NVMe PCIe SSD
M.2
Manual
NVMe PCIe SSD is a non-volatile, solid-state storage device delivering
uncompromising performance, reliability and ruggedness for
environmentally challenging applications.
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Revision History
Date
Revision
3/30/17
A
7/13/17
7/26/17
8/14/17
B
C
D
Description
Initial Release from modified
PSFNP5xxxxVxxx_A. update PN table
performance and features, and PCI Express
Device Link Capabilities Register. Change
lanes from 4 to 2.
Revise temperature spec
Add TLC PN’s
Add 1TB PN
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Legal Information
Legal Information
Copyright© 2017 Sanmina Corporation. All rights reserved. The information in
this document is proprietary and confidential to Sanmina Corporation. No part of
this document may be reproduced in any form or by any means or used to make
any derivative work (such as translation, transformation, or adaptation) without
written permission from Sanmina. Sanmina reserves the right to revise this
documentation and to make changes in content from time to time without
obligation on the part of Sanmina to provide notification of such revision or
change.
Sanmina provides this documentation without warranty, term or condition of any
kind, either expressed or implied, including, but not limited to, expressed and
implied warranties of merchantability, fitness for a particular purpose, and noninfringement. While the information contained herein is believed to be accurate,
such information is preliminary, and should not be relied upon for accuracy or
completeness, and no representations or warranties of accuracy or
completeness are made. In no event will Sanmina be liable for damages arising
directly or indirectly from any use of or reliance upon the information contained in
this document. Sanmina may make improvements or changes in the product(s)
and/or the program(s) described in this documentation at any time.
Sanmina, Viking Technology, Viking Modular Solutions, and Element logo are
trademarks of Sanmina Corporation. Other company, product or service names
mentioned herein may be trademarks or service marks of their respective
owners.
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Ordering Information: M.2 80mm PCIe SSD Solid-State Drive
Interface
Application
User
Capacity
(GB)
PCIe/NVMe
Enterprise
120
PCIe/NVMe
Enterprise
240
PCIe/NVMe
Enterprise
480
VPFNP5120GDCHWT3
PCIe/NVMe
Enterprise
120
VPFNP5240GDCHWT3
PCIe/NVMe
Enterprise
240
VPFNP5480GDCHWT3
PCIe/NVMe
Enterprise
480
VPFNP5001TDCFWT3
PCIe/NVMe
Enterprise
1000
Part Number
VPFNP5120GDEBMTL
VPFNP5240GDEAMTL
VPFNP5480GDEZMTL
Encryption
Pyrite/AES256
OPAL 2.0
Pyrite/AES256
OPAL 2.0
Pyrite/AES256
OPAL 2.0
Pyrite/AES256
OPAL 2.0
Pyrite/AES256
OPAL 2.0
Pyrite/AES256
OPAL 2.0
Pyrite/AES256
OPAL 2.0
Temperature
NAND
-25'C to +70'C
TSB 15nm MLC L-die
-25'C to +70'C
TSB 15nm MLC L-die
-25'C to +70'C
TSB 15nm MLC L-die
0'C to +70'C
TSB TLC 3D NAND
0'C to +70'C
TSB TLC 3D NAND
0'C to +70'C
TSB TLC 3D NAND
0'C to +70'C
TSB TLC 3D NAND
Notes:
1. Usable capacity based on a level of over-provisioning applied to wear leveling, bad sectors, index tables etc.
2. SSD’s ship unformatted from the factory unless otherwise requested.
3. 1 GB = 1,000,000,000 Byte
4. One Sector = 512 Byte.
5. Lowercase x is a wildcard character that represents the device code for Flash device capacity
.
