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VWUSD032GCE1WW3C

VWUSD032GCE1WW3C

  • 厂商:

    VIKINGTECHNOLOGY

  • 封装:

  • 描述:

    MEMORY CARD 32GB MICRO SD CARD

  • 数据手册
  • 价格&库存
VWUSD032GCE1WW3C 数据手册
US Headquarters 2950 Red Hill Ave, Costa Mesa California, USA 92626 Office: 714.913.2200 Fax: 714.913.2202 www.vikingtechnology.com Datasheet for: SDHC/SDXC UHS104 microSD Cards PSFUSDxxxxCxxxxx_W microSD Cards Legal Information Copyright© 2020 Sanmina Corporation. All rights reserved. The information in this document is proprietary and confidential to Sanmina Corporation. No part of this document may be reproduced in any form or by any means or used to make any derivative work (such as translation, transformation, or adaptation) without written permission from Sanmina. Sanmina reserves the right to revise this documentation and to make changes in content from time to time without obligation on the part of Sanmina to provide notification of such revision or change. Sanmina provides this documentation without warranty, term or condition of any kind, either expressed or implied, including, but not limited to, expressed and implied warranties of merchantability, fitness for a particular purpose, and non-infringement. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made. In no event will Sanmina be liable for damages arising directly or indirectly from any use of or reliance upon the information contained in this document. Sanmina may make improvements or changes in the product(s) and/or the program(s) described in this documentation at any time. Sanmina, Viking Technology, Viking Modular Solutions, and the Viking logo are trademarks of Sanmina Corporation. Other company, product or service names mentioned herein may be trademarks or service marks of their respective owners. Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 2 Revision History Date Revisio n 4/15/19 A 10/2/19 B 10/14/19 C 11/1/19 D 11/15/19 E 1/21/20 F Description Revised from PSUSDxxxxCxxxxxC_A Remove references to tos, change performance. Change to TLC Add new PN’s per PSG 9/25/19. Add VWFUSD016GCEDWW PN per agile Add VWFUSD016GCEDWW PN per agile Add specs for 256GB Revise VWFUSD8192CEWWW to (-25to+85ºC) Add VWUSD128GCEHWW3C VWUSD064GCE5WW3C Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 Checked by SDHC/SDXC UHS104 microSD Cards Page 3 Ordering Information for the SDHC/SDXC UHS104 microSD Cards VikingPart# Interface Temp GB Client/Ent NAND VWFUSD8192CEWWW VWFUSD016GCEDWW VWUSD032GCE1WW3C VWUSD064GCE5WW3C VWUSD128GCEHWW3C VWFUSD064GCEAMWL VWFUSD128GCEZMWL VWFUSD256GCECMWL microSD Card microSD Card microSD Card microSD Card microSD Card microSD Card microSD Card microSD Card (-25 to +85ºC) (-25 to +85ºC) (-25 to +85ºC) (-25 to +85ºC) (-25 to +85ºC) (-25 to +85ºC) (-25 to +85ºC) (-25 to +85ºC) 8 16 32 64 128 64 128 256 Client Client Client Client Client Client Client Client TSB BiCS 3D TSB BiCS 3D TSB BiCS 3D TLC TSB BiCS 3D TLC TSB BiCS 3D TLC SanDisk MLC SanDisk MLC SanDisk MLC Notes: 1. Contact Viking for availability date 2. The lowercase letters x,y and z are wildcard characters that indicate product or customer specific information 3. Refer to the Viking part number coversheet or PN decoder for details. Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 4 Table of Contents 1 INTRODUCTION 8 1.1 FEATURES 8 2 MICROSD CARD STANDARDS COMPATIBILITY 9 3 PHYSICAL CHARACTERISTICS 9 3.1 Package Characteristics 9 3.2 Environmental Characteristics 9 3.3 Physical Characteristics 10 4 ELECTRICAL INTERFACE 10 4.1 Pin Assignment 10 4.2 microSD Card Bus Topology 4.2.1 SD Bus Mode protocol 11 11 4.3 17 Initialization 4.4 Electrical Characteristics 4.4.1 Absolute Maximum Conditions 4.4.2 DC Characteristics 4.4.3 AC Characteristics (Default Speed) 4.4.4 AC Characteristics (High Speed) 4.4.5 AC Characteristics (Ultra High Speed; UHS104) 21 21 22 25 27 28 5 CARD INTERNAL INFORMATION 33 5.1 Security Information 33 5.2 microSD Card Registers 5.2.1 OCR Register 5.2.2 CID Register 5.2.3 CSD Register 5.2.4 RCA Register 5.2.5 DSR Register 5.2.6 SCR Register 5.2.7 Card Status 5.2.8 SD Status 5.2.9 Switch Function Status 33 34 35 35 37 37 37 38 40 41 5.3 Logical Format 5.3.1 microSD card Capacities 42 43 Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 5 6 SD SPECIFICATION COMPLIANCE 43 7 RELIABILITY GUIDANCE 43 8 MICROSD CARD MECHANICAL DIMENSIONS 45 Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 6 Table of Tables Table 1-1: Features ___________________________________________________________________ 8 Table 4-1: microSD Card Pin Assignment ________________________________________________ 10 Table 4-2: SD Mode Command Set ( + = Implemented, - = Not Implemented) __________________ 12 Table 4-3: SPI Mode Command Set ( + = Implemented, - = Not Implemented) _________________ 15 Table 4-4:S18R and S18A Combinations _________________________________________________ 19 Table 4-5: Absolute Maximum Conditions ________________________________________________ 21 Table 4-6: DC Characteristics __________________________________________________________ 22 Table 4-7: Bus Operating Conditions - Signal Line's Load ____________________________________ 24 Table 4-8: Threshold Level 1.8V Signaling ________________________________________________ 24 Table 4-9: Threshold Level 1.8V Signaling ________________________________________________ 25 Table 4-10: Bus Timing - Parameters Values (Default Speed) _________________________________ 26 Table 4-11: Bus Timing - Parameters Values (High Speed) ___________________________________ 27 Table 4-12: Clock Signal Timing of SDR104, SDR50, SDR25, SDR12 __________________________ 29 Table 4-13: Clock input Timing of SDR104, SDR50, SDR25, SDR12 ___________________________ 29 Table 4-14: Output Timing of Fixed Data Window ( SDR50, SDR25, SDR12 ) ____________________ 30 Table 4-15: Output Timing of Variable Data Window ( SDR104 ) ______________________________ 31 Table 4-16: Clock Signal Timing of DDR50 _______________________________________________ 31 Table 4-17: BUS Timings – Parameters Values (DDR50 mode) _______________________________ 32 Table 5-1: microSD Card Registers _____________________________________________________ 34 Table 5-2: OCR register definition ______________________________________________________ 34 Table 5-3: CID register _______________________________________________________________ 35 Table 5-4: CSD register ______________________________________________________________ 35 Table 5-5: The SCR Fields ____________________________________________________________ 37 Table 5-6: Card Status _______________________________________________________________ 38 Table 5-7: SD Status _________________________________________________________________ 40 Table 5-8: Switch Function Status ______________________________________________________ 41 Table of Figures Figure 1-1: Top View __________________________________________________________________ 9 Figure 4-1: microSD Card Pin Assignment (Back view of the Card) ____________________________ 10 Figure 4-2: Bus Connection Diagram (SD Mode) ___________________________________________ 12 Figure 4-3: Bus Connection Diagram (SPI Mode) __________________________________________ 15 Figure 4-4: UHS-I Host Initialization Flow Chart ____________________________________________ 17 Figure 4-5: ACMD41 Timing Followed by Signal Voltage Switch Sequence ______________________ 18 Figure 4-6: Signal Voltage Switch Sequence ______________________________________________ 20 Figure 4-7: microSD Card Connection Diagram ____________________________________________ 21 Figure 4-8: Card Input Timing (Default Speed Mode) ________________________________________ 25 Figure 4-9: Card Output Timing (Default Speed Mode) ______________________________________ 26 Figure 4-10: Card Input Timing (High Speed Card) _________________________________________ 27 Figure 4-11: Card Output Timing (High Speed Card) ________________________________________ 27 Figure 4-12: Clock Signal Timing _______________________________________________________ 28 Figure 4-13: Clock Input Timing ________________________________________________________ 29 Figure 4-14: Output Timing of Fixed Window ______________________________________________ 30 Figure 4-15: Output Timing of Variable Window ____________________________________________ 30 Figure 4-16: Clock Signal Timing _______________________________________________________ 31 Figure 4-17: Timing Diagram DAT Inputs/Outputs Referenced to CLK in DDR50 Mode _____________ 32 Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 7 1 Introduction This data sheet describes the specifications of the SDHC/SDXC Standard microSD Card with UHS104 SD Bus mode. The SDHC/SDXC microSD Cards are a Memory Card of Small and Thin with SDMI compliant Security method. (SDMI: Secure Digital Music Initiative) Contents in the Card can be protected by CPRM based security. This contents security can be accomplished by SDHC/SDXC Card, host, and security application software combinations. 1.1 FEATURES Table 1-1: Features Media Format microSD Memory Card Standard Compliant with the SD Memory Card Standard Ver. 4.20, UHS104 Security Functions SD Security Specification Ver.2.00 Compliant (CPRM Based) *CPRM: Contents Protection for Recording Media Specification Logical Format Electrical Features Operating Voltage Operating Current SD Interface UHS-I Interface Physical Features Physical Package size /Mass Durability RoHS Performance Features Maximum access speed Speed Class Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SD File System Specification Ver.2.00 Compliant SDHC Card = FAT32, SDXC Card = exFAT VDD = 2.7V(min), 3.3V(Typ), 3.6V(max) SDR104 Write : 140mA(max) SDR104 Read : 150mA(max) DS : Signaling Voltage = 3.3V(Typ), SDCLK = 25MHz HS : Signaling Voltage = 3.3V(Typ), SDCLK = 50MHz Ultra High Speed: UHS104 : Signaling Voltage = 1.8V(Typ), SDCLK = 208MHz UHS50 : Signaling Voltage = 1.8V(Typ), SDCLK = 100MHz@SDR100 / 50MHz@DDR50 Supported UHS-I bus modes are SDR104, SDR50, DDR50, SDR25, SDR12. L: 15, W: 11, T: 1 (mm), Weight: 0.3g (typ.) SD Physical Layer Specification Ver.3.01 Compliant Compliant with SD Physical Layer Specification Ver.3.01 and microSD Memory Card specification 2.01 Compliant Compliant with RoHS regulations (DIRECTIVE 2011/65/EU) Bus mode Sequential Write = 50 MB/s Sequential Read = 80 MB/s UHS Speed Class = U3 SD Speed Class = C10, Class 4 SDHC/SDXC UHS104 microSD Cards Page 8 Figure 1-1: Top View 2 microSD Card Standards Compatibility This microSD Memory Card Specification is compliant with:     PHYSICAL LAYER SPECIFICATION Ver.3.01 (Part1) (Except for Mechanical Specification) FILE SYSTEM SPECIFICATION Ver.2.00. (Part2) SECURITY SPECIFICATION Ver.2.00. (Part3) microSD Card Memory Card Specification Version 2.01 3 Physical Characteristics 3.1 Package Characteristics 1. Mold Material: Epoxy Resin+Silicon Dioxide 2. Flameproof Grade: V-0(UL94) 3. Heatproof Temperature: approx.400 degrees 3.2 Environmental Characteristics The standard Operation Conditions are:  Absolute Maximum Temperature Range  Humidity less than RH = 95 %, Non condensed Ta = -25 to +85°C Ta = 25°C The standard Storage Conditions are:  Maximum Temperature Range:  Humidity less than RH = 93%, Non condensed Tstg = -40 to +85°C Ta = 40°C Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 9 3.3 Physical Characteristics 1) Hot Insertion or Removal The microSD Card can be removed or inserted without power off from the host system as described in the SD Physical Layer Specification 6.1 The connector will recognize the Hot Insertion or Removal is defined in the 6.2 of the PHYSICAL LAYER SPECIFICATION. 2) Mechanical Write Protect Switch The microSD memory Card has no mechanical write protect switch. 4 Electrical Interface 4.1 Pin Assignment The table below describes the pin assignment of the microSD card. The following figure describes the pin assignment of the microSD card. Please refer to the detail descriptions by SD Card Physical Layer Specification. Figure 4-1: microSD Card Pin Assignment (Back view of the Card) Table 4-1: microSD Card Pin Assignment SD Mode SPI Mode Pin Name IO Type Description Name IO Type Description 1 DAT2 I/O/PP Data Line[Bit2] RSV I/O/ PP Card Detect/ Data Line[Bit3] CS I PP Command/Response DI I Chip Select (Negative True) Data In S Supply Voltage VDD S Supply Voltage 3 CD/ DAT3 CMD 4 VDD 5 CLK I Clock SCLK I Clock 6 VSS S Ground VSS S Ground 7 DAT0 I/O/PP Data Line[Bit0] DO O/PP Data Out 8 DAT1 I/O/PP Data Line[Bit1] RSV - Reserved(*) 2 Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 10 Notes: S: Power Supply I: Input O: Output using push-pull drivers PP: I/O using push-pull drivers (*) These signals should be pulled up by host side with 10-100k ohm resistance in the SPI Mode. 4.2 microSD Card Bus Topology The device supports two alternative communication protocols: SD and SPI Bus Mode. It is as same as standard microSD memory cards. Host System can choose either one of modes. Same Data of the device can read and write by both modes. SD Mode allows the 4-bit high performance data transfer. SPI Mode allows easy and common interface for SPI channel. The disadvantage of this mode