ZXMN10A07ZTA
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N-Channel 100 V (D-S) MOSFET
FEATURES
MOSFET PRODUCT SUMMARY
VDS (V)
ID (A)a
RDS(on) () Typ.
100
0.102 at VGS = 10 V
4.2
0.120 at VGS = 6 V
3.8
0.125 at VGS = 4.5 V
3.6
Qg (Typ.)
2.9 nC
APPLICATIONS
D
D
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
•
•
•
•
DC/DC Converters / Boost Converters
Load Switch
LED Backlighting in LCD TVs
Power Management for Mobile Computing
G
G
S
D
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Drain Current (TJ = 150 °C)
Limit
100
± 20
4.2
3.5
3.2b,c
2.8b,c
15
2.1
1b, c
3
0.45
2.5
1.6
1.25b, c
0.8b, c
- 55 to 150
ID
IDM
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
IAS
EAS
Maximum Power Dissipation
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
PD
TJ, Tstg
Operating Junction and Storage Temperature Range
Unit
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Foot (Drain)
5 s
Steady State
Symbol
RthJA
RthJF
Typical
75
40
Maximum
100
50
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 166 °C/W.
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MOSFET SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
100
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS/TJ
VDS Temperature Coefficient
V
59
mV/°C
VGS(th) Temperature Coefficient
VGS(th)/TJ
ID = 250 µA
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = 250 µA
3
V
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = 100 V, VGS = 0 V
-1
VDS = 100 V, VGS = 0 V, TJ = 55 °C
- 10
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
RDS(on)
gfs
VDS 5 V, VGS = 10 V
- 4.8
1.2
5
µA
A
VGS = 10 V, ID = 2 A
0.102
VGS = 6 V, ID = 1 A
0.120
VGS = 4.5 V, ID = 1 A
0.125
VDS = 20 V, ID = 2 A
5
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
196
VDS = 50 V, VGS = 0 V, f = 1 MHz
67
VDS = 50 V, VGS = 10 V, ID = 2.2 A
5.2
10.4
2.9
5.8
14
VDS = 50 V, VGS = 4.5 V, ID = 2.2 A
4.3
8.6
40
60
68
102
14
21
tf
20
30
td(on)
8
16
10
20
10
20
7
14
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
VDD = 50 V, RL = 27.7
ID = 1.8 A, VGEN = 4.5 V, Rg = 1
VDD = 50 V, RL = 27.7
ID = 1.8 A, VGEN = 10 V, Rg = 1
tf
Fall Time
1
nC
1.4
f = 1 MHz
td(on)
Turn-On Delay Time
pF
0.9
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
a
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
TC = 25 °C
- 2.1
-8
IS = 1.8 A
IF = 1.8 A, dI/dt = 100 A/µs,
TJ = 25 °C
- 0.8
- 1.2
A
V
23
35
ns
21
32
nC
17
6
ns
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
8
VGS = 10 V thru 5 V
VGS = 4.5 V
0.8
ID - Drain Current (A)
ID - Drain Current (A)
6
VGS = 4 V
4
0.6
TC = 25 °C
0.4
2
0.2
TC = 125 °C
VGS = 3 V
TC = - 55 °C
0
0
0
0.5
1
1.5
2
0
2
3
4
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
280
0.15
RDS(on) - On-Resistance (Ω)
1
VDS - Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.13
VGS = 4.5 V
VGS = 6 V
0.11
VGS = 10 V
0.09
Ciss
210
140
Coss
70
Crss
0.07
0
2
4
ID - Drain Current (A)
6
0
8
0
20
40
On-Resistance vs. Drain Current and Gate Voltage
2
RDS(on) - On-Resistance (Normalized)
VGS - Gate-to-Source Voltage (V)
8
6
VDS = 25 V
VDS = 80 V
4
2
0
3
4.5
Qg - Total Gate Charge (nC)
Gate Charge
100
VGS = 10 V, 2 A
ID = 2.2 A
1.5
80
Capacitance
10
0
60
VDS - Drain-to-Source Voltage (V)
6
1.7
1.4
VGS = 4.5 V, 1 A
1.1
VGS = 6 V, 1 A
0.8
0.5
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
100.0
0.35
ID = 2 A
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
0.28
10.0
TJ = 150 °C
TJ = 25°C
1.0
TJ = 125 °C
0.21
0.14
TJ = 25 °C
0.07
0.1
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
2
4
6
8
10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
10
2.8
8
Power (W)
VGS(th) (V)
2.5
ID = 250 μA
2.2
6
4
1.9
2
1.6
- 50
- 25
0
25
50
75
100
125
TA = 25 °C
0
0.01
150
0.1
1
10
100
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power
1000
100
Limited by RDS(on)*
ID - Drain Current (A)
10
100 μs
1
1 ms
10 ms
0.1
100 ms
10 s, 1s
DC
0.01
0.001
TA = 25 °C
Single Pulse
0.1
BVDSS Limited
1
10
100
1000
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
3.5
ID - Drain Current (A)
2.8
2.1
1.4
0.7
0
0
25
50
75
100
125
150
0
25
TC - Case Temperature (°C)
3
1.0
2.4
0.8
1.8
0.6
Power (W)
Power (W)
Current Derating*
1.2
0.6
0.4
0.2
0
0.0
0
25
50
75
100
125
150
50
75
100
125
TC - Case Temperature (°C)
TA - Ambient Temperature (°C)
Power, Junction-to-Foot
Power, Junction-to-Ambient
150
* The power dissipation PD is based on TJ(max.) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
0.02
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 166 °C/W
3. TJM - TA = PDMZthJA(t)
0.01
10 -4
4. Surface Mounted
Single Pulse
10 -3
10 -2
10 -1
1
100
10
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
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Package outline - SOT89
D
A
C
D1
E
H
E1
L
B
e
B1
DIM
e1
Millimeters
Inches
Min
Max
Min
Max
A
1.40
1.60
0.550
0.630
B
0.44
0.56
0.017
B1
0.36
0.48
C
0.35
D
D1
DIM
Millimeters
Inches
Min
Max
Min
Max
E
2.29
2.60
0.090
0.102
0.022
E1
2.13
2.29
0.084
0.090
0.014
0.019
e
1.50 BSC
0.059 BSC
0.44
0.014
0.017
e1
3.00 BSC
0.118 BSC
4.40
4.60
0.173
0.181
H
3.94
4.25
0.155
0.167
1.62
1.83
0.064
0.072
L
0.89
1.20
0.035
0.047
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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