www.osram-os.com
Produktdatenblatt | Version 1.1
LS R976
LS R976
Chip LED 0805
Applications
—Electronic Equipment
—White Goods
—Gaming, Amusement, Gambling
Features:
—Package: SMT package 0805, colorless diffused resin
—Chip technology: InGaAlP
—Typ. Radiation: 150°
—Color: λdom = 633 nm (● super red)
—Optical efficacy: 7 lm/W
—Corrosion Robustness Class: 3B
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
1 Version 1.3 | 2021-09-28
LS R976
Ordering Information
Type
Luminous Intensity 1)
IF = 20 mA
Iv
LS R976-NR-1
28 ... 180 mcd
2 Version 1.3 | 2021-09-28
Ordering Code
Q62702P5178
LS R976
Maximum Ratings
Parameter
Symbol
Operating Temperature
Top
min.
max.
-30 °C
85 °C
Storage Temperature
Tstg
min.
max.
-40 °C
85 °C
Junction Temperature
Tj
max.
95 °C
Forward current
TA = 25 °C
IF
max.
25 mA
Surge Current
t ≤ 10 µs; D = 0.005 ; TA = 25 °C
IFS
max.
100 mA
Reverse voltage 2)
TA = 25 °C
VR
max.
12 V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD
3 Version 1.3 | 2021-09-28
Values
2 kV
LS R976
Characteristics
IF = 20 mA; TA = 25 °C
Parameter
Symbol
Peak Wavelength
λpeak
typ.
645 nm
Dominant Wavelength 3)
λdom
min.
typ.
max.
625 nm
633 nm
650 nm
Spectral Bandwidth at 50% Irel,max
∆λ
typ.
16 nm
Viewing angle at 50% IV
2φ
typ.
160 °
Forward Voltage 4)
IF = 20 mA
VF
typ.
max.
2.00 V
2.50 V
Reverse current 2)
VR = 12 V
IR
typ.
max.
0.01 µA
10 µA
Temperature Coefficient of Peak Wavelength
TCλpeak
typ.
0.14 nm / K
Temperature Coefficient of Dominant Wavelength
TCλdom
typ.
0.05 nm / K
Temperature Coefficient of Forward Voltage
TCVF
typ.
-2 mV / K
Real thermal resistance junction/ambient
RthJA real
max.
800 K / W
Real thermal resistance junction/solderpoint 5)
RthJS real
max.
450 K / W
5)6)
4 Version 1.3 | 2021-09-28
Values
LS R976
Brightness Groups
Group
Luminous Intensity 1)
IF = 20 mA
min.
Iv
Luminous Intensity. 1)
IF = 20 mA
max.
Iv
Luminous Flux 7)
IF = 20 mA
typ.
ΦV
N
28 mcd
45 mcd
110 mlm
P
45 mcd
71 mcd
180 mlm
Q
71 mcd
112 mcd
290 mlm
R
112 mcd
180 mcd
460 mlm
Group Name on Label
Example: N-1
Brightness
Wavelength
N
1
5 Version 1.3 | 2021-09-28
LS R976
Relative Spectral Emission
7)
Irel = f (λ); IF = 20 mA; TA = 25 °C
OHL00555
100
Ι rel
%
orange
80
Vλ
super-red
yellow
60
40
20
0
400
450
Radiation Characteristics
500
550
600
650
nm
λ
700
7)
Irel = f (ϕ); TA = 25 °C
40˚
30˚
20˚
10˚
0˚
ϕ
50˚
OHL00408
1.0
0.8
0.6
60˚
0.4
70˚
0.2
80˚
0
90˚
100˚
0.8
1.0
6 Version 1.3 | 2021-09-28
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
LS R976
Forward current
Relative Luminous Intensity
7)
IF = f(VF); TA = 25 °C
7), 8)
Iv/Iv(20 mA) = f(IF); TA = 25 °C
OHL00232
10 2
mA
5
OHL00642
10 1
ΙV
Ι V (20 mA)
IF
10 0
10 1
5
5
10 -1
5
10 0
10 -2
5
super-red,
orange
yellow
5
10 -1
1
1.4
1.8
2.2
2.6
10 -3
10 -2
3 V 3.4
Relative Luminous Intensity
7)
Iv/Iv(25 °C) = f(Tj); IF = 20 mA
OHL02378
IV
I V (25 ˚C)
1.6
orange
yellow
super-red
1.2
0.8
orange
yellow
super-red
0.4
0
-20
0
20
40
60
˚C 100
Tj
7 Version 1.3 | 2021-09-28
10 0
10 1 mA 10 2
ΙF
VF
2.0
10 -1
LS R976
Max. Permissible Forward Current
IF = f(T)
OHL00420
30
mA
I F 25
20
15
10
5
0
0 10 20 30 40 50 60 70 80 °C 100
TA
Permissible Pulse Handling Capability
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TA = 25 °C
IF = f(tp); D: Duty cycle; TA = 85 °C
OHL02140
0.12
IF
A
t
D = TP
tP
IF
OHL02147
0.12
IF
A
T
t
tP
D = TP
IF
T
D=
0.08
0.06
0.04
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
0.06
0.04
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
0.02
0.02
8 Version 1.3 | 2021-09-28
0.08
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
LS R976
Dimensional Drawing
9)
Further Information:
Approximate Weight:
3.0 mg
Corrosion test:
Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)
9 Version 1.3 | 2021-09-28
LS R976
Electrical Internal Circuit
9)
1.2 (0.047)
Recommended Solder Pad
1.2 (0.047)
0.9 (0.035)
1.2 (0.047)
OHAPY607
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.
