VPFNP5240G5I5WT3

NVMe PCIe SSD M.2 2280 Manual NVMe PCIe SSD is a non-volatile, solid-state storage device delivering uncompromising performance, reliability and ruggedness for environmentally challenging applications. Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 1 of 23 www.vikingtechnology.com Revision History Date Revision 5/12/19 A 7/24/19 B 8/19/19 C Description Initial Release from modified PSFN22xxxx5xxx_A revise PN table, mechanical and pin out(add 4 lanes) and supply voltage. Add IT and CT PNs, LBA, power, performance endurance. Checked By Add VPFNP5002T5C4WT3 VPFNP5002T5I4WT3 VPFNP5960G5IFWT3 Add section for “Data Integrity Assurance After Unexpected Power Loss” and a reference to whitepaper AN00025 Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 2 of 23 www.vikingtechnology.com Legal Information Legal Information Copyright© 2019 Sanmina Corporation. All rights reserved. The information in this document is proprietary and confidential to Sanmina Corporation. No part of this document may be reproduced in any form or by any means or used to make any derivative work (such as translation, transformation, or adaptation) without written permission from Sanmina. Sanmina reserves the right to revise this documentation and to make changes in content from time to time without obligation on the part of Sanmina to provide notification of such revision or change. Sanmina provides this documentation without warranty, term or condition of any kind, either expressed or implied, including, but not limited to, expressed and implied warranties of merchantability, fitness for a particular purpose, and noninfringement. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made. In no event will Sanmina be liable for damages arising directly or indirectly from any use of or reliance upon the information contained in this document. Sanmina may make improvements or changes in the product(s) and/or the program(s) described in this documentation at any time. Sanmina, Viking Technology, Viking Modular Solutions, and Element logo are trademarks of Sanmina Corporation. Other company, product or service names mentioned herein may be trademarks or service marks of their respective owners. Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 3 of 23 www.vikingtechnology.com Ordering Information: M.2 2280 PCIe SSD Solid-State Drive Part Number Interface Application User Capacity (GB) Encryption Temperature VPFNP5240G5C5WT3 PCIe/NVMe Enterprise 240 Pyrite/AES256 OPAL 2.0 (0to+70ºC) VPFNP5480G5CHWT3 PCIe/NVMe Enterprise 480 Pyrite/AES256 OPAL 2.0 (0to+70ºC) VPFNP5960G5CFWT3 PCIe/NVMe Enterprise 960 Pyrite/AES256 OPAL 2.0 (0to+70ºC) VPFNP5240G5I5WT3 PCIe/NVMe Industrial 240 Pyrite/AES256 OPAL 2.0 (-40to+85ºC) VPFNP5480G5IHWT3 PCIe/NVMe Industrial 480 Pyrite/AES256 OPAL 2.0 (-40to+85ºC) VPFNP5960G5IFWT3 PCIe/NVMe Industrial 960 Pyrite/AES256 OPAL 2.0 (-40to+85ºC) VPFNP5002T5C4WT3 PCIe/NVMe Enterprise 2048 Pyrite/AES256 OPAL 2.0 (0to+70ºC) VPFNP5002T5I4WT3 PCIe/NVMe Industrial 2048 Pyrite/AES256 OPAL 2.0 (-40to+85ºC) Notes: 1. Usable capacity based on a level of over-provisioning applied to wear leveling, bad sectors, index tables etc. 2. SSD’s ship unformatted from the factory unless otherwise requested. 3. 1 GB = 1,000,000,000 Byte 4. One Sector = 512 Byte. 5. Lowercase x is a wildcard character that represents the device code for Flash device capacity NAND TSB BiCS TLC 3D TSB BiCS TLC 3D TSB BiCS TLC 3D TSB BiCS TLC 3D TSB BiCS TLC 3D TSB BiCS TLC 3D TSB BiCS TLC 3D TSB BiCS TLC 3D . Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 4 of 23 www.vikingtechnology.com Table of Contents 1 INTRODUCTION 8 1.1 Features 8 1.2 PCIE Interface 9 2 PRODUCT SPECIFICATIONS 10 2.1 Capacity and LBA count 10 2.2 Performance 10 2.1 Power Consumption 2.1.1 Throughput 2.1.2 Predict & Fetch 11 11 11 2.2 Electrical Characteristics 2.2.1 Absolute Maximum Ratings 2.2.2 Supply Voltage 11 11 12 2.3 Environmental Conditions 2.3.1 Temperature and Altitude 2.3.2 Shock and Vibration 2.3.3 Electromagnetic Immunity 12 12 12 13 2.4 13 Reliability 2.5 Data Security 2.5.1 Secure Erase 2.5.2 Write Protect 2.5.3 Encryption OPTIONAL 2.5.4 Data Integrity Assurance After Unexpected Power Loss* 13 13 13 14 14 2.6 Flash Management 2.6.1 Error Correction Code (ECC) 2.6.2 Wear