FCCB960GBS-EC0S

Industrial PCIe U.2 SSD Specification (HIX Series, 3D TLC) Version 1.6 Address: 28 Genting Lane, #09-03/4/5 Platinum 28, Singapore 349585 Tel : +65-6493 5035 Fax : +65-6493 5037 Website: http://www.flexxon.com Email: flexxon@flexxon.com ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED, OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM FLEXXON. TABLE OF CONTENTS 1. 2. GENERAL DESCRIPTION ..................................................................................................... 1 1.1. Introduction ....................................................................................................................... 1 1.2. Product Overview .............................................................................................................. 2 1.3. Power Loss Protection (Optional) ...................................................................................... 3 PRODUCT SPECIFICATIONS ................................................................................................ 4 2.1. Performance ...................................................................................................................... 4 2.2. Power ................................................................................................................................. 4 2.3. TBW (Terabytes Written) ................................................................................................... 4 2.4. MTBF .................................................................................................................................. 5 2.5. Data Retention ................................................................................................................... 5 3. ENVIRONMENTAL SPECIFICATIONS ................................................................................... 6 4. SUPPORTED COMMANDS ................................................................................................. 7 5. PIN ASSIGNMENT .............................................................................................................. 9 6. PHYSICAL DIMENSION ..................................................................................................... 12 7. ORDERING INFORMATION .............................................................................................. 14 ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED, OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM FLEXXON. 1. GENERAL DESCRIPTION 1.1. Introduction FLEXXON’s HIX U.2 PCIe SSD has PCIe Gen3x4 interface, and is fully compliant with NVMe 1.3 industrial standard. It supports ultimate performance, high density and great reliability, suitable for enterprise application. Figure 1-1 HIX U.2 PCIe SSD Controller Block Diagram 1 1.2. Product Overview Flash  ￭ 3D TLC Capacity  ￭ 240GB ~ 7680GB PCIe Interface  ￭ Compliant with NVMe 1.3 ￭ Compatible with PCIe I/II/III x4 interface ￭ Support power management ECC Scheme  ￭ LDPC (Low Density Parity Check) of ECC algorithm  GPIO  UART  Dynamic and Static Wear Leveling  Support SMART and TRIM commands  Power Loss Protection Algorithm  Support AES256/TCG OPAL  Support PYRITE (Optional)  Secure Erase  Temperature Range ￭ ￭ ￭ Operation (Silver) : 0°C ~ 70°C Operation (Diamond) : -40°C ~ 85°C Storage: -40°C ~ 85°C  RoHS Compliant  Conformal Coating (Optional) 2 1.3. Power Loss Protection (Optional) FLEXXON designs SSD device with a hardware power loss protection mechanism. It has a voltage drop detector, so when the SSD device detects the host power dropping, the SSD’s power loss protection circuit will be triggered and begin providing power to the SSD. The SSD then will start to flush cached data from DRAM memory to NAND flash memory in order to preserve data integrity and prevent data loss. Normal operation Unexpected Power Loss happens The SSD is powered by the host power, and When the SSD