Industrial PCIe M.2 2280 Specification
(GEX SERIES, 3D TLC)
Version 1.4
Address: 28 Genting Lane, #09-03/4/5 Platinum 28, Singapore 349585
Tel : +65-6493 5035
Fax : +65-6493 5037
Website: http://www.flexxon.com
Email: flexxon@flexxon.com
ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED,
OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM FLEXXON.
TABLE OF CONTENTS
1.
2.
GENERAL DESCRIPTION ............................................................................. 3
1.1.
Introduction........................................................................................................................ 3
1.2.
Product Overview .............................................................................................................. 3
1.3.
Power Loss Protection (Optional) ..................................................................................... 4
PRODUCT SPECIFICATIONS ........................................................................ 5
2.1.
Performance ....................................................................................................................... 5
2.2.
Power ................................................................................................................................. 5
2.3.
TBW (Terabytes Written) .................................................................................................. 6
2.4.
MTBF ................................................................................................................................ 6
2.5.
Data Retention ................................................................................................................... 6
3.
ENVIRONMENTAL SPECIFICATIONS........................................................... 7
4.
PIN ASSIGNMENT ....................................................................................... 8
5.
PHYSICAL DIMENSION ............................................................................. 12
6.
ORDERING INFORMATION ....................................................................... 13
ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED,
OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM FLEXXON.
1. GENERAL DESCRIPTION
1.1. Introduction
FLEXXON’s GEX M.2 2280 has PCIe Gen3x4 interface, and is fully compliant with NVMe 1.3 industrial
standard. It supports high performance, good reliability and low power solution suitable for
Industrial PC, Enterprise-Grade server and Professional-Grade Photography System.
1.2. Product Overview
Flash
3D TLC
Capacity
256GB to 2TB
PCIe Interface
Compliant with NVMe 1.3
Compatible with PCIe I/II/III x4 interface
ECC Scheme
GEX M.2 2280 applies the LDPC (Low Density Parity Check) of ECC algorithm
UART Function
GPIO
Support SMART and TRIM commands
Support DDR3/DDR3L External DRAM
Low Power Management
Power Failure Protection (Optional)
End to End data path protection
Global Wear Leveling Algorithm
AES256 and TCG Opal (Optional)
Temperature Range
■
Operation (Silver) : 0°C ~ 70°C
■
Operation (Diamond) : -40°C ~ 85°C
■
Storage: -55°C ~ 95°C
RoHS Compliant
3
1.3. Power Loss Protection (Optional)
FLEXXON designs SSD device with a hardware power loss protection mechanism. It has a voltage
drop detector, so when the SSD device detects the host power dropping, the SSD’s power loss
protection circuit will be triggered and begin providing power to the SSD. The SSD then will start to
flush cached data from DRAM memory to NAND flash memory in order to preserve data integrity
and prevent data loss.
Normal operation
Unexpected Power Loss happens
When the SSD detects the host power
The SSD is powered by the host power, and
dropping, the power loss protection circuit
the power loss protection circuit is charged
starts to provide power to the SSD while it
by the host power.
flushes cached data from DRAM to NAND.
Figure 1-1 power loss protection mechanism
4
2. PRODUCT SPECIFICATIONS
2.1. Performance
Table 2-1 Performance of PCIe GEX M.2 2280
Sequential
Capacity
Read
(MB/s)
Write
(MB/s)
240/256GB
2000
1100
480/512GB
3123
2110
960GB/1TB
3255
2721
1920GB/2TB
3369
2845
NOTES:
1.
Performance may differ according to flash configuration and platform.
2.2. Power
Table 2-2 Supply Voltage of GEX M.2 2280
Parameter
Rating
Operating Voltage
3.3V +/- 5%
Table 2-3 Power Consumption of GEX M.2 2280
NOTE:
Parameter
Power Consumption
Idle (max.)
0.7W
Active (max.)
6.6W
Power Consumption may differ according to flash configuration and platform.
5
2.3. TBW (Terabytes Written)
Capacity
TBW
240/256GB
436
480/512GB
889
960GB/1TB
1756
1920GB/2TB
3376
NOTES:
1. TBW may differ according to flash configuration and platform.
2. Samples were tested under JESD218A endurance test method and JESD219A endurance
workloads specification.
2.4. MTBF
MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value
represents the average time between a repair and the next failure. The predicted result of FLEXXON’s
GEX M.2 2280 is more than 2 million hours.
2.5. Data Retention
10 years if > 90% life remaining (@25C)
1 year if < 10% life remaining (@25C)
6
3. ENVIRONMENTAL SPECIFICATIONS
Test Items
Test Conditions
Storage Temperature
-55°C ~ 95°C
Operating Temperature
Silver Grade: 0°C ~ 70°C
Diamond Grade: -40°C~ 85°C
Storage Humidity
Silver Grade: 40°C, 95% RH
Diamond Grade: 55°C, 95% RH
Operating Humidity
Silver Grade: 40°C, 93% RH
Diamond Grade: 55°C, 95% RH
Shock
1500G, Half Sin Pulse Duration 0.5ms
Vibration
80Hz ~ 2000Hz/20G, 20Hz ~ 80Hz/1.52mm, 3 axis/60min
Drop
80cm free fall, 6 face of each unit, 2 times each
Bending
≥ 20N, Hold 1 min/5 times
ESD
24°C, 49% RH, +/-4KV 25 times, Air +/-8KV 10 times
7
4. PIN ASSIGNMENT
Table 4-1 Pin Assignment and Description of GEX M.2 2280
Pin No.
PCIe Pin
Description
1
GND
CONFIG_3 = GND
2
3.3V
3.3V source
3
GND
Ground
4
3.3V
3.3V source
5
PETn3
PCIe TX Differential signal defined by PCI Express
M.2 spec
6
N/C
No connect
7
PETp3
PCIe TX Differential signal defined by PCI Express
M.2 spec
8
N/C
No connect
9
GND
Ground
10
LED1#
Open drain, active low signal. These signals are used to
allow the add-in card to provide status indicators via LED
devices that will be provided by the system.
11
PERn3
PCIe RX Differential signal defined by PCI Express
M.2 spec
12
3.3V
3.3V source
13
PERp3
PCIe RX Differential signal defined by PCI Express
M.2 spec
14
3.3V
3.3V source
15
GND
Ground
16
3.3V
3.3V source
17
PETn2
PCIe TX Differential signal defined by PCI Express
M.2 spec
18
3.3V
3.3V source
19
PETp2
PCIe TX Differential signal defined by PCI Express
M.2 spec
20
N/C
No connect
21
GND
Ground
22
N/C
No connect
8
23
PERn2
PCIe RX Differential signal defined by PCI Express
M.2 spec
24
N/C
No connect
25
PERp2
PCIe RX Differential signal defined by PCI Express
M.2 spec
26
N/C
No connect
27
GND
Ground
28
N/C
No connect
29
PETn1
PCIe TX Differential signal defined by PCI Express
M.2 spec
30
N/C
No connect
31
PETp1
PCIe TX Differential signal defined by PCI Express
M.2 spec
32
N/C
No connect
33
GND
Ground
34
N/C
No connect
35
PERn1
PCIe RX Differential signal defined by PCI Express
M.2 spec
36
N/C
No connect
37
PERp1
PCIe RX Differential signal defined by PCI Express
M.2 spec
38
N/C
No connect
39
GND
Ground
40
SMB_CLK (I/O)
SMBus Clock; Open Drain with pull-up on platform
(0/1.8V)
41
PETn0
PCIe TX Differential signal defined by PCI Express
M.2 spec
42
SMB_DATA (I/O)
SMBus Data; Open Drain with pull-up on platform
(0/1.8V)
43
PETp0
PCIe TX Differential signal defined by PCI Express
M.2 spec
44
ALERT#(O) (0/1.8V)
Alert notification to master; Open Drain with pull-up
on platform; Active Low
45
GND
Ground
9
46
N/C
No connect
47
PERn0
PCIe RX Differential signal defined by PCI Express
M.2 spec
48
N/C
No connect
49
PERp0
PCIe RX Differential signal defined by PCI Express
M.2 spec
50
PERST#(I)(0/3.3V)
PE-Reset is a functional reset to the card as defined
by the PCIe Mini CEM specification.
51
GND
Ground
52
CLKREQ#(I/O)(0/3.3V)
Clock Request is a reference clock request signal as
defined by the PCIe Mini CEM specification; Also
used by L1 PM Sub-states.
53
REFCLKn
PCIe Reference Clock signals (100 MHz) defined by
the PCI Express M.2 spec.
