B3D350M-R

B3D350M-R Order Code: B3D350M-R Version: A4 2018-4-2 Gas Discharge Tube Features Exterior Surface Mounting Design 7.8×5.0×5.6mm High Current Handling Capability 5,000A @ 8/20μ s Low Capacitance and Insertion Loss Quick Response and Long Service Life Moisture sensitivity level: Level 1 SMD Application Information rmation ` Package (Top View) DC30V Power 1 Agency Approvals 2 Schematic Symbol Icon Description 160 R=160Ω Compliance with 2011/65/EU Compliance with IEC61249-2-21:2003 2 1 Mean lead free UL Certificated E232249 Electrical Parameter DC Breakdown Voltage 1)2) Impulse Spark-over Voltage Impulse Discharge Current 3) 100V/s 245-455 At 1kV/μs for 99 % of measured values At 1kV/μs Typical values of distribution V  850  700 V V 8/20μs，±5T 5,000 A Arc Voltage At 1A >33 V Insulation Resistance DC=100V ≥1 GΩ Capacitance at 1MHz VDC=0.5V ≤1.5 pF Weight ~1.1 g Operating And Storage Temperature -40-90 ℃ Marking without 1) At delivery AQL 0.65 level II ISO 2859 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12 and IEC 61643-21 1/3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications B3D350M-R Order Code: B3D350M-R Version: A4 2018-4-2 Gas Discharge Tube Product Characteristics Characteristics Part Numbering System B3D xxx M -R (1) (2) (3) (4) Bencent 3-Electrode Gas (1) (1) Bencent 3-Electrode SMD SMD Gas Discharge Tube Discharge Tube 7.6×5×5mm 7.8×5.0×5.6mm (2) Breakdown DC Breakdown e.g., (2) DC Voltage, Voltage, e.g., 350=350V 350=350V (3) Surge Rating @8/20μ s, M=5,000A Lead Material Copper Body Material Ceramics Terminal Finish 100% Matte-Tin Plated (3) Surge Rating @8/20μs, M=5,000A (4) Resistance Triggering (4) resistance triggering Environmental Reliability Characteristics (1) (2) ( 3) Testing items Technical standards Temperature: 90℃ Time: 2H Temperature: -40℃ Time: 2H Frequency: 10-500Hz Amplitude: 0.15mm Time: 45min Temperature: 260±5℃ Time of dip soldering: 10s, 1time High Temperature Storage Test Low Temperature Storage Test Vibration Resistance of soldering heat Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability Test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 secs. Product Dimensions A B C D E F G REF mm inch A B C D E F G 7.8±0.3 0.5±0.2 1.6±0.2 0.5±0.2 5.0±0.2 5.0±0.2 5.6±0.3 0.307±0.012 0.020±0.008 0.063±0.008 0.020±0.008 0.197±0.008 0.197±0.008 0.220±0.012 Recommended Soldering Pad A B C 2/3 www.bencent.com.cn REF mm inch A 9.6 0.378 B 6.6 0.260 C 5.0 0.197 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications B3D350M-R Order Code: B3D350M-R Version: A4 2018-4-2 Gas Discharge Tube Reflow Profile Reflow Condition Heat Temperature Min 150°C Temperature Max 200°C Time (min to max) 60 – 180 secs. Average ramp up rate (Liquids) Tamp (TL) to peal TS(max) to TL - Ramp-up Rate 3°C/second max (Liquids) - Temperature (TL) Peak Temperature (TP) 217°C 60 – 150 secs. TL TS(max) Ramp-down Preheat TS(min) tS 260+0/-5 °C Time within 5°C of actual peak ~10 secs Temperature (tp) Critical Zone TL to TP Ramp-up TL 3°C/second max - Temperature (TL) Reflow tP TP Temperature Pre Pb-Free assembly 25 Ramp-down Rate 6°C/secs. max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Time time to peak temper ature Remarking: it’s only suitable for SMT manufacture, not for manual welding. Package Reel Information 3/3 REF mm inch A0 8.4±0.2 0.331±0.008 B0 5.4±0.2 0.216±0.008 P0 4.0±0.2 0.157±0.008 P1 8.0±0.2 0.315±0.008 P2 2.0±0.2 0.079±0.008 E 1.75±0.2 0.069±0.008 F 7.5±0.2 0.295±0.008 K0 6.3±0.2 0.248±0.008 T 0.5±0.2 0.020±0.008 G 2 0.079 D0 Φ 1.5±0.2 Φ 0.059±0.008 W 16.0±0.3 0.630± 0.012 D Φ 330.0 Φ 13.0 D1 Φ 50Min Φ 1.97Min D2 Φ 13±0.5 Φ 0.512±0.020 W1 16.8±0.5 0.661±0.020 Outline Reel (PCS) Per Carton (PCS) Reel Diameter (mm) TAPING 1,000 16,000 330 www.bencent.com.cn Carton Size(mm) L W H 360 360 385 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications