Approval sheet
RFDSB Series – 1210(0504)- RoHS Compliance
MULTILAYER CERAMIC DIFFERENTIAL SIGNAL
BALANCER
P/N: RFDSB121013RU0T
*Contents in this sheet are subject to change without prior notice.
Page 1 of 7
ASC_RFDSB121013RU0T_V01
Mar. 2018
Approval sheet
FEATURES
3
Miniature footprint: 1.25 X 1.00 X 0.83 mm , Non-Magnetic LTCC product applying delay line technology
Novel common mode removal by combination of absorption and time domain dispersing reflection.
High attenuation for common mode noise over wide frequency range
Low insertion loss and strong balance capability for high-speed differential signal.
APPLICATIONS
1. USB 3.1 GEN.2, Type C (10 Gb/s)
2. PCI Express Gen.4 (16 Gb/s)
CONSTRUCTION
Figure
PIN
Connection
1
IN/OUT
2
IN/OUT
3
GND
4
OUT/ IN
5
OUT/ IN
6
GND
Top view
DIMENSIONS
Figure
Top view
Symbol
Dimension (mm)
L
1.25 ± 0.10
W
1.00 ± 0.10
T
0.83 ± 0.10
A
0.30 ± 0.10
B
0.25 ± 0.10
C
0.20 ± 0.10
D
0.275 ± 0.10
E
0.20 ± 0.10
F
0.30 ± 0.10
G
0.55 ± 0.10
Side view
Side view
Bottom view
Page 2 of 7
ASC_RFDSB121013RU0T_V01
Mar. 2018
Approval sheet
ELECTRICAL CHARACTERISTICS
Item
Specification
Frequency Range
DC~12,000 MHz
Sdd21 -1.0 dB or more @ 5,000 MHz
Differential mode
Sdd21 -2.0 dB or more @ 8,000 MHz
Common mode
Scc21 -15.0 dB or less @ 2,400 MHz
Insulation resistance
100 MΩ min. (DC 50 V)
DC resistance
2Ω max. pin1-pin5 and pin2-pin4
Delay time
130 ps typ.
Impedance
95±10 Ω
Temperature coefficient
Delay time : +200 ppm typ.
Moisture sensitivity levels
MSL is LEVEL 1 (Refer to : IPC/JEDEC J-STD-020)
Operating & Storage Condition (Component)
Operation Temperature Range: -40 ~ +85 ℃
Storage Temperature Range: -40 ~ +85 ℃
Storage Condition before Soldering (Included packaging material)
Storage Temperature Range: +5 ~ +40 ℃
Humidity: 30 to 70% relative humidity
-10
-20
-30
0
5
10
15
Frequency [GHz]
tr/tf= 20 ps/20 ps
FR4 2 inch
TX
DSB
Output Waveform
10 Gb/s, 30 ps Skew
16 Gb/s, 20 ps Skew
20
Vp
Vn RX
150
100
50
0
-50
-100
-150
25.0
Vp
10 Gb/s, Without DSB
Vn
Vp & Vn [%]
Vp & Vn [%]
Sdd21
25.5
26.0
26.5
27.0
150
100
50
0
-50
-100
-150
25.0
10 Gb/s, With DSB
25.5
Time [ns]
150
100
50
0
-50
-100
-150
25.0
26.0
26.5
27.0
Time [ns]
16 Gb/s, Without DSB
Vp Vn
150
100
50
0
-50
-100
-150
27.0
25.0
16 Gb/s, With DSB
Vp & Vn [%]
Scc21
0
Vp & Vn [%]
Magnitude [dB]
Frequency Characteristics
TYPICAL ELECTRICAL PERFORMANCE
Balance Capability for 10 G & 16 Gb/s Signal (PRBS Simulation)
25.5
26.0
26.5
Time [ns]
25.5
26.0
26.5
27.0
Time [ns]
SOLDER LAND PATTERN
Figure
Unit : mm
Page 3 of 7
ASC_RFDSB121013RU0T_V01
Mar. 2018
Approval sheet
Mechanical Test
Test item
Solderability
Ref. JIS C 0050-4.6
Test condition / Test method
*Ethanol solution of rosin, 25(wt)%
*Pre-Heating:150C, 60sec
Specification
At least 95% of a surface of each terminal
electrode must be covered by fresh solder.
*Solder bath temperature:245 3C
*Immersion time:3 1 sec
*Solder:Sn3Ag0.5Cu for lead-free
Resistance to soldering heat
*Ethanol solution of rosin, 25(wt)%
Ref. JIS C 0050-5.4
*Preheating temperature:150℃. 60sec
Meet Table 1.
