FCSO001TBE-M600

Industrial PCIe M.2 2280 Specification (GEX SERIES, 3D TLC) Version 1.4 Address: 28 Genting Lane, #09-03/4/5 Platinum 28, Singapore 349585 Tel : +65-6493 5035 Fax : +65-6493 5037 Website: http://www.flexxon.com Email: flexxon@flexxon.com ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED, OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM FLEXXON. TABLE OF CONTENTS 1. 2. GENERAL DESCRIPTION ............................................................................. 3 1.1. Introduction........................................................................................................................ 3 1.2. Product Overview .............................................................................................................. 3 1.3. Power Loss Protection (Optional) ..................................................................................... 4 PRODUCT SPECIFICATIONS ........................................................................ 5 2.1. Performance ....................................................................................................................... 5 2.2. Power ................................................................................................................................. 5 2.3. TBW (Terabytes Written) .................................................................................................. 6 2.4. MTBF ................................................................................................................................ 6 2.5. Data Retention ................................................................................................................... 6 3. ENVIRONMENTAL SPECIFICATIONS........................................................... 7 4. PIN ASSIGNMENT ....................................................................................... 8 5. PHYSICAL DIMENSION ............................................................................. 12 6. ORDERING INFORMATION ....................................................................... 13 ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED, OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM FLEXXON. 1. GENERAL DESCRIPTION 1.1. Introduction FLEXXON’s GEX M.2 2280 has PCIe Gen3x4 interface, and is fully compliant with NVMe 1.3 industrial standard. It supports high performance, good reliability and low power solution suitable for Industrial PC, Enterprise-Grade server and Professional-Grade Photography System. 1.2. Product Overview  Flash  3D TLC Capacity   256GB to 2TB PCIe Interface   Compliant with NVMe 1.3  Compatible with PCIe I/II/III x4 interface ECC Scheme   GEX M.2 2280 applies the LDPC (Low Density Parity Check) of ECC algorithm  UART Function  GPIO  Support SMART and TRIM commands  Support DDR3/DDR3L External DRAM  Low Power Management  Power Failure Protection (Optional)  End to End data path protection  Global Wear Leveling Algorithm  AES256 and TCG Opal (Optional)  Temperature Range  ￭ Operation (Silver) : 0°C ~ 70°C ￭ Operation (Diamond) : -40°C ~ 85°C ￭ Storage: -55°C ~ 95°C RoHS Compliant 3 1.3. Power Loss Protection (Optional) FLEXXON designs SSD device with a hardware power loss protection mechanism. It has a voltage drop detector, so when the SSD device detects the host power dropping, the SSD’s power loss protection circuit will be triggered and begin providing power to the SSD. The SSD then will start to flush cached data from DRAM memory to NAND flash memory in order to preserve data integrity and prevent data loss. Normal operation Unexpected