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Table of Contents
1
INTRODUCTION
10
1.1
Features
10
1.2
PCIE Interface
10
2
2.1
PRODUCT SPECIFICATIONS
Capacity and LBA count
11
11
2.2
Performance
2.2.1 Throughput
2.2.2 Predict & Fetch
11
12
12
2.3
Electrical Characteristics
2.3.1 Absolute Maximum Ratings
2.3.2 Supply Voltage
12
12
13
2.4
Environmental Conditions
2.4.1 Temperature and Altitude
2.4.2 Shock and Vibration
2.4.3 Electromagnetic Immunity
13
13
13
14
2.5
14
Reliability
2.6
Data Security
2.6.1 Power Loss Protection: Flushing Mechanism
2.6.2 Secure Erase
2.6.3 Write Protect
2.6.4 Encryption
14
14
15
15
15
2.7
Flash Management
2.7.1 Error Correction Code (ECC)
2.7.2 Wear Leveling
2.7.3 Bad Block Management
2.7.4 TRIM
2.7.5 SMART
2.7.6 Over-Provision
2.7.7 Firmware Upgrade
15
15
17
17
17
18
18
18
3
19
3.1
MECHANICAL INFORMATION
Card Edge Detail
22
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3.2
4
4.1
5
M.2 SSD Weight
23
PIN AND SIGNAL DESCRIPTIONS
Signal and Power Description Tables
PCIE AND NVM EXPRESS REGISTERS
23
23
24
5.1
PCI Express Registers
5.1.1 PCI Register Summary
5.1.2 PCI Header Registers
5.1.3 PCI Power Management Registers
5.1.4 Message Signaled Interrupt Registers
5.1.5 MSI-X Registers
5.1.6 PCI Express Capability Registers
5.1.7 Advanced Error Reporting Registers
5.1.8 Device Serial Number Capability Register
5.1.9 Power Budgeting Extended Capability
5.1.10
Latency Tolerance Reporting Capability Registers
5.1.11
L1 Substates Capability Registers
24
24
25
30
31
32
33
37
41
42
43
43
5.2
NVM Express Registers
5.2.1 Register Summary
5.2.2 Controller Registers
44
44
45
6
48
SUPPORTED COMMAND SET
6.1
Admin Command Set
6.1.1 Identify Command
48
49
6.2
NVM Express I/O Command Set
54
6.3
SMART/Health Information
55
7
REFERENCES
55
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Table of Tables
Table 2-1: Maximum Sustained Read and Write Bandwidth and Power Consumption ________ 11
Table 2-2: Maximum Random Read and Write Input/Output Operations per Second (IOPS) ___ 12
Table 2-3: Absolute Maximum Ratings ____________________________________________ 13
Table 2-4: Operating Voltage ____________________________________________________ 13
Table 2-5: Temperature and Altitude Related Specifications ____________________________ 13
Table 2-6: Shock and Vibration Specifications _______________________________________ 13
Table 2-7: Reliability Specifications _______________________________________________ 14
Table 3-1: M.2 SSD weight ______________________________________________________ 23
Table 4-1: M.2 PCIE Connector Pinouts ___________________________________________ 23
Table 5-1: PCI Register Summary ________________________________________________ 24
Table 5-2: PCI Header Register Summary __________________________________________ 25
Table 5-3: Identifier Register ____________________________________________________ 26
Table 5-4: Command Register ___________________________________________________ 27
Table 5-5: Device Status Register ________________________________________________ 27
Table 5-6: Revision ID Register __________________________________________________ 27
Table 5-7: Class Code Register __________________________________________________ 27
Table 5-8: Cache Line Size Register ______________________________________________ 28
Table 5-9: Master Latency Timer Register __________________________________________ 28
Table 5-10: Header Type Register ________________________________________________ 28
Table 5-11: Built-in Self Test Register _____________________________________________ 28
Table 5-12: Memory Register Base Address Lower 32-bits (BAR0) Register _______________ 28
Table 5-13: Memory Register Base Address Upper 32-bits (BAR1) Register _______________ 29
Table 5-14: Index/Data Pair Register Base Address (BAR2) Register ____________________ 29
Table 5-15: BAR3 Register ______________________________________________________ 29
Table 5-16: Vendor Specific BAR4 Register ________________________________________ 29
Table 5-17: Vendor Specific BAR5 Register ________________________________________ 29
Table 5-18: Subsystem Identifier Register __________________________________________ 29
Table 5-19: Expansion ROM Register _____________________________________________ 29
Table 5-20: Capabilities Pointer Register ___________________________________________ 29
Table 5-21: Interrupt Information Register __________________________________________ 29
Table 5-22: Minimum Grant Register ______________________________________________ 30
Table 5-23: Maximum Latency Register ____________________________________________ 30
Table 5-24: PCI Power Management Capability Register Summary ______________________ 30
