VENR6028-100M

LU M E SO U RC E S P E C I F I C AT IONS VO Customer Product Name Wire Wound SMD Power Inductor 司 H286 电 子 有 Customer Part Number VENR6028 Series 限 公 Volume Part Number [ New Released, Revised] SPEC No.: VENR6028-100M PART NO: FIA06028-22 源 【This SPEC is total 11 pages.】 千 代 【ROHS Compliant Parts】 Checked By Issued By 深 圳 市 Approved By SHEN ZHEN VOLUME SOURCE CO.,LTD Address: F16,N4 Building, Fenggang Tianan Cyber Park, Yantian Village, Fenggang Town, Dong Guan City, GuangDong Province, China. Tel: 0769-89891993 Fax: 0769-89891993-806 【For Customer approval Only】 Qualification Status: Approved By Comments: □Full □Restricted Verified By Date: □Rejected Re-checked By Checked By 【Version change history】 Effective Date Changed Contents Change Reasons Approved By 01 2024-3-15 New released / Luyong Han 深 圳 市 千 代 源 电 子 有 限 公 司 VO LU M E SO U RC E Rev. 1 2 Scope This specification applies to the VENR6028 Series of wire wound SMD power inductor. Product Description and Identification (Part Number) ③ ④ ⑤ ⑥ ⑦ Type ① External Dimensions(L×W×H) [mm] ② Wire wound SMD power 6028 VO inductor Nominal Inductance ④ Standard Type ±30% M ±20% Packing ⑥ 1.0uH 100 10uH 101 100uH Tape Carrier Package Special Process code Special Process code □□□ 千 代 * Standard product is blank 市 Electrical Characteristics Please refer to Item 12. Operating and storage temperature range (individual chip without packing): -40℃ ~ +125℃（Including Self-heating） Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.) 圳 1) 2) Test and Measurement Procedures Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: 深 4 Example 1R0 ⑦ 源 T 电 子 N Example 有 Inductance Tolerance ⑤ 3 限 公 S 司 Feature type ③ 6.0X6.0X2.8 LU M VENR SO U ② E ① RC E 1） Description: VENR6028 series of Wire wound SMD power inductor. 2） Product Identification (Part Number) VENR 6028 S T a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86kPa to 106kPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86kPa to 106kPa Visual Examination Inspection Equipment: Visual. Electrical Test Inductance (L) a. Refer to Item 12.Test equipment: HP4214 LCR meter or equivalent. b. Test Frequency and Voltage: refers to Item 12. Direct Current Resistance (DCR) a. Refer to Item 12. b. Test equipment: HP4140 or equivalent. Saturation Current (Isat) a. Refer to Item 12. b. Test equipment: HP4214 LCR meter or equivalent. c. Definition of saturation current (Isat): DC current at which the inductance drops approximate 30% from its value without current. Temperature rise current (Irms) a. Refer to Item 12. b. Test equipment (see Fig. 4.3.4-1, Fig. 4.3.4-2): Electric Power, Electric current meter, Thermometer. c. Measurement method 1. Set test current to be 0 mA. 2. Measure initial temperature of choke surface. 3. Gradually increase current and measure choke temperature for corresponding current. 4. Definition of Temperature rise current: DC current that causes the temperature rise from C ambient Thermometer Electric Power RC E Fig. 4.3.4-2 SO U Fig. 4.3.4-1 Shape and Dimensions Dimensions and recommended PCB pattern for reflow soldering, please see Fig.5-1, Fig. 5-2 and Table 5-1. A 6.0±0.3 Fig.5-1 [Table 5-1] (Unit: mm) B C. D E F a. b. c. 6.0±0.3 2.8 Max 4.9±0.3 1.55±0.3 2.9±0.3 2.8Typ 1.7 Typ 5.7Typ 深 圳 市 VENR6028 千 代 Series 源 电 子 有 限 公 司 VO LU M E 5 Electric Current Meter Fig.5 -2 Δf: Clearance between terminal and the surface of plate must be 0.2mm max when coil is placed on a flat plate. 6 Structure The structure of VENR6028 product, please refer to Fig.6-1 and Table 6-1. [Table 6-1] No. Components Material ① Ferrite Core Ni-Zn Ferrite ② Wire Polyurethane system enameled copper wire ③ Magnetic Glue Epoxy resin and magnetic powder ④ substrate FeNiCu/Ag or Ag/Ni/Sn ⑤ Top Electrodes Sn alloy ⑥ Marking Nitrocellulose Fig. 6-1 7 Product Marking Please refer to Fig. 7-1. The content of marking please refers to Item 12. 