HSE-B18635-035H-04

Additional Resources: Product Page date 08/05/2022 page 1 of 8 SERIES: HSE-BX-035H | DESCRIPTION: HEAT SINK FEATURES • TO-218 package • placement pins for secure PCB attachment • clip on style for component attachment • multiple available cut lengths MODEL thermal resistance1 length (mm) power dissipation1 @ 75°C ΔT, nat conv (°C/W) @ 1 W, nat conv (°C/W) @ 1 W, 200 LFM (°C/W) @ 1 W, 400 LFM (°C/W) @ 75°C ΔT, nat conv (W) 7.50 8.51 4.03 2.09 10.00 HSE-B18254-035H-00 25.4 HSE-B18317-035H-01 31.75 7.50 10.49 4.33 2.50 10.00 HSE-B18381-035H-02 38.1 6.25 9.81 3.79 2.60 12.00 HSE-B18508-035H-03 50.8 5.77 8.94 3.44 2.09 13.00 HSE-B18635-035H-04 63.5 4.97 7.90 2.38 1.66 15.10 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. cuidevices.com Additional Resources: Product Page CUI DEVICES | SERIES: HSE-BX-035H | DESCRIPTION: HEAT SINK date 08/05/2022 | page 2 of 8 PERFORMANCE CURVES HSE-B18254-035H-00 100 Heatsink Temperature Rise Above Ambient (ΔT = Ths - Ta) (°C) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 8.51 4.03 2.09 2 17.71 8.25 4.19 3 25.98 11.41 6.31 4 33.43 14.51 8.46 5 41.33 17.65 10.72 6 48.00 20.68 12.91 7 55.82 23.05 15.08 8 62.87 26.42 17.23 9 69.51 29.15 19.61 10 75.10 32.19 21.76 11 82.03 34.47 24.00 26.09 12 88.82 37.70 13 95.84 40.70 28.34 14 103.36 43.79 30.54 15 109.24 46.92 32.70 200 LFM 400 LFM 80 Mounting Surface Temperature Rise Above Ambient (°C) Power (W) Without Airflow 90 70 60 50 40 30 20 10 0 0 1 2 Ths: “hot spot” temperature measured on the heatsink Ta: ambient temperature cuidevices.com 3 4 5 6 7 8 9 10 Dissipated Power (W) 11 12 13 14 15 Additional Resources: Product Page CUI DEVICES | SERIES: HSE-BX-035H | DESCRIPTION: HEAT SINK date 08/05/2022 | page 3 of 8 PERFORMANCE CURVES (CONTINUED) HSE-B18317-035H-01 100 Heatsink Temperature Rise Above Ambient (ΔT = Ths - Ta) (°C) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 10.49 4.33 2.50 2 20.11 8.77 5.33 3 27.82 13.00 8.38 4 35.65 17.48 10.70 5 42.56 21.57 13.86 6 49.31 25.42 17.23 7 56.42 29.92 19.64 8 62.46 34.18 22.78 9 68.54 38.43 26.07 10 74.96 42.08 28.67 11 80.66 46.41 31.77 34.93 12 86.72 50.78 13 92.47 54.93 37.27 14 97.61 58.30 40.39 15 103.34 62.54 43.64 200 LFM 400 LFM 80 Mounting Surface Temperature Rise Above Ambient (°C) Power (W) Without Airflow 90 70 60 50 40 30 20 10 0 0 1 2 Ths: “hot spot” temperature measured on the heatsink Ta: ambient temperature cuidevices.com 3 4 5 6 7 8 9 Dissipated Power (W) 10 11 12 13 14 15 Additional Resources: Product Page CUI DEVICES | SERIES: HSE-BX-035H | DESCRIPTION: HEAT SINK date 08/05/2022 | page 4 of 8 PERFORMANCE CURVES (CONTINUED) HSE-B18381-035H-02 100 Heatsink Temperature Rise Above Ambient (ΔT = Ths - Ta) (°C) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 9.81 3.79 2.60 2 17.47 7.41 5.09 3 25.07 11.15 7.61 4 31.22 14.91 10.12 5 37.72 18.35 12.61 6 42.95 21.94 15.16 7 49.17 25.41 17.64 8 54.78 28.73 20.17 9 60.08 32.32 22.72 10 65.42 35.58 25.29 11 70.48 39.62 27.97 30.30 12 75.24 43.44 13 79.80 46.88 32.78 14 85.06 50.16 35.09 15 89.64 53.54 37.66 200 LFM 400 LFM 80 Mounting Surface Temperature Rise Above Ambient (°C) Power (W) Without Airflow 90 70 60 50 40 30 20 10 0 0 1 2 Ths: “hot spot” temperature measured on the