is loss of performance, relatively to the SD mode. 4.2.1 SD Bus Mode protocol The SD bus allows the dynamic configuration of the number of data line from 1 to 4 Bidirectional data signal. After power up by default, the Device will use only DAT0. After initialization, host can change the bus width. Multiplied microSD cards connections are available to the host. Common VDD, VSS and CLK signal connections are available in the multiple connections. However, Command, Respond and Data lined (DAT0-DAT3) shall be divided for each card from host. This feature allows easy tradeoff between hardware cost and system performance. Communication over the SD bus is based on command and data bit stream initiated by a start bit and terminated by stop bit. Command: Commands are transferred serially on the CMD line. A command is a token to starts an operation from host to the card. Commands are sent to an addressed single card (addressed Command) or to all connected cards (Broad cast command). Response: Responses are transferred serially on the CMD line. A response is a token to answer to a previous received command. Responses are sent from an addressed single card or from all connected cards. Data: Data can be transfer from the card to the host or vice versa. Data is transferred via the data lines. Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 11 microSD Card (A) microSD Card (B) Figure 4-2: Bus Connection Diagram (SD Mode) CLK CMD DAT0 - DAT3 VDD VSS Host card Clock signal Bi-directional Command/ Response Signal 4 Bi-directional data signal Power supply GND Table 4-2: SD Mode Command Set ( + = Implemented, - = Not Implemented) CMD Index Abbreviation CMD0 GO_IDLE_STATE + CMD2 ALL_SEND_CID + CMD3 SEND_RELATIVE_ADDR + CMD4 SET_DSR - CMD6 SWITCH_FUNC + CMD7 SELECT/DESELECT_CARD + CMD8 SEND_IF_COND + CMD9 SEND_CSD + Implementation Note CMD10 SEND_CID + CMD11 VOLTAGE_SWITCH + Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 DSR Register is not implemented. UHS-I mode SDHC/SDXC UHS104 microSD Cards Page 12 CMD Index Abbreviation Implementation Note CMD12 STOP_TRANSMISSION + CMD13 SEND_STATUS + CMD15 GO_INACTIVE_STATE + CMD16 SET_BLOCKLEN + CMD17 READ_SINGLE_BLOCK + CMD18 READ_MULTIPLE_BLOCK + CMD19 SEND_TUNING_PATTERN + UHS-I mode CMD20 SPEED_CLASS_CONTROL + For SDHC/SDXC CMD23 SET_BLOCK_COUNT + CMD24 WRITE_BLOCK + CMD25 WRITE_MULTIPLE_BLOCK + CMD26 Reserved for Manufacturer + CMD27 PROGRAM_CSD + CMD28 SET_WRITE_PROT - CMD29 CLR_WRITE_PROT - CMD30 SEND_WRITE_PROT - CMD32 ERASE_WR_BLK_START + CMD33 ERASE_WR_BLK_END + CMD38 ERASE + CMD42 LOCK_UNLOCK + CMD55 APP_CMD + CMD56 GEN_CMD + CMD60 Reserved for Manufacturer + CMD61 Reserved for Manufacturer + CMD62 Reserved for Manufacturer + ACMD6 SET_BUS_WIDTH + ACMD13 SD_STATUS + ACMD22 SEND_NUM_WR_BLOCKS + ACMD23 SET_WR_BLK_ERASE_COUNT + ACMD41 SD_SEND_OP_COND + ACMD42 SET_CLR_CARD_DETECT + ACMD51 SEND_SCR + ACMD18 SECURE_READ_MULTI_BLOCK + ACMD25 SECURE_WRITE_MULTI_BLOCK + ACMD26 SECURE_WRITE_MKB + ACMD38 SECURE_ERASE + ACMD43 GET_MKB + ACMD44 GET_MID + ACMD45 SET_CER_RN1 + ACMD46 GET_CER_RN2 + ACMD47 SET_CER_RES2 + ACMD48 GET_CER_RES1 + ACMD49 CHANGE_SECURE_AREA Notes: - Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 Internal Write Protection is not implemented. This command is not specified. 1.8V Signaling and XPC (SDXC Power Control) support SDHC/SDXC UHS104 microSD Cards Page 13  CMD28, 29 and CMD30 are optional commands.  CMD4 is not implemented because DSR register (Optional Register) is not implemented.  CMD56 is a vender specific command which is not defined in the standard card. 6.2.2 SPI Bus mode Protocol The SPI bus allows 1 bit Data line by 2-chanel (Data In and Out). The SPI compatible mode allows the MMC Host systems to use microSD card with little change. The SPI bus mode protocol is byte transfers. All the data token are multiples of the bytes (8-bit) and always byte aligned to the CS signal. The advantage of the SPI mode is reducing the host design effort. Especially, the MMC host can be modified with little change. The disadvantage of the SPI mode is the loss of performance versus SD mode. Caution: Please use SD Card Specification. DO NOT use MMC Specification. (For example, initialization is achieved by ACMD41, and be careful to Register. Register definition is different, especially CSD Register.) Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 14 microSD Card (A) microSD Card (B) Figure 4-3: Bus Connection Diagram (SPI Mode) CS CLK CMD DataIN DataOUT VDD VSS Card Select Signal Host card Clock signal Bi-directional Command/ Response Signal Host to card data line Host to card data line Power supply GND Table 4-3: SPI Mode Command Set ( + = Implemented, - = Not Implemented) CMD Index Abbreviation Implementation Note CMD0 GO_IDLE_STATE + CMD1 SEND_OP_COND + CMD6 SWITCH_FUNC + CMD8 SEND_IF_COND + CMD9 SEND_CSD + CMD10 SEND_CID + CMD12 STOP_TRANSMISSION + CMD13 SEND_STATUS + CMD16 SET_BLOCKLEN + Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 NOTICE: DO NOT USE SDHC/SDXC UHS104 microSD Cards Page 15 CMD Index Abbreviation Implementation Note CMD17 READ_SINGLE_BLOCK + CMD18 READ_MULTIPLE_BLOCK + CMD24 WRITE_BLOCK + CMD25 WRITE_MULTIPLE_BLOCK + CMD26 Reserved for Manufacturer + CMD27 PROGRAM_CSD + CMD28 SET_WRITE_PROT - CMD29 CLR_WRITE_PROT - CMD30 SEND_WRITE_PROT - CMD32 ERASE_WR_BLK_START + CMD33 ERASE_WR_BLK_END + CMD38 ERASE + CMD42 LOCK_UNLOCK + CMD55 APP_CMD + CMD56 GEN_CMD + CMD58 READ_OCR + CMD59 CRC_ON_OFF + CMD60 Reserved for Manufacturer + ACMD13 SD_STATUS + ACMD22 SEND_NUM_WR_BLOCKS + ACMD23 SET_WR_BLK_ERASE_COUNT + ACMD41 SD_SEND_OP_COND + ACMD42 SET_CLR_CARD_DETECT + ACMD51 SEND_SCR + ACMD18 SECURE_READ_MULTI_BLOCK + ACMD25 SECURE_WRITE_MULTI_BLOCK + ACMD26 SECURE_WRITE_MKB + ACMD38 SECURE_ERASE + ACMD43 GET_MKB + ACMD44 GET_MID + ACMD45 SET_CER_RN1 + ACMD46 GET_CER_RN2 + ACMD47 SET_CER_RES2 + Internal Write Protection is not implemented. This command is not specified. ACMD48 GET_CER_RES1 + Notes:  CMD28, 29 and CMD30 are optional commands.  CMD56 is a vender specific command which is not defined in the standard card. Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 16 4.3 Initialization The flow chart for UHS-I hosts and the sequence of commands to perform a signal voltage switch is shown below. Red and yellow boxes are new procedures to initialize the UHS-I card. Figure 4-4: UHS-I Host Initialization Flow Chart Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 17 Figure 4-5: ACMD41 Timing Followed by Signal Voltage Switch Sequence 1) POWER ON: Supply Voltage for initialization. Host System applies the perating Voltage to the card. Apply more than 74 cycles of Dummy-clock to the microSD card. 2) Select operation mode (SD mode or SPI mode) In the case of SPI mode operation, the host should drive pin 1 (CD/DAT3) of the microSD Card I/F to a “Low” level. Then, issue CMD0. In the case of SD mode operation, the host should drive or detect pin 1 of the microSD Card I/F (Pull up register of pin 1 is pull up to “High” normally). The card maintains selected operation mode except re-issue of CMD0 or power on below is SD mode initialization procedure. 