VINR256ET008LCEB-C

Direct Rambus NexMod™ VINRXXXETX0XXCXX Viking TechnologySingle-Channel RDRAM NexMod™ Specification General Description Viking VINRxxxETx0xCxx are high-density Direct Rambus NexMod™ Modules. The modules consist of up to eight, CMOS 16M x 18-bit Rambus DRAM in FBGA packages uniquely arranged in a PCB stacked module. The modules also include an EEPROM for Serial Presence Detect, VRM (voltage regulator module), DRCG (Direct Rambus Clock Generator), and end-of-channel termination. Decoupling capacitors are mounted on the circuit boards for each RDRAM. NexMod™ modules directly mount to motherboards using a BGA connection. The NexMod™ product family addresses the needs of customers designing space-constrained systems. NexMod™ is a cost effective, small volumetric form factor solution that simplifies system layout and speeds time-to-market by providing virtually all the components needed for a complete Rambus channel. Rambus Signaling Level (RSL) technology permits up to 1066 MHz transfer rates while using conventional system and board design technologies. RDRAM devices are capable of sustained data transfers at 938ps per two bytes (7.5ns per 16 bytes). The RDRAM architecture enables the highest sustained bandwidth for multiple, simultaneous, randomly addressed, memory transactions. The separate control and data buses with independent row and column control yield over 95% bus efficiency. The RDRAM’s multi-bank architecture supports up to four simultaneous transactions per device. Features  NexMod and Rambus compatible: - Fully compatible with NexMod - Simplifies system layout - Faster time-to-market  Stacked PCB module design: - Improves signal integrity and margin - Shortens Rambus channel length by stacking PCBs and placing DRCG, VRM, RDRAM VREF and termination networks on module - BGA connectors to mainboard provide mounting and prototype flexibility - BGA connector to mainboard utilizes tin/lead paste for RoHS 5 applications - BGA interposers within module         200 pin interconnect pattern with 0.50” (1.27mm) pitch Module footprint: 1.1 inches x 2.0 inches Serial Presence Detect (SPD) support Operates from a 2.5 volt supply (±5%) Low power and powerdown self-refresh modes I/O Freq up to 1066 Mhz, tRAC up to 32 ns Separate RAS and CAS buses for higher efficiency RoHS 5 Compliant* (see last page) Related Documents Data sheets for the Rambus memory system components, including the Rambus DRAMs, Rambus standards, and SORIMM connector are available on the Rambus web site at http://www.rambus.com. Viking Technology¨2950 Red Hill Ave ¨ Costa Mesa, CA 92626 Office: 714.913.2200 Fax: 714.913.2202¨Website: http://www.vikingtechnology.com This Data Sheet is subject to change without notice. Doc. # PSNRXXXETX0XXCXX  Revision D  Created By: Brian Ouellette Page 1 of 14 Direct Rambus NexMod™ VINRXXXETX0XXCXX Part Numbers by Configuration Part Number Description RDRAM Device Module Speed VINR128ET004LCEB-C VINR256ET008LCEB-C VRNR512ET216LCEB 144MB, ECC, BGA connector 288MB, ECC, BGA connector 576MB, ECC, BGA connector Elpida EDR2518ABSE-AEP-E Elpida EDR2518ABSE-AEP-E Elpida EDR2518ABSE-AEP-E 1066MHz 32ns 1066MHz 32ns 1066MHz 32ns RDRAM die