heatsink Ta: ambient temperature cuidevices.com 3 4 5 6 7 8 9 Dissipated Power (W) 10 11 12 13 14 15 Additional Resources: Product Page CUI DEVICES | SERIES: HSE-BX-035H | DESCRIPTION: HEAT SINK date 08/05/2022 | page 5 of 8 PERFORMANCE CURVES (CONTINUED) HSE-B18508-035H-03 100 Heatsink Temperature Rise Above Ambient (ΔT = Ths - Ta) (°C) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 8.94 3.44 2.09 2 16.03 6.78 4.27 3 22.45 10.09 6.51 4 27.78 13.89 8.83 5 34.40 17.53 11.11 6 39.38 20.70 13.45 7 45.53 23.64 15.79 8 50.65 27.50 18.11 9 55.79 30.96 20.36 10 60.58 34.44 22.57 11 65.31 37.84 25.05 12 70.60 40.46 27.26 13 75.69 43.35 29.49 14 80.29 46.18 31.74 15 84.24 49.24 34.05 200 LFM 400 LFM 80 Mounting Surface Temperature Rise Above Ambient (°C) Power (W) Without Airflow 90 70 60 50 40 30 20 10 0 0 1 2 Ths: “hot spot” temperature measured on the heatsink Ta: ambient temperature cuidevices.com 3 4 5 6 7 8 9 10 Dissipated Power (W) 11 12 13 14 15 Additional Resources: Product Page CUI DEVICES | SERIES: HSE-BX-035H | DESCRIPTION: HEAT SINK date 08/05/2022 | page 6 of 8 PERFORMANCE CURVES (CONTINUED) HSE-B18635-035H-04 100 Without Airflow Heatsink Temperature Rise Above Ambient (ΔT = Ths - Ta) (°C) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 7.90 2.38 1.66 2 14.77 5.01 3.29 3 20.74 7.86 5.00 4 26.09 10.53 6.72 5 31.33 12.95 8.40 6 36.21 15.76 10.10 7 41.13 18.39 11.96 8 45.64 21.04 13.63 9 50.06 23.72 15.39 10 55.04 26.59 17.14 11 59.16 29.04 18.78 20.63 12 63.79 31.69 13 67.33 34.48 22.54 14 70.81 37.15 23.69 15 74.62 39.59 25.98 16 78.52 41.91 27.94 17 81.87 44.42 29.96 18 85.40 46.92 31.91 19 89.13 49.57 33.56 20 92.50 52.19 34.89 400 LFM 80 Mounting Surface Temperature Rise Above Ambient (°C) Power (W) 200 LFM 90 70 60 50 40 30 20 10 0 0 1 2 3 Ths: “hot spot” temperature measured on the heatsink Ta: ambient temperature cuidevices.com 4 5 6 7 8 9 10 Dissipated Power (W) 11 12 13 14 15 16 17 18 19 20 Additional Resources: Product Page CUI DEVICES | SERIES: HSE-BX-035H | DESCRIPTION: HEAT SINK date 08/05/2022 | page 7 of 8 MECHANICAL DRAWING units: mm tolerance: ±0.5 mm MATERIAL AL 6063-T5 FINISH black anodized PIN MATERIAL steel PIN PLATING tin LENGTH, L (mm) WEIGHT (g) HSE-B18254-035H-00 25.4 20 HSE-B18317-035H-01 31.75 23 HSE-B18381-035H-02 38.1 28.34 HSE-B18508-035H-03 50.8 37.8 HSE-B18635-035H-04 63.5 50 MODEL NO. cuidevices.com Additional Resources: Product Page CUI DEVICES | SERIES: HSE-BX-035H | DESCRIPTION: HEAT SINK date 08/05/2022 | page 8 of 8 REVISION HISTORY rev. description date 1.0 initial release 05/12/2017 1.01 brand update 02/10/2020 1.02 added pin dimensions 08/17/2020 logo, datasheet style update 08/05/2022 1.03 The revision history provided is for informational purposes only and is believed to be accurate. CUI Devices offers a one (1) year limited warranty. Complete warranty information is listed on our website. CUI Devices reserves the right to make changes to the product at any time without notice. Information provided by CUI Devices is believed to be accurate and reliable. However, no responsibility is assumed by CUI Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. CUI Devices products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. cuidevices.com