detects the host power the power loss protection circuit is charged dropping, the power loss protection circuit by the host power. starts to provide power to the SSD while it flushes cached data from DRAM to NAND. Figure 1-2 power loss protection mechanism 3 2. PRODUCT SPECIFICATIONS 2.1. Performance Table 2-1 Performance of HIX U.2 PCIe SSD Sequential Random Capacity Read (MB/s) Write (MB/s) Read (IOPS) Write (IOPS) 240GB 3,000 340 100K 13K 480GB 3,000 520 200K 20K 960GB 3,200 1,000 360K 25K 1920GB 3,200 1,000 360K 28K 3840GB 2,900 970 400K 30K 7680GB 2,900 970 400K 30K NOTES: 1. Performance may differ according to flash configuration and platform. 2.2. Power Table 2-2 Supply Voltage of HIX U.2 PCIe SSD Parameter Rating Operating Voltage 12V 2.3. TBW (Terabytes Written) Capacity TBW 240GB 380 480GB 804 960GB 1625 1920GB 3100 3840GB 6050 7680GB 12100 4 2.4. MTBF MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value represents the average time between a repair and the next failure. The predicted result of FLEXXON’s HIX PCIe U.2 SSD is more than 2 million hours. 2.5. Data Retention   10 years if > 90% life remaining (@25C) 1 year if < 10% life remaining (@25C) 5 3. ENVIRONMENTAL SPECIFICATIONS Test Items Test Conditions Storage Temperature -40°C ~ 85°C Operating Temperature Silver Grade: 0°C ~ 70°C Diamond Grade: -40°C ~ 85°C Storage Humidity 40°C, 93% RH Operating Humidity 40°C, 90% RH Shock 1500G, Half Sin Pulse Duration 0.5ms Vibration 80Hz ~ 2000Hz/20G, 20Hz ~ 80Hz/1.52mm, 3 axis/60min Drop 80cm free fall, 6 face of each unit Bending ≥ 20N, Hold 1 min/5 times ESD 24°C, 49% RH, +/-4KV 6 4. SUPPORTED COMMANDS Table 4-1 Admin Commands Identifier Command Description 00h Delete I/O Submission Queue 01h Create I/O Submission Queue 02h Get Log Page 04h Delete I/O Completion Queue 05h Create I/O Completion Queue 06h Identify 08h Abort 09h Set Feature 0Ah Get Feature 0Ch Asynchronous Event Request 10h Firmware Commit 11h Firmware Image Download 14h Device Self-test 80h Format NVM 81h Security Send 82h Security Receive 84h Sanitize Table 4-2 I/O Commands Identifier Command Description 00h Flush 01h Write 02h Read 04h Write Uncorrectable 05h Compare 08h Write Zeroes 09h Dataset Management 7 Table 4-3 Set Feature Commands Identifier Command Description 00h Reserved 01h Arbitration 02h Power Management 03h LBA Range Type 04h Temperature Threshold 05h Error Recovery 06h Volatile Write Cache 07h Number of Queues 08h Interrupt Coalescing 09h Interrupt Vector Configuration 0Ah Write Atomicity Normal 0Bh Asynchronous Event Configuration 0Ch Autonomous Power State Transition 0Dh Host Memory Buffer 0Eh Timestamp 10h Host Controlled Thermal Management 11h Non-Operational Power State Config 0Eh-7Dh 80h Reserved Software Progress Marker Table 4-4 Get Log Page Commands Identifier Command Description 00h Reserved 01h Error Information 02h SMART / Health Information 03h Firmware Slot Information 04h Changed Namespace List 06h Device Self-test 09h-07h 81h 82h-FFh Reserved Sanitize Status Reserved 8 5. PIN ASSIGNMENT Figure 5-1 HIX U.2 PCIe SSD Pin Locations Table 5-1 U.2 PCIe SSD SFF-8639 Connector Pin Assignment and Descriptions Pin Number Name Type Description P1 WAKE# Input P2 - - P3 CLKREQ# Bi-Dir Clock request P4 IfDet# Input Interface Type Detect P5 Ground Ground Ground P6 Ground Ground Ground P7 - - Outside scope of this specification P8 - - Outside scope of this specification P9 - - Outside scope of this specification P10 PRSNT# Input P11 Activity Input P12 Ground Ground Ground P13 +12V Precharge Power +12V Precharge power for SFF-8639 module P14 +12V Power +12V power for SFF-8639 module P15 +12V Power +12V power for SFF-8639 module S1 Ground Ground Ground S2 - - Outside scope of this specification S3 - - Outside scope of this specification S4 Ground Ground Signal for Link reactivation Outside scope of this specification Presence detect Ground 9 Pin Number Name