SK6252B
17V 2A 500KHz ECOT Force-CCM Sync Step-Down Regulator
General Description
Features
The SK6252B is a high frequency, synchronous, rectified,
step-down, switch-mode converter with internal power
MOSFETs. It offers a very compact solution to provide 2A
continuous output current over wide input supply range
with excellent load and line regulation. ECOT control
operation provides very fast transient response and easy
loop design as well as very tight output regulation.
The SK6252B requires a minimal number of external
components, and available in a space saving SOT23-6
package.
Applications
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Digital Set-top Box (STB)
Tablet Personal Computer (Pad)
Flat-Panel Television and Monitor
Wi-Fi Router / AP
Digital Video Recorder (DVR)
Portable Media Player (PMP)
Cable Modem / XDSL
General Purposes
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Wide 4.5V to 17V Operating Input Range
2A Continuous Output Current
500KHz Switching Frequency
ECOT Mode Control with Fast Transient Response
Built-in Over Current Limit
Built-in Over Voltage Protection
Continuous Conduction Mode (CCM)
Internal Soft-Start
110mΩ/70mΩ Low RDS(ON) Internal Power
MOSFETs
Output Adjustable from 0.765V
No Schottky Diode Required
Short Protection with Hiccup-Mode
Integrated internal compensation
Thermal Shutdown
Available in SOT23-6 Package
-40°C to +85°C Temperature Range
Typical Application Circuit
C1
BS
VIN
IN
SW
L1
VOUT
R1
CIN
ON/
OFF
EN
CFF
COUT
FB
GND
R2
Basic Application Circuit
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Pin Description
Pin Configuration
TOP VIEW
GND
1
6
BS
SW
2
5
EN
IN
3
4
FB
SOT23-6
Pin Description
Pin
Name
Function
1
GND
2
SW
Switching Pin
3
IN
Power Supply Pin
4
FB
Feedback input. Connect FB to the center of the external resistor divider.
5
EN
Drive this pin to a logic-high to enable the IC. Drive to a logic-low to disable the
IC and enter micro-power shutdown mode.
6
BS
Supply input for the high-side MOSFET gate drive circuit. Connect 0.1 µF (typical)
capacitor between BS and SW pins.
Ground Pin
Ordering Information (1)
Part Number
Package
Mark
Quantity/ Reel
SK6252B
SOT23-6
CSXXX
3000
SK6252B devices are Pb-free and RoHS compliant.
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Specifications
Absolute Maximum Ratings (1) (2)
Item
Min
Max
Unit
VIN voltage
-0.3
18
V
EN voltage
-0.3
18
V
SW voltage
-3
19
V
SW voltage ( L)
VFB=90%
Minimum Off-Time
EN Rising Threshold
1.4
V
EN Falling Threshold
Wake up VIN Voltage
Under-Voltage Lockout Threshold
Shutdown VIN Voltage
4.3
V
4.5
V
3.8
V
500
mV
Soft Start
1.5
mS
Thermal Shutdown
160
℃
Thermal Hysteresis
30
℃
Hysteresis VIN voltage
3.6
0.8
Note (1): MOSFET on-resistance specifications are guaranteed by correlation to wafer level measurements.
Note (2): Thermal shutdown specifications are guaranteed by correlation to the design and characteristics analysis.
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Typical Performance Characteristics (1) (2)
Note (1): Performance waveforms are tested on the evaluation board.
Note (2): VIN =12V, VOUT=3.3V, TA = +25ºC, unless otherwise noted.
Efficiency vs Load Current
Load Regulation
Line Regulation
VOUT=5V, 3.3V, 1.2V, 1.1V, 1.0V
VOUT=5V, 3.3V, 1.2V, 1.1V, 1.0V
VOUT=3.3V
```
Output Ripple Voltage
Output Ripple Voltage
Output Ripple Voltage
VIN=12V, VOUT=3.3V, IOUT=0A
VIN=12V, VOUT=3.3V, IOUT=1A
VIN=12V, VOUT=3.3V, IOUT=2A
Loop Response
Output Short
Short Circuit Entry
VIN=12V, VOUT=3.3V, IOUT=1A-2A
VIN=12V, VOUT=3.3V
VIN=12V, VOUT=3.3V
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Short Circuit Recovery
Enable Startup at No Load
Enable Shutdown at No Load
VIN=12V, VOUT=3.3V
VIN=12V, VOUT=3.3V, IOUT=0A
VIN=12V, VOUT=3.3V, IOUT=0A
Enable Startup at Full Load
Enable Shutdown at Full Load
Power Up at No Load
VIN=12V, VOUT=3.3V, IOUT=2A
VIN=12V, VOUT=3.3V, IOUT=2A
VIN=12V, VOUT=3.3V, IOUT=0A
Power Up at Full Load
VIN=12V, VOUT=3.3V, IOUT=2A
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Functional Block Diagram
IN
Internal
Regulator
EN
Bias&Voltage
Reference
VCC
BS
UVLO
HICCUP
VSHORT
Reference
FB
On-Time
Control
OC
PWM
Reference
SW
Driver
Ripple Gen
OCL
Reference
SW
GND
Block Diagram
Functions Description
Internal Regulator
The SK6252B is an ECOT mode step down DC/DC converter which provides excellent transient response with no
extra external compensation components. This device contains an internal, low resistance, high voltage
power MOSFET, and operates at a high 500KHz frequency to ensure a compact, high efficiency design with
excellent AC and DC performance.
Error Amplifier
The error amplifier compares the FB pin voltage with the internal reference (VFB) and outputs a current
proportional to the difference. This output current is then used to charge or discharge the internal compensation
network, which is used to control the power MOSFET current. The optimized internal compensation network
minimizes the external component counts and simplifies the control loop design.
Under-Voltage Lockout (UVLO)
Under-voltage lockout (UVLO) protects the chip from operating at insufficient supply voltage. UVLO protection
monitors the internal regulator voltage. When the voltage is lower than UVLO threshold voltage, the device shuts
off. When the voltage is higher than UVLO threshold voltage, the device is enabled again.
Thermal Shutdown
Thermal shutdown prevents the chip from operating at exceedingly high temperature. When the silicon
die temperature exceeds 160°C, it shuts down the whole chip. When the temperature falls below its lower
threshold (Typ. 130°C) the chip is enabled again.
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Internal Soft-Start
The soft-start is implemented to prevent the converter output voltage from overshooting during startup. When
the chip starts, the internal circuitry generates a soft-start voltage (SS) ramping up from 0V to 0.765V. When it is
lower than the internal reference (REF), SS overrides REF so that the error amplifier uses SS as the reference.
When SS is higher than REF, REF regains control. The SS time is internally set to 1.5ms.
Over Current Protection and Hiccup
The SK6252B employs a cycle-by-cycle over current limit; when the inductor current valley value exceeds the set
current limit threshold, meanwhile, output voltage starts to drop until FB is below the Under-Voltage (UV)
threshold, a UV event is triggered, the SK6252B enters hiccup mode to periodically restart. This protection mode
is especially useful when the output is dead-short to ground. The average short circuit current is greatly reduced
to alleviate the thermal issue and to protect the regulator. The SK6252B exits the hiccup mode once the
over current condition is removed.
Startup and Shutdown
If both VIN and EN are higher than the appropriate thresholds, the chip starts. The reference block starts
first, generates stable reference voltage and currents, and then the internal regulator is enabled. The regulator
provides stable supply for the remaining circuitries. Three events can shut down the chip: EN low, VIN low
and thermal shutdown. In the shutdown procedure, the signaling path is first blocked to avoid any fault
triggering. The comp voltage and the internal supply rail are then pulled down. The floating driver is not
subject to this shutdown command.
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Applications Information
Setting the Output Voltage
SK6252B requires an input capacitor, an output capacitor and an inductor. These components are CRYTICAL to
the performance of the device. SK6252B is internally compensated and does not require any
external components to achieve a stable operation. The output voltage can be programmed by resistor divider.
𝑉𝑂𝑈𝑇 = 𝑉𝐹𝐵 ×
𝑅1 + 𝑅2
𝑅2
VOUT(V)
R1(KΩ)
R2(KΩ)
L1(μH)
C1(nF)
CIN(μF)
COUT(μF)
CFF (pF) Opt.
1.0
3.07
10
2.2
100
22
22×2
CFF Chapter
1.05
3.73
10
2.2
100
22
22×2
CFF Chapter
1.2
5.69
10
2.2
100
22
22×2
CFF Chapter
1.5
9.61
10
2.2
100
22
22×2
CFF Chapter
1.8
13.53
10
3.3
100
22
22×2
CFF Chapter
2.5
22.68
10
4.7
100
22
22×2
CFF Chapter
3.3
33.14
10
4.7
100
22
22×2
CFF Chapter
5.0
55.36
10
4.7
100
22
22×2
CFF Chapter
All the external components are the suggested values, the final values are based on the application testing results.