54
PCIe PME Wake. Open Drain with pull up on
PEWAKE#(I/O)(0/3.3V)
platform; Active low
55
REFCLKp
PCIe Reference Clock signals (100 MHz) defined by
the PCI Express M.2 spec.
56
Reserved for
Manufacturing Data Line. Used for SSD
MFG DATA
manufacturing only. Not used in normal operation.
Pins should be left N/C in platform socket.
57
GND
Ground
58
Reserved for
Manufacturing Clock Line. Used for SSD
MFG CLOCK
manufacturing only. Not used in normal operation.
Pins should be left N/C in platform socket.
59
Module Key M
60
Module Key M
61
Module Key M
62
Module Key M
63
Module Key M
64
Module Key M
65
Module Key M
66
Module Key M
67
N/C
Module Key
No connect
10
68
SUSCLK (32KHz)
Do not use
(I)(0/3.3V)
69
PEDET
NC-PCIe
70
3.3V
3.3V source
71
GND
Ground
72
3.3V
3.3V source
73
GND
Ground
74
3.3V
3.3V source
75
GND
Ground
11
5. PHYSICAL DIMENSION
Dimension: 80mm(L) x 22 mm(W) x 3.8mm(H)
12
6. ORDERING INFORMATION
Capacity
MPN (Diamond Grade)
MPN (Silver Grade)
256GB
FCSO256GBE-M600
FCSO256GBS-M600
240GB
FCSO240GBE-M600
FCSO240GBS-M600
512GB
FCSO512GBE-M600
FCSO512GBS-M600
480GB
FCSO480GBE-M600
FCSO480GBS-M600
1TB
FCSO001TBE-M600
FCSO001TBS-M600
960GB
FCSO960GBE-M600
FCSO960GBS-M600
2TB
FCSO002TBE-M600
FCSO002TBS-M600
1920GB
FCSO1920BE-M600
FCSO1920BS-M600
Capacity
MPN (Diamond Grade)
MPN (Silver Grade)
256GB
FCSO256GBE-M60P
FCSO256GBS-M60P
240GB
FCSO240GBE-M60P
FCSO240GBS-M60P
512GB
FCSO512GBE-M60P
FCSO512GBS-M60P
480GB
FCSO480GBE-M60P
FCSO480GBS-M60P
1TB
FCSO001TBE-M60P
FCSO001TBS-M60P
960GB
FCSO960GBE-M60P
FCSO960GBS-M60P
2TB
FCSO002TBE-M60P
FCSO002TBS-M60P
1920GB
FCSO1920BE-M60P
FCSO1920BS-M60P
Capacity
MPN (Diamond Grade)
MPN (Silver Grade)
256GB
FCSO256GBE-M60S
FCSO256GBS-M60S
240GB
FCSO240GBE-M60S
FCSO240GBS-M60S
512GB
FCSO512GBE-M60S
FCSO512GBS-M60S
480GB
FCSO480GBE-M60S
FCSO480GBS-M60S
1TB
FCSO001TBE-M60S
FCSO001TBS-M60S
960GB
FCSO960GBE-M60S
FCSO960GBS-M60S
2TB
FCSO002TBE-M60S
FCSO002TBS-M60S
1920GB
FCSO1920BE-M60S
FCSO1920BS-M60S
Power Loss Protection
AES256/TCG OPAL
13
Conformal coating
Capacity
MPN (Diamond Grade)
MPN (Silver Grade)
256GB
FCSO256GBE-M60F
FCSO256GBS-M60F
240GB
FCSO240GBE-M60F
FCSO240GBS-M60F
512GB
FCSO512GBE-M60F
FCSO512GBS-M60F
480GB
FCSO480GBE-M60F
FCSO480GBS-M60F
1TB
FCSO001TBE-M60F
FCSO001TBS-M60F
960GB
FCSO960GBE-M60F
FCSO960GBS-M60F
2TB
FCSO002TBE-M60F
FCSO002TBS-M60F
1920GB
FCSO1920BE-M60F
FCSO1920BS-M60F
14
Revision History
Revision
Date
Description
1.0
2020/04
Preliminary release
1.1
2020/12
Update Pin assignment description
1.2
2021/02
Update performance and ordering information
1.3
2021/04
Update power consumption
1.4
2021/06
Update ordering information
15
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