3) Send Interface condition command (CMD8). When the card is in the Idle state, the host shall issue CMD8 before ACMD41. In the argument, 'voltage supplied' is set to the host supply voltage and 'check pattern' is set to any 8-bit pattern. The card that accepted the supplied voltage returns R7 response. In the response, the card echoes back both the voltage range and check pattern set in the argument. If the card does not support the host supply voltage, it shall not return response and stays in the Idle state. 4) Send initialization command (ACMD41). When the signaling level is 3.3V, the host repeats an issue ACMD41 with HCS=1 and S18R=1 until the response indicates ready. The argument (HCS and S18R) of the first ACMD41 is effective but the all the following ACMD41 should be issued with the same argument. If Bit 31 indicates ready, the host needs to check CCS and S18A. The card indicates S18A=0, which means that the voltage switch is not allowed and the host needs to use the current signaling level. Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 18 Table 4-4:S18R and S18A Combinations Current Signaling Level 18R S18A Comment 0 0 1.8V signaling is not requested 3.3V 1 0 The card does not support 1.8V signaling 1 1 Start signal voltage switch sequence 1.8V X 0 Already switched to 1.8V 5) Send voltage switch command (CMD11) S18A=1 means that the voltage switch is allowed and host issues CMD11 to invoke voltage switch sequence. By receiving CMD11, the card returns R1 response and start voltage switch sequence. No response of CMD11 means that S18A was 0 and therefore the host should not have sent CMD11. Completion of voltage switch sequence is checked by high level of DAT[3:0]. Any bit of DAT[3:0] can be checked depends on ability of the host. The card enters UHS-I mode and card input and output timings are changed (SDR12 in default) when the voltage switch sequence is completed successfully. 6) Send ALL_SEND_CID command (CMD2) and get the Card ID (CID) 7) Send SEND_RELATIVE_ADDR (CMD3) and get the RCA. RCA value is randomly changed by access, not equal zero. 8) Send SELECT / DESELECT_CARD command (CMD7) and move to the transfer state. When entering tran state, CARD_IS_LOCKED status in the R1 response should be checked (it is indicated in the response of CMD7). If the CARD_IS_LOCKED status is set to 1 in the response of CMD7, CMD42 is required before ACMD6 tounlock the card. ( If the card is locked, CMD42 is required to unlock the card. ) If the card is unlocked, CMD42 can be skipped. 9) Send SET_BUS_WIDTH command (ACMD6). UHS-I supports only 4-bit mode. Host shall select 4-bit mode by ACMD6. If the card is locked, host needs to unlock the card by CMD42 in 1-bit mode and then needs to issue ACMD6 to change 4-bit bus mode. Operating in 1-bit mode is not assured. 10) Set driver strength. CMD6 mode 0 is used to query which functions the card supports, and to identify the maximum current consumption of the card under the selected functions. In case of UHS-I card, appropriate driver strength (default is Type-B buffer) is selected by CMD6 Function Group 3. 11) Set UHS-I mode current limit. UHS-I modes ( Bus Speed Mode ) is selected by CMD6 Function Group 1. Current limit is selected by CMD6 Function Group 4. Maximum access settings: SDR104 = (CMD6 Function Group 1 = 3-h, CMD6 Function Group 4 = 0-h(*)) SDR50 = (CMD6 Function Group 1 = 2-h, CMD6 Function Group 4 = 0-h(*)) DDR50 = (CMD6 Function Group 1 = 4-h, CMD6 Function Group 4 = 0-h(*)) (*) The Current Limit is default value (200mA). Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 19 Note: Function Group 4 is defined as Current Limit switch for SDR50, SDR104. The Current Limit does not act on the card in SDR12 and SDR25. The default value of the Current Limit is 200mA (minimum setting). Then after selecting one of SDR50, SDR104 mode by Function Group 1, host needs to change the Current Limit to enable the card to operate in higher performance. This value is determined by a host power supply capability to the card, heat release method taken by a host and the maximum current of a connector. 12) Tuning of sampling point CMD19 sends a tuning block to the host to determine sampling point. In SDR50 and SDR104 modes, if tuning of sampling point is required, CMD19 is repeatedly issued until tuning is completed. Then the Host can access the Data between the microSD card as a storage device. Application Notes: 1.The host shall set ACMD41 timeout to more than 1 second to abort repeat of issuing ACMD41 when the card does not indicate ready. The timeout count starts from the first ACMD41 which is set voltage window in the argument. 2.Once the signal voltage is switched to 1.8V, the card continues 1.8V signaling regardless of CMD0. Power cycle resets the signal voltage to 3.3V. After switching 1.8V singling, the card cannot be changed to SPI mode. 3.Timing to Switch Signal Voltage To change signaling level at the same time between host and card, signal voltage switch sequence is invoked by CMD11 as shown in the figure below. CMD11 is issued only when S18A=1 in the response of ACMD41. Figure 4-6: Signal Voltage Switch Sequence Steps that the host takes to start a voltage switch sequence. 1. The host issues CMD11 to start voltage switch sequence. 2. The card returns R1 response. 3. The card drives CMD and DAT[3:0] to “low” immediately after the response. 4. The host stops supplying SDCLK. The card shall start switching voltage after host stops SDCLK. The Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 20 time to stop SDCLK is not specified. The host can detect whether the sequence starts by checking signal level of either one of CMD, DAT[3:0]. What signal should be checked will depend on the ability of the host. If low level is not detected, the host should abort the sequence and execute power cycle. 5. 