WIP322512A-1R0MLDG

PRODUCT SPECIFICATION DOCUMENT NO. ENS000126560 DESCRIPTION DRAWN BY DESIGNED BY CHECKED BY APPROVED BY WIP322512A-1R0ML Rueiying Phil JiaJing Wiley INPAQ TECHNOLOGY CO., LTD. RoHS Pb WIP322512A-1R0ML Series Engineering Specification 1. Scope Feature  High saturation current realized by material properties and structure design  Low DC resistance to achieve high conversion efficiency and lower temperature rising  Low Profile: 3.2 mm × 2.5 mm × 1.2 mm.   Magnetically shielded structure to accomplish high resolution in EMC protection. Halogen free, Lead Free, RoHS Compliance. Applications  WIP322512A-1R0ML is generic applied in portable DC to DC converter line.  Smart phone, PAD  DC/DC converter  Thin-type power supply module 2. Explanation of Part Number W I P 3 2 2 5 1 2 A 1 R 0 W R w 2 3 4 5 W 1  W 1 : Series Name: Wire-wound type power inductor        M L D G R 6 7 8 2 : Size Code: The first two digitals: length(mm), The last two digitals: width(mm) 3 : Thickness in mm 4：Material code: Iron powder 5：Initial inductance value: 1R0 = 1.0 H 6：Model code, Tolerance of Inductance ±20%. 7：Electrode type. 8：Control code. TITLE : WIP322512A-1R0ML Engineering Specification DOCUMENT NO. ENS000126560 SPEC REV.: P11 Page 1 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 3. Construction & Dimensions 3.1. End termination: Ni/Sn 3.2. Construction & Dimension L [mm] W [mm] T [mm] E [mm] 3.2±0.2 2.5±0.2 1.2 max. 0.6±0.2 3.3. Recommend Land Pattern Dimensions B A A [mm] B [mm] C [mm] 2.5 typ. 1.7 typ. 3.2 typ. C 4. General specifications 4.1. Temperature Specifications Operating Temperature range Storage Temperature range TITLE : WIP322512A-1R0ML Engineering Specification : -40℃ to +125℃ : -50℃ to +125℃ DOCUMENT NO. ENS000126560 SPEC REV.: P11 Page 2 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 5. Performance Characteristics 5.1. Specifications INPAQ Part Number RDC [mΩ] DC Resistance Li [μH] Initial inductance Typical WIP322512A-1R0MLDG Isat [A] Saturation Current Irms [A] Heat Rating Current Maximum Typical Maximum Typical Maximum 1 25 32 5.5 5.0 4.9 4.4 Li [μH] RDC [mΩ] Isat [A] Irms [A] INPAQ Initial inductance DC Resistance Saturation Current Heat Rating Current Part Number Typical Maximum Typical Maximum Typical Maximum Note 1: Customized design@1mA is available, please contact us. WIP201610S-R33ML 25 6.4 5.77 4.7 4.09 Note 2: All test referenced to 0.33 26℃ ambient 21 0.47 WIP201610S-R47ML 25 30 5.3 4.77 4.2 3.65 Note 3: Inductance tolerance +/- 20% 2.2 WIP201610S-2R2ML 106 124 2.6 2.34 2 1.77 ® Note 4: Inductance is measured with Agilent LCR meter 4285A (or equivalent) at 1MHz/1V. ® Note 5: DC resistance is measured with HIOKI micro-ohm meter RM3542 or equivalent. Note 6: Isat means that DC current will cause a 30% inductance reduction from initial value. Note 7: Irms means that DC current will cause part temp. rising 40℃ whichever is smaller. TITLE : WIP322512A-1R0ML Engineering Specification DOCUMENT NO. ENS000126560 SPEC REV.: P11 Page 3 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 5.2 Current Characteristic WIP322512A-1R0MLDG TITLE : WIP322512A-1R0ML Engineering Specification DOCUMENT NO. ENS000126560 SPEC REV.: P11 Page 4 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 6. Reliability and Test Condition Test item Criteria 1. More than 95 % of terminal electrode should be covered 1. Solder temperature : 260 ± 5℃ with new solder 2. No mechanical damage Resistance to Solder Heat 2. Flux : Rosin 3. DIP time : 10 ± 1 sec 3. Inductance value should be within ± 20 % of the initial value 1. Reflow temperature : 245℃ It 1. No mechanical damage shall be Soldered on the 2. Soldering the products on substrate applying direction Adhesive Test PCB after the pulling