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SIT6085EB

SIT6085EB

  • 厂商:

    SITIME

  • 封装:

  • 描述:

    时钟振荡 计时 评估板

  • 详情介绍
  • 数据手册
  • 价格&库存
SIT6085EB 数据手册
Aug15, 2015 Manufacturing Notes for SiTime MEMS-Based Silicon Timing Products 1 Introduction These manufacturing notes apply to all of SiTime’s MEMS-based Silicon Timing products in Quad, Flat No-Lead (QFN) package, SOT23-5 package, 2.0 x 1.2mm SMD, and WLCSP. The information provided in this document is meant to assist customers with manufacturing set-up and use of SiTime products designed into systems. The materials used in the construction of SiTime’s products comply with Green standards. They are compliant to RoHS and REACH163 requirements. Material composition reports are on file and can be made available on request. No hazardous materials defined by OSHA are contained in the products and MSDS reports are not required when using SiTime’s products. All SiTime products have been qualified to JEDEC JESD47 requirements as they apply to the type of product and packaging of the product. Reliability reports are available upon request from your sales representative. 2 Device Packaging Detailed mechanical dimensions for the various body sizes are provided in the data sheets as Package Outline Drawings. 2.1 Package Marking Details - Standard Mark The Standard Mark for all SiTime products is shown below. It contains an assembly location code and lot code to allow tracing the manufacturing origin. This marking is used on all samples, low volume, and mass production orders unless stipulated otherwise. The marking method is laser mark. The Smart Timing Choice™ 1 Rev A08 Manufacturing Notes for SiTime Products 2.0x1.6 package marking diagram: Assembly Identifier AXXX X X = Mfg Lot Code Pin 1 Indicator Other packages marking diagram: Assembly Identifier Pin-1 Indicator Mfg Lot Code YXXXX In the above diagrams, which show the “STANDARD MARK”: “Y” denotes assembly identifier: A as a first letter to indicate Vendor A (Carsem) B as a first letter to indicate Vendor B (UTAC) C as a first letter to indicate Vendor C (ASE) “XXXX” denotes 4 alpha-numeric characters of the manufacturing lot code without any dashes, periods, or symbols. Top Marking Dimensions (otherwise indicated differently) - All dimension are in mm - Font type: LLGOTHIC_ STD or EO135P or EO145 - Tolerance for: o Dimension X, X1, Y and Y1: +/- 0.25mm o Dimension Y2: +/- 0.1mm o Char Pitch: +/- 0.1mm o Char Height: +/- 0.1mm o Pin 1 Dot Diameter: +/- 0.1mm o All other tolerances: +/- 0.20 mm The Smart Timing Choice™ 2 Rev A08 Manufacturing Notes for SiTime Products Figure 1. Standard Marking Dimensions For 2.5x2.0, 3.2x2.5, 5.0x3.2, 7.0x5.0mm, and SOT23 Packages X Y AXXX Y2 X Y1 X1 Figure 2. Standard Marking Dimensions for 2.0x1.6mm Package Table 1. Marking Dimensions for Package Type Package X X1 Y Y1 Y2 Char Height Char Pitch Pin 1 Dot diameter 2.5 x 2.0 0.30 0.30 0.85 0.25 N/A 0.45 0.35 0.25 0.40 0.35 0.16 SOT23 0.55 0.30 0.81 0.25 N/A 2.7 x 2.4 0.30 0.30 0.85 0.25 N/A 0.45 0.35 0.25 3.5 x 3.0 0.30 0.20 1.10 0.35 N/A 0.45 0.45 0.25 3.2 x 2.5 0.30 0.20 1.10 0.35 N/A 0.45 0.45 0.25 5.0 x 3.2 7.0 x 5.0 2.0 x 1.6 0.35 1.00 0.33 0.35 0.70 0.33 1.50 2.70 0.28 0.5 0.7 0.28 N/A N/A 0.45 0.45 0.40 0.50 0.55 0.35 0.25 0.35 0.20 The Smart Timing Choice™ 0.15 3 Rev A08 Manufacturing Notes for SiTime Products Figure 3. Standard Marking Dimensions for 2.0x1.2mm Package Table 2. Marking Dimensions for SMD Package Type (2.0 mm X 1.2 mm) Package Char Height 2.0 x 1.2 0.38 The Smart Timing Choice™ Underline Width 0.3 Char Pitch 0.35 Pin 1 Diameter 0.14 4 X Y Y1 0.33 0.28 0.28 Rev A08 Manufacturing Notes for SiTime Products  Font size tolerance: (+/- 0.05mm)  Marking shift tolerance: (+/- 0.15mm) Figure 4. Standard Marking Dimensions for WLCSP Package Table 3. Marking Dimensions for WLCSP Package Height Width Space Description Position Font Type ↕ Pin 1 Dot Line 1 Line 2 Dot CX XXX The Smart Timing Choice™ NA Left Left NA S_X.FNT S_X.FNT ↔ 0.15 mm 0.15 mm 0.20 mm 0.18 