Table 5-25: PCI Power Management Capability ID Register ____________________________ 30
Table 5-26: PCI Power Management Capability Register ______________________________ 30
Table 5-27: PCI Power Management Control and Status Register _______________________ 30
Table 5-28: Message Signaled Interrupt Capability Register Summary ___________________ 31
Table 5-29: Message Signaled Interrupt Capability ID Register _________________________ 31
Table 5-30: Message Signaled Interrupt Control Register ______________________________ 31
Table 5-31: Message Signaled Interrupt Lower Address Register ________________________ 31
Table 5-32: Message Signaled Interrupt Upper Address Register ________________________ 31
Table 5-33: Message Signaled Interrupt Message Data Register ________________________ 31
Table 5-34: Message Signaled Interrupt Masked Bits Register __________________________ 31
Table 5-35: Message Signaled Interrupt Pending Bits Register _________________________ 32
Table 5-36: MSI-X Capability Register Summary _____________________________________ 32
Table 5-37: MSI-X Identifier Register ______________________________________________ 32
Table 5-38: MSI-X Control Register _______________________________________________ 32
Table 5-39: MSI-X Table Offset Register ___________________________________________ 32
Table 5-40: MSI-X Pending Bit Array Offset Register _________________________________ 32
Table 5-41: PCI Express Capability Register Summary________________________________ 33
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Table 5-42: PCI Express Capability ID Register _____________________________________ 33
Table 5-43: PCI Express Capabilities Register ______________________________________ 33
Table 5-44: PCI Express Device Capabilities Register ________________________________ 33
Table 5-45: PCI Express Device Control Register ____________________________________ 34
Table 5-46: PCI Express Device Status Register _____________________________________ 34
Table 5-47: PCI Express Device Link Capabilities Register ____________________________ 34
Table 5-48: PCI Express Device Link Control Register ________________________________ 35
Table 5-49: PCI Express Device Link Status Register _________________________________ 35
Table 5-50: PCI Express Device Capabilities 2 Register _______________________________ 35
Table 5-51: PCI Express Device Control 2 Register __________________________________ 36
Table 5-52: PCI Express Device Status 2 Register ___________________________________ 36
Table 5-53: PCI Express Link Capabilities 2 Register _________________________________ 36
Table 5-54: PCI Express Link Control 2 Register _____________________________________ 36
Table 5-55: PCI Express Link Status 2 Register _____________________________________ 36
Table 5-56: Advanced Error Reporting Capability Register Summary _____________________ 37
Table 5-57: AER Capability ID Register ____________________________________________ 37
Table 5-58: AER Uncorrectable Error Status Register _________________________________ 37
Table 5-59: AER Uncorrectable Error Mask Register _________________________________ 38
Table 5-60: AER Uncorrectable Error Severity Register _______________________________ 38
Table 5-61: AER Correctable Error Status Register ___________________________________ 39
Table 5-62: AER Correctable Error Mask Register ___________________________________ 39
Table 5-63: AER Capabilities and Control Register ___________________________________ 39
Table 5-64: AER Header Log Register _____________________________________________ 40
Table 5-65: AER TLP Prefix Log Register __________________________________________ 40
Table 5-66: Secondary PCI Express Capability Register Summary ______________________ 40
Table 5-67: Secondary PCI Express Capability ID Register ____________________________ 40
Table 5-68: PCI Express Link Control 3 Register ____________________________________ 41
Table 5-69: PCI Express Lane Error Status Register __________________________________ 41
Table 5-70: PCI Express Lane 0 Equalization Register ________________________________ 41
Table 5-71: PCI Express Lane 1 Equalization Register _______________________________ 41
Table 5-74: Device Serial Number Capability Register Header _________________________ 41
Table 5-75: Serial Number Register Header (offset 0x4/0x8) ___________________________ 41
Table 5-76: Power Budgeting Extended Capability Header _____________________________ 42
Table 5-77: Data Register ______________________________________________________ 42
Table 5-78: Power Budget Capability Register ______________________________________ 42
Table 5-79: LTR Extended Capability Header _______________________________________ 43