Table 1
Appearance
*Solder temperature:2705C
No damaged
Electrical specification
*Immersion time:101 sec
Differential
*Solder:Sn3Ag0.5Cu for lead-free
Drop
Ref. JIS C 0044
mode
characteristics
room temperature for 4 to 48 hrs
Electrical specification
Common
*Height:1m
mode
shall satisfy the
descriptions in electrical
characteristics.
or steel.
I.R.
*The number of times : 3 times
Ref. JIS C 0040
descriptions in electrical
Measurement to be made after keeping at
*Test Surface:Rigid surface of concrete
Vibration
shall satisfy the
DC
*Frequency:10Hz~55Hz~10Hz(1min)
100MΩ min.
2Ω max. pin1-pin5 and
Resistance
*Total amplitude:1.5mm
pin2-pin4
Change
*Test time:A period of 2 hours in each
of 3 mutually perpendicular directions.
Bending Strength
Ref. JIS C 0051- 7.4.1
The middle part of substrate shall be
Meet Table 2.
pressurized by means of the pressurizing
Table 2
rod at a rate of about 0.5 mm/s per
Appearance
second until the deflection becomes 1mm
No damaged
2Ω max. pin1-
and then pressure shall be maintained for
DC Resistance
pin5 and pin2-
30 sec.
Change
pin4
Adhesive Strength
*Pressurizing force:
No remarkable damage or removal of the
of Termination
5N(≦0603);10N(>0603)
termination.
JIS C 0051- 7.4.3
*Test time:10±1 sec
Page 4 of 7
ASC_RFDSB121013RU0T_V01
Mar. 2018
Approval sheet
Environmental Performance
Test item
Temperature cycle
Ref. JIS C 0025
Test condition / Test method
1.
30(+3,-0) min at -40C(+0C,-3C)
2.
within 3 minutes at ordinary temp.
3.
30(+3,-0) minutes at +85C(+3C,-0C)
4.
within 3 minutes at ordinary temp.
Specification
Meet Table 1.
Total 100 cycles
Measurement to be made after keeping at
room temperature for 4 to 48 hours
Humidity
Ref. JIS C 0022
*Humidity:90% to 95% R.H.
*Temperature:402C
*Time:1000hrs (+48/-0 hrs.)
Measurement to be made after keeping at
room temperature for 4 to 48 hours
Heat life
Ref. JIS C5101-10 4.15
*Temperature:85C2C
*Test Voltage:5V
*Time:1000hrs (+48/-0 hrs.)
Measurement to be made after keeping at
room temperature for 4 to 48 hours
Cold Resistance
Ref. JIS C 0020
*Temperature:-40C2C
*Time:1000hrs (+48/-0 hrs.)
Measurement to be made after keeping at
room temperature for 4 to 48 hours
Page 5 of 7
ASC_RFDSB121013RU0T_V01
Mar. 2018
Approval sheet
SOLDERING CONDITION
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,
Fig 2. Infrared soldering profile
ORDERING CODE
RF
DSB
1210
13R
U
0
T
Walsin
Product Code
Dimension code
Delay time
Application
Specification
Packing
RF device
DSB:
Per 2 digits of Length,
Width.
130 ps
USB 3.1
Design Code
T : Reeled
Differential
Signal Balancer
e.g. :
1210=
Length 12 mm,
Width 10 mm,
Minimum Ordering Quantity: 2000 pcs per reel.
PACKAGING
Plastic Tape specifications (unit :mm)
Index
A0
B0
ΦD
T
W
Dimension(mm)
1.20±0.10
1.40±0.10
1.50±0.10
0.90±0.10
8.00±0.10
Index
E
F
P0
P1
P2
Dimension(mm)
1.75±0.10
3.50±0.05
4.00±0.10
4.00±0.10
2.00±0.05
Page 6 of 7
ASC_RFDSB121013RU0T_V01
Mar. 2018
Approval sheet
Reel dimensions
C
Index
Dimension (mm)
A
Φ178.0
B
Φ60.0
A
B
C
Φ13.0
Taping Quantity:2000 pieces per 7” reel
CAUTION OF HANDLING
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects, which might directly cause damage to the third party’s life, body or property.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Aircraft equipment
Aerospace equipment
Undersea equipment
Medical equipment
Disaster prevention / crime prevention equipment
Traffic signal equipment
Transportation equipment (vehicles, trains, ships, etc.)
Applications of similar complexity and /or reliability requirements to the applications listed in the above.
Storage condition
(1)
Products should be used in 6 months from the day of WALSIN outgoing inspection.
(2)
Storage environment condition.
Page 7 of 7
Products should be storage in the warehouse on the following conditions.
Temperature
: +5 to +40℃
Humidity
: 30 to 70% relative humidity
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of
electrode, resulting in poor solderability.
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be storage under the airtight packaged condition.
ASC_RFDSB121013RU0T_V01
Mar. 2018
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