mm 0.20 mm 0.18 mm 5 Max Marking Width Max chars ↔ NA 0.05 mm 0.05 mm ←――→ NA 0.41 mm 0.64 mm Rev A08 NA 2 3 Manufacturing Notes for SiTime Products 3 Product Packing 3.1 Tape & Reel Carrier tape basic dimensions are based on EIA481. The pocket is designed to hold the part for shipping and loading onto SMT manufacturing equipment, while protecting the body and the solder terminals from damaging stresses. The individual pocket design can vary from vendor to vendor, but width and pitch will be consistent. Carrier tape is wound or placed onto a 7” or 13” shipping reel depending on the quantity of parts on the reel and the package body size The center hub design is large enough to ensure the radius formed by the carrier tape around it does not put unnecessary stress on the parts. Prior to shipping, parts are placed into the pockets of the carrier tape. A cover tape is sealed over the top of the entire length of the carrier tape. The reel is sealed in a protective bag with a dry N2 backfill. The reel is made with high impact polystyrene and is anti-static material. It is possible that color of the reels may be different in two different shipments depending on drop shipment location. However, the specifications of the reel are identical. The carrier tape is made with polystyrene with carbon impregnation and is static dissipative material. The cover tape is made with polystyrene antistatic material. The Smart Timing Choice™ 6 Rev A08 Manufacturing Notes for SiTime Products Figure 5. Carrier Tape Dimensions The Smart Timing Choice™ 7 Rev A08 Manufacturing Notes for SiTime Products Figure 6. Reel Dimensions The Smart Timing Choice™ 8 Rev A08 Manufacturing Notes for SiTime Products Device orientation in the carrier tape is shown in the diagram below for all QFN and WLCSP packages (Figure 7) and SOT23-5 (Figure 8). Figure 7. Standard Tape and Reel Pin 1 orientation (all except for SOT-23) Figure 8. SOT23 Tape and Reel Pin 1 orientation Table 4 below provides the ordering details for tape and reel quantity, reel size, and top mark options. The “Suffix” character is the last character in the part number string as shown in the example below. Deviation from this table will be indicated via a custom part number (CS). SIT8002AI-23-33E-30.00000Y Suffix Character The Smart Timing Choice™ 9 Rev A08 Manufacturing Notes for SiTime Products Table 4. Marking and Tape & Reel Option Selections with Part Number Coding Suffix Packaging Method Package Size (mm) Reel Size (inches) M Bulk All N/A 16mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 16mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 16mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 16mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 16mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 16mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 12mm Tape & Reel 7.0 x 5.0 5.0 x 3.2 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 7.0 x 5.0 5.0 x 3.2 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 7.0 x 5.0 5.0 x 3.2 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 2.0 x 1.6 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 2.0 x 1.6 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 2.0 x 1.6 7.0 x 5.0 5.0 x 3.2 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 7.0 x 5.0 5.0 x 3.2 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 7.0 x 5.0 5.0 x 3.2 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 13 13 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 13 13 7 7 7 7 7 7 7 7 7 7 7 7 7 V Z W H J K T Y X The Smart Timing Choice™ Qty per Reel Shipped in canister or ESD bag or tube – any qty 3000 3000 3000 3000 3000 1000 1000 1000 1000 1000 250 250 250 250 250 3000 3000 3000 3000 1000 1000 1000 1000 250 250 250 250 3000 3000 3000 3000 3000 1000 1000 1000 1000 1000 250 250 250 250 250 10 Top Mark 2 Lines Frequency Mark 2 Lines Frequency Mark 2 Lines Frequency Mark 2 Lines Frequency Mark 2 Lines Frequency Mark 2 Lines Frequency Mark 2 Lines Frequency Mark 1 Line Standard Mark 1 Line