Table 5-80: LTR Max Snoop latency Register _______________________________________ 43
Table 5-81: LTR Max No Snoop latency Register ____________________________________ 43
Table 5-82: L1 Substates Extended Capability Header ________________________________ 43
Table 5-83: L1 Substates Capability Register _______________________________________ 43
Table 5-84: L1 Substates Control1 Register ________________________________________ 44
Table 5-85: L1 Substates Control2 Register ________________________________________ 44
Table 5-86: Register Summary __________________________________________________ 44
Table 5-87: Controller Capabilities ________________________________________________ 45
Table 5-88: Version ___________________________________________________________ 45
Table 5-89: Interrupt Mask Set __________________________________________________ 45
Table 5-90: Interrupt Mask Clear _________________________________________________ 46
Table 5-91: Controller Configuration ______________________________________________ 46
Table 5-92: Controller Status____________________________________________________ 46
Table 5-93: Admin Queue Attributes ______________________________________________ 46
Table 5-94: Admin Submission Queue Base Address _________________________________ 47
Table 5-95: Admin Completion Queue Base Address _________________________________ 47
Table 5-96: Submission Queue Tail y Doorbell ______________________________________ 47
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Table 5-97: Completion Queue Head y Doorbell _____________________________________ 47
Table 6-1: Opcode for Admin Commands __________________________________________ 48
Table 6-2: Admin Commands –NVM Command Set Specific ___________________________ 48
Table 6-3: Identify Controller Data Structure ________________________________________ 49
Table 6-4: Identify Power State Descriptor Data Structure _____________________________ 51
Table 6-5: Identify Namespace Data Structure ______________________________________ 52
Table 6-6: LBA Format 0 Data Structure ___________________________________________ 54
Table 6-7: Opcode for NVM Express I/O Commands _________________________________ 54
Table 6-8: SMART/Health Information Log _________________________________________ 55
Table of Figures
Figure 3-1: Dimension Details for M.2 80mm length __________________________________ 19
Figure 3-2: Signal and Power Pins on M.2 card edge _________________________________ 22
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1 Introduction
This document describes the specification of Viking SSD which uses PCIe
interface. The Viking SSD is fully consist of semiconductor device and using
NAND Flash Memory which has a high reliability and a high technology in a small
form factor for using a SSD and supporting Peripheral Component Interconnect
Express (PCIe) 3.0 interface standard up to 2 lanes shows much faster
performance than previous SATA SSDs It could also provide rugged features
with an extreme environment with a high MTBF.
1.1 Features
The SSD delivers the following features:
Native-PCIe SSD for enterprise application
PCI Express Gen3: Single port X2 lanes
Compliant with PCI Express Base Specification Rev. 3.0
Compliant with NVM Express Specification Rev.1.2
Static and Dynamic Wear Leveling and Bad Block Management
RoHS / Halogen-Free Compliant
Support up to queue depth 64K
Support Power Management: ASPM/PCI-PM L0s, L1, L1.1 and L1.2
Support SMART and TRIM commands
Support 48-bit addressing mode
Firmware update
Firmware support for encryption
1.2 PCIE Interface
PCI Express Gen3: Single port X2 lanes, 4Gb/s
Compliant with PCI Express Base Specification Rev. 3.0
Compliant with NVM Express Specification Rev.1.2
For a list of supported commands and other specifics, refer to Chapter 5 and 6.
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2 Product Specifications
2.1 Capacity and LBA count
Raw Capacity
(GB)
User Capacity
(GB)
LBA Count
128
120
234,441,648
256
240
468,862,128
512
480
937,703,088
1000
960
1,875,385,008
Notes:
1. Per www.idema.org, LBA1-03 spec,
LBA counts = (97,696,368) + (1,953,504 * (Advertised Capacity in GBytes – 50))
2.2 Performance
Table 2-1: Maximum Sustained Read and Write Bandwidth and Power
Consumption
Performance
Capacity
(GB)
Flash Structure
120
Power Consumption
Read
(mW)
Write
(mW)
Idle
(mW)
TBD
4,440
3,370
400
1,600
TBD
4,890
4,810
400
128GB x 4, BGA, 15nm
1,600
1,300
5,110
6,920
400
256GB x 4, BGA, 15nm
1,600
1,300
5,120
6,930
400
Read
(MB/s)
Write
(MB/s)
32GB x 4, BGA, 15nm
1,600
240
64GB x 4, BGA, 15nm
480
960
Notes:
1. Performance measured using CrystalDiskMark and ATTO
2. Performance may vary from flash configuration and platform.
3. Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology.