Leveling 2.6.3 Bad Block Management 2.6.4 TRIM 15 15 16 16 16 Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 5 of 23 www.vikingtechnology.com 2.6.5 2.6.6 2.6.7 3 3.1 SMART Over-Provision Firmware Upgrade 17 17 17 MECHANICAL INFORMATION Signal and Power Description Tables Manual PSFNP5xxxx5xxx Revision C 18 21 8/19/2019 Viking Technology Page 6 of 23 www.vikingtechnology.com Table of Tables Table 2-1: Maximum Sustained Read and Write Bandwidth ____________________________ 10 Table 2-2: Power Consumption __________________________________________________ 11 Table 2-3: Operating Voltage ____________________________________________________ 12 Table 2-4: Temperature and Altitude Related Specifications ____________________________ 12 Table 2-5: Shock and Vibration Specifications _______________________________________ 12 Table 2-6: Reliability Specifications _______________________________________________ 13 Table 3-1: M.2 PCIE Connector Pinouts ___________________________________________ 21 Table of Figures Figure 3-1: Dimension Details for M.2 2280 _________________________________________ 18 Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 7 of 23 www.vikingtechnology.com 1 Introduction This document describes the specification of Viking SSD which uses PCIe interface. The Viking SSD is fully consist of semiconductor device and using NAND Flash Memory which has a high reliability and a high technology in a small form factor for using a SSD and supporting Peripheral Component Interconnect Express (PCIe) 3.0 interface standard up to 4 lanes shows much faster performance than previous SATA SSDs It could also provide rugged features with an extreme environment with a high MTBF. 1.1 Features The SSD delivers the following features:  Native-PCIe SSD for enterprise application  PCI Express Gen3: Single port X4 lanes  Compliant with PCI Express Base Specification Rev. 3.1  Compliant with NVM Express Specification Rev.1.3  Static and Dynamic Wear Leveling and Bad Block Management  RoHS / Halogen-Free Compliant  Support up to queue depth 64K  Support Power Management: ASPM/PCI-PM L0s, L1, L1.1 and L1.2  Support SMART and TRIM commands  Support 48-bit addressing mode  Firmware update  Firmware support for encryption Advanced Flash Management Advanced Wear Leveling Bad Block Management TRIM SMART Over-Provision Firmware Update Power Management Support APST Support ASPM Support L1.2 Power Consumption2 Idle < 910 mW L1.2 < 2 mW Temperature Range3 Industrial temperature: -40°C ~ 85°C Storage: -40°C ~ 85°C Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 8 of 23 www.vikingtechnology.com RoHS compliant Features Support List4: End to end data path protection Thermal throttling SmartECCTM SmartRefreshTM Drive log Support of TCG OPAL4 Support TCG Pyrite4 Notes: 1. Refer to Chapter 2 for more details 2. Refer to section on Power Consumption for more details. 3. Operational temperature is measured by device temperature sensor. 4. Supported by a separate firmware version. Further information available upon request. 1.2 PCIE Interface    PCI Express Gen3: Single port X4 lanes Compliant with PCI Express Base Specification Rev. 3.1 Compliant with NVM Express Specification Rev.1.3 For a list of supported commands and other specifics, refer to PCI and NVME specifications. Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 9 of 23 www.vikingtechnology.com 2 Product Specifications 2.1 Capacity and LBA count Raw Capacity (GB) User Capacity (GB) LBA Count 256 240 468,862,128 512 480 937,703,088 1024 960 1,875,385,008 2048 2048 4,000,797,360 Notes: 1. Per www.idema.org, LBA1-03 spec, LBA counts = (97,696,368) + (1,953,504 * (Advertised Capacity in GBytes – 50)) 2.2 Performance Table 2-1: Maximum Sustained Read and Write Bandwidth Performance Capacity (GB) Flash Structure 240 CrystalDiskMark IOMeter Read (MB/s) Write (MB/s) Read IOPS Write IOPS BiCS3, TLC, 8CE 3,100 1,040 187K 245K 480 BiCS3, TLC, 16CE 3,370 2,030 369K 470K 960 BiCS3, TLC, 32CE 3,470 3,000 600K 600K 2048 BiCS3, TLC, 32CE TBD TBD TBD TBD Notes: 1. Performance measured under the following conditions: A. CrystalDiskMark 5.1.2, 1GB range, QD=32, Thread=1 B. IOMeter, 8GB range, 4K data size, QD=32 (3) ATTO, transfer Size 8192 KB 2. Performance may vary from flash configuration and platform. 3. Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology. 4. Data is based on SSD’s using Toshiba TLC BiCS3 5. Typical Power Consumption Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 10 of 23 www.vikingtechnology.com 2.1 Power Consumption Table 2-2: Power Consumption Power Consumption Capacity 240GB 480GB 960GB 2048GB Flash Configuration BiCS3 TLC, 8CE BiCS3 TLC, 16CE BiCS3 TLC, 32CE BiCS3 TLC, 32CE Read (mW) 6,400 7,000 7,200 TBD Write (mW) 3,900 5,000 6,100 TBD 1 PS3 (mW) 16 16 16 16 PS4 (mW) 2 2 2 2 NOTES: 1. Power consumption is measured during the sequential read and write operations performed by CrystalDiskMark 5.1.2, 1GB range, QD=32, Thread=1 2.1.1 Throughput Based on the available space of the disk, the SSD will regulate the read/write speed and manage the performance of throughput. When there still remains a lot of space, the firmware will continuously perform read/write action. There is still no need to implement garbage collection to allocate and release memory, which will accelerate the read/write processing to improve the performance. Contrarily, when the space is going to be used up, the SSD will slow down the read/write processing, and implement garbage collection to release memory. Hence, read/write performance will become slower. 2.1.2 Predict & Fetch Normally, when the Host tries to read data from a PCIe SSD, the PCIe SSD will only perform one read action after receiving one command. However, the Viking SSD applies Predict & Fetch to improve the read speed. When the host issues sequential read commands to the PCIe SSD, the PCIe SSD will automatically expect that the following will also be read commands. Thus, before receiving the next command, flash has already prepared the data. Accordingly, this accelerates the data processing time, and the host does not need to wait so long to receive data. 2.2 Electrical Characteristics 2.2.1 Absolute Maximum Ratings Values shown are stress ratings only. Functional operation outside normal operating values is not implied. Extended exposure to absolute maximum ratings may affect reliability. Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 11 of 23 www.vikingtechnology.com 2.2.2 Supply Voltage The operating voltage is 3.3V Table 2-3: Operating Voltage Description Operating Voltage for 3.3 V (+/- 5%) Min Max Unit 3.135 3.465 V 2.3 Environmental Conditions 2.3.1 Temperature and Altitude Table 2-4: Temperature and Altitude Related Specifications Conditions CommercialTemperature1 Case Industrial Temperature1 Case Humidity (noncondensing) Operating 0 to 70°C Shipping -40 to 85°C Storage -40 to 85°C -40 to 85°C -40 to 85°C -40 to 85°C 90% under 40°C 93% under 40°C 93% under 40°C Notes: 1. Tc is measured at the surface of NAND Flash package 2.3.2 Shock and Vibration SSD products are tested in accordance with environmental specification for shock and vibration Table 2-5: Shock and Vibration Specifications Stimulus Shock(non-operating) Vibration (non-operating) Description 1500G ( 0.5ms duration x,y,z with 1/2 sine wave) (60min /axis on 3 axes) Displacement: 1.52mm (20 ~ 80 Hz) Acceleration: 20G (80 ~ 2,000 Hz) Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 12 of 23 www.vikingtechnology.com 2.3.3 Electromagnetic Immunity M.2 is an embedded product for host systems and is designed not to impair with system functionality or hinder system EMI/FCC compliance. 2.4 Reliability Table 2-6: Reliability Specifications Parameter Description ECC Correct up to 120 bits error in 2K Byte data MTBF 2,000,000 hours Write Endurance (BiCS3 TLC) Capacity TBW 120GB 170 240GB 380 480GB 960GB 1920GB 2048GB 3845GB 800 Data Retention 1665 TBD TBD TBD > 90 days at NAND expiration Notes: 1. The reliability specification follows JEDEC standards JESD218A and JESD219A 2. Based on 0.8 DWPD based with 3,000 PE for TLC (TBW = DWPD * CAPACITY * 365 (days) * 3 years of Warranty/1000 2.5 Data Security 2.5.1 Secure Erase Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe all the data on hard drives and SSDs. When this command is issued, the SSD controller will empty its storage blocks and return to its factory default settings. 