FDMS512MSE-N300

Industrial SD 2.0 Specification (FxPrem III, SLC) Version 1.1 Address: 28 Genting Lane, #09-03/04/05 Platinum 28, Singapore 349585 Tel : +65-6493 5035 Fax : +65-6493 5037 Website: http://www.flexxon.com Email: flexxon@flexxon.com ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED, OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM FLEXXON. Table of Contents 1. General Description..................................................................................... 1 1.1. Introduction ...................................................................................................................... 1 1.2. Product Overview ............................................................................................................ 1 2. Product Specifications................................................................................. 3 2.1. Performance ..................................................................................................................... 3 2.2. Power ............................................................................................................................... 3 2.3. MTBF ............................................................................................................................... 3 2.4. Data Retention.................................................................................................................. 3 3. Environmental Specifications ..................................................................... 4 4. Electrical Specifications .............................................................................. 5 4.1. 4.1.1. 4.1.2. 4.1.3. 4.1.4. DC Characteristics ........................................................................................................... 5 Bus Operation Conditions for 3.3V Signaling ..................................................... 5 Bus Signal Line Load ........................................................................................... 6 Power Up Time of Host ....................................................................................... 7 Power Up Time of Card ....................................................................................... 8 4.2. 4.2.1. AC Characteristic ............................................................................................................. 8 SD Interface timing (Default) .............................................................................. 9 4.2.2. SD Interface Timing (High-Speed Mode) .......................................................... 10 5. 5.1. Pad Assignment ......................................................................................... 12 Pad Assignment and Descriptions .................................................................................. 12 6. Registers ................................................................................................... 13 7. Physical Dimension ................................................................................... 14 8. Ordering Information ................................................................................ 15 1. GENERAL DESCRIPTION 1.1. Introduction FLEXXON Industrial FxPrem III Series SD 2.0 card is data crypto solution which provides low power consumption, good reliability, and wide compatibility. It can alternate communication protocol between SD mode and SPI mode. It’s well adapted for hand-held application in industrial/medical markets already. 1.2. Product Overview  Flash ￭  SLC Capacity ￭ 512MB up to 2GB  Support SD system specification version 2.0  Support SD SPI mode  Copyrights Protection Mechanism ￭ Compliant with the highest security of SDMI standard  Support CPRM (Content Protection for Recordable Media) of SD Card  Card removal during read operation will never harm the content  Password Protection of cards (optional)  Write Protect feature using mechanical switch  Built-in write protection features (permanent and temporary)  Support Adaptive Wear Leveling  Sudden Power Loss management  Temperature Range Operation (Diamond) : -40°C ~ 85°C ￭ ￭ Storage: -40°C ~ 85°C  RoHS Compliant  SMART Function 1  Bus Speed Mode (use 4 parallel data lines) ￭ Non-UHS mode  Default speed mode: 3.3V signaling, frequency up to 25MHz, up to 12.5MB/sec  High speed mode: 3.3V signaling, frequency up to 50MHz, up to 25MB/sec 2 2. PRODUCT SPECIFICATIONS 2.1. Performance Table 2-1 Performance of SD (FxPrem III) Capacity Sequential Read (MB/s) Write (MB/s) 512MB 23 17 1GB 23 19 2GB 23 20 NOTES: 1. The performance is obtained from TestMetrix Test (@500MB). 