4. Data is based on SSD’s using Toshiba MLC 15nm L die
5. Typical Power Consumption at 3.3V
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Table 2-2: Maximum Random Read and Write Input/Output Operations per
Second (IOPS)
Access Type
Read, 4K, IOPS
Write, 4K, IOPS
128GB
Up to TBD
Up to TBD
256GB
Up to TBD
Up to TBD
512GB
Up to TBD
Up to TBD
Notes:
1. Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology
2.2.1 Throughput
Based on the available space of the disk, the SSD will regulate the read/write
speed and manage the performance of throughput. When there still remains a lot
of space, the firmware will continuously perform read/write action. There is still no
need to implement garbage collection to allocate and release memory, which will
accelerate the read/write processing to improve the performance. Contrarily,
when the space is going to be used up, the SSD will slow down the read/write
processing, and implement garbage collection to release memory. Hence,
read/write performance will become slower.
2.2.2 Predict & Fetch
Normally, when the Host tries to read data from a PCIe SSD, the PCIe SSD will
only perform one read action after receiving one command. However, the Viking
SSD applies Predict & Fetch to improve the read speed. When the host issues
sequential read commands to the PCIe SSD, the PCIe SSD will automatically
expect that the following will also be read commands. Thus, before receiving the
next command, flash has already prepared the data. Accordingly, this
accelerates the data processing time, and the host does not need to wait so long
to receive data.
2.3 Electrical Characteristics
2.3.1 Absolute Maximum Ratings
Values shown are stress ratings only. Functional operation outside normal
operating values is not implied. Extended exposure to absolute maximum ratings
may affect reliability.
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Table 2-3: Absolute Maximum Ratings
Description
Maximum Voltage Range for Vin
Maximum Temperature Range
Min
-0.2
-40
Max
3.6
85
Unit
V
c
Min
Max
Unit
3.135
3.465
V
2.3.2 Supply Voltage
The operating voltage is 3.3V
Table 2-4: Operating Voltage
Description
Operating Voltage for 3.3 V (+/- 5%)
2.4 Environmental Conditions
2.4.1 Temperature and Altitude
Table 2-5: Temperature and Altitude Related Specifications
Conditions
Commercial
1
Temperature- Case
Humidity (noncondensing)
Operating
-25'C to +70'C
Shipping
-40 to 85°C
Storage
-40 to 85°C
90% under 40C
93% under 40C
93% under 40C
Notes:
1. Tc is measured at the surface of NAND Flash package
2.4.2 Shock and Vibration
SSD products are tested in accordance with environmental specification for
shock and vibration
Table 2-6: Shock and Vibration Specifications
Stimulus
Shock(non-operating)
Vibration
(non-operating)
Description
1500G ( 0.5ms duration x,y,z with 1/2 sine wave)
(60min /axis on 3 axes)
Displacement: 1.52mm (20 ~ 80 Hz)
Acceleration: 20G (80 ~ 2,000 Hz)
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2.4.3 Electromagnetic Immunity
M.2 is an embedded product for host systems and is designed not to impair with
system functionality or hinder system EMI/FCC compliance.
2.5 Reliability
Table 2-7: Reliability Specifications
Parameter
Description
ECC
Correct up to 120 bits error in 2K Byte data
MTBF
2,000,000 hours
Write
Endurance
(MLC)
Write
Endurance
(TLC)
Capacity
TBW
120GB
175
240GB
349
480GB
960GB
Capacity
120GB
698
240GB
480GB
960GB
Data
retention
1396
TBW
TBD
TBD
TBD
TBD
> 90 days at NAND expiration
Notes:
1. The reliability specification follows JEDEC standards JESD218A and JESD219A
2. Average Minimum Program/Erase cycles (MLC, 3000)
2.6 Data Security
2.6.1 Power Loss Protection: Flushing Mechanism
Power Loss Protection is a mechanism to prevent data loss during unexpected
power failure. DRAM is a volatile memory and frequently used as temporary
cache or buffer between the controller and the NAND flash to improve the SSD
performance. However, one major concern of the DRAM is that it is not able to
keep data during power failure. Accordingly, the SSD applies the
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GuaranteedFlush technology, which requests the controller to transfer data to the
cache.
DDR performs as a cache, and its sizes include 256MB, 512MB,
1024MB or 2048MB. Only when the data is fully committed to the NAND flash will
the controller send acknowledgement (ACK) to the host. Such implementation
can prevent false-positive performance and the risk of power cycling issues.