1.8V output of voltage regulator in card shall be stable within 5ms.The Host keeps SDCLK low at least 5ms. This means that 5ms is the maximum for the card and the minimum for the host. 6. After 5ms from (step 4) and host voltage regulator is stable, the host starts providing SDCLK at 1.8V. The card can check whether SDCLK voltage is 1.8V. 7. By detecting SDCLK, the card drives CMD to high at 1.8V for at least one clock and then stops driving (tri-state). CMD is triggered by rising edge of SDCLK (SDR timing). 8. The card can check whether host drives CMD to 1.8V through the host pull-up resister. 9. If switching to 1.8V signaling is completed successfully, the card drives DAT[3:0] to high at 1.8V at least one clock and then stop driving (tri-state). DAT[3:0] is triggered by rising edge of SDCLK (SDR timing). DAT[3:0] shall be high within 1ms from start of providing SDCLK. Host check whether DAT[3:0] is high after 1ms from supplying SDCLK. This means that 1ms is the maximum for the card and the minimum for the host. 4.4 Electrical Characteristics Figure 4-7: microSD Card Connection Diagram 4.4.1 Absolute Maximum Conditions Table 4-5: Absolute Maximum Conditions Item Symbol Value Unit Supply Voltage VDD -0.3 to 3.9 V Input Voltage VIN -0.3 to VDD+0.3 (≤3.9) V Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 21 4.4.2 DC Characteristics Table 4-6: DC Characteristics Item Supply Voltage High Level Input Voltage 3.3V Signaling Output Voltage Input Voltage 1.8V Signaling Output Voltage Low Level High Level Low Level High Level Low Level High Level Low Level Symbol Condition VDD - MIN. 2.7 Typ. - MAX. Unit 3.6 V VIH VDD*0.625 - - VIL - - VDD*0.25 VDD*0.75 - - 1.27 - VDD*0.125 2 1.4 - VOH IOH = 2mA VOL IOL = 2mA VIH 0.58 VIL VOH IOH = 2mA VOL IOL = 2mA - 0.45 - V V V V V V V V 400 32GB Standby Current 64GB ICCS 128GB 256GB Operation Read Current (peak) 32GB 64GB 128GB 256GB ICCOP1 1 VDD = 3.6V Clock Stop SDR104 Current Limit = 200mA, 400mA VDD= 3.6V SDR50 Current Limit = 200mA, 400mA VDD = 3.6V DDR50 Current Limit = 200mA, 400mA VDD = 3.6V SDR25, HS VDD = 3.6V Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 - - - - - - - - 170 - - 155 - - 155 - - 135 450 uA 650 mA SDHC/SDXC UHS104 microSD Cards Page 22 Item Symbol Condition SDR12, DS VDD = 3.6V SDR104 Current Limit = 200mA, 400mA VDD= 3.6V Operation Write Current (peak) Operation Read Current (average) 32GB 64GB 128GB 256GB 32GB 64GB 128GB 256GB Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 ICCOP1 1 ICCOP2 2 SDR50 Current Limit = 200mA, 400mA VDD = 3.6V DDR50 Current Limit = 200mA, 400mA VDD = 3.6V SDR104 Current Limit = 200mA, 400mA VDD= 3.6V MIN. Typ. MAX. - - 125 - - 220 mA - - 205 - - 205 mA - - 130 - - 100 - - 95 SDR25, HS VDD = 3.6V - - 80 SDR12, DS VDD = 3.6V - - 70 SDR50 Current Limit = 200mA, 400mA VDD = 3.6V DDR50 Current Limit = 200mA, 400mA VDD = 3.6V Unit SDHC/SDXC UHS104 microSD Cards Page 23 Item Symbol Condition MIN. Typ. MAX. Unit SDR104 Current Limit = 200mA, 400mA VDD= 3.6V Operation Write Current (average) 32GB 64GB 128GB 256GB ICCOP2 2 mA SDR50 Current Limit = 200mA, 400mA VDD = 3.6V DDR50 Current Limit = 200mA, 400mA VDD = 3.6V SDR25, HS VDD = 3.6V - - 145 - - 115 - - 110 - - 90 SDR12, DS VDD = 3.6V 75 Notes: Peak Current RMS value over a 10usec period. 2) Average Current value over 1second period. Table 4-7: Bus Operating Conditions - Signal Line's Load Parameter Pull-up resistance Symbol Min. Max. Unit RCMD RDAT 10 100 kΩ Remark To prevent bus floating Total bus capacitance for each signal line CL 40 pF Card capacitance for each signal pin CCARD 10 pF 16 nH 90 kΩ May be used for card detection 5 uF To prevent inrush current Maximum signal line inductance Pull-up resistance inside card (pin1) RDAT3 Capacity Connected to Power Line CC 10 1 card CHOST+CBUS shall not exceed 30 pF Table 4-8: Threshold Level 1.8V Signaling Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 24 Parameter Symbol Min. Max. VDD 2.70 3.60 V VDDIO 1.70 1.95 V Generated by VDD Output High Voltage VOH 1.40 - V IOH= -2mA Output Low Voltage VOL 0.45 V IOL = 2mA Input High Voltage VIH 1.27 2.00 V Input Low Voltage VIL VSS-0.30 0.58 V Supply Voltage Regulator Voltage Unit Remark Table 4-9: Threshold Level 1.8V Signaling Parameter Symbol Input Leakage Current Min. Max. -2 2 Unit Remark uA DAT3 pull-up is disconnected. 4.4.3 AC Characteristics (Default Speed) Figure 4-8: Card Input Timing (Default Speed Mode) Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 25 Figure 4-9: Card Output Timing (Default Speed Mode) Table 4-10: Bus Timing - Parameters Values (Default Speed) Parameter Symbol Min. Max. Unit Remark Clock CLK (All values are referred to min (VIH) and max (VIL) Clock frequency Data Transfer Mode fPP 0 25 MHz CCARD ≤ 10 pF (1 card) Clock frequency Identification Mode fOD 0(1)/100 400 kHz CCARD ≤ 10 pF (1 card) Clock low time tWL 10 ns CCARD ≤ 10 pF (1 card) Clock high time tWH 10 ns CCARD ≤ 10 pF (1 card) Clock rise time tTLH 10 ns CCARD ≤ 10 pF (1 card) Clock fall time Parameter tTHL Symbol 10 Max. ns Unit CCARD ≤ 10 pF (1 card) Remark Min. Inputs CMD, DAT (referenced to CLK) Input set-up time tISU 5 ns Input hold time tIH 5 ns Parameter Symbol Outputs CMD, DAT (referenced to CLK) Output Delay time during Data Transfer Mode tODLY Output Delay time during Identification Mode tODLY Min. Max. Unit CCARD ≤ 10 pF (1 card) CCARD ≤ 10 pF (1 card) Remark 0 14 ns CL ≤ 40 pF (1 card) 0 50 ns CL ≤ 40 pF (1 card) Note: 1. 0 Hz means to stop the clock. The given minimum frequency range is for cases were continues clock is required Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 26 4.4.4 AC Characteristics (High Speed) Figure 4-10: Card Input Timing (High Speed Card) Figure 4-11: Card Output Timing (High Speed Card) Table 4-11: Bus Timing - Parameters Values (High Speed) Parameter Symbol Min. Max. Unit Remark Clock CLK (All values are referred to min (VIH) and max (VIL) Clock frequency Data Transfer Mode Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 fPP 0 50 MHz CCARD ≤ 10 pF (1 card) SDHC/SDXC UHS104 microSD Cards Page 27 Parameter Symbol Min. Max. Unit Remark Clock low time tWL 7 ns CCARD ≤ 10 pF (1 card) Clock high time tWH 7 ns CCARD ≤ 10 pF (1 card) Clock rise time tTLH 3 ns CCARD ≤ 10 pF (1 card) Clock fall time tTHL 3 ns CCARD ≤ 10 pF (1 card) Parameter Symbol Min. Max. Unit Remark Inputs CMD, DAT (referenced to CLK) Input set-up time tISU 6 ns CCARD ≤ 10 pF (1 card) Input hold time tIH 2 ns CCARD ≤ 10 pF (1 card) Parameter Symbol Min. Max. Unit Remark Outputs CMD, DAT (referenced to CLK) Output Delay time during Data Transfer Mode tODLY Output Hold time Output Delay time during Identification Mode 14 tOH 2.5 tODLY 0 ns CL ≤ 40 pF (1 card) ns CL > 15pF (1 card) 50 ns CL ≤ 40 pF (1 card) 4.4.5 AC Characteristics (Ultra High Speed; UHS104) 6.4.5.1 Bus Timing Specification Figure 4-12: Clock Signal