WNM4002-3/TR
150mW SOT-523 SURFACE MOUNT
Plastic Package
N-Channel MOSFET
Absolute Maximum Ratings
Symbol
3
TA = 25°C unless otherwise noted
Parameter
VDS
Drain-Source Voltage
VGS
Continuous Gate-Source Voltage
Value
Units
30
V
±20V
V
ID
Continuous Drain Current
100
mA
PD
Power Dissipation
150
mW
RθJA
Thermal Resistance from Junction to Ambient
833
°C /W
TSTG
Storage Temperature Range
-55 to +150
°C
+150
°C
TJ
Operating Junction Temperature
2
1. Gate
2. Source
3. Drain
1
SOT-523
These ratings are limiting values above which the serviceability of the device may be impaired.
Specification Features:
Electrical Symbol:
Low On-resistance
Fast Switching Speed
KN
Low Voltage Drive Makes This Device
Ideal for Portable Equipment
Device Marking Code:
Easily Designed Drive Circuits
Easy to Parallel
RoHS Compliant & Green EMC
Matte Tin(Sn) Lead Finish
Weight: approx. 0.002g
1/3
WNM4002-3/TR
Electrical Characteristics (TA = 25°C unless otherwise noted)
Off Characteristics
Symbol
BVDSS
Parameter
Test Condition
Drain-Source Breakdown Voltage
VGS=0V, ID=10uA
IGSS
Gate-Body Leakage
VDS=0V, VGS=±20V
IDSS
Zero Gate Voltage Drain Current
VDS=30V, VGS=0V
Limits
Min
Typ
Max
30
Unit
Volts
±1
uA
1
µA
On Characteristics
Symbol
Parameter
Test Condition
Vth(GS)
Gate-Threshold Voltage
VDS= 3V, ID=100uA
RDS(on)
Drain-Source On-Resistance
Limits
Min
Typ
Unit
1.5
Volts
VGS=4V, ID=10mA
8
Ω
VGS=2.5V, ID=1mA
13
Ω
gfs
Forward Trans Conductance
VDS=3V, ID=10mA
VSD
Drain-Source Diode Forward Voltage
IS=115mA, VGS=0V
0.8
Max
20
ms
1.2
V
Dynamic Characteristics
Symbol
Parameter
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Test Condition
Limits
Min
VDS = 5V
VGS = 0V
f = 1.0MHz
Typ
Max
Unit
13
pF
9
pF
4
pF
Switching Characteristics
Symbol
tD(on)
tD(off)
Parameter
Turn-on Time
Turn-off Time
Test Condition
VDD=5V, RL=500Ω,
ID=10mA, VGs=5V,
RG = 10Ω
2/3
Limits
Min
Typ
Max
Unit
15
nS
80
nS
WNM4002-3/TR
SOT-523 Package Outline
DIM
MILLIMETERS
MIN
MAX
MIN
MAX
A
0.70
0.90
0.028
0.035
A1
0.00
0.10
0.000
0.004
A2
0.70
0.80
0.028
0.031
b1
0.15
0.25
0.006
0.010
b2
0.25
0.35
0.010
0.014
c
0.10
0.20
0.004
0.008
D
1.50
1.70
0.059
0.067
E
0.70
0.90
0.028
0.035
E1
1.45
1.75
0.057
0.069
e
Typical Soldering Pattern:
INCHES
e1
0.50 TYP.
0.90
L
0.020 TYP.
1.10
0.035
0.40 REF.
L1
0.10
θ
0
O
0.043
0.016 REF.
0.30
8
O
0.004
0
O
0.012
8
O
NOTES:
1. Above package outline conforms to JEITA EAIJ ED-7500A SC-75A.
2. Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions.
3/3
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