Power Loss happens When the SSD detects the host power The SSD is powered by the host power, and dropping, the power loss protection circuit the power loss protection circuit is charged starts to provide power to the SSD while it by the host power. flushes cached data from DRAM to NAND. Figure 1-1 power loss protection mechanism 4 2. PRODUCT SPECIFICATIONS 2.1. Performance Table 2-1 Performance of PCIe GEX M.2 2280 Sequential Capacity Read (MB/s) Write (MB/s) 240/256GB 2000 1100 480/512GB 3123 2110 960GB/1TB 3255 2721 1920GB/2TB 3369 2845 NOTES: 1. Performance may differ according to flash configuration and platform. 2.2. Power Table 2-2 Supply Voltage of GEX M.2 2280 Parameter Rating Operating Voltage 3.3V +/- 5% Table 2-3 Power Consumption of GEX M.2 2280 NOTE: Parameter Power Consumption Idle (max.) 0.7W Active (max.) 6.6W Power Consumption may differ according to flash configuration and platform. 5 2.3. TBW (Terabytes Written) Capacity TBW 240/256GB 436 480/512GB 889 960GB/1TB 1756 1920GB/2TB 3376 NOTES: 1. TBW may differ according to flash configuration and platform. 2. Samples were tested under JESD218A endurance test method and JESD219A endurance workloads specification. 2.4. MTBF MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value represents the average time between a repair and the next failure. The predicted result of FLEXXON’s GEX M.2 2280 is more than 2 million hours. 2.5. Data Retention   10 years if > 90% life remaining (@25C) 1 year if < 10% life remaining (@25C) 6 3. ENVIRONMENTAL SPECIFICATIONS Test Items Test Conditions Storage Temperature -55°C ~ 95°C Operating Temperature Silver Grade: 0°C ~ 70°C Diamond Grade: -40°C~ 85°C Storage Humidity Silver Grade: 40°C, 95% RH Diamond Grade: 55°C, 95% RH Operating Humidity Silver Grade: 40°C, 93% RH Diamond Grade: 55°C, 95% RH Shock 1500G, Half Sin Pulse Duration 0.5ms Vibration 80Hz ~ 2000Hz/20G, 20Hz ~ 80Hz/1.52mm, 3 axis/60min Drop 80cm free fall, 6 face of each unit, 2 times each Bending ≥ 20N, Hold 1 min/5 times ESD 24°C, 49% RH, +/-4KV 25 times, Air +/-8KV 10 times 7 4. PIN ASSIGNMENT Table 4-1 Pin Assignment and Description of GEX M.2 2280 Pin No. PCIe Pin Description 1 GND CONFIG_3 = GND 2 3.3V 3.3V source 3 GND Ground 4 3.3V 3.3V source 5 PETn3 PCIe TX Differential signal defined by PCI Express M.2 spec 6 N/C No connect 7 PETp3 PCIe TX Differential signal defined by PCI Express M.2 spec 8 N/C No connect 9 GND Ground 10 LED1# Open drain, active low signal. These signals are used to allow the add-in card to provide status indicators via LED devices that will be provided by the system. 11 PERn3 PCIe RX Differential signal defined by PCI Express M.2 spec 12 3.3V 3.3V source 13 PERp3 PCIe RX Differential signal defined by PCI Express M.2 spec 14 3.3V 3.3V source 15 GND Ground 16 3.3V 3.3V source 17 PETn2 PCIe TX Differential signal defined by PCI Express M.2 spec 18 3.3V 3.3V source 19 PETp2 PCIe TX Differential signal defined by PCI Express M.2 spec 20 N/C No connect 21 GND Ground 22 N/C No connect 8 23 PERn2 PCIe RX Differential signal defined by PCI Express M.2 spec 24 N/C No connect 25 PERp2 PCIe RX Differential signal defined by PCI Express M.2 spec 26 N/C No connect 27 GND Ground 28 N/C No connect 29 PETn1 PCIe TX Differential signal defined by PCI Express M.2 spec 30 N/C No connect 31 PETp1 PCIe TX Differential signal defined by PCI Express M.2 spec 32 N/C No connect 33 GND Ground 34 N/C No connect 35 PERn1 PCIe RX Differential signal defined by PCI Express M.2 spec 36 N/C No connect 37 PERp1 PCIe RX Differential signal defined by PCI Express M.2 spec 38 