10 Version 1.3 | 2021-09-28
LS R976
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
tS
Time tS
TSmin to TSmax
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
60
2
3
100
120
2
3
Unit
K/s
s
K/s
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
3
6
Ramp-down rate*
TP to 100 °C
10
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
11 Version 1.3 | 2021-09-28
°C
480
s
K/s
s
LS R976
Taping
9)
12 Version 1.3 | 2021-09-28
LS R976
Tape and Reel
10)
Reel Dimensions
A
180 mm
W
Nmin
8 + 0.3 / - 0.1 mm
13 Version 1.3 | 2021-09-28
W1
60 mm
W2 max
8.4 + 2 mm
14.4 mm
Pieces per PU
4000
LS R976
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
9)
Moisture-sensitive label or print
L
E
E
V
l
e be
sela
).
k,
H
de
L
If
an
bl r co
ba
(R
id
m
ity
.
H
R
hu
0%
e
e
/6
tiv
˚C
la ared ag
ck
re
fr
30
_
<
in pa
%
k
of
to
90
rs
ea
s
d
).
rs
ou
or
te (p
on
rs
H
de
,
ou
iti
H
an bjec ng
ou rs
co
˚C
72
si
nd
H ou
5
te
48
˚C su es
e
H
co
±
24 6
da
e
y
40 be oc
tim
˚C
e
or
<
ith
tim
ill pr).
or
ct
w
O
w nt
23
tim e
at
lo
or
fa
M TO
F
s
al
tim
at le ˚C at
lo
at
or
e.
P
th
F
l
tic
th va
lo or
ur
O
F lo
s ui
on
be
if: read
en
w
ed
l 4 5
F
m
la
ce eq
id
lo
g, n
oc
l
ve
vi
5a
is
in
or
be
24
de
pr
ve l
6
Le
de ,
nt whe
e
te
co
g:
, w
e
Le ve l
ke
r
ou
se
da
ba ed flo
ur
e
Le ve
m %
ba
e
ba
al
st
ur e
Le
r
en re
ed
e
re> 10
oi
st
e
e
fo
tim
ur
se
al
op
fo
M
se
oi st ur
as
k,
is
or .
33
se
is
M oi st
bed
k,
lo H
an
,
g ph
-0
M oi
in
an in F R ng ar
rbl
D
M
e
ba
T
r
po If bl ith
%
lif
ki r C.
(if
S
is
p.
w
ea r ks
lf
J10 ba to et
th va
Y ea
m
rs
m
_
r w,
<
he
ed
1
ee
te
Y
d, EC
iredicat
S
fte
at
nt
>
1
W Hou
D
A flody
qu In no ire
1.
d
e
ou
4 8
re
reity is
qu/JE
re
2.
bo
e
M
tim
to es id 2b
re C
16
:
e
a)
S
tim
is IP
ic
ed loor
tim e
b) ev Humor
or
e
en
F
tim
lo
or
D
2a king
nc
te
F
op
a)
lo or
3.
b) ba re
F lo
da
e
fe
l 1 2
F
If
al
re
tim ve
l
4.
se
d
l 2a
ve
Le
3
an
ve l
ag
e
Le
e
B
ve
ur
e
Le
at
st
ur
e
Le
D
oi
st
ur e
M
oi
st ur
M
oi st
M oi
M
N
E RS
s
in IV O
IT T
S C
nta
N U
TIO
U coSEND
Ais bUagRMEICO
T E
CThIS
S
d
Barcode label
<
M
RA
OS
Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
Desiccant
AM
OSR
OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
14 Version 1.3 | 2021-09-28
LS R976
Schematic Transportation Box
9)
Dimensions of Transportation Box
Width
Length
260 ± 5 mm
230 ± 5 mm
15 Version 1.3 | 2021-09-28
Height
85 ± 5 mm
LS R976
Type Designation System
Wavelength
(λdom typ.)
B:
470 nm
S:
633 nm
T:
528 nm
Y:
587 nm
A:
617 nm
R/J:
625 nm
H:
645 nm
O:
606 nm
G:
570 nm
L:
Emission Color
blue
super red
true green
yellow
amber
red
hyper-red
orange
green
Color coordinates according
CIE 1931/Emission color:
W:
white
Package Type
Q:
CHIPLED 0603 / 0402
R:
CHIPLED 0805
N:
CHIPLED 1206 /
CHIPLED with lens
Light
emitting
diode
L
B
Q
H
Lead / Package Properties
1:
footprint: 0603 / height: 0.6 mm
3:
footprint: 0603 / height: 0.35 mm
9:
standard
H:
footprint: 0402 / height: 0.35 mm
Encapsulant Type / Lens Properties
1:
focusing lens (=20°)
7:
clear resin or white volume conversion
8:
white volume conversion
9:
clear resin
Chip Technology:
1:
TSN
3:
standard InGaN
4:
AlGaAs
6:
standard InGalP
E:
ThinGaN & package with 8 kV
ESD stability
G:
NOTA, Powerflip, ThinGaN
16 Version 1.3 | 2021-09-28
9
G
LS R976
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
17 Version 1.3 | 2021-09-28
LS R976
Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer.
18 Version 1.3 | 2021-09-28
LS R976
Glossary
1)
Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of
±11 %.
2)
Reverse Operation: This product is intended to be operated applying a forward current within the
specified range. Applying any continuous reverse bias or forward bias below the voltage range of light
emission shall be avoided because it may cause migration which can change the electro-optical characteristics or damage the LED.
3)
Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm.
4)
Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of
±0.1 V.
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad)
7)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
19 Version 1.3 | 2021-09-28
LS R976
Revision History
Version
Date
Change
1.2
2020-04-07
Dimensional Drawing
Taping
1.3
2021-09-28
Brand
20 Version 1.3 | 2021-09-28
LS R976
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
21 Version 1.3 | 2021-09-28