Standard Mark 1 Line Standard Mark Rev A08 Manufacturing Notes for SiTime Products Table 4 (cont.) Suffix D E G S Blank Devices 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel 8mm Tape & Reel Package Size (mm) 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 2.0 x 1.6 2.0 x 1.2 WLCSP 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 2.0 x 1.2 2.0 x 1.6 WLCSP 3.2 x 2.5 2.7 x 2.4 2.5 x 2.0 2.0 x 1.6 2.0 x 1.2 WLCSP Reel Size (inches) 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 13 13 Bulk All N/A Packaging Method Qty per Reel 3000 3000 3000 3000 3000 3000 1000 1000 1000 1000 1000 1000 250 250 250 250 10000 10000 Top Mark 1 Line Standard Mark Two Line Standard Mark 1 Line Standard Mark Two Line Standard Mark 1 Line Standard Mark 1 Line Standard Mark Two Line Standard Mark Shipped in canister or ESD bag or tube – any qty 1 Line Standard Mark Tape leader and trailer are per EIA-481-B as shown below: Table 5. Leader and Trailer Lengths All Reels Minimum Length Leader 400 mm Trailer 160 mm Peel Strength The force required to peel off the cover tape from the carrier tape will fall within the range of 0.1 Newton to 1.3 Newton (10 grams to 130 grams) at a peeling speed to 300 mm per minute. This complies with the EIA standard. The Smart Timing Choice™ 11 Rev A08 Manufacturing Notes for SiTime Products 4 Storage and Handling It is recommended that the sealed tape be stored in conditions where the environment does not exceed: → Temperature: 40oC maximum → Relative humidity: 90% maximum → No direct exposure to sunlight 5 ESD SiTime’s products are semiconductor based and as such have sensitivity to Electro-Static Discharge. Care must be taken to insure careful handling to avoid damaging the components. Reference to JEDEC document JESD625, Requirements for Handling Electrostatic-DischargeSensitive Devices. This standard establishes the minimum requirements for Electrostatic Discharge (ESD) control methods and materials used to protect electronic devices that are susceptible to damage or degradation from electrostatic discharge (ESD). The passage of a static charge through an electrostatic-discharge-sensitive (ESDS) device can result in catastrophic failure or performance degradation of the part. Device sensitivity to ESD is determined by test methods such as EIA/JESD22-A114. 6 Moisture Sensitivity Level All SiTime’s products have been qualified to Moisture Sensitivity Level 1 for Pb-Free devices per JEDEC J-STD-020 and are deemed to not be moisture sensitive. This means partially consumed reels may be stored indefinitely without re-sealing the protective storage bags in which the reels are shipped in. It also means unused reels with a damaged bag seal may be used without baking. Because the parts meet moisture sensitivity level 1, the protective storage bags in which the reels are shipped do not require desiccant or HIC cards and are not required to maintain a tight vacuum seal or dry nitrogen purge. The Smart Timing Choice™ 12 Rev A08 Manufacturing Notes for SiTime Products 7 PCB Assembly Guidelines 7.1 Solder Reflow Profile The solder reflow profile shown in Figure 9 is IPC/JEDEC J-STD-020 compliant and applies to all SiTime packages; QFN, SOT23-5, 2.0x1.2 SMD, and WLCSP. Maximum reflow temperature is 260°C. An optimized reflow profile depends on several factors such as the solder paste, board density, and type of reflow equipment used. Additional reflow information can be obtained from solder paste vendor data sheets. It is recommended that any reflow profile be characterized with a fully populated production PCB and thermocouple placed on or closest to the SiTime component during profile. Thermocouples are generally used to record temperatures across the surface and any sensitive components on the PCB. Ensure that a thermocouple is placed in contact with the top surface of any moisture sensitive component to ensure maximum temperature is not exceeded. Figure 9. Convection Reflow Soldering Profile, per IPC/JEDEC J-STD-020 The Smart Timing Choice™ 13 Rev A08 