test parallel to the substrate force > 5 N 2. Apply force(F) : 5 N 3. Test time : 10 sec 1. Temperature:-50 ~ 125℃ For 30 minutes each 1. No mechanical damage 2. Cycle: 500 cycles 2. Inductance should be Thermal shock 3. Measurement: At ambient within ±20% of the initial temperature 24 hours after test value completion 1. Temperature: 85 ± 2℃ 2. Testing time: 500 hrs 1. No mechanical damage 3. Applied current: Full rated 2. Inductance should be Dry Heat Test current within ± 20% of the initial 4. Measurement: At ambient value temperature 24 hours after test completion 1. Temperature: 60 ± 2℃ 2. Humidity: 90-95 % RH 1. No mechanical damage 3. Applied current: Full rated 2. Inductance should be current within ±20% of the initial Humidity Test 4. Testing time: 500 hrs value 5. Measurement: At ambient temperature 24 hours after test completion TITLE : WIP322512A-1R0ML Engineering Specification Test condition DOCUMENT NO. ENS000126560 SPEC REV.: P11 Page 5 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 7. Tape and reel specifications 7.1. Carrier tape dimensions A0 mm B0 2.80 ± 0.1 K0 3.45 ± 0.1 t 1.34 ± 0.1 0.23 ± 0.05 7.2 Taping reel dimensions PART SIZE (EIA SIZE) 3225 (1210) Qty.(pcs) 3,000 BOX 5 reels / inner box TITLE : WIP322512A-1R0ML Engineering Specification DOCUMENT NO. ENS000126560 SPEC REV.: P11 Page 6 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 7.3 Taping specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 7.4 Label Marking The label specified as follows shall be put on the side of reel. (1) Part No. (2) Quantity (3) Lot No. * Part No. And Quantity shall be marked on outer packaging. 7.5 Quantity of products in the taping package (1) Standard quantity：3000pcs/Reel (2) Shipping quantity is a multiple of standard quantity. 8. Precautions for Handling 8.1. Precaution for handling of substrate Do not exceed to bend the board after soldering this product extremely. (reference examples)  Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board.  Do not bend extremely the board, in mounting another components. If necessary, use back-up pin (support pin) to prevent from bending extremely.  Do not break the board by hand. We recommend to use the machine or the jig to break it. 8.2. Precaution for soldering Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100C in the process of soldering. We recommend to take preheating and gradual cooling. TITLE : WIP322512A-1R0ML Engineering Specification DOCUMENT NO. ENS000126560 SPEC REV.: P11 Page 7 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 8.3. Recommendable reflow soldering Reference IPC-020c-5-1 Profile Feature Average Ramp Rate (Ts max to Tp) Preheat - Temperature Min (Tsmin) - Temperature Min (Tsmax) - Time(tsmin to tsmin) Time maintained above: - Temperature (TL) - Time (tL) Pb free Assembly 3 ℃/second max Peak Temperature (Tp) 260℃ +0/-5 ℃ Time within 5 ℃ of actual Peak Temperature (Tp) Ramp-Down Rate Time 25℃ to Peak Temperature 20-40 seconds TITLE : WIP322512A-1R0ML Engineering Specification 150℃ 200℃ 60-180 seconds 217℃ 60-150 seconds 6 ℃/second max. 8 minutes max DOCUMENT NO. ENS000126560 SPEC REV.: P11 Page 8 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 8.4. Soldering gun procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 280C for the period within 3 seconds by using soldering gun under 30 W. (2) The soldering gun tip shall not touch this product directly. 8.5. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. 8.6. Taping Package Storage Condition Storage Temperature : 5 to 40 ℃ Relative Humidity: < 65%RH Storage Time : 12 months max TITLE : WIP322512A-1R0ML Engineering Specification DOCUMENT NO. ENS000126560 SPEC REV.: P11 Page 9 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40