HCM1012GD900B05PDG

PRODUCT SPECIFICATION DOCUMENT NO.ENS000066640 DESCRIPTION HCM1012G Series DRAWN BY DESIGNED BY CHECKED BY APPROVED BY INPAQ TECHNOLOGY CO., LTD. HCM1012G SERIES LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification RoHS Pb Features and Application ．Powerful components with composite co-fired material to solve EMI problem for high speed differential signal transmission line as USB, and LVDS, without distortion to high speed signal transmission. ．MIPI, MHL serial interface in mobile device. 1.PRODUCT DETAIL Part No. Imp. Com. (Ω)±25% @100MHz DCR Max. (Ω) Rated Current Max.(mA) Rated Voltage (V) Insulation Resistance Min.(MΩ) HCM1012GD900B05PDG 90 3.0 100 10 100 Test Instruments Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER HP4338 MILLIOHMMETER Agilent E5071C ENA SERIES NETWORK ANALYZER Keithley 2410 1100V SOURCE METER 2.PART NUMBER CODE HCM 1012 G □ 90 0 □ 05 P DG 1 2 3 4 5 6 7 8 9 10 1：Series name 2：Dimensions L*W 3：Material code 4：Product identification number 5：Impedance value (ex：900=90Ω) 6：Fixed decimal point 7：INPAQ internal code 8：Dimension T (ex：05=0.50mm) 9：Packaging style P – Embossed paper tape, 7”reel. 10：INPAQ internal code TITLE : HCM1012G LOW PROFILE TYPE Engineering Specification DOCUMENT NO. ENS000066640 SPEC REV.: A2 PAGE 1 OF 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 3.TYPICAL CHARACTERISTIC HCM1012GD900B05PDG IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 1000 Common Mode Insertion loss (dB) Impedance (ohm) Differential Mode 100 Differential Mode 10 -5 -10 -15 -20 Common Mode -25 1 10 100 1,000 10,000 100 1,000 10,000 Frequency (MHz) Frequency (MHz) TITLE : HCM1012G LOW PROFILE TYPE Engineering Specification 10 DOCUMENT NO. ENS000066640 SPEC REV.: A2 PAGE 2 OF 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 4.SHAPES AND DIMENSIONS TYPE L W T P C1 C2 Dimension 1.250.10 1.000.10 0.500.10 0.550.10 0.300.10 0.200.15 Unit：mm 5.CIRCUIT CONFIGURATION & LAYOUT PAD TITLE : HCM1012G LOW PROFILE TYPE Engineering Specification DOCUMENT NO. ENS000066640 SPEC REV.: A2 PAGE 3 OF 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 6.TAPE AND REEL SPECIFICATIONS/ TAPING DIMENSIONS Type：Paper Carrier Unit：mm Symbol Size Symbol Size A 1.20±0.05 Po 4.00±0.10 B 1.45±0.05 P1 4.00±0.10 W 8.00±0.10 P2 2.00±0.05 E 1.75±0.05 Do 1.55±0.05 F 3.50±0.05 T 0.60±0.03 TITLE : HCM1012G LOW PROFILE TYPE Engineering Specification DOCUMENT NO. ENS000066640 SPEC REV.: A2 PAGE 4 OF 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 7.REEL DIMENSIONS Unit：mm 8.STANDARD QUANTITY FOR PACKAGING Packaging style：Taping Reel packaging quantity：4000 pcs/reel Inner box：5 reel/inner box TITLE : HCM1012G LOW PROFILE TYPE Engineering Specification DOCUMENT NO. ENS000066640 SPEC REV.: A2 PAGE 5 OF 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 9.RECOMMENDED SOLDERING CONDITIONS 10.GENERAL TECHNICAL DATA Operating temperature range : - 40℃ ~ +85℃ Storage Condition : Less than 40℃ and 70% RH Storage Time: 6 months Max. Soldering method: Reflow or Wave Soldering TITLE : HCM1012G LOW PROFILE TYPE Engineering Specification DOCUMENT NO. ENS000066640 SPEC REV.: A2 PAGE 6 OF 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 11.RELIABILITY AND TEST CONDITION Test item Test condition A. Temperature : -40 ~ +85℃ B. Cycle : 100 cycles C. Dwell time : 30minutes Temperature Cycle Measurement : at ambient temperature 24 hrs after test Criteria A. No mechanical damage B.Impedance value should be within ± 20 % of the initial value completion A. Temperature : 85℃ ± 5℃ Operational Life B. Test time : 1000 hrs C. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion A. Temperature : 40 ± 2℃ B. Humidity : 90 ~ 95 % RH Biased Humidity C. Test time : 1000 hrs D. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion A. Solder temperature : 260 ± 5℃ Resistance to Solder Heat B. Flux : Rosin C. DIP time : 10 ± 1 sec A. No mechanical damage B. Impedance value should be within ± 20 % of the initial value A. More than 95 % of terminal electrode should be covered with new solder B. No mechanical damage C.Impedance value should be within ± 20 % of the initial value A. Temperature : 93 ± 2℃ Steam Aging Test A. No mechanical damage B.Impedance value should be within ± 20 % of the initial value B. Test time : 4 hrs C. Solder temperature : 235 ± 5℃ More than 95 % of terminal electrode should be covered with new solder D. Flux : Rosin E. DIP time : 5 ± 1 sec TITLE : HCM1012G LOW PROFILE TYPE Engineering Specification DOCUMENT NO. ENS000066640 SPEC REV.: A2 PAGE 7 OF 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40