SF5539H
η-BalanceTM PWM Power Switch Fixed 65KHz Fsw
FEATURES
GENERAL DESCRIPTION
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SF5539H is a high performance, high efficiency,
highly integrated current mode PWM power switch for
offline flyback converter applications.
In SF5539H, PWM switching frequency with shuffling
is fixed to 65KHz and is trimmed to tight range. When
the output power demands decrease, the IC
decreases switching frequency based on the
TM
control to boost power
proprietary η -Balance
conversion efficiency at the light load. When output
power falls below a given value, the IC enters into
burst mode and provides excellent efficiency without
audio noise.
The IC can achieve “Zero OCP/OPP Recovery Gap”
using SiFirst’s proprietary control algorithm.
Meanwhile, the OCP/OPP variation versus universal
line input is compensated.
The IC has built-in synchronized slope compensation
to prevent sub-harmonic oscillation at high PWM duty
output. The IC also has built-in soft start function to
soften the stress on the MOSFET during power on
period.
SF5539H integrates functions and protections of
Under Voltage Lockout (UVLO), VCC Over Voltage
Protection (OVP), Cycle-by-cycle Current Limiting
(OCP), Pins Floating Protection, Over Load
Protection (OLP), VCC Clamping, Leading Edge
Blanking (LEB), etc.
SF5539H is available in DIP8 and DIP7 packages.
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Less than 75mW Standby Power
Built-in 600V Power MOSFET
Programmable OLP Debounce Time
TM
Proprietary η-Balance
Control to Boost
Light Load Efficiency
Proprietary “Zero OCP/OPP Recovery Gap”
Control
Fixed 65KHz Switching Frequency
Built-in Soft Start Function
Very Low Startup Current
Frequency Reduction and Burst Mode Control
for Energy Saving
Current Mode Control
Built-in Frequency Shuffling
Built-in Synchronous Slope Compensation
Cycle-by-Cycle Current Limiting
Built-in Leading Edge Blanking (LEB)
Constant Power Limiting
Pins Floating Protection
Audio Noise Free Operation
VDD OVP & Clamp
VDD Under Voltage Lockout (UVLO)
APPLICATIONS
Offline AC/DC Flyback Converter for
◆ AC/DC Adaptors
◆ Open-frame SMPS
TYPICAL APPLICATION
AC IN
EMI
Filter
DC Out
SF5539H
1 CT
GND 7
2 VDD
©SiFirst Technology
TL431
3 FB
Drain 6
4 CS
Drain 5
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SiFirst_DS_5539H_V1.2
SF5539H
Pin Configuration
CT
1
VDD
2
FB
3
6
CS
4
5
7
GND
8
GND
7
GND
3
6
Drain
4
5
Drain
CT
1
VDD
2
Drain
FB
Drain
CS
DIP7
DIP8
Ordering Information
Part Number
Top Mark
SF5539HEP
SF5539HDP
SF5539HDP
SF5539HEP
Package
DIP7
DIP8
Tape & Reel
RoHs
Output Power Table(1)
230VAC ± 15%(2)
Adapter(3)
Open Frame(4)
Part Number
SF5539H
18W
26W
85-265VAC
Adapter(3)
Open Frame(4)
15W
18W
Note 1. The Max. output power is limited by junction temperature
Note 2. 230VAC or 100/115VAC with doublers
Note 3. Typical continuous power in a non-ventilated enclosed adapter with sufficient drain pattern as a heat
o
sink at 50 C ambient.
Note 4. Max. practical continuous power in a open-frame design with sufficient drain pattern as a heat sink at
o
50 C ambient.
Marking Information
SF 5539H EP
SF 5539H DP
Y WW
Y WW
YWW: Year&Week code
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SiFirst_DS_5539H_V1.2
SF5539H
Block Diagram
Drain
65KHz Oscillator with
Frequency Shuffling
S
Power
MOSFET
Totem Pole
Gate Driver
Q
R
Zero OCP Recovery
Gap Control
GND
Frequency
Reduction Control
Trimmed Voltage &
Current Reference
η-Balance TM
Control
CS floating
protection
Internal
blocks
LEB
CS
VDD
PWM
&
Logic
POR
OCP
Soft start
4.5V
VDD OVP
Slope
compensation
9V/15.5V
FB
Burst Mode
Control
35V
OLP
27V
14uA
3.7V
CT
55ms Delay
3V
Pin Description
Pin Num
I/O
Description
1
Pin Name
CT
I
2
3
VDD
FB
P
I
4
5-6
7
CS
Drain
GND
I
P
P
Pin for program OLP debounce time. If this pin is floating, the OLP time is
55ms. If an external capacitor is connected between CT and GND, the
OLP debounce time can be programmable.
IC power supply pin.
