MM1Z30

山东晶导微电子有限公司 MM1Z2V0 THRU MM1Z75 Jingdao Microelectronics Silicon Planar Zener Diodes PINNING PIN FEATURES • Total power dissipation: Max. 500mW. • Wide zener reverse voltage range 2.0V to 75V. • Small plastic package suitable for surface mounted design. • Tolerance approximately±5% DESCRIPTION 1 Cathode 2 Anode 2 1 MECHANICAL DATA ▪Case: SOD-123 ▪Terminals: Solderable per MIL-STD-750, Method 2026 Simplified outline SOD-123 and symbol Absolute Maximum Ratings And Characteristics （Ta = 25 °C） Symbol Value Unit Power Dissipation P tot 500 mW Forward Voltage at I F = 10 mA VF 0.9 V RθJA 340 °C/W T j , T stg -55 ~ +150 °C Parameter Typical thermal resistance juncting to ambient Operating and Storage Temperature Range (1) Fig.1 Maximum Continuous Power Derating 0.6 Power Dissipation ( W ) 0.5 0.4 0.3 0.2 0.1 0.0 25 50 75 100 125 150 T c ,Case Temperature (°C) 2016.11 175 Transient Thermal Impedance（ °C /W） (1) Thermal resistance from junction to ambient at P.C.B. mounted with 2 .0" X 2.0" (54 X 5 cm) copper areas pads. Fig.2 Typical Transient Thermal Impedance 2000 1000 100 10 0.01 0.1 1 10 100 t, Pulse Duration（sec） SOD123-W-MM1Z2V0~MM1Z75-500mW Page 1 of 3 山东晶导微电子有限公司 MM1Z2V0 THRU MM1Z75 Jingdao Microelectronics Characteristics at Ta = 25°C Dynamic Impedance Zener Voltage Range （1） Type Marking V ZT（at I ZT） Min（V） Reverse Current I ZT Z ZT（at I ZT） IR at V R Max（μA） （V） Nom（V） Max（V） (mA) Max (Ω) MM1Z2V0 4A 1.8 2.0 2.15 5 100 120 0.5 MM1Z2V2 4B 2.08 2.2 2.33 5 100 120 0.7 MM1Z2V4 4C 2.28 2.4 2.56 5 100 120 1 MM1Z2V7 4D 2.5 2.7 2.9 5 110 120 1 MM1Z3V0 4E 2.8 3.0 3.2 5 120 50 1 MM1Z3V3 4F 3.1 3.3 3.5 5 130 20 1 MM1Z3V6 4H 3.4 3.6 3.8 5 130 10 1 MM1Z3V9 4J 3.7 3.9 4.1 5 130 5 1 MM1Z4V3 4K 4 4.3 4.6 5 130 5 1 4.7 5 MM1Z4V7 4M 4.4 5 130 2 1 MM1Z5V1 4N 4.8 5.1 5.4 5 130 2 1.5 MM1Z5V6 4P 5.2 5.6 6 5 80 1 2.5 MM1Z6V2 4R 5.8 6.2 6.6 5 50 1 3 MM1Z6V8 4X 6.4 6.8 7.2 5 30 0.5 3.5 MM1Z7V5 4Y 7 7.5 7.9 5 30 0.5 4 MM1Z8V2 4Z 7.7 8.2 8.7 5 30 0.5 5 MM1Z9V1 5A 8.5 9.1 9.6 5 30 0.5 6 MM1Z10 5B 9.4 10 10.6 5 30 0.1 7 MM1Z11 5C 10.4 11 11.6 5 30 0.1 8 MM1Z12 5D 11.4 12 12.7 5 35 0.1 9 MM1Z13 5E 12.4 13 14.1 5 35 0.1 10 MM1Z15 5F 13.8 15 15.6 5 40 0.1 11 MM1Z16 5H 15.3 16 17.1 5 40 0.1 12 MM1Z18 5J 16.8 18 19.1 5 45 0.1 13 MM1Z20 5K 18.8 20 21.2 5 50 0.1 15 MM1Z22 5M 20.8 22 23.3 5 55 0.1 17 MM1Z24 5N 22.8 24 25.6 5 60 0.1 19 MM1Z27 5P 25.1 27 28.9 5 70 0.1 21 MM1Z30 5R 28 30 32 5 80 0.1 23 MM1Z33 5X 31 33 35 5 80 0.1 25 90 0.1 27 MM1Z36 5Y 34 36 38 5 MM1Z39 5Z 37 39 41 2.5 100 2 30 MM1Z43 6A 40 43 46 2.5 130 2 33 MM1Z47 6B 44 47 50 2.5 150 2 36 MM1Z51 6C 48 51 54 2.5 180 1 39 MM1Z56 6D 52 56 60 2.5 180 1 43 MM1Z62 6E 58 62 66 2.5 200 0.2 47 MM1Z68 6F 64 68 72 2.5 250 0.2 52 MM1Z75 6H 70 75 79 2.5 300 0.2 57 （1） V ZT is tested with pulses (20 ms) 2016.11 www.sdjingdao.com Page 2 of 3 山东晶导微电子有限公司 MM1Z2V0 THRU MM1Z75 Jingdao Microelectronics PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-123 A D b E A1 C ∠ALL ROUND L1 E1 SOD-123 mechanical data A C D E E1 L1 b A1 max 1.3 0.22 1.8 2.8 3.9 0.45 0.7 0.2 min 0.9 0.09 1.5 2.5 3.6 0.25 0.5 max 51 8.7 71 110 154 18 28 min 35 3.5 59 98 142 10 20 UNIT ∠ mm 9° 8 mil The recommended mounting pad size 2.0 (79) 1.2 (47) 1.2 (47) 1.2 (47) Unit： mm (mil) 2016.11 www.sdjingdao.com Page 3 of 3