Timing Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 28 Table 4-12: Clock Signal Timing of SDR104, SDR50, SDR25, SDR12 Symbol Min. Max. Unit Remark tCLK 4.80 - tCR, tCF - 0.2* tCLK ns Clock Duty 30 70 % ns 208MHz (Max.), Between rising edge, VCT= 0.975V tCR, tCF < 0.96ns (max.) at 208MHz, CCARD=10pF tCR, tCF, < 2.00ns (max.) at 100MHz, CCARD=10pF Figure 4-13: Clock Input Timing Table 4-13: Clock input Timing of SDR104, SDR50, SDR25, SDR12 Symbol Min. Max. Unit tIS 1.40 - ns CCARD =10pF, VCT= 0.975V tIH 0.80 - ns CCARD =5pF, VCT= 0.975V Symbol Min. Max. Unit tIS 3.00 - ns CCARD =10pF, VCT= 0.975V tIH 0.80 - ns CCARD =5pF, VCT= 0.975V Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDR104 mode SDR12, SDR25 and SDR50 mode SDHC/SDXC UHS104 microSD Cards Page 29 Figure 4-14: Output Timing of Fixed Window Table 4-14: Output Timing of Fixed Data Window ( SDR50, SDR25, SDR12 ) Symbol Min. Max. Unit Remark tODLY 7.5 ns tCLK>=10.0ns, CL=30pF, using driver Type B, for SDR50 tODLY 14 ns tCLK>=20.0ns, CL=40pF, using driver Type B, for SDR25 and SDR12 - ns Hold time at the tODLY (min.), CL=15pF tOH 1.5 Figure 4-15: Output Timing of Variable Window Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 30 Table 4-15: Output Timing of Variable Data Window ( SDR104 ) Symbol tOP ΔtOP Min. 0 Max. Unit Remark 2 -350 +1550 UI Card Output Phase ps Delay variation due to temperature change after tuning tODW 0.60 UI tODW=2.88ns at 208MHz Card ΔtOP is the total allowable shift of output valid window (tODW) from last system Tuning procedure. Card ΔtOP =1550pS for junction temperature of ΔT= 90°C during operation. Card ΔtOP =-350pS for junction temperature of ΔT= -20°C during operation. 6.4.5.2 Bus Timing Specification Figure 4-16: Clock Signal Timing Table 4-16: Clock Signal Timing of DDR50 Symbol Min. Max. tCLK 20 - tCR, tCF - Clock Duty 45 Unit Remark ns 50MHz (Max.), Between rising edge 0.2* tCLK ns tCR, tCF, < 4.00ns (max.) at 50MHz, CCARD=10pF 55 % CMD signal timings are not shown in the figure below but For CMD signal timing refers to Figure 4-13 (Card Input Timing) and Figure 4-14 (Output Timing of Fixed Data Window) for Timing Diagram of SDR mode). Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 31 Figure 4-17: Timing Diagram DAT Inputs/Outputs Referenced to CLK in DDR50 Mode Table 4-17: BUS Timings – Parameters Values (DDR50 mode) Parameter Symbol Min Max Unit Remark Input CMD (referenced to CLK rising edge) Input set-up time (*) tISU 3 Input hold time tIH 0.8 Output CMD (referenced to CLK rising edge) Output Delay time during Data Transfer Mode tODLY - - ns CCARD ≤ 10 pF (1 card) - ns CCARD ≤ 10 pF (1 card) 13.7 ns CL ≤ 30 pF (1 card) Output hold time tOH 1.5 ns CL ≥ 15pF (1 card) Inputs DAT (referenced to CLK rising and falling edges) Input set-up time tISU2x 3 - ns CCARD ≤ 10 pF (1 card) Input hold time tIH2x 0.8 ns CCARD ≤ 10 pF (1 card) Outputs DAT (referenced to CLK rising and falling edges) Output Delay time during Data Transfer Mode tODLY2x 7.0 ns CL ≤ 25 pF (1 card) Output hold time tODLY2x 1.5 ns CL ≥ 15pF (1 card) (*) Input set-up time : tISU(min) is 6ns in PHYSICAL LAYER SPECIFICATION Ver.3.01 Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 32 5 Card Internal Information 5.1 Security Information MKB (Media Key Block) and Media ID are Standard Information. This information is in compliance with the CPRM. Note: The security information is NOT Development information for evaluation. The Host System shall be compliance with the CPRM to use the security function. This information is kept as confidential because of security reasons. 5.2 microSD Card Registers The device has six Registers and two Status information: OCR, CID, CSD, RCA, DSR, SCR and Card Status, SD Status as same as SD card. DSR IS NOT SUPPORTED in this card. There are two types of register groups.   MMC compatible registers: OCR, CID, CSD, RCA, DSR, and SCR SD card Specific: SD Status and Card Status Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 33 Table 5-1: microSD Card Registers Register Bit Description Name Width CID 128 Card Identification number RCA 16 Relative Card Address DSR 16 Optional : Driver Stage CSD 128 Card Specific Data SCR 64 SD Configuration OCR 32 Operation conditions SSR 512 SD Status CSR 32 CMD6 Card Status 512 Switch Function Status 5.2.1 OCR Register This 32-bit register describes operating voltage range and status bit in the power supply. Table 5-2: OCR register definition OCR bit position OCR Fields Definition Response Value 8GB 16GB 32GB 64GB 128GB 256GB 0-3 reserved TBD TBD 0 0 0 0 6-Apr reserved TBD TBD 0 0 0 0 7 Reserved for Low Voltage Range TBD TBD 0 0 0 0 14-Aug reserved TBD TBD 0 0 0 0 2.7 - 2.8 TBD TBD 1 1 1 1 2.8 - 2.9 TBD TBD 1 1 1 1 2.9 - 3.0 TBD TBD 1 1 1 1 18 3.0 - 3.1 TBD TBD 1 1 1 1 19 3.1 - 3.2 TBD TBD 1 1 1 1 20 3.2 - 3.3 TBD TBD 1 1 1 1 21 3.3 - 3.4 TBD TBD 1 1 1 1 22 3.4 - 3.5 TBD TBD 1 1 1 1 23 3.5 - 3.6 TBD TBD 1 1 1 1 15 16 17 VDD voltage Window 24(1) Switching to 1.8V Accepted (S18A) TBD TBD 1 1 1 1 25-29 reserved TBD TBD 0 0 0 0 30 Card Capacity Status (CCS)(2) TBD TBD 1 (SDHC) 1 (SDXC) 1 (SDXC) 1 (SDXC) 31 Card power up status bit (busy)(3) TBD TBD “ 0 “ = busy “ 1 “ = ready “ 0 “ = busy “ 1 “ = ready “ 0 “ = busy “ 1 “ = ready “ 0 “ = busy “ 1 “ = ready Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 34 Notes: 1. bit24: Only UHS-I card supports this bit. 2. bit30 : This bit is valid only when the card power up status bit is set. 3. bit31: This bit is set to LOW if the card has not finished the power up routine. bit 23-4: Describes the micro SD Card Voltage bit 31 indicates the card power up status. Value “1” is set after power up and initialization procedure has been completed. 