Voltage feedback pin. The loop regulation is achieved by connecting a
photo-coupler to this pin. PWM duty cycle is determined by this pin voltage
and the current sense signal at Pin 4.
Current sense input pin.
High voltage power MOSFET drain connection.
Ground. For SF5539HDP, pin 7 and pin 8 are Ground.
Absolute Maximum Ratings (Note 5)
Parameter
VDD DC Supply Voltage
VCC DC Clamp Current
Drain pin
©SiFirst Technology
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Value
Unit
35
10
-0.3 to 600
V
mA
V
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SiFirst_DS_5539H_V1.2
SF5539H
FB, CS voltage range
Package Thermal Resistance (DIP-8)
Package Thermal Resistance (DIP-7)
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10sec.)
ESD Capability, HBM (Human Body Model)
ESD Capability, MM (Machine Model)
-0.3 to 7
84
88
150
-40 to 85
-65 to 150
260
3
250
V
C/W
o
C/W
o
C
o
C
o
C
o
C
kV
V
o
Recommended Operation Conditions (Note 6)
Parameter
Value
Supply Voltage, VDD
Operating Ambient Temperature
Unit
11 to 25
-40 to 85
V
C
o
ELECTRICAL CHARACTERISTICS
O
(TA = 25 C, VDD=18V, if not otherwise noted)
Symbol
Parameter
Supply Voltage Section (VDD Pin)
UVLO(ON)
UVLO(OFF)
I_Startup
I_VDD_Op
VDD_OVP
VDD_Clamp
T_Softstart
VDD Under Voltage
Lockout Exit (Startup)
VDD Under Voltage
Lockout Enter
VDD Start up Current
Operation Current
VDD Over Voltage
Protection trigger
VDD Zener Clamp
Voltage
Soft Start Time
Test Conditions
Min
Typ
Max
Unit
14.5
15.5
16.5
V
8
9
9.8
V
3
15
uA
2.0
27
3.5
29
mA
V
VDD =UVLO(ON)-1V,
Measure current into VDD
VFB=3V
25
I(VDD ) = 10mA
35.5
V
4
mSec
4.5
V
Feedback Input Section(FB Pin)
VFB_Open
FB Open Voltage
IFB_Short
FB short circuit
current
PWM Input Gain
FB under voltage gate
clock is off.
Power Limiting FB
Threshold Voltage
Minimum Power
limiting Debounce
Time
Input Impedance
AVCS
VFB_min_duty
VTH_PL
TD_PL_min
ZFB_IN
Short FB pin to GND,
measure current
ΔVFB /ΔVcs
0.22
CT is floating
0.33
0.45
mA
1.6
1.0
V/V
V
3.7
V
43
mSec
14
Kohm
Current Sense Input Section (CS Pin)
Vth_OC_min
T_blanking
TD_OC
Internal current
limiting threshold
CS Input Leading
Edge Blanking Time
Over Current
Detection and Control
Delay
Zero duty cycle
0.70
0.75
0.80
V
250
nSec
90
nSec
Oscillator Section
FOSC
∆F(shuffle)/Fosc
©SiFirst Technology
Normal Oscillation
Frequency
Frequency shuffling
range
60
Note 8
-4
-4-
65
70
KHZ
4
%
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SiFirst_DS_5539H_V1.2
SF5539H
∆f_Temp
∆f_VDD
Duty_max
F_BM
Frequency
Temperature Stability
Frequency Voltage
Stability
Maximum Duty cycle
Burst Mode Base
Frequency
o
o
-20 C to 100 C (Note 7)
5
%
VDD = 12-25V,
5
%
75
80
22
85
%
KHZ
10
14
18
uA
OLP Debounce Program Section (CT Pin)
I_CT
VTH_CT
Output Current of CT
Pin
Comparator threshold
for OLP debounce
time
3
V
Power MOSFET Section(8)
BVdss
Power MOSFET
Drain Source
Breakdown Voltage
Rdson
Static Drain-Source On
Resistance
Idss
Zero Gate Voltage
Drain Current
Td(on)
Td(off)
Turn-on delay time
600
I(Drain)=1A
V
3.8
9
24
Turn-off delay time
4.7
Ω
1
uA
ns
ns
Note 5. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other
conditions beyond those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 6. The device is not guaranteed to function outside its operating conditions.
Note 7. Guaranteed by design.
Note 8. These parameters, although guaranteed, are not 100% tested in production
©SiFirst Technology
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SiFirst_DS_5539H_V1.2
SF5539H
CHARACTERIZATION PLOTS
Vth_OC vs Duty
Vth_OC (V)
1.2
1.1
1
0.9
0.8
0.7
0
10
20
30
40
50
60
70
80
Duty (%)
©SiFirst Technology
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SiFirst_DS_5539H_V1.2
SF5539H
OPERATION DESCRIPTION
◆ “Zero OCP/OPP Recovery Gap” Control
SF5539H is a high performance, high efficiency,
highly integrated current mode PWM power switch
for offline flyback converter applications. The builtin advanced energy saving with high level
protection features improves the SMPS reliability
and performance without increasing the system
cost.
