occupying blocks all the time.
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2.6.5 SMART
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is
an open standard that allows a hard disk drive to automatically detect its health
and report potential failures. When a failure is recorded by SMART, users can
choose to replace the drive to prevent unexpected outage or data loss.
Moreover, SMART can inform users of impending failures while there is still time
to perform proactive actions, such as copy data to another device.
2.6.6 Over-Provision
Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which
is not visible and cannot be used by users. With Over Provisioning, the
performance and IOPS (Input/Output Operations per Second) are improved by
providing the controller additional space to manage P/E cycles, which enhances
the reliability and endurance as well. Moreover, the write amplification of the SSD
becomes lower when the controller writes data to the flash.
2.6.7 Firmware Upgrade
Firmware can be considered as a set of instructions on how the device
communicates with the host. Firmware will be upgraded when new features are
added, compatibility issues are fixed, or read/write performance gets improved.
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3 Mechanical Information
Figure 3-1: Dimension Details for M.2 2280
TOP VIEW
Notes:
1. All dimensions are in millimeter. General tolerance is ± 0.15. PCB thickness 0.8 ± 0.08
2. Refer to Ordering Information table for the complete Viking part number that describes the “xxx”.
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BOTTOM VIEW
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SIDE VIEW
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3.1
Signal and Power Description Tables
Table 3-1: M.2 PCIE Connector Pinouts
Pin
No.
PCIe Pin
Description
1
GND
CONFIG_3 = GND
2
3.3V
3.3V source
3
GND
Ground
4
3.3V
5
PETn3
6
N/C
7
PETp3
8
N/C
No connect
9
GND
Ground
3.3V source
PCIe TX Differential signal defined by the PCI Express M.2
spec
No connect
PCIe TX Differential signal defined by the PCI Express M.2
spec
Open drain, active low signal. These signals are used to
allow the add-in card to provide status indicators via LED
devices that will be provided by the system.
PCIe RX Differential signal defined by the PCI Express M.2
spec
10
LED1#
11
PERn3
12
3.3V
13
PERp3
14
3.3V
3.3V source
15
GND
Ground
16
3.3V
17
PETn2
18
3.3V
19
PETp2
3.3V source
PCIe RX Differential signal defined by the PCI Express M.2
spec
3.3V source
PCIe TX Differential signal defined by the PCI Express M.2
spec
3.3V source
PCIe TX Differential signal defined by the PCI Express M.2
spec
20
N/C
No connect
21
GND
Ground
22
N/C
23
PERn2
24
N/C
25
PERp2
26
N/C
No connect
27
GND
Ground
No connect
PCIe RX Differential signal defined by the PCI Express M.2
spec
No connect
PCIe RX Differential signal defined by the PCI Express M.2
spec
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Pin
No.
PCIe Pin
Description
28
N/C
No connect
PCIe TX Differential signal defined by the PCI Express M.2
spec
29
PETn1
30
N/C
31
PETp1
32
N/C
No connect
33
GND
Ground
34
N/C
35
PERn1
36
N/C
37
PERp1
38
N/C
No connect
39
GND
Ground
40
SMB_CLK (I/O)(0/1.8V)
41
PETn0
42
SMB_DATA (I/O)(0/1.8V)
43
PETp0
SMBus Data; Open Drain with pull-up on platform.
PCIe TX Differential signal defined by the PCI Express M.2
spec
44
ALERT#(O) (0/1.8V)
Alert notification to master; Open Drain with pull-up on
platform; Active low.
45
GND
46
N/C
47
PERn0
48
N/C
49
PERp0
No connect
PCIe RX Differential signal defined by the PCI Express M.2
spec
50
PERST#(I)(0/3.3V)
PE-Reset is a functional reset to the card as defined by the
PCIe Mini CEM specification.
51
GND
52
CLKREQ#(I/O)(0/3.3V)
53
REFCLKn
54
PEWAKE#(I/O)(0/3.3V)
PCIe Reference Clock signals (100 MHz) defined by the PCI
Express M.2 spec.
PCIe PME Wake. Open Drain with pull up on platform;
Active Low.
55
REFCLKp
PCIe Reference Clock signals (100 MHz) defined by the PCI
Express M.2 spec.
No connect
PCIe TX Differential signal defined by the PCI Express M.2
spec
No connect
PCIe RX Differential signal defined by the PCI Express M.2
spec
No connect
PCIe RX Differential signal defined by the PCI Express M.2
spec
SMBus Clock; Open Drain with pull-up on platform
PCIe TX Differential signal defined by the PCI Express M.2
spec
Ground
No connect
PCIe RX Differential signal defined by the PCI Express M.2
spec
Ground
Clock Request is a reference clock request signal as defined
by the PCIe Mini CEM specification; Also used by L1 PM
Sub-states.
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Pin
No.
PCIe Pin
Description
56
Reserved for MFG DATA
57
GND
58
Reserved for MFG
CLOCK
59
60
61
62
63
64
65
Module Key M
Module Key M
Module Key M
Module Key M
Module Key M
Module Key M
Module Key M
66
Module Key M
67
68
N/C
SUSCLK(32KHz)
(I)(0/3.3V)
Manufacturing Data line. Used for SSD manufacturing only.
Not used in normal operation. Pins should be left N/C in
platform Socket.
Ground
Manufacturing Clock line. Used for SSD manufacturing only.
Not used in normal operation. Pins should be left N/C in
platform Socket.
Module Key
No connect
32.768 kHz clock supply input that is provided by the
platform chipset to reduce power and cost for the module.
69
N/C
PEDET (NC-PCIe)
70
3.3V
3.3V source
71
GND
Ground
72
3.3V
3.3V source
73
GND
Ground
74
3.3V
3.3V source
75
GND
Ground
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