Selecting the Inductor
The recommended inductor values are shown in the table above. It is important to guarantee the inductor core
does not saturate during any foreseeable situation. The inductor should be rated to handle the maximum
inductor peak current: Care should be taken when reviewing the different saturation current ratings that are
specified by different manufacturers. Saturation current ratings are typically specified at 25°C, so ratings
at maximum ambient temperature of the application should be requested from the manufacturer. The
inductor value can be calculated with:
𝐿=
𝑉𝑂𝑈𝑇 × (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 )
𝑉𝐼𝑁 × ∆𝐼𝐿 × 𝐹𝑂𝑆𝐶
Where ΔIL is the inductor ripple current. Choose inductor ripple current to be approximately 30% to 50% of the
maximum load current. The maximum inductor peak current can be estimated as:
𝐼𝐿(𝑀𝐴𝑋) = 𝐼𝐿𝑂𝐴𝐷 +
∆𝐼𝐿
2
Under light load conditions below 100mA, larger inductance is recommended for improved efficiency.
Larger inductances lead to smaller ripple current and voltage, but they also have larger physical
dimensions, lower saturation currents and higher linear impedance. Therefore, the choice of inductance
should be compromised according to the specific application.
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Selecting the Input Capacitor
The input current to the step-down converter is discontinuous and therefore requires a capacitor to supply the
AC current while maintaining the DC input voltage. For a better performance, use ceramic capacitors placed as
close to VIN as possible. A 0.1µF input capacitor to filter out high frequency interference is recommended.
Capacitors with X5R and X7R ceramic dielectrics are recommended because they are stable with temperature
fluctuations.
The capacitors must also have a ripple current rating greater than the maximum input ripple current of the
converter. The input ripple current can be estimated with Equation:
𝐼𝐶𝐼𝑁 = 𝐼𝑂𝑈𝑇 × √
𝑉𝑂𝑈𝑇
𝑉𝑂𝑈𝑇
× (1 −
)
𝑉𝐼𝑁
𝑉𝐼𝑁
From the above equation, it can be concluded that the input ripple current reaches its maximum at VIN=2VOUT where
𝐼
I𝐶𝐼𝑁 = 𝑂𝑈𝑇. For simplification, choose an input capacitor with an RMS current rating greater than half of the
2
maximum load current.
The input capacitance value determines the input voltage ripple of the converter. If there is an input voltage
ripple requirement in the system, choose the input capacitor that meets the specification. The input voltage
ripple can be estimate with Equation:
∆𝑉𝐼𝑁 =
𝐼𝑂𝑈𝑇
𝑉𝑂𝑈𝑇
𝑉𝑂𝑈𝑇
×
× (1 −
)
𝐹𝑂𝑆𝐶 × 𝐶𝐼𝑁
𝑉𝐼𝑁
𝑉𝐼𝑁
Similarly, when VIN=2VOUT, input voltage ripple reaches its maximum of ∆𝑉𝐼𝑁 =
1
4
×
𝐼𝑂𝑈𝑇
𝐹𝑂𝑆𝐶 ×𝐶𝐼𝑁
.
Selecting the Output Capacitor
An output capacitor is required to maintain the DC output voltage. The output voltage ripple can be estimated
with Equation:
∆𝑉𝑂𝑈𝑇 =
𝑉𝑂𝑈𝑇
𝑉𝑂𝑈𝑇
1
× (1 −
) × (𝑅𝐸𝑆𝑅 +
)
𝐹𝑂𝑆𝐶 × 𝐿
𝑉𝐼𝑁
8 × 𝐹𝑂𝑆𝐶 × 𝐶𝑂𝑈𝑇
There are some differences between different types of capacitors. In the case of ceramic capacitors, the
impedance at the switching frequency is dominated by the capacitance. The output voltage ripple is mainly
caused by the capacitance. For simplification, the output voltage ripple can be estimated with Equation:
∆𝑉𝑂𝑈𝑇 =
𝑉𝑂𝑈𝑇
2
8 × 𝐹𝑂𝑆𝐶 × 𝐿 × 𝐶𝑂𝑈𝑇
× (1 −
𝑉𝑂𝑈𝑇
)
𝑉𝐼𝑁
A larger output capacitor can achieve a better load transient response, but the maximum output capacitor
limitation should also be considered in the design application. If the output capacitor value is too high, the
output voltage will not be able to reach the design value during the soft-start time and will fail to regulate.