Type Description S5 - - Outside scope of this specification S6 - - Outside scope of this specification S7 Ground Ground Ground S8 Ground Ground Ground S9 - - Outside scope of this specification S10 - - Outside scope of this specification S11 Ground Ground S12 - - Outside scope of this specification S13 - - Outside scope of this specification S14 Ground Ground S15 Reserved - S16 Ground Ground Ground S17 PETp1 Diff-Pair Transmitter differential pair, Lane 1 S18 PETn1 Diff-Pair Transmitter differential pair, Lane 1 S19 Ground Ground Ground S20 PERn1 Diff-Pair Receiver differential pair, Lane 1 S21 PERp1 Diff-Pair Receiver differential pair, Lane 1 S22 Ground Ground Ground S23 PETp2 Diff-Pair Transmitter differential pair, Lane 2 S24 PETn2 Diff-Pair Transmitter differential pair, Lane 2 S25 Ground Ground Ground S26 PERn2 Diff-Pair Receiver differential pair, Lane 2 S27 PERp2 Diff-Pair Receiver differential pair, Lane 2 S28 Ground Ground Ground E1 REFCLKB+ Diff-Pair Reference clock (differential pair) for second X2 port E2 REFCLKB- Diff-Pair Reference clock (differential pair) for second X2 port E3 +3.3 Vaux Power 3.3 V auxiliary power E4 PERSTB# Output Fundamental reset for second X2 port E5 PERST# Output Fundamental reset (if dual-port enabled, first X2 Ground Ground Reserved port) E6 Reserved - Reserved E7 REFCLK+ Diff-Pair Reference clock (if dual-port enabled, first X2 port) E8 REFCLK- Diff-Pair Reference clock (if dual-port enabled, first X2 port) E9 Ground Ground Ground E10 PETp0 Diff-Pair Transmitter differential pair, Lane 0 E11 PETn0 Diff-Pair Transmitter differential pair, Lane 0 10 E12 Ground Ground Ground Pin Number Name Type E13 PERn0 Diff-Pair Receiver differential pair, Lane 0 E14 PERp0 Diff-Pair Receiver differential pair, Lane 0 E15 Ground Ground Ground E16 Reserved - E17 PETp3 Diff-Pair Transmitter differential pair, Lane 3 E18 PETn3 Diff-Pair Transmitter differential pair, Lane 3 E19 Ground Ground Ground E20 PERn3 Diff-Pair Receiver differential pair, Lane 3 E21 PERp3 Diff-Pair Receiver differential pair, Lane 3 E22 Ground Ground Ground E23 SMCLK Bi-Dir SMBus (System Management Bus) clock E24 SMDAT Bi-Dir SMBus (System Management Bus) data E25 DualPortEn# Output Description Reserved Dual-port Enable 11 6. PHYSICAL DIMENSION Dimension: 100.00mm(L) x 69.85mm(W) x 7.00mm(H) Top View 12 Bottom / Side View 13 7. ORDERING INFORMATION AES 256/TCG OPAL Capacity MPN (Silver) MPN (Diamond) 240GB FCCB240GBS-EC0S FCCB240GBE-EC0S 480GB FCCB480GBS-EC0S FCCB480GBE-EC0S 960GB FCCB960GBS-EC0S FCCB960GBE-EC0S 1920GB FCCB1920BS-EC0S FCCB1920BE-EC0S 3480GB FCCB3840BS-EC0S FCCB3840BE-EC0S 7680GB FCCB7680BS-EC0S FCCB7680BE-EC0S * AES 256/TCG OPAL with conformal coating Capacity MPN (Silver) MPN (Diamond) 240GB FCCB240GBS-EC0V FCCB240GBE-EC0V 480GB FCCB480GBS-EC0V FCCB480GBE-EC0V 960GB FCCB960GBS-EC0V FCCB960GBE-EC0V 1920GB FCCB1920BS-EC0V FCCB1920BE-EC0V 3480GB FCCB3840BS-EC0V FCCB3840BE-EC0V 7680GB FCCB7680BS-EC0V FCCB7680BE-EC0V* Power Loss Protection with AES 256/TCG OPAL Capacity MPN (Silver) MPN (Diamond) 240GB FCCB240GBS-EC0X FCCB240GBE-EC0X 480GB FCCB480GBS-EC0X FCCB480GBE-EC0X 960GB FCCB960GBS-EC0X FCCB960GBE-EC0X 1920GB FCCB1920BS-EC0X FCCB1920BE-EC0X 3480GB FCCB3840BS-EC0X FCCB3840BE-EC0X 7680GB FCCB7680BS-EC0X FCCB7680BE-EC0X * AES 256/TCG OPAL, NSA-130 and Conformal coating Capacity MPN (Silver) MPN (Diamond) 240GB FCCB240GBS-EC0Z FCCB240GBE-EC0Z 480GB FCCB480GBS-EC0Z FCCB480GBE-EC0Z 960GB FCCB960GBS-EC0Z FCCB960GBE-EC0Z 1920GB FCCB1920BS-EC0Z FCCB1920BE-EC0Z 3480GB FCCB3840BS-EC0Z FCCB3840BE-EC0Z 7680GB FCCB7680BS-EC0Z FCCB7680BE-EC0Z * * Please check with FLEXXON 14 Revision History Revision Date Description 1.0 2019/04 Preliminary release 1.1 2019/05 Update ordering number 1.2 2019/06 Update capacity 1.3 2019/10 Update ordering information 1.4 2020/03 Update performance 1.5 2020/05 Update ordering information 1.6 2020/06 Update performance 15