Manufacturing Notes for SiTime Products Table 6. High Temperature Infrared/Convection Reflow Conditions IPC/JEDEC J-STD-020 IPC/JEDEC Standard IPC/JEDEC J-STD-020 Moisture Sensitivity Level Level 1 TS MAX to TL (Ramp-up Rate) 3°C/second Maximum Preheat - Temperature Minimum (TS MIN) 150°C - Temperature Typical (TS TYP) 175°C - Temperature Maximum (TS MAX) 200°C - Time (tS) 60 - 180 Seconds Ramp-up Rate (TL to TP) 3°C/second Maximum Time Maintained Above: - Temperature (TL) 217°C - Time (TL) 60 - 150 Seconds Peak Temperature (TP) 260°C Maximum Target Peak Temperature (TP Target) 255°C Time within 5°C of actual peak (tP) 20 - 40 seconds Max. Number of Reflow Cycles 3 Ramp-down Rate 6°C/second Maximum Time 25°C to Peak Temperature (t) 8 minutes Maximum 60 - 150 Seconds 260 60 - 150 Seconds 260 Note: Temperatures shown are applied to body of device. Table 7. Manual Soldering Conditions Manual Soldering (Iron) 350ºC Maximum for 3 seconds The Smart Timing Choice™ Caution: Small package body parts heat up very quickly and can be damaged 14 Rev A08 Manufacturing Notes for SiTime Products 7.2 PCB Cleaning After Assembly Cleaning PCB assemblies after reflow is a common process requirement to remove residual flux and loose solder. No-Clean and water soluble fluxes are left behind and require removal to meet assembly inspection standards. The package materials of the SiTime products are not susceptible to water or other common solvents (alcohol and acetone) used for assembly cleaning. SiTime recommends not using cleaning baths operating at ultrasonic frequencies. Instead, SiTime recommends that the customer use IPA (Isopropyl Alcohol) baths. 8 Additional Questions? If you have any questions about the information contained in this manufacturing note or other manufacturing questions, please contact your sales representative. SiTime Corporation 990 Almanor Avenue Sunnyvale, CA 94085 USA Phone: 4088-328-4400 http://www.sitime.com © SiTime Corporation, 2013. The information contained herein is subject to change at any time without notice. SiTime assumes no responsibility or liability for any loss, damage or defect of a Product which is caused in whole or in part by (I) use of any circuitry other than circuitry embodied in a SiTime product, (ii) misuse or abuse including static discharge, neglect or accident, (iii) unauthorized modification or repairs which have been soldered or altered during assembly and are not capable of being tested by SiTime under its normal test conditions, or (iv) improper installation, storage, handling, warehousing or transportation, or (v) being subjected to unusual physical, thermal, or electrical stress. Disclaimer: SiTime makes no warranty of any kind, express or implied, with regard to this material, and specifically disclaims any and all express or implied warranties, either in fact or by operation of law, statutory or otherwise, including the implied warranties of merchantability and fitness for use or a particular purpose, and any implied warranty arising from course of dealing or usage of trade, as well as any common-law duties relating to accuracy or lack of negligence, with respect to this material, any SiTime product and any product documentation. Products sold by SiTime are not suitable or intended to be used in a life support applicat ion or component, to operate nuclear facilities, or in other mission critical applications where human life may be involved or at stake. The Smart Timing Choice™ 15 Rev A08
SIT6085EB
1. 物料型号:文档中没有明确列出具体的物料型号,但提到了SiTime的MEMS-based Silicon Timing产品,这些产品可能包括多种型号。

2. 器件简介:文档主要介绍了SiTime MEMS-based Silicon Timing产品的制造注意事项,包括产品符合的环保标准(如RoHS和REACH),以及产品的可靠性报告。

3. 引脚分配:文档提供了不同封装类型的详细机械尺寸和标记细节,例如2.0x1.6mm封装的标记尺寸。

4. 参数特性:文档中提到了产品符合JEDEC JESD47要求,并提供了关于产品包装、标记、以及PCB组装指南的详细信息。

5. 功能详解:文档详细描述了SiTime产品的制造过程,包括材料使用、产品包装、卷带和盘装信息、存储和处理建议、ESD保护、湿度敏感性等级、PCB组装指南等。

6. 应用信息:文档提供了SiTime产品在系统设计中的应用信息,如卷带和盘装的尺寸、方向、以及如何正确处理和存储。

7. 封装信息:文档包含了不同封装类型的标记细节和尺寸,例如2.0x1.2mm SMD和WLCSP封装的标记尺寸。
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