N/C No connect 39 GND Ground 40 SMB_CLK (I/O) SMBus Clock; Open Drain with pull-up on platform (0/1.8V) 41 PETn0 PCIe TX Differential signal defined by PCI Express M.2 spec 42 SMB_DATA (I/O) SMBus Data; Open Drain with pull-up on platform (0/1.8V) 43 PETp0 PCIe TX Differential signal defined by PCI Express M.2 spec 44 ALERT#(O) (0/1.8V) Alert notification to master; Open Drain with pull-up on platform; Active Low 45 GND Ground 9 46 N/C No connect 47 PERn0 PCIe RX Differential signal defined by PCI Express M.2 spec 48 N/C No connect 49 PERp0 PCIe RX Differential signal defined by PCI Express M.2 spec 50 PERST#(I)(0/3.3V) PE-Reset is a functional reset to the card as defined by the PCIe Mini CEM specification. 51 GND Ground 52 CLKREQ#(I/O)(0/3.3V) Clock Request is a reference clock request signal as defined by the PCIe Mini CEM specification; Also used by L1 PM Sub-states. 53 REFCLKn PCIe Reference Clock signals (100 MHz) defined by the PCI Express M.2 spec. 54 PCIe PME Wake. Open Drain with pull up on PEWAKE#(I/O)(0/3.3V) platform; Active low 55 REFCLKp PCIe Reference Clock signals (100 MHz) defined by the PCI Express M.2 spec. 56 Reserved for Manufacturing Data Line. Used for SSD MFG DATA manufacturing only. Not used in normal operation. Pins should be left N/C in platform socket. 57 GND Ground 58 Reserved for Manufacturing Clock Line. Used for SSD MFG CLOCK manufacturing only. Not used in normal operation. Pins should be left N/C in platform socket. 59 Module Key M 60 Module Key M 61 Module Key M 62 Module Key M 63 Module Key M 64 Module Key M 65 Module Key M 66 Module Key M 67 N/C Module Key No connect 10 68 SUSCLK (32KHz) Do not use (I)(0/3.3V) 69 PEDET NC-PCIe 70 3.3V 3.3V source 71 GND Ground 72 3.3V 3.3V source 73 GND Ground 74 3.3V 3.3V source 75 GND Ground 11 5. PHYSICAL DIMENSION Dimension: 80mm(L) x 22 mm(W) x 3.8mm(H) 12 6. ORDERING INFORMATION Capacity MPN (Diamond Grade) MPN (Silver Grade) 256GB FCSO256GBE-M600 FCSO256GBS-M600 240GB FCSO240GBE-M600 FCSO240GBS-M600 512GB FCSO512GBE-M600 FCSO512GBS-M600 480GB FCSO480GBE-M600 FCSO480GBS-M600 1TB FCSO001TBE-M600 FCSO001TBS-M600 960GB FCSO960GBE-M600 FCSO960GBS-M600 2TB FCSO002TBE-M600 FCSO002TBS-M600 1920GB FCSO1920BE-M600 FCSO1920BS-M600 Capacity MPN (Diamond Grade) MPN (Silver Grade) 256GB FCSO256GBE-M60P FCSO256GBS-M60P 240GB FCSO240GBE-M60P FCSO240GBS-M60P 512GB FCSO512GBE-M60P FCSO512GBS-M60P 480GB FCSO480GBE-M60P FCSO480GBS-M60P 1TB FCSO001TBE-M60P FCSO001TBS-M60P 960GB FCSO960GBE-M60P FCSO960GBS-M60P 2TB FCSO002TBE-M60P FCSO002TBS-M60P 1920GB FCSO1920BE-M60P FCSO1920BS-M60P Capacity MPN (Diamond Grade) MPN (Silver Grade) 256GB FCSO256GBE-M60S FCSO256GBS-M60S 240GB FCSO240GBE-M60S FCSO240GBS-M60S 512GB FCSO512GBE-M60S FCSO512GBS-M60S 480GB FCSO480GBE-M60S FCSO480GBS-M60S 1TB FCSO001TBE-M60S FCSO001TBS-M60S 960GB FCSO960GBE-M60S FCSO960GBS-M60S 2TB FCSO002TBE-M60S FCSO002TBS-M60S 1920GB FCSO1920BE-M60S FCSO1920BS-M60S Power Loss Protection AES256/TCG OPAL 13 Conformal coating Capacity MPN (Diamond Grade) MPN (Silver Grade) 256GB FCSO256GBE-M60F FCSO256GBS-M60F 240GB FCSO240GBE-M60F FCSO240GBS-M60F 512GB FCSO512GBE-M60F FCSO512GBS-M60F 480GB FCSO480GBE-M60F FCSO480GBS-M60F 1TB FCSO001TBE-M60F FCSO001TBS-M60F 960GB FCSO960GBE-M60F FCSO960GBS-M60F 2TB FCSO002TBE-M60F FCSO002TBS-M60F 1920GB FCSO1920BE-M60F FCSO1920BS-M60F 14 Revision History Revision Date Description 1.0 2020/04 Preliminary release 1.1 2020/12 Update Pin assignment description 1.2 2021/02 Update performance and ordering information 1.3 2021/04 Update power consumption 1.4 2021/06 Update ordering information 15