The definition of OCP or OPP recovery gap of a
power adaptor is illustrated in Fig.2.
At T0,
assuming an adaptor is at full loading mode. If the
loading keeps increasing, then the system will
output maximum power P_opp, which will trigger
OPP protection at the same time. After the OPP
protection is triggered, usually the system will enter
into the auto-recovery mode, in burst manner. If the
system
power
demand
decreases
below
P_recovery, then system will enter into normal
mode again, as shown in Fig.2. The difference
between P_opp and P_recovery is defined as “OPP
Recovery Gap”, which can cause system startup
failure especially in 90VAC full load startup.
◆ UVLO and Startup Operation
Fig.1 shows a typical startup circuit. Before the IC
begins switching operation, it consumes only
startup current (typically 3uA) and current supplied
through the startup resistor Rst charges the VDD
hold-up capacitor Cdd. When VDD reaches UVLO
turn-on voltage of 15.5V(typical), SF5539H begins
switching and the IC current consumed increased
to 2mA (typical). The hold-up capacitor Cdd
continues to supply VDD before the energy can be
delivered from auxiliary winding Na. During this
process, VDD must not drop below UVLO turn-off
voltage (typical 9V). The selection of Rst and Cdd
should be a trade off between the power loss and
startup time.
System Output
Power
OPP Trigger Point
P_opp
OPP Release Point
P_recovery
P_full_load
System is in OPP
burst mode
OPP Recovery Gap
AC IN
Time
Np
Cbulk
T0
Rst
SF5539H can achieve “Zero OCP/OPP Recovery
Gap” in the whole universal AC input range using
SiFirst’s proprietary control algorithm.
Na
SF5539H
GND 8
2 VDD
GND 7
3 FB
Drain 6
4 CS
Drain 5
◆ Oscillator with Frequency Shuffling
PWM switching frequency in SF5539H is fixed to
65KHz and is trimmed to tight range. To improve
system EMI performance, SF5539H operates the
system with ±4% frequency shuffling around setting
frequency.
◆ Synchronous Slope Compensation
InSF5539H, the synchronous slope compensation
circuit is integrated by adding voltage ramp onto the
current sense input voltage for PWM generation.
This greatly improves the close loop stability at
CCM and prevents the sub-harmonic oscillation
and thus reduces the output ripple voltage.
Fig.1
◆ Low Operating Current
The operating current in SF5539H is as small as
2mA (typical). The small operating current results in
higher efficiency and reduces the VDD hold-up
capacitance requirement.
◆ Programmable OLP Debounce Time
Connecting a capacitor CCT from CT pin to GND
according to the equation below to program the
OLP debounce time. In OLP debounce time, an
internal current (14uA, typical) charges CCT , when
CT pin voltage reaches 3V, an internal 43ms
debounce is triggered. When internal 43ms
debounce time is over, the OLP protection is
triggered and the system will enter into auto
recovery protection mode.
◆ Soft Start
SF5539H features an internal 4ms (typical) soft
start that slowly increases the threshold of cycle-bycycle current limiting comparator during startup
sequence. It helps to prevent transformer saturation
and reduce the stress on the secondary diode
during startup. Every restart attempt is followed by
a soft start activation.
©SiFirst Technology
T2
Fig.2
Cdd
1 CT
T1
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SiFirst_DS_5539H_V1.2
SF5539H
TOLP_debounce =
3V * C CT
+ 43ms
14uA
Switching Frequency
P1
65kHz
If CT pin is floating, the OLP debounce time is
43ms. Otherwise, the OLP debounce time can be
programmed by CT capacitor.
P2
P3
◆ Leading Edge Blanking (LEB)
Each time the power MOSFET is switched on, a
turn-on spike occurs across the sensing resistor.
The spike is caused by primary side capacitance
and secondary side rectifier reverse recovery. To
avoid premature termination of the switching pulse,
an internal leading edge blanking circuit is built in.
During this blanking period (250ns, typical), the
PWM comparator is disabled and cannot switch off
the gate driver. Thus, external RC filter with a small
time constant is enough for current sensing.
η-Balance TM
Control
P4
22kHz
VFB
0
Burst
mode
Efficiency
Normal
mode
Frequency
Reduction mode
Using η-Balance TM Technique
◆ Proprietary η-BalanceTM Control
The efficiency requirement of power conversion is
becoming tighter than before. These new energy
standards focus on the average efficiency of the
whole loading range. Therefore, the light load
efficiency is becoming more and more important.