Additionally, it is critical for a controller to shorten the time the in-flight data stays
in the cache. Thus, the SSD applies an algorithm to reduce the amount of data
resides in the cache to provide a better performance. This SmartCacheFlush
technology allows incoming data to only have a “pit stop” in the cache and then
move to the NAND flash at once. If the flash is jammed due to particular file sizes
(such as random 4KB data), the cache will be treated as an “organizer”,
consolidating incoming data into groups before written into the flash to improve
write amplification. In sum, with Flush Mechanism, the SSD proves to provide
the reliability required by consumer, industrial, and enterprise-level applications.
2.6.2 Secure Erase
Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe
all the data on hard drives and SSDs. When this command is issued, the SSD
controller will empty its storage blocks and return to its factory default settings.
2.6.3 Write Protect
When a SSD contains too many bad blocks and data are continuously written in,
then the SSD might not be usable anymore. Thus, Write Protect is a mechanism
to prevent data from being written in and protect the accuracy of data that are
already stored in the SSD.
2.6.4 Encryption
Pyrite
AES256
OPAL 2.0
2.7 Flash Management
2.7.1 Error Correction Code (ECC)
Flash memory cells will deteriorate with use, which might generate random bit
errors in the stored data. The SSD applies a BCH ECC algorithm, which can
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detect and correct errors occur during read process, ensure data been read
correctly, as well as protect data from corruption.
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2.7.2 Wear Leveling
NAND flash devices can only undergo a limited number of program/erase cycles,
and in most cases, the flash media are not used evenly. If some areas get
updated more frequently than others, the lifetime of the device would be reduced
significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND
Flash by evenly distributing write and erase cycles across the media.
Advanced Wear Leveling algorithm, can efficiently spread out the flash usage
through the whole flash media area. Moreover, by implementing both dynamic
and static Wear Leveling algorithms, the life expectancy of the NAND flash is
greatly improved.
2.7.3 Bad Block Management
Bad blocks are blocks that include one or more invalid bits, and their reliability is
not guaranteed. Blocks that are identified and marked as bad by the
manufacturer are referred to as “Initial Bad Blocks”. Bad blocks that are
developed during the lifespan of the flash are named “Later Bad Blocks”. Viking
implements an efficient bad block management algorithm to detect the factoryproduced bad blocks and manages any bad blocks that appear with use. This
practice further prevents data being stored into bad blocks and improves the data
reliability.
2.7.4 TRIM
TRIM is a feature which helps improve the read/write performance and speed of
solid-state drives (SSD). Unlike hard disk drives (HDD), SSDs are not able to
overwrite existing data, so the available space gradually becomes smaller with
each use. With the TRIM command, the operating system can inform the SSD
which blocks of data are no longer in use and can be removed permanently.
Thus, the SSD will perform the erase action, which prevents unused data from
occupying blocks all the time.
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2.7.5 SMART
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is
an open standard that allows a hard disk drive to automatically detect its health
and report potential failures. When a failure is recorded by SMART, users can
choose to replace the drive to prevent unexpected outage or data loss.
Moreover, SMART can inform users of impending failures while there is still time
to perform proactive actions, such as copy data to another device.
2.7.6 Over-Provision
Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which
is not visible and cannot be used by users. With Over Provisioning, the
performance and IOPS (Input/Output Operations per Second) are improved by
providing the controller additional space to manage P/E cycles, which enhances
the reliability and endurance as well. Moreover, the write amplification of the SSD
becomes lower when the controller writes data to the flash.
2.7.7 Firmware Upgrade
Firmware can be considered as a set of instructions on how the device
communicates with the host. Firmware will be upgraded when new features are
added, compatibility issues are fixed, or read/write performance gets improved.
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3 Mechanical Information
Figure 3-1: Dimension Details for M.2 80mm length
Top View
.
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Bottom View
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Side View
Notes:
1. M.2 2280-D5-M: 80mm (L) x 22mm (W) x 3.8mm (H)
2. All dimensions are in millimeter
3. General tolerance is ± 0.15mm
4.
Max component height designated by ……….
5.
No component area designated by .…………
6.
No component (signal vias/Signal copper/Print
7.
Check points locations at .………….…………
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3.1 Card Edge Detail
Figure 3-2: Signal and Power Pins on M.2 card edge
Top View
Manual
PSFNP5xxxxDxxx
Revision D
Bottom View
8/14/2017
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3.2 M.2 SSD Weight
Table 3-1: M.2 SSD weight
Length
80 mm
Weight