TAK CHEONG
®
SEM IC O N DU C TO R
Plastic Package
N-Channel MOSFET
Absolute Maximum Ratings
Symbol
Green Product
3
TA = 25°C unless otherwise noted
Parameter
VDS
Drain-Source Voltage
VGS
Continuous Gate-Source Voltage
Value
Units
30
V
±20V
V
ID
Continuous Drain Current
100
mA
PD
Power Dissipation
150
mW
RθJA
Thermal Resistance from Junction to Ambient
833
°C /W
TSTG
Storage Temperature Range
-55 to +150
°C
+150
°C
TJ
2SK3019
150mW SOT-523 SURFACE MOUNT
Operating Junction Temperature
2
1. Gate
2. Source
3. Drain
1
SOT-523
These ratings are limiting values above which the serviceability of the device may be impaired.
Specification Features:
Electrical Symbol:
Device Marking Code:
Low On-resistance
Fast Switching Speed
Low Voltage Drive Makes This Device
KN
Ideal for Portable Equipment
Easily Designed Drive Circuits
Easy to Parallel
RoHS Compliant & Green EMC
Matte Tin(Sn) Lead Finish
Weight: approx. 0.002g
DB Number: DB-248
October 2015, Revision A
Page 1
TAK CHEONG
®
SEM IC O N DU C TO R
Electrical Characteristics (TA = 25°C unless otherwise noted)
Off Characteristics
Symbol
BVDSS
Parameter
Test Condition
Drain-Source Breakdown Voltage
VGS=0V, ID=10uA
IGSS
Gate-Body Leakage
VDS=0V, VGS=±20V
IDSS
Zero Gate Voltage Drain Current
VDS=30V, VGS=0V
Limits
Min
Typ
Max
30
Unit
Volts
±1
uA
1
µA
On Characteristics
Symbol
Parameter
Test Condition
Vth(GS)
Gate-Threshold Voltage
VDS= 3V, ID=100uA
RDS(on)
Drain-Source On-Resistance
Limits
Min
Typ
Unit
1.5
Volts
VGS=4V, ID=10mA
8
Ω
VGS=2.5V, ID=1mA
13
Ω
gfs
Forward Trans Conductance
VDS=3V, ID=10mA
VSD
Drain-Source Diode Forward Voltage
IS=115mA, VGS=0V
0.8
Max
20
ms
1.2
V
Dynamic Characteristics
Symbol
Parameter
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Test Condition
Limits
Min
VDS = 5V
VGS = 0V
f = 1.0MHz
Typ
Max
Unit
13
pF
9
pF
4
pF
Switching Characteristics
Parameter
Symbol
tD(on)
tD(off)
Turn-on Time
Turn-off Time
Test Condition
VDD=5V, RL=500Ω,
ID=10mA, VGs=5V,
RG = 10Ω
Limits
Min
Typ
Max
Unit
15
nS
80
nS
DB Number: DB-248
October 2015, Revision A
Page 2
TAK CHEONG
®
SEM IC O N DU C TO R
SOT-523 Package Outline
DIM
Typical Soldering Pattern:
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
0.70
0.90
0.028
0.035
A1
0.00
0.10
0.000
0.004
A2
0.70
0.80
0.028
0.031
b1
0.15
0.25
0.006
0.010
b2
0.25
0.35
0.010
0.014
c
0.10
0.20
0.004
0.008
D
1.50
1.70
0.059
0.067
E
0.70
0.90
0.028
0.035
E1
1.45
1.75
0.057
0.069
e
e1
0.50 TYP.
0.90
L
0.020 TYP.
1.10
0.035
0.40 REF.
L1
0.10
θ
0
O
0.043
0.016 REF.
0.30
8
O
0.004
0
O
0.012
8
O
NOTES:
1. Above package outline conforms to JEITA EAIJ ED-7500A SC-75A.
2. Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions.
DB Number: DB-248
October 2015, Revision A
Page 3
TAK CHEONG
®
DISC LA I MER NOTIC E
NOTICE
The information presented in this document is for reference only. Tak Cheong reserves the right to make
changes without notice for the specification of the products displayed herein.
The product listed herein is designed to be used with ordinary electronic equipment or devices, and not
designed to be used with equipment or devices which require high level of reliability and the malfunction of with
would directly endanger human life (such as medical instruments, transportation equipment, aerospace
machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong Semiconductor
Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers resulting from such
improper use of sale.
This publication supersedes & replaces all information reviously supplied. For additional information, please visit
our website http://www.takcheong.com, or consult your nearest Tak Cheong’s sales office for further assistance.
Number: DB-100
April 14, 2008 / A