Rev. B B B Module arrangement Module cover plate VRM, DRCG, Termination resistors BGA interposers BGA connection to mainboard 256/288Mb RDRAMs Module Stack-up Diagram Viking Technology¨2950 Red Hill Ave ¨ Costa Mesa, CA 92626 Office: 714.913.2200 Fax: 714.913.2202¨Website: http://www.vikingtechnology.com This Data Sheet is subject to change without notice. Doc. # PSNRXXXETX0XXCXX  Revision D  Created By: Brian Ouellette Page 2 of 14 Direct Rambus NexMod™ VINRXXXETX0XXCXX Module Pad Number and Signal Names Top View of NexMod Footprint, Indicating Pin Locations (Not in scale) J2 Connector Pinout Pin Signal Pin Signal Pin Signal Pin Signal Pin Signal A1 B1 C1 D1 VCMOS E1 VDD VDD VCMOS VCMOS A2 B2 C2 D2 DQA8 E2 VDD SCK GND GND A3 B3 DQA6 C3 D3 E3 VDD GND CMD VTERM* A4 B4 DQA4 C4 D4 DQA7 E4 VDD GND VTERM* A5 B5 DQA2 C5 D5 DQA5 E5 VDD GND VTERM* A6 B6 DQA0 C6 D6 DQA3 E6 VDD GND GND A7 B7 C7 D7 DQA1 E7 GND CFM GND GND A8 B8 CFMN C8 D8 CTMN E8 CTMN-DRCG* GND GND A9 B9 ROW1 C9 D9 E9 CTM-DRCG* GND GND CTM A10 GND B10 COL4 C10 D10 ROW2 E10 GND GND A11 GND B11 COL2 C11 D11 ROW0 E11 GND VREF A12 GND B12 COL0 C12 D12 COL3 E12 GND VREF A13 GND B13 DQB0 C13 D13 COL1 E13 GND GND A14 VDD B14 DQB2 C14 D14 DQB1 E14 GND SIN A15 VDD B15 DQB4 C15 D15 E15 GND DQB3 GND A16 VDD B16 DQB6 C16 D16 DQB5 E16 GND GND A17 SA0 B17 GND C17 D17 DQB7 E17 GND GND A18 SA1 B18 REFCLK C18 D18 DQB8 E18 GND VDD3.3 A19 SA2 B19 C19 D19 GND E19 SDA SWP VDD3.3 A20 PCLK/M B20 GND C20 SYNCLK/N D20 SVDD E20 SCL *VTERM, CTMN-DRCG, and CTM DRCG pins are only used if internal VRM and DRCG options are not used on the NexMod. Viking Technology¨2950 Red Hill Ave ¨ Costa Mesa, CA 92626 Office: 714.913.2200 Fax: 714.913.2202¨Website: http://www.vikingtechnology.com This Data Sheet is subject to change without notice. Doc. # PSNRXXXETX0XXCXX  Revision D  Created By: Brian Ouellette Page 3 of 14 Direct Rambus NexMod™ VINRXXXETX0XXCXX Module Pad Number and Signal Names (cont’d) J4 Connector Pinout Pin Signal Pin Signal Pin Signal Pin Signal Pin Signal A1 B1 C1 VCMOS D1 E1 VDD VCMOS VCMOS VDD A2 B2 C2 D2 GND RESERVED* GND RESERVED* E2 VDD A3 B3 RESERVED* C3 D3 RESERVED* E3 VDD VTERM GND A4 B4 RESERVED* C4 D4 RESERVED* E4 VDD VTERM GND A5 B5 RESERVED* C5 D5 RESERVED* E5 VDD VTERM GND A6 B6 RESERVED* C6 D6 RESERVED* E6 VDD GND GND A7 B7 RESERVED* C7 D7 RESERVED* E7 GND GND GND A8 B8 RESERVED* C8 D8 RESERVED* E8 GND GND GND A9 B9 RESERVED* C9 D9 RESERVED* E9 GND GND GND A10 B10 RESERVED* C10 GND D10 RESERVED* E10 GND GND A11 B11 RESERVED* C11 GND D11 RESERVED* E11 GND VREF A12 B12 RESERVED* C12 GND D12 RESERVED* E12 GND VREF A13 B13 RESERVED* C13 GND D13 RESERVED* E13 GND GND A14 RESERVED* B14 RESERVED* C14 GND D14 RESERVED* E14 GND A15 B15 RESERVED* C15 GND D15 RESERVED* E15 VDD GND A16 B16 RESERVED* C16 GND D16 RESERVED* E16 VDD GND A17 B17 RESERVED* C17 GND D17 E17 VDD GND GND A18 B18 C18 D18 E18 VDD GND RESERVED* GND VDD A19 B19 C19 GND D19 E19 VDD GND GND VDD A20 B20 C20 GND D20 E20 GND GND GND GND *Reserved pins are used during module assembly at the factory. Do NOT connect in system layout. Viking Technology¨2950 Red Hill Ave ¨ Costa Mesa, CA 92626 Office: 714.913.2200 Fax: 714.913.2202¨Website: http://www.vikingtechnology.com This Data Sheet is subject to change without notice. Doc. # PSNRXXXETX0XXCXX  Revision D  Created By: Brian Ouellette Page 4 of 14 Direct Rambus NexMod™ VINRXXXETX0XXCXX Module Connector Pad Description Signal I/O Type GND Description Ground reference for connector pads, RDRAM core, and interface. CFM I RSL Clock from master. Interface clock used for receiving RSL signals from the Channel. Positive polarity. CFMN I RSL Clock from master. Interface clock used for receiving RSL signals from the Channel. Negative polarity. I VCMOS COL4… COL0 I RSL Column bus. 5-bit bus containing control and address information for column accesses. CTM 0 RSL Clock from on-board DRCG to Master. Interface clock used for transmitting RSL signals to the Channel. Positive polarity. CTMN 0 RSL Clock from on-board DRCG to master. Interface clock used for transmitting RSL signals to the Channel. Negative polarity. DQA8… DQA0 I/O RSL Data bus A. 9-bit bus carrying a byte of read or write data between the Channel and RDRAMs. DQA8 is not used on modules with x16 RDRAM devices. DQB8… DQB0 I/O RSL Data bus B. 9-bit bus carrying a byte of read or write data between the Channel and RDRAMs. DQB8 is not used on modules with x16 RDRAM devices. ROW2… ROW0 I RSL Row bus. 3-bit bus containing control and address information for row accesses. SCK I VCMOS CMD NC Serial Command used to read from and write to the control registers. Also used for power management. Serial clock input. Clock source used to read from and write to the RDRAM control registers. Pads are not connected. Reserved for future use. Viking Technology¨2950 Red Hill Ave ¨ Costa Mesa, CA 92626 Office: 714.913.2200 Fax: 714.913.2202¨Website: http://www.vikingtechnology.com This Data Sheet is subject to change without notice. Doc. # PSNRXXXETX0XXCXX  Revision D  Created By: Brian Ouellette Page 5 of 14 Direct Rambus NexMod™ VINRXXXETX0XXCXX Module Connector Pad Description (cont’d) Signal I/O Type SA0 I SVDD Serial Presence Detect Address 0. SA1 I SVDD Serial Presence Detect Address 1. SA2 I SVDD Serial Presence Detect Address 2. SCL I SVDD Serial Presence Detect Clock. SDA I/O SVDD Serial Presence Detect Data (Open Collector I/O). SIN I/O VCMOS SVDD SWP Description Serial I/O for reading from and writing to the control registers. Attaches to SIO0 of the first RDRAM on the module. SPD Voltage. Used for signals SCL, SDA, SWE, SA0, SA1 and SA2. I SVDD Serial Presence Detect Write Protect (active high). When low, the SPD can be written as well as read. PCLK/M VDD3.3 Phase detector input (DRCG). SYNCLK/N VDD3.3 Phase detector input (DRCG). REFCLK VDD3.3 Reference clock (DRCG). CTM-DRCG I RSL Clock from external DRCG to master routed to last device in channel. Positive polarity. CTMNDRCG I RSL Clock from external DRCG to master routed to last device in channel. Negative polarity. VDD3.3 Supply voltage for DRCG VCMOS CMOS I/O Voltage. Used for signals CMD, SCK, SIN, SOUT. VDD Supply voltage for the RDRAM core and interface logic. VREF Logic threshold reference voltage for RSL signals. Viking Technology¨2950 Red Hill Ave ¨ Costa Mesa, CA 92626 Office: 714.913.2200 Fax: 714.913.2202¨Website: http://www.vikingtechnology.com This Data Sheet is subject to change without notice. Doc. # PSNRXXXETX0XXCXX  Revision D  Created By: Brian Ouellette Page 6 of 14 Direct Rambus NexMod™ VINRXXXETX0XXCXX Physical Layout Dimensions Top view layout dimensions (millimeters) 256MB NexMod with BGA connector vertical dimensions Viking Technology¨2950 Red Hill Ave ¨ Costa Mesa, CA 92626 Office: 714.913.2200 Fax: 714.913.2202¨Website: http://www.vikingtechnology.com This Data Sheet is subject to change without notice. Doc. # PSNRXXXETX0XXCXX  Revision D  Created By: Brian Ouellette Page 7 of 14 Direct Rambus NexMod™ VINRXXXETX0XXCXX Physical Layout Dimensions (cont’d) 128MB NexMod with BGA connector vertical dimensions 64MB NexMod with BGA connector vertical dimensions Viking Technology¨2950 Red Hill Ave ¨ Costa Mesa, CA 92626 Office: 714.913.2200 Fax: 714.913.2202¨Website: http://www.vikingtechnology.com This Data Sheet is subject to change without notice. Doc. # PSNRXXXETX0XXCXX  Revision D  Created By: Brian Ouellette Page 8 of 14 Direct Rambus NexMod™ VINRXXXETX0XXCXX Functional Block Diagram DQB8.. DQB0 9 ROW2. .ROW0 SCK, CMD COL4.. DQA8.. COL0 DQA0 3 2 5 SIN CFM CFMN CTM CTMN CTMDRCG1 CTMNDRCG1 PCLKM SYNCLKN REFCLK 9 Jumpers Clock Termin Netwrok RDRAM(1) DRCG n Devices VDD RDRAM(n) VRM Channel Termination SPD VCOMS VDD33 SVDD VREF VTERM2 SA0 SA1 SA2 SCL SWP SDA 1. Used if internal DRCG not used (contact Viking for ordering options and application notes) 2. Used if internal VRM not used (contact Viking for ordering options and application notes) Viking Technology¨2950 Red Hill Ave ¨ Costa Mesa, CA 92626 Office: 714.913.2200 Fax: 714.913.2202¨Website: http://www.vikingtechnology.com This Data Sheet is subject to change without notice. Doc. # PSNRXXXETX0XXCXX  Revision D  Created By: Brian Ouellette Page 9 of 14 Direct Rambus NexMod™ VINRXXXETX0XXCXX ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit Voltage applied to any RSL or CMOS signal pad with VIABS -0.3 ~ VDD + 0.3 V respect to Gnd Voltage on VDD with respect to Gnd VDD,ABS -0.5 ~ VDD + 1.0 V Storage temperature TSTORE -50 ~ 100 C o Operating junction temperature TjMAX 100 C o Operating heat spreader surface temperature TCMAX 92 C Operating and storage humidity (non-condensing) RHSTORE, RHOP 95 %RH Note: Permanent device damage may occur if ‘ABSOLUTE MAXIMUM RATINGS’ are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. DC OPERATING CONDITIONS AND CHARACTERISTICS Recommended operating conditions (Voltages referenced to GND, TA = 0 to 70C, VDD / VCMOS = 2.5 ± 0.13V) Parameter and Conditions Supply voltage (Note 1) CMOS I/O power supply for 2.5V controllers (Note 2) CMOS I/O power supply for 1.8V controllers (Note 2) Reference voltage (Note 1) Serial Presence Detect- positive power supply 800 MHz versions (A,B) RSL input low voltage 1066 MHz versions (L) 800 MHz versions (A,B) RSL input high voltage 1066 MHz versions (L) CMOS input low voltage (Note 3) CMOS input high voltage (Note 4) CMOS output low voltage @ IOL = 1mA CMOS output high voltage @ IOH = -0.25mA Reference current @ VREF max 800 MHz versions (A,B) RSL output low current (Note 5) 1066 MHz versions (L) RSL output high current @ (0