MM1W51

山东晶导微电子有限公司 MM1W3V3 THRU MM1W330 Jingdao Microelectronics Silicon Planar Zener Diodes PINNING PIN FEATURES • Total power dissipation: Max. 1 W. • Wide zener reverse voltage range 3.3V to 330V. • Small plastic package suitable for surface mounted design. DESCRIPTION 1 Cathode 2 Anode 2 MECHANICAL DATA ▪ Case: SOD-123 1 • Terminals: Solderable per MIL-STD-750, Method 2026 Simplified outline SOD-123 and symbol Absolute Maximum Ratings And Characteristics （Ta = 25 °C） Symbol Value Unit Power Dissipation at T L =75°C PD 1 W Forward Voltage at I F = 200 mA VF 1.2 V RθJA 300 °C/W T j , T stg -55 ~ +150 °C Parameter Typical thermal resistance juncting to ambient Operating and Storage Temperature Range (1) Fig.1 Maximum Continuous Power Derating 1.2 Power Dissipation ( W ) 1.0 0.8 0.6 0.4 0.2 0.0 25 50 75 100 125 T c ,Case Temperature (°C) 2016.10 150 175 Transient Thermal Impedance（ °C /W） (1) Thermal resistance from junction to ambient at P.C.B. mounted with 2. 0" X 2.0" (5 X 5 cm) copper areas pads. Fig.2 Typical Transient Thermal Impedance 200 100 10 1 0.01 0.1 1 10 100 t, Pulse Duration（sec） SOD123-W-MM1W3V3~MM1W330-1W Page 1 of 3 Characteristics at Ta = 25°C Dynamic Impedance Zener Voltage Range （1） Type Marking V ZT（at I ZT） Reverse Current I ZT Z ZT（at I ZT） IR at V R Admissible Zener Current Min（V） Nom（V） Max（V） (mA) Max (Ω) Max（μA） （V） I ZM (mA) MM1W3V3 FHD 3.10 3.3 3.50 75 10 100 1 285 MM1W3V6 FHE 3.40 3.6 3.80 69 10 100 1 263 MM1W3V9 FHF 3.70 3.9 4.10 64 9.0 50 1 243 MM1W4V3 FHG 4.06 4.3 4.56 58 9.0 25 1 219 MM1W4V7 FHJ 4.50 4.7 4.93 53 8.0 10 1 203 MM1W5V1 FHK 4.84 5.1 5.36 49 7.0 10 1 186 MM1W5V6 FHL 5.32 5.6 5.92 45 5.0 10 2 170 MM1W6V2 FHN 5.86 6.2 6.51 41 2.0 10 3 154 MM1W6V8 FHO 6.46 6.8 7.18 37 3.5 10 4 140 MM1W7V5 FHQ 7.12 7.5 7.88 34 4.0 10 5 127 MM1W8V2 FHR 7.79 8.2 8.67 31 4.5 10 6 116 MM1W9V1 FHT 8.60 9.1 9.59 28 5.0 10 7 104 MM1W10 FHU 9.50 10 10.5 25 7.0 10 7 95 MM1W11 FHV 10.4 11 11.6 23 8.0 5 8 86 MM1W12 FHW 11.4 12 12.6 21 9.0 5 9 79 MM1W13 FHX 12.4 13 14.1 19 10 5 10 71 MM1W15 FHZ 13.8 15 15.8 17 14 5 11 63 MM1W16 FJA 15.2 16 17.1 16 16 5 12 58 MM1W18 FJF 16.8 18 19.2 14 20 5 13 52 MM1W20 FJG 19.0 20 21.2 13 22 5 15 47 MM1W22 FJK 20.8 22 23.3 12 23 5 17 43 MM1W24 FJL 22.8 24 26.0 11 25 5 18 38 MM1W27 FJN 25.3 27 28.9 9.5 35 5 21 35 MM1W30 FJQ 28.2 30 32.0 8.5 40 5 23 31 MM1W33 FJR 31.3 33 34.9 7.5 45 5 25 28 MM1W36 FJS 34.2 36 37.9 7.0 50 5 27 26 MM1W39 FJT 37.2 39 41.5 6.5 60 5 30 24 MM1W43 FLG 40.9 43 45.6 6.0 70 1 32 22 MM1W47 FLJ 44.9 47 49.8 5.5 80 1 35 20 MM1W51 FLK 48.6 51 54.0 5.0 95 1 38 18 MM1W56 FLL 53.6 56 58.8 4.5 110 1 42 17 MM1W62 FLN 58.9 62 65.6 4.0 125 1 47 15 MM1W68 FLO 64.6 68 71.7 3.7 150 1 52 14 MM1W75 FLQ 71.2 75 78.8 3.3 175 1 56 12 MM1W82 FLR 77.9 82 87.0 3.0 200 1 62 11 MM1W91 FLT 86.0 91 96.0 2.8 250 1 69 10 MM1W100 FLU 95.0 100 105 2.5 350 1 76 9.5 MM1W110 FLV 104 110 116 2.3 450 1 84 8.6 MM1W120 FLW 114 120 127 2.0 550 1 91 7.8 MM1W135 FLX 125 135 142 1.9 700 1 100 7.0 MM1W150 FLZ 140 150 157 1.7 900 1 110 6.3 MM1W165 FPA 155 165 172 1.6 1100 1 120 5.8 MM1W180 FPF 170 180 191 1.4 1200 1 135 5.2 MM1W200 FPG 189 200 211 1.2 1400 1 150 4.7 MM1W220 FPK 209 220 231 1.0 1600 1 165 4.3 MM1W240 FPL 229 240 251 1.0 1800 1 180 3.9 MM1W260 FPM 249 260 271 1.0 2000 1 190 3.7 MM1W280 FPN 269 280 291 1.0 2100 1 205 3.4 MM1W300 FPQ 289 300 315 1.0 2300 1 230 3.1 MM1W330 FLR 313 330 346 1.0 2500 1 250 2.8 （1） V ZT is tested with pulses (20 ms) www.sdjingdao.com Page 1 of 3 山东晶导微电子有限公司 MM1W3V3 THRU MM1W330 Jingdao Microelectronics PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-123 A D b E A1 C ∠ALL ROUND L1 E1 SOD-123 mechanical data A C D E E1 L1 b A1 max 1.3 0.22 1.8 2.8 3.9 0.45 0.7 0.2 min 0.9 0.09 1.5 2.5 3.6 0.25 0.5 max 51 8.7 71 110 154 18 28 min 35 3.5 59 98 142 10 20 UNIT ∠ mm 9° 8 mil The recommended mounting pad size 2.0 (79) 1.2 (47) 1.2 (47) 1.2 (47) Unit： mm (mil) 2016.10 www.sdjingdao.com Page 1 of 3