100 Fig.7-1 Start Reliability Test Requirements Test Methods and Remarks No removal or split of the termination or other defects shall occur. Y direct 8.1 Terminal Strength X direct ① Solder the inductor to the testing jig (glass epoxy board shown in Fig.8.1-1) using eutectic solder. Then apply a force in the direction of the arrow. ② 10N force. ③ Keep time: 5s Fig.8.1-1 8.2 Resistance to Flexure RC E Items SO U 8 No visible mechanical damage. 限 公 司 VO LU M E ① Solder the chip to the test jig (glass epoxy board)using eutectic solder. Then apply a force in the direction shown as Fig.8.2-1. ② ③ ④ ⑤ Flexure: 2mm Pressurizing Speed: 0.5mm/sec Keep time: 30±1s Test board size: 100X40X1.0 ⑥ Land dimension: Please see Fig. 5-1 ① Solder the chip to the testing jig (glass epoxy board shown as the following figure) using eutectic solder. ② The chip shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. ③ The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). ① Temperature: -40℃~+125℃ ② With a reference value of +20℃, change rate shall be calculated ① The test samples shall be dipped in flux, and then immersed in molten solder. ② Solder temperature: 245±5℃ ③ ④ ⑤ Duration: 5±1 sec. Solder: Sn/3.0Ag/0.5Cu Flux: 25% resin and 75% ethanol in weight ⑥ Immersion depth: all sides of mounting terminal shall be immersed ① ② ③ Re-flowing Profile: Please refer to Fig. 8.6-1. Test board thickness: 1.0mm Test board material: glass epoxy resin ④ The chip shall be stabilized at normal condition for 1~2 hours before measuring No visible mechanical damage. ② Inductance change: Within ±10% 电 子 ① 深 圳 市 千 代 源 8.3 Vibration 有 Fig.8.2-1 8.4 Temperature coefficient Inductance change: Within ±20% 8.5 Solderability 90% or more of electrode area shall be coated by new solder. 8.6 Resistance to Soldering Heat ① No visible mechanical damage. ② Inductance change: Within ±10% Peak 260℃ max 260℃ 217℃ Max Ramp Up Rate=3℃/sec. Max Ramp Down Rate=6℃/sec. 200℃ 60～90sec. 150℃ 60～120sec. 25℃ Time 25℃ to Peak =8 min max Fig. 8.6-1 ① No visible mechanical damage. ② Inductance change: Within ±10% Temperature 30 min. ② 30 min. ③ ④ RC E 125℃ Ambient Temperature and time: -40±3℃ for 30±3 min→125℃ for 30±3min, please refer to Fig. 8.7-1. Transforming interval: Max. 20 sec Tested cycle: 100 cycles The chip shall be stabilized at normal condition for 1~2 hours before measuring ① 30 min. -40℃ 20sec. (max.) SO U 8.7 Thermal Shock 8.8 Resistance to Low Temperature ① 8.9 Resistance to High Temperature ① No mechanical damage. ② Inductance change: Within ±10% 8.10 Damp Heat ① No mechanical damage. ② Inductance change: Within ±10% No visible mechanical damage 限 公 司 VO Inductance change: Within ±10% ① Temperature: 125±2℃ ② Duration: 1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. 有 电 子 No mechanical damage. ① Inductance change: Within ±10% ② ③ ④ 市 ② ③ Duration: 1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring ④ 千 代 ① Temperature: -40±3℃ ② ① ② ③ 圳 8.11 Loading Under Damp Heat ① ③ 源 ② LU M E Fig.8.7-1 深 ⑤ 8.12 Loading at High Temperature ① No mechanical damage. ① ② Inductance change: Within ±10% ② ③ ④ Humidity: 90% to 95%RH Duration: 1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring Temperature: 60±2℃ Humidity: 90% to 95% RH Applied current: Rated current Duration:1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring Temperature: 85±2℃ Applied current: Rated current Duration: 1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring Packaging and Storage Tape and Reel Packaging Dimensions Taping Dimensions (Unit: mm Please refer to Fig. 9.1.1 and Table 9.1.1 P2 F D0 K0 A0 T B0 P0 W P1 E 9 Temperature: 60±2℃ Fig.9.1.1 [Table9.1.1] Series A0 B0 W E F P0 P1 VENR6028 6.3±0.1 6.3±0.1 16.0±0.3 1.75±0.1 5.5±0.1 4.0±0.1 12.0±0.1 P2 2.0±0.1 D0 T K0 1.5+0.1/-0.0 0.4±0.03 3.0±0.1 Trailer no com ponent 100 mm min. SO U RC E Direction of rolling Please refer to Fig. 9.1.2. Leader no com ponent 160m m min. LU M E C om ponents Trailer no com ponent 400mm min. VO U ser direction of feeder Reel Dimensions (Unit: mm) 司 Please refer to Fig. 9.1.3. Fig.9.1.2 限 公 16.4+0.2/0.0mm 深 Ø330 10.75±0.2 Ø100 Ø13.0+0.2/-0.0 Max