5.2.2 CID Register The CID (Card Identification) register is 128-bit width. It contains the card identification information. The Value of CID Register is vender specific. Table 5-3: CID register CIDslice Field Width MID OID PNM 8 [127:120] 16 [119:104] 40 [103:64] Initial Value Initial Value 8GB 16GB TBD TBD TBD TBD TBD TBD TBD TBD 0x5543304435 TBD TBD 32GB 128GB 256GB 64GB TBD Comment Manufacture ID( WDC) TBD OEM/Application ID (WDC) TBD 32GB:"UC0D5" 0x5543304535 0x5543304635 64GB:"UC0E5" 128GB:"UC0F5" PRV 8 [63:56] TBD TBD TBD 0x52 PSN 32 [55:24] TBD TBD TBD 0xnnnnnnnn Product Revision Product serial number - 4 [23:20] TBD TBD TBD 0x0 MDT 12 [19:8] TBD TBD TBD 0xmmm reserved Manufacturing data CRC 7 [7:1] TBD TBD TBD CRC CRC 7 Checksum - 1 [0:0] TBD TBD TBD 0x1 not used, always 1 5.2.3 CSD Register CSD is Card-Specific Data register provides information on 128bit width. Some field of this register can writable by PROGRAM_CSD (CMD27). Table 5-4: CSD register Cell CSDslice Initial Value Field Width CSD_STR UCTURE 2 R [127:126 ] 01b - 6 R [125:120 ] 00_0000b TAAC 8 R [119:112 ] 0000_1110b 1ms(time unit) * 1.0(time value) = 1ms NSAC 8 R [111:104 ] 0000_0000b 0 clock Cycle SDR104 0010_1011b 200Mbit/s SDR50 0000_1011b 100Mbit/s Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 Type 32GB 64GB 128GB 256GB Comment CSD version 2.0(High Capacity and Extended Capacity) reserved SDHC/SDXC UHS104 microSD Cards Page 35 Cell Field Width Type CSDslice R [103:96] DDR50 Initial Value 32GB 128GB 256GB 64GB Comment 0000_1011b 100Mbit/s 0101_1010b 50Mbit/s SDR12 0011_0010b 25Mbit/s HS 0101_1010b 50Mbit/s DS 0011_0010b 25Mbit/s TRAN_SPEED SDR25 8 CCC 12 R [95:84] 0101_1011_0101b READ_BL_LEN 4 R [83:80] 1001b Class 0,2,4,5,7,8,10 are supported READ_BL_PARTIAL 1 R [79:79] 0 “ 0 “: Partial block read is inhibited and only unit of block access is allowed. WRITE_BLK_MISALIG N 1 R [78:78] 0 “ 0 “ : Not allowed on this card READ_BLK_MISALIGN 1 R [77:77] 0 “ 0 “ : Invalid on this card DSR_IMP 1 R [76:76] 0 “ 0 “ :DSR NOT implemented - 6 R [75:70] 00_0000b C_SIZE 22 R [69:48] EE87h 1DD17h - 1 R [47:47] 0 reserved ERASE_BLK_EN 1 R [46:46] 1 “ 1 “ :Can erase by WRITE_BL_LEN unit (512 Bytes) SECTOR_SIZE 7 R [45:39] 111_1111b This size of an erasable sector. This field is fixed to 7F-h. Sector size = 64KBytes. WP_GRP_SIZE 7 R [38:32] 000_0000b This size of a write protected group. This field is fixed to 00-h. 1 Write Protect Group = 1sector. WP_GRP_ENABLE 1 R [31:31] 0 - 2 R [30:29] 00b reserved 512Bytes 3B9EFh reserved memory capacity = (C_SIZE+1) * 512K byte value of 0 means no group write protection possible. R2W_FACTOR 3 R [28:26] 010b This field is fixed to “2-h”, which indicates 4 multiples. However, host should not use this factor and should use 250ms for write timeout. WRITE_BL_LEN 4 R [25:22] 1001b “ 9 “: 512Bytes on this card. WRITE_BL_PARTIAL 1 R [21:21] 0 - 5 R [20:16] 0_0000b FILE_FORMAT_GRP 1 R [15:15] 0 This field is set to “0”. Host should not use this field. COPY 1 R/W [14:14] 0 “ 0 “ : Original on this card PERM_WRITE_PROTE CT 1 R/W [13:13] 0 “ 0 “: Not protected / Writable on this card Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 “ 0 “: Only the WRITE_BL_LEN size or 512Bytes are available reserved SDHC/SDXC UHS104 microSD Cards Page 36 Cell Initial Value Type CSDslice 1 R/W [12:12] 0 FILE_FORMAT 2 R [11:10] 00b “ 0 “: Hard disk-like file system with partition table on this card. - 2 R [9:8] 00b reserved CRC 7 R/W [7:1] CRC CRC 7 Checksum - 1 - [0:0] 1 not used, always 1 Field Width TMP_WRITE_PROTEC T 32GB 128GB 256GB 64GB Comment “ 0 “: Not protected / Writable on this card Notes: 1.Cell Types: R: Read Only, R/W: Writable and Readable, R/W(1): One-time Writable / Readable 2. Erase of one data block is not allowed in this card. This information is indicated by “ERASE_BLK_EN”. Host System should refer this value before one data block size erase. 5.2.4 RCA Register The writable 16bit relative card address register carries the card address in SD Card mode. 5.2.5 DSR Register This register is not used 5.2.6 SCR Register CR(microSD Card Configuration Register) provides information on the microSD Memory Cardʼs special features. The size of SCR Register is 64 bit. Table 5-5: The SCR Fields Field Width SCRslice SCR_STRUCTURE 4 [63:60] SD_SPEC 4 [59:56] DATA_STAT_AFTER_ERASE 1 [55:55] SD_SECURITY 3 [54:52] SD_BUS_WIDTHS 4 [51:48] SD_SPEC3 1 [47:47] Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 Initial Value 8GB 16GB TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Initial Value 32GB 64GB 128GB Comment 256GB 0x0 SCR version 1.0(Version 1.01-3.00) 0x2 “ 2 “ : Version 2.00 or Version 3.0X, Version 4.xx ( Refer to SD_SPEC3 and SD_SPEC4 ) 0x1 “ 1 “ : on this card 0x3 0x4 “3“ : Security Version 2.00 ”4”:Security Version 3.00 0x5 “ 0101 “ : 1 and 4 bit supported 0x1 “ 1 “ : Version 3.0X, Version 4.xx ( Refer to SD_SPEC4 ) SDHC/SDXC UHS104 microSD Cards Page 37 EX_SECURITY 4 [46:43] SD_SPEC4 1 [42:42] - 6 [41:36] CMD_SUPPORT 4 [35:32] - 32 [31:0] TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 0x0 Extended Security is not supported. 0x1 “ 1 “ : Version 4.xx 0x0 reserved 0x3 “ 11 “ : CMD23 and CMD20 support 0x3202nnnn reserved for manufacture usage 5.2.7 Card Status This field is intended to transmit the cardʼs status information to the host. Table 5-6: Card Status Identifier Bits Type Value OUT_OF_RANGE 31 ER “ 0 “ = no error , “ 1 “ = error X ADDRESS_ERROR 30 ER “ 0 “ = no error , “ 1 “ = error X BLOCK_LEN_ERROR 29 ER “ 0 “ = no error , “ 1 “ = error X ERASE_SEQ_ERROR 28 E R “ 0 “ = no error , “ 1 “ = error ERASE_PARAM 27 ER “ 0 “ = no error , “ 1 “ = error X WP_VIOLATION 26 ER “ 0 “ = not protected , “ 1 “ = protected X CARD_IS_LOCKED 25 S X “ 0 “ = card unlocked , “ 1 “ = card locked LOCK_UNLOCK_FAILED 24 ER “ 0 “ = no error , “ 1 “ = error X COM_CRC_ERROR 23 E R “ 0 “ = no error , “ 1 “ = error ILLEGAL_COMMAND 22 E R “ 0 “ = no error , “ 1 “ = error CARD_ECC_FAILED 21 ER “ 0 “ = success , “ 1 “ = failure X CC_ERROR 20 ER “ 0 “ = no error , “ 1 “ = error X ERROE 19 ER “ 0 “ = no error , “ 1 “ = error X - 18 reserved - 17 reserved for DEFERRED_RESPONSE CSD_OVERWRITE 16 ER “ 0 “ = no error , “ 1 “ = error X WE_ERASE_SKIP 15 ER “ 0 “ = not protected , “ 1 “ = protected X CARD_ECC_DISABLED 14 S X “ 0 “ = enabled , “ 1 “ = disabled ERASE_STATE 13 S R “ 0 “ = cleared , “ 1 “ = set CURRENT_STATE 12 – S X “ 0 “ = idle , “ 1 “ = ready , “ 2 “ = ident , “ 3 “ = stanby “ 4 “ = tran , “ 5 “ = data , 9 “ 6 “ = rcv , “ 7 “ = prg “ 8 “ = dis , “ 9 – 14 “ = reserved “ 15 “ = reserved for I/O mode Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 38 Identifier READY_FOR_DATA - Bits Type Value 8 7,6 APP_CMD 5 - 4 AKE_SEQ_ERROR 3 - 2 S X “ 0 “ = not ready , “ 1 “ = ready S R “ 0 “ = Disabled , “ 1 “ = Enabled reserved for SD I/O Card E R “ 0 “ = no error , “ 1 “ = error reserved 1,0 reserved Notes: E: Error bit , S: Status bit , R: Detected and set for actual command response. X: Detected and set during command execution. Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 39 5.2.8 SD Status Table 5-7: SD Status Initial Value Field DAT_BUS_WIDTH SD Status Width Type -slice 2 SECUERED_MODE 1 reserved SR SR Comment 64GB 128GB 256GB 32GB 00b 1bit: HS1bit, SD1bit, HSSPI, SPI 10b 4bit: SDR104, DDR50, SDR50, SDR25, SDR12, HS4bit, SD4bit [511:510] [509] 1 8 [508:502] 0x00 reserved reserved 6 [501:496] 0x00 reserved SD_CARD_TYPE 16 SR [495:480] 0x0000 SIZE_OF_PROTECTED_AREA 32 SR [479:448] SPEED_CLASS 8 SR [447:440] PERFORMANCE_MOVE 8 SR [439:432] AU_SIZE 4 SR reserved 4 ERASE_SIZE 16 ERASE_TIMEOUT 0x05000000 0x08000000 0x04 Secured Mode Regular SD RD/WR card 32GB:81,920KB 64GB:131,072KB 128GB:131,072KB Class10 0x00 0x02:2MB/s、 0x00:0MB/s [431:428] 0x9 0x9:4MB [427:424] 0x0 reserved SR [423:408] 0x0020 32AU 6 SR [407:402] 0x01 1sec ERASE_OFFSET 2 SR [401:400] 11b 3sec UHS_SPEED_GRADE 4 SR [399:396] 0x3 0x3:30MB/sec and above UHS_AU_SIZE 4 SR [395:392] 0xC 0xC:16MB - 80 [391:312] ALL 0 reserved - 312 [311:0] ALL 0 reserved for manufacture 0x02 S : Status bit , R : Set based on Command Response Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 40 5.2.9 Switch Function Status Switch function command (CMD6) is used to switch or expand memory card functions. Currently four function groups are defined: (1) Access Mode: Selection of SD bus interface speed modes. (2) Command System: A specific function can be extended and controlled by a set of shared commands. (3) Driver Strength Selection of suitable output driver strength in UHS-I modes depends on host environment. (4) Power Limit Selection to limit the maximum power depends on host power supply capability and heat release capability. Table 5-8: Switch Function Status Description Width Bits Bus Speed Mode 32GB to 256GB 0x0 0x00C8 (0.72W/200mA) 0x1 0x00FA (0.90W/250mA) 0x2 0x00FA (0.90W/250mA) 0x3 0x00FA (0.90W/250mA) 0x4 0x00FA (0.90W/250mA) SDR25 0x0〜0x4 0x00C8 (0.72W/200mA) SDR12 0x0〜0x4 0x0064 (0.36W/100mA) HS 0x0 0x00C8 (0.72W/200mA) DS 0x0 0x0064 (0.36W/100mA) SDR104/ SDR50/ DDR50 Maximum Current Consumption 16 Value Set Value of Gr4 [511:496] Function Gr 6, information. 16 [495:480] - - 0x8001 Function Gr 5, information. 16 [479:464] - - 0x8001 Function Gr4, information. 16 SDR104[463:448] 12 DDR50 HS,DS - 0x801F - 0x8001 Function Gr3, information. 16 - 0x800F - 0x8001 Function Gr 2, information. 16 [431:416] - 0x8001 Function 16 [415:400] SDR104- - 0x801F SDR104[447:432] 12 DDR50 HS,DS Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 - SDHC/SDXC UHS104 microSD Cards Page 41 Description Width Bus Speed Mode Bits Gr1, information. Value Set Value of Gr4 32GB to 256GB HS,DS - 0x8003 12 DDR50 Function Gr6, information. 4 [399:396] - - Set Response Value Function Gr5, information. 4 [395:392] - - Set Response Value Function Gr4, information. 4 [391:388] - - Set Response Value Function Gr3, information. 4 [387:384] - - Set Response Value Function Gr2, information. 4 [383:380] - - Set Response Value Function Gr1, information. 4 [379:376] - - Set Response Value Data Structure Version 8 [375:368] - - 0x00 Busy Status of functions in Gr6 16 [367:352] - - 0x0000 Busy Status of functions in Gr5 16 [351:336] - - 0x0000 Busy Status of functions in Gr4 16 [335:320] - - 0x0000 Busy Status of functions in Gr3 16 [319:304] - - 0x0000 Busy Status of functions in Gr2 16 [303:288] - - 0x0000 Busy Status of functions in Gr1 16 [287:272] - - 0x0000 Reserved 272 [271:0] - - ALL 0 5.3 Logical Format The microSD card is formatted before shipping to be compliant to the SD Card FILE SYSTEM SPECIFICATION. The following parameters may be changed if the host system is not compliant with the SD Card Format Specification. The data of the logical format is described in section 5.3.3 to 5.3.6. Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 42 5.3.1 microSD card Capacities Item microSD Card Capacities Total Capacity 32GB 64GB 128GB 256GB User Data Bytes 31,902,400,512 63,831,015,424 127,831,375,872 255,802,212,352 LBAs 62,333,952 124,735,488 249,736,192 499,744,768 # Partition System Area Sectors 8,192 32,768 Total Partition Sectors 62,325,760 User Data Sectors 62,309,376 32,768 65,536 124,702,720 249,703,424 499,769,232 124,669,952 249,670,656 499,613,696 6 SD Specification Compliance 1) Non Supported Registers: DSR Register (Optional register: PHISYCAL LAYER SPECIFICATION 5.5) 2) Non Supported Functions: Programmable Card Output Driver (Optional in PHYSICAL LAYER SPECIFICATION 6.5) Card ʻs Internal Write Protect (Optional in PHYSICAL LAYER SPECIFICATION 4.3.6.) 3) Non Specified Command: CMD4 SET_DSR CMD28 SET_WRITE_PROT CMD29 CLR_WRITE_PROT CMD30 SEND_WRITE_PROT CMD56 GEN_CMD 7 Reliability Guidance This reliability guidance is intended to provide some guidance related to using raw NAND flash. Although random bit errors may occur during use, it does not necessarily mean that a block is bad. Generally, a block should be marked as bad when a program status failure or erase status failure is detected. The other failure modes may be recovered by a block erase. ECC treatment for read data is mandatory due to the following Data Retention and Read Disturb failures. Write/Erase Endurance Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 43 Write/Erase endurance failures may occur in a cell, page, or block, and are detected by doing a status read after either an auto program or auto block erase operation. The cumulative bad block count will increase along with the number of write/erase cycles. Data Retention The data in memory may change after a certain amount of storage time. This is due to an electrical charge loss or charge gain. After block erasure and reprogramming, the block may become usable again. Also write/erase endurance deteriorates data retention capability. The figure below shows a generic trend of relationship between write/erase endurance and data retention. Read Disturb A read operation may disturb the data in memory. The data may change due to charge gain. Usually, bit errors occur on other pages in the block, not the page being read. After a large number of read cycles (between block erases), a tiny charge may build up and can cause a cell to be soft programmed to another state. After block erasure and reprogramming, the block may become usable again. Considering the above failure modes, Viking recommends following usage model: Avoid any excessive iteration of resets and initialization sequences (card identification mode) as far much as possible after power-on, which may result in read disturb failure. The resets include hardware resets and software resets. i.e. 1) The iteration of the following command sequence: CMD0 -ACMD41 (The assertion of ACMD41 implies a count of internal read operation in Raw NAND.   CMD0: Go idle state command, ACMD41 : SD send operation command 2) Iteration of the following command: ACMD43  ACMD43 : Get MKB command Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 44 8 microSD Card Mechanical Dimensions Datasheet: PSFUSDxxxxCxxxxx_W Revision F | January 21, 2020 SDHC/SDXC UHS104 microSD Cards Page 45
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