2. Samples are made of SLC NAND Flash. 3. Performance may vary from flash configuration and platform. 2.2. Power Table 2-2 Max Power Consumption of SD (FxPrem III Low Power) Standby Capacity Read (mA) Write (mA) 512MB 40 47 128 1GB 40 48 128 2GB 42 50 138 (uA) 2.3. MTBF MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value represents the average time between a repair and the next failure. The higher the MTBF value, the higher the reliability of the device. The predicted result of FLEXXON’s FxPrem III Series SD is more than 3,000,000 hours. 2.4. Data Retention   10 years if > 90% life remaining (@25C) 1 year if < 10% life remaining (@25C) 3 3. ENVIRONMENTAL SPECIFICATIONS Test Items Test Conditions Storage Temperature -40°C ~ 85°C Operating Temperature -40°C~ 85°C Storage Humidity 55°C, 95% RH Operating Humidity 55°C, 95% RH Shock 1500G, Half Sin Pulse Duration 0.5ms Vibration 80Hz ~ 2000Hz/20G, 20Hz ~ 80Hz/1.52mm, 3 axis/30min Drop 150cm free fall, 6 face of each unit Bending ≥ 10N, Hold 1 min/5 times Torque 0.1N-m or +/-2.5 deg, Hold 30 seconds/5 times Salt Spray Concentration: 3% NaCl, Temperature: 35°C, 24hours Waterproof Water temperature: 25°C Water depth: The lowest point of unit is locating 1000mm below surface. Storage for 30 mins Switch Cycle 0.4~0.5 N, 1,000 times Durability 10,000 times ESD Contact: +/- 4KV each item 25 times Air: +/- 8KV 10 times 4 4. ELECTRICAL SPECIFICATIONS 4.1. DC Characteristics 4.1.1. Bus Operation Conditions for 3.3V Signaling Table 4-1 Threshold Level for High Voltage Range Parameter Symbol Min. Max Unit Supply Voltage VDD 2.7 3.6 V Output High Voltage VOH 0.75*VDD Output Low Voltage VOL Input High Voltage VIH Input Low Voltage VIL V IOH=-2mA VDD Min 0.125*VDD V IOL=2mA VDD Min 0.625*VDD VDD+0.3 V VSS-0.3 0.25*VDD V 250 ms Power Up Time Parameter Condition From 0V to VDD min Symbol Min. Max Unit Supply Voltage VDD 2.7 3.6 V Regulator Voltage VDDIO 1.7 1.95 V Generated by VDD Output High Voltage VOH 1.4 - V IOH=-2mA Output Low Voltage VOL - 0.45 V IOL=2mA Input High Voltage VIH 1.27 2.00 V Input Low Voltage VIL Vss-0.3 0.58 V Parameter Symbol Input Leakage Current Condition Min Max. Unit Remarks -2 2 uA DAT3 pull-up is disconnected. Table 4-2 Peak Voltage and Leakage Current Parameter Peak voltage on all lines Symbol Min Max. Unit -0.3 VDD+0.3 V 10 uA 10 uA Remarks All Inputs Input Leakage Current -10 All Outputs Output Leakage Current -10 5 4.1.2. Bus Signal Line Load Bus Operation Conditions – Signal Line’s Load Total Bus Capacitance = CHOST + CBUS + N CCARD Parameter symbol Min Max Unit Remark Pull-up resistance RCMD 10 100 kΩ to prevent bus floating 40 pF 1 card RDAT Total bus capacitance for each signal CL line CHOST+CBUS shall not exceed 30 pF Card Capacitance for each signal pin CCARD Maximum signal line inductance Pull-up resistance inside card (pin1) RDAT3 10 101 pF 16 nH 90 kΩ May be used for card detection Capacity Connected to Power Line CC 5 uF To prevent inrush current 6 4.1.3. Power Up Time of Host Host needs to keep power line level less than 0.5V and more than 1ms before power ramp up. Power On or Power Cycle Followings are requirements for Power on and Power cycle to assure a reliable SD Card hard reset. (1) Voltage level shall be below 0.5V (2) Duration shall be at least 1ms. Power Supply Ramp Up The power ramp up time is defined from 0.5V threshold level up to the operating supply voltage which is stable between VDD (min.) and VDD (max.) and host can supply SDCLK. Followings are recommendation of Power ramp up: (1) Voltage of power ramp up should be monotonic as much as possible. (2) The minimum ramp up time should be 0.1ms. (3) The maximum ramp up time should be 35ms for 2.7-3.6V power supply. (4) Host shall wait until VDD is stable. (5) After 1ms VDD stable time, host provides at least 74 clocks before issuing the first command. Power Down and Power Cycle • When the host shuts down the power, the card VDD shall be lowered to less than 0.5Volt for a minimum period of 1ms. During power down, DAT, CMD, and CLK should be disconnected or driven to logical 0 by the host to avoid a situation that the operating current is drawn through the signal lines. • If the host needs to change the operating voltage, a power cycle is required. Power cycle means the power is turned off and supplied again. Power cycle is also needed for accessing cards that are already in Inactive State. To create a power cycle the host shall follow the power down description before power up the card (i.e. the card VDD shall be once lowered to less than 0.5Volt for a minimum period of 1ms). 