TM
In SF5539H, a proprietary η-Balance control is
integrated to boost the light load efficiency. As
shown in Fig.3, when the loading becomes light,
the IC will reduce the PWM switching frequency
according to an optimized frequency reduction
curve. The specific frequency reduction curve and
the power at a frequency are determined by the
TM
output ofη-Balance control. For example, P1 is
at full load, P2 is at 75% full load, P3 and P4 are
50% and 25% full load respectively. The η BalanceTM control can provide higher average
efficiency than conventional frequency reduction
technique, as illustrated in Fig.3
Using Conventional Technique
Load
Fig.3
◆ Burst Mode Control
When the loading is very small, the system enters
into burst mode. When VFB drops below Vskip,
SF5539H will stop switching and output voltage
starts to drop, which causes the VFB to rise. Once
VFB rises above Vskip, switching resumes. Burst
mode control alternately enables and disables
switching, thereby reducing switching loss in
standby mode.
Vout
VFB
Gate of Power
MOSFET
ON
OFF
Fig.4
©SiFirst Technology
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SiFirst_DS_5539H_V1.2
SF5539H
◆ Auto Recovery Mode Protection
detected. If this fault is present for more than
TOLP_debounce , the protection will be triggered, the IC
As shown in Fig.5, once a fault condition is
detected, switching will stop. This will cause VDD to
fall because no power is delivered form the
auxiliary winding. When VDD falls to UVLO(off)
(typical 9V), the protection is reset and the
operating current reduces to the startup current,
which causes VDD to rise, as shown in Fig.4.
However, if the fault still exists, the system will
experience the above mentioned process. If the
fault has gone, the system resumes normal
operation. In this manner, the auto restart can
alternatively enable and disable the switching until
the fault condition is disappeared.
Protection Tiggers
will experience an auto-recovery mode protection
as mentioned above, as shown in Fig.6. The
TOLP_debounce debounce time is to prevent the false
trigger from the power-on and turn-off transient.
4.5V
PWM
FB
3
Fault Removed
Gate of Power
MOSFET
OLP/OCP/
OPP
3V * C CT
+ 43ms
14uA
3.7V
SF5539H
VDD
VFB
4.5V
15.5V
VTH_PL=3.7V
9V
OLP/OCP/OPP
Debounce time
Fig.5
Fig.6
◆ VDD OVP(Over Voltage Protection)
VDD OVP (Over Voltage Protection) is
implemented in SF5539H and it is a protection of
auto-recovery mode.
◆ Soft Gate Drive
The driving stage of SF5539H is a soft totem-pole
gate driver to minimize EMI. Cross conduction has
been avoided to minimize heat dissipation, increase
efficiency, and enhance reliability.
◆ Over Load Protection (OLP) / Over
Current Protection (OCP) / Over Power
Protection
(OPP)
/
Open
Loop
Protection (OLP)
When OLP/OCP/OPP/Open Loop occurs, a fault is
©SiFirst Technology
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SiFirst_DS_5539H_V1.2
SF5539H
PACKAGE MECHANICAL DATA
Symbol
A
A1
A2
B
B1
C
D
E
E1
e
L
E2
©SiFirst Technology
Dimensions In Millimeters
Min
Max
3.710
5.334
0.381
3.175
3.600
0.350
0.650
1.524 (BSC)
0.200
0.360
9.000
10.160
6.200
6.600
7.320
7.920
2.540 (BSC)
2.921
3.810
8.200
9.525
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Dimensions In Inches
Min
Max
0.146
0.210
0.015
0.125
0.142
0.014
0.026
0.06 (BSC)
0.008
0.014
0.354
0.400
0.244
0.260
0.288
0.312
0.1 (BSC)
0.115
0.150
0.323
0.375
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SiFirst_DS_5539H_V1.2
SF5539H
©SiFirst Technology
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SiFirst_DS_5539H_V1.2
SF5539H
IMPORTANT NOTICE
SiFirst Technology Nanhai, Ltd (SiFirst) reserves the right to make corrections, modifications, enhancements,
improvements and other changes to its products and services at any time and to discontinue any product or
service without notice. Customers should obtain the latest relevant information before placing orders and should
verify that such information is current and complete.
SiFirst warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with SiFirst’s standard warranty. Testing and other quality control techniques are used to the extent
SiFirst deems necessary to support this warranty. Except where mandated by government requirements,
testing of all parameters of each product is not necessarily performed.
SiFirst assumes no liability for application assistance or customer product design. Customers are responsible
for their products and applications using SiFirst’s components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
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for any damages or claims resulting from the use of its products in military applications.
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life. SiFirst will not be held liable for any damages or claims resulting from the use of its products in medical
applications.
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SiFirst_DS_5539H_V1.2