The maximum output capacitor value (COUT_MAX) can be limited approximately with Equation:
𝐶𝑂𝑈𝑇_𝑀𝐴𝑋 = (𝐼𝐿𝐼𝑀_𝐴𝑉𝐺 − 𝐼𝑂𝑈𝑇 ) × 𝑇𝑆𝑆/𝑉𝑂𝑈𝑇
Where LLIM_AVG is the average start-up current during the soft-start period, and TSS is the soft- start time.
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On the other hand, special attention should be paid when selecting these components. The DC bias of
these capacitors can result in a capacitance value that falls below the minimum value given in the recommended
capacitor specifications table.
The ceramic capacitor’s actual capacitance can vary with temperature. The capacitor type X7R, which operates
over a temperature range of −55°C to +125°C, will only vary the capacitance to within ±15%. The capacitor type
X5R has a similar tolerance over a reduced temperature range of −55°C to +85°C. Many large value ceramic
capacitors, larger than 1uF are manufactured with Z5U or Y5V temperature characteristics. Their capacitance can
drop by more than 50% as the temperature varies from 25°C to 85°C. Therefore, X5R or X7R is recommended
over Z5U and Y5V in applications where the ambient temperature will change significantly above or below 25°C.
Feed-Forward Capacitor (CFF)
SK6252B has internal loop compensation, so adding CFF is optional. For specific applications, if necessary, consider
whether to add feed-forward capacitors according to the situation.
The use of a feed-forward capacitor (CFF) in the feedback network is to improve the transient response or
higher phase margin. For optimizing the feed-forward capacitor, knowing the cross frequency is the first thing.
The cross frequency (or the converter bandwidth) can be determined by using a network analyzer. When
getting the cross frequency with no feed-forward capacitor identified, the value of feed-forward capacitor (CFF)
can be calculated with the following equation:
𝐶𝐹𝐹 =
1
1
1
1
×√ ×( + )
2𝜋 × 𝐹𝐶𝑅𝑂𝑆𝑆
𝑅1
𝑅1 𝑅2
Where FCROSS is the cross frequency.
To reduce transient ripple, the feed-forward capacitor value can be increased to push the cross frequency to
higher region. Although this can improve transient response, it also decreases phase margin and cause more
ringing. In the other hand, if more phase margin is desired, the feed-forward capacitor value can be decreased
to push the cross frequency to lower region.
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PC Board Layout Consideration
PCB layout is very important to achieve stable operation and better performance. It is highly recommended
to duplicate EVB layout for optimum performance. If change is necessary, please follow these guidelines
for reference.
1. Keep the path of switching current short and minimize the loop area formed by Input capacitor, high-side
MOSFET and low-side MOSFET.
2. Bypass ceramic capacitors are suggested to be put close to the VIN Pin.
3. Ensure all feedback connections are short and direct. Place the feedback resistors and compensation
components as close to the chip as possible.
4. VOUT, SW away from sensitive analog areas such as FB.
5. Connect IN, SW, and especially GND respectively to a large copper area to cool the chip to improve thermal
performance and long-term reliability.
Top Layer
Bottom Layer
Sample Board Layout
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Package Description: SOT23-6
Unit: mm
Symbol
Dimensions In Millimeters
Min
Typ
Max
A
2.80
2.90
3.00
B
2.60
2.80
B1
1.50
C
Symbol
Dimensions In Millimeters
Min
Typ
Max
L3
1.800
1.900
2.000
3.00
L4
0.077
0.127
0.177
1.60
1.70
L5
-
0.250
-
-
-
1.05
L6
-
0.600
-
C1
0.60
0.80
1.00
θ
0°
C2
0.35
0.40
0.45
Θ1
10°
12°
14°
C4
0.223
0.273
0.323
Θ2
10°
12°
14°
K
0.000
0.075
0.150
R
-
0.100
-
L
0.325
0.400
0.475
R1
-
0.100
-
L1
0.325
0.450
0.550
R2
-
0.100
-
L2
0.850
0.950
1.050
0°
Note: 1) All dimensions are in millimeters.
2) Package length does not include mold flash, protrusion or gate burr.
3) Package width does not include inter lead flash or protrusion.
4) Lead popularity (bottom of leads after forming) shall be 0.10 millimeters max.
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