7 4.1.4. Power Up Time of Card A device shall be ready to accept the first command within 1ms from detecting VDD min. Device may use up to 74 clocks for preparation before receiving the first command. 4.2. AC Characteristic 8 4.2.1. SD Interface timing (Default) 9 Parameter Symbol Min Max Unit Remark Clock CLK (All values are referred to min(VIH) and max(VIL) Clock frequency Data fPP Ccard≤ 10 pF 0 25 MHz Transfer Mode (1 card) Clock frequency Ccard≤ 10 pF fOD 0(1)/100 400 KHz Identification Mode (1 card) Ccard≤ 10 pF Clock low time tWL 10 ns (1 card) Ccard≤ 10 pF Clock high time tWH 10 ns (1 card) Ccard≤ 10 pF Clock rise time tTLH 10 ns (1 card) Ccard≤ 10 pF Clock fall time tTHL 10 ns (1 card) Inputs CMD, DAT (referenced to CLK) Ccard≤ 10 pF Input set-up time tISU 5 ns (1 card) Ccard≤ 10 pF Input hold time tIH 5 ns (1 card) Outputs CMD, DAT (referenced to CLK) Output Delay time during CL≤ 40 pF tODLY 0 14 ns Data Transfer Mode (1 card) Output Delay time during CL≤ 40 pF tODLY 0 50 ns Identification Mode (1 card) (1) 0Hz means to stop the clock. The given minimum frequency range is for cases where continues clock is required. 4.2.2. SD Interface Timing (High-Speed Mode) 10 Parameter Symbol Min Max Unit Clock CLK (All values are referred to min(VIH) and max(VIL) Clock frequency Data Transfer Mode fPP 0 50 MHz Clock low time tWL 7 ns Clock high time tWH 7 ns Clock rise time tTLH 3 ns Clock fall time tTHL 3 ns Remark Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Inputs CMD, DAT (referenced to CLK) Input set-up time tISU 6 ns Input hold time tIH 2 ns Outputs CMD, DAT (referenced to CLK) Output Delay time during Data tODLY 14 Transfer Mode Output Hold time TOH 2.5 ns ns Total System capacitance of each CL 40 pF line¹ (1) In order to satisfy severe timing, the host shall drive only one card. Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) CL ≤ 40 pF (1 card) CL ≤ 15 pF (1 card) CL ≤ 15 pF (1 card) 11 5. PAD ASSIGNMENT 5.1. Pad Assignment and Descriptions Table 5-1 SD Memory Card Pad Assignment pin SD Mode Type1 Name 1 CD/DAT3 2 I/O/PP SPI Mode Description 3 Card Detect/ Name CS Type I 3 Description Chip Select (net true) Data Line[bit3] 2 CMD PP Command/Response DI I Data In 3 VSS1 S Supply voltage ground VSS S Supply voltage ground 4 VDD S Supply voltage VDD S Supply voltage 5 CLK I Clock SCLK I Clock 6 VSS2 S Supply voltage ground VSS2 S Supply voltage ground 7 DAT0 I/O/PP Data Line[bit0] DO O/PP Data Out 8 DAT1 I/O/PP Data Line[bit1] RSV 9 DAT2 I/O/PP Data Line[bit2] RSV (1) S: power supply, I: input; O: output using push-pull drivers; PP: I/O using push-pull drivers. (2) The extended DAT lines (DAT1-DAT3) are input on power up. They start to operate as DAT lines after SET_BUS_WIDTH command. The Host shall keep its own DAT1-DAT3 lines in input mode as well while they are not used. It is defined so in order to keep compatibility to MultiMedia Cards. (3) At power up, this line has a 50KOhm pull up enabled in the card. This resistor serves two functions: Card detection and Mode Selection. For Mode Selection, the host can drive the line high or let it be pulled high to select SD mode. If the host wants to select SPI mode, it should drive the line low. For Card detection, the host detects that the line is pulled high. This pull-up should be disconnected by the user during regular data transfer with SET_CLR_CARD_DETECT (ACMD42) command. 12 SET_CLR_CARD_DETECT (ACMD42) command. 6. REGISTERS Name Width Description CID 128bit Card identification number; card individual number for identification. RCA 16bit Relative card address; local system address of a card, dynamically suggested by the card and approved by the host during initialization. DSR 16bit Driver Stage Register; to configure the card’s output drivers. CSD 128bit Card Specific Data; Information about the card operation conditions. SCR 64bit SD Configuration Register; Information about the SD Memory Card's Special Features capabilities OCR 32bit Operation conditions register. SSR 512bit SD Status; Information about the card proprietary features. OCR 32bit Card Status; Information about the card status. 13 7. PHYSICAL DIMENSION Dimension: 32mm(L) x 24mm(W) x 2.1mm(H) 14 8. ORDERING INFORMATION Capacity Part Number (Diamond Grade) 512MB FDMS512MSE-N300 1GB FDMS001GSE-N300 2GB FDMS002GSE-N300 15 Revision History Revision Release Date 1.0 2017/10 1.1 2021/11 Description First release Add 512MB and 2GB, Update Performance and Power consumption 16