2.5.2 Write Protect When a SSD contains too many bad blocks and data are continuously written in, then the SSD might not be usable anymore. Thus, Write Protect is a mechanism Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 13 of 23 www.vikingtechnology.com to prevent data from being written in and protect the accuracy of data that are already stored in the SSD. 2.5.3 Encryption OPTIONAL    Pyrite AES256 OPAL 2.0 Note: Encryption is optional requiring a special firmware support 2.5.4 Data Integrity Assurance After Unexpected Power Loss* Enterprise SSD – An Enterprise SSD contains optional PFAIL hardware and firmware that detect and manage power failures. This allows the drive to flush the controller cache and harden data to NAND flash. No data is lost or corrupted. Refer to Viking Application Note AN0025 for details. Industrial/Client SSD’s – Viking’s Industrial/Client SSD contains sophisticated provisions to protect firmware and data from corruption due to unexpected power loss. Refer to Viking Application Note AN0025 for details. *Refer to Viking Application Note AN0025 for details. Pfail function is optional for Enterprise SSDs only Industrial/Client SSDs use special firmware algorithms Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 14 of 23 www.vikingtechnology.com 2.6 Flash Management 2.6.1 Error Correction Code (ECC) Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data. The SSD applies a BCH ECC algorithm, which can detect and correct errors occur during read process, ensure data been read correctly, as well as protect data from corruption. Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 15 of 23 www.vikingtechnology.com 2.6.2 Wear Leveling NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the flash media are not used evenly. If some areas get updated more frequently than others, the lifetime of the device would be reduced significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND Flash by evenly distributing write and erase cycles across the media. Advanced Wear Leveling algorithm, can efficiently spread out the flash usage through the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms, the life expectancy of the NAND flash is greatly improved. 2.6.3 Bad Block Management Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks that are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad blocks that are developed during the lifespan of the flash are named “Later Bad Blocks”. Viking implements an efficient bad block management algorithm to detect the factoryproduced bad blocks and manages any bad blocks that appear with use. This practice further prevents data being stored into bad blocks and improves the data reliability. 2.6.4 TRIM TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD). Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually becomes smaller with each use. With the TRIM command, the operating system can inform the SSD which blocks of data are no longer in use and can be removed permanently. Thus, the SSD will perform the erase action, which prevents unused data from occupying blocks all the time. Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 16 of 23 www.vikingtechnology.com 2.6.5 SMART SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows a hard disk drive to automatically detect its health and report potential failures. When a failure is recorded by SMART, users can choose to replace the drive to prevent unexpected outage or data loss. Moreover, SMART can inform users of impending failures while there is still time to perform proactive actions, such as copy data to another device. 2.6.6 Over-Provision Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which is not visible and cannot be used by users. With Over Provisioning, the performance and IOPS (Input/Output Operations per Second) are improved by providing the controller additional space to manage P/E cycles, which enhances the reliability and endurance as well. Moreover, the write amplification of the SSD becomes lower when the controller writes data to the flash. 2.6.7 Firmware Upgrade Firmware can be considered as a set of instructions on how the device communicates with the host. Firmware will be upgraded when new features are added, compatibility issues are fixed, or read/write performance gets improved. Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 17 of 23 www.vikingtechnology.com 3 Mechanical Information Figure 3-1: Dimension Details for M.2 2280 TOP VIEW Notes: 1. All dimensions are in millimeter. General tolerance is ± 0.15. PCB thickness 0.8 ± 0.08 2. Refer to Ordering Information table for the complete Viking part number that describes the “xxx”. Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 18 of 23 www.vikingtechnology.com BOTTOM VIEW Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 19 of 23 www.vikingtechnology.com SIDE VIEW Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 20 of 23 www.vikingtechnology.com 3.1 Signal and Power Description Tables Table 3-1: M.2 PCIE Connector Pinouts Pin No. PCIe Pin Description 1 GND CONFIG_3 = GND 2 3.3V 3.3V source 3 GND Ground 4 3.3V 5 PETn3 6 N/C 7 PETp3 8 N/C No connect 9 GND Ground 3.3V source PCIe TX Differential signal defined by the PCI Express M.2 spec No connect PCIe TX Differential signal defined by the PCI Express M.2 spec Open drain, active low signal. These signals are used to allow the add-in card to provide status indicators via LED devices that will be provided by the system. PCIe RX Differential signal defined by the PCI Express M.2 spec 10 LED1# 11 PERn3 12 3.3V 13 PERp3 14 3.3V 3.3V source 15 GND Ground 16 3.3V 17 PETn2 18 3.3V 19 PETp2 3.3V source PCIe RX Differential signal defined by the PCI Express M.2 spec 3.3V source PCIe TX Differential signal defined by the PCI Express M.2 spec 3.3V source PCIe TX Differential signal defined by the PCI Express M.2 spec 20 N/C No connect 21 GND Ground 22 N/C 23 PERn2 24 N/C 25 PERp2 26 N/C No connect 27 GND Ground No connect PCIe RX Differential signal defined by the PCI Express M.2 spec No connect PCIe RX Differential signal defined by the PCI Express M.2 spec Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 21 of 23 www.vikingtechnology.com Pin No. PCIe Pin Description 28 N/C No connect PCIe TX Differential signal defined by the PCI Express M.2 spec 29 PETn1 30 N/C 31 PETp1 32 N/C No connect 33 GND Ground 34 N/C 35 PERn1 36 N/C 37 PERp1 38 N/C No connect 39 GND Ground 40 SMB_CLK (I/O)(0/1.8V) 41 PETn0 42 SMB_DATA (I/O)(0/1.8V) 43 PETp0 SMBus Data; Open Drain with pull-up on platform. PCIe TX Differential signal defined by the PCI Express M.2 spec 44 ALERT#(O) (0/1.8V) Alert notification to master; Open Drain with pull-up on platform; Active low. 45 GND 46 N/C 47 PERn0 48 N/C 49 PERp0 No connect PCIe RX Differential signal defined by the PCI Express M.2 spec 50 PERST#(I)(0/3.3V) PE-Reset is a functional reset to the card as defined by the PCIe Mini CEM specification. 51 GND 52 CLKREQ#(I/O)(0/3.3V) 53 REFCLKn 54 PEWAKE#(I/O)(0/3.3V) PCIe Reference Clock signals (100 MHz) defined by the PCI Express M.2 spec. PCIe PME Wake. Open Drain with pull up on platform; Active Low. 55 REFCLKp PCIe Reference Clock signals (100 MHz) defined by the PCI Express M.2 spec. No connect PCIe TX Differential signal defined by the PCI Express M.2 spec No connect PCIe RX Differential signal defined by the PCI Express M.2 spec No connect PCIe RX Differential signal defined by the PCI Express M.2 spec SMBus Clock; Open Drain with pull-up on platform PCIe TX Differential signal defined by the PCI Express M.2 spec Ground No connect PCIe RX Differential signal defined by the PCI Express M.2 spec Ground Clock Request is a reference clock request signal as defined by the PCIe Mini CEM specification; Also used by L1 PM Sub-states. Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 22 of 23 www.vikingtechnology.com Pin No. PCIe Pin Description 56 Reserved for MFG DATA 57 GND 58 Reserved for MFG CLOCK 59 60 61 62 63 64 65 Module Key M Module Key M Module Key M Module Key M Module Key M Module Key M Module Key M 66 Module Key M 67 68 N/C SUSCLK(32KHz) (I)(0/3.3V) Manufacturing Data line. Used for SSD manufacturing only. Not used in normal operation. Pins should be left N/C in platform Socket. Ground Manufacturing Clock line. Used for SSD manufacturing only. Not used in normal operation. Pins should be left N/C in platform Socket. Module Key No connect 32.768 kHz clock supply input that is provided by the platform chipset to reduce power and cost for the module. 69 N/C PEDET (NC-PCIe) 70 3.3V 3.3V source 71 GND Ground 72 3.3V 3.3V source 73 GND Ground 74 3.3V 3.3V source 75 GND Ground Manual PSFNP5xxxx5xxx Revision C 8/19/2019 Viking Technology Page 23 of 23 www.vikingtechnology.com