SM1A23NSU
®
N-Channel Enhancement Mode MOSFET
Features
·
Pin Description
100V/15A,
D
RDS(ON)= 100mW(max.) @ VGS= 10V
RDS(ON)= 110mW(max.) @ VGS= 4.5V
·
·
·
·
S
100% UIS + Rg Tested
G
ESD Protection
Top View of TO-252-2
Reliable and Rugged
Lead Free and Green Devices Available
D (2)
(RoHS Compliant)
G (1)
Applications
·
Power Management in DC/DC Converter.
S (3)
N-Channel MOSFET
Ordering and Marking Information
SM1A23NS
Assembly Material
Handling Code
Temperature Range
Package Code
SM1A23NS U :
SM1A23N
XXXXX
Package Code
U : TO-252-2
Operating Junction Temperature Range
C : -55 to 150 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
XXXXX - Lot Code
Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate
termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the leadfree requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER
defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight
in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ã Sinopower Semiconductor Inc.
Rev. A.3 - December, 2018
1
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SM1A23NSU
®
Absolute Maximum Ratings
Symbol
(TA = 25°C Unless Otherwise Noted)
Parameter
Rating
Unit
Common Ratings
VDSS
Drain-Source Voltage
100
VGSS
Gate-Source Voltage
±20
Maximum Junction Temperature
150
TJ
T STG
IS
Diode Continuous Forward Current
ID
Continuous Drain Current
a
IDM
PD
Pulsed Drain Current
Maximum Power Dissipation
R qJC
Continuous Drain Current
PD
Maximum Power Dissipation
R qJA c
15
TC=25°C
15
TC=100°C
9
TC=25°C
60
TC=25°C
44
TC=100°C
17
2.8
TA=25°C
3.4
TA=70°C
2.7
TA=25°C
2.5
TA=70°C
1.6
Thermal Resistance-Junction to Ambient
b
Avalanche Current, Single pulse
b
Avalanche Energy, Single pulse
EAS
TC=25°C
Thermal Resistance-Junction to Case
ID
IAS
-55 to 150
Storage Temperature Range
V
°C
A
W
°C/W
A
W
50
°C/W
L=0.5mH
7
A
L=0.5mH
12
mJ
Note a:Pulse width limited by max. junction temperature.
o
o
Note b:UIS tested and pulse width limited by maximum junction temperature 150 C (initial temperature Tj=25 C).
2
Note c:Surface Mounted on 1in pad area.
Copyright ã Sinopower Semiconductor Inc.
Rev. A.3 - December, 2018
2
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SM1A23NSU
®
Electrical Characteristics
Symbol
(TA = 25°C Unless Otherwise Noted)
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
100
-
-
V
-
-
1
-
-
30
Static Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VGS(th)
IGSS
RDS(ON)
d
VGS=0V, IDS=250mA
VDS=80V, VGS=0V
TJ=85°C
mA
Gate Threshold Voltage
VDS=VGS , IDS=250mA
1
2
3
V
Gate Leakage Current
VGS=±20V, VDS=0V
-
-
±10
mA
VGS=10V, IDS =8A
-
80
100
VGS=4.5V, IDS=7A
-
85
110
ISD=8A, VGS=0V
-
0.8
1.3
V
-
24
-
ns
-
31
-
nC
-
2.5
-
W
-
740
960
-
45
-
-
24
-
-
11
20
-
6
11
-
27
49
-
5
10
-
7.1
-
-
15
20
-
2.8
-
-
2.8
-
Drain-Source On-state Resistance
mW
Diode Characteristics
VSD
d
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Dynamic Characteristics
e
RG
Gate Resistance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
tf
ISD=8A, dlSD/dt=100A/ms
VGS=0V,VDS=0V,f=1MHz
VGS=0V,
VDS=30V,
Frequency=1.0MHz
VDD=30V, R L=30W,
IDS=1A, VGEN=10V,
RG=6W
Turn-off Fall Time
Gate Charge Characteristics
pF
ns
e
Qg
Total Gate Charge
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS=30V, VGS=4.5V,
IDS=8A
VDS=30V, VGS=10V,
IDS=8A
nC
Note d:Pulse test ; pulse width£300ms, duty cycle£2%.
Note e:Guaranteed by design, not subject to production testing.
Copyright ã Sinopower Semiconductor Inc.
Rev. A.3 - December, 2018
3
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SM1A23NSU
®
Typical Operating Characteristics
Power Dissipation
Drain Current
18
50
15
ID - Drain Current (A)
Ptot - Power (W)
40
30
20
10
12
9
6
3
o
0
o
T C =25 C
0
20
40
60
80
0
100 120 140 160
20
40
60
80
100 120 140 160
Tj - Junction Temperature
Safe Operation Area
Thermal Transient Impedance
Normalized Transient Thermal Resistance
Lim
it
100
s(o
n)
10ms
10
Rd
ID - Drain Current (A)
0
Tj - Junction Temperature (°C)
300
100ms
1
1ms
DC
o
0.1
0.01
T C=25 C,VG=10V
TC=25 C
0.1
1
10
100
500
VDS - Drain - Source Voltage (V)
Copyright ã Sinopower Semiconductor Inc.
Rev. A.3 - December, 2018
2
Duty = 0.5
1
0.2
0.1
0.1
0.05
0.02
0.01
0.01
Single Pulse
o
1E-3
1E-6
RqJC :2.8 C/W
1E-5
1E-4
1E-3
0.01
0.1
Square Wave Pulse Duration (sec)
4
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SM1A23NSU
®
Typical Operating Characteristics (Cont.)
Output Characteristics
Drain-Source On Resistance
140
20
VGS=3.5,4,5,6,7,8,9,10V
RDS(ON) - On - Resistance (mW)
ID - Drain Current (A)
16
12
3V
8
4
0
2.5V
0
1
2
3
4
5
120
100
VGS=4.5V
80
VGS=10V
60
40
6
0
3
6
9
ID - Drain Current (A)
Gate-Source On Resistance
Gate Threshold Voltage
1.6
160
18
IDS=250mA
IDS=8A
1.4
Normalized Threshold Voltage
RDS(ON) - On - Resistance (mW)
15
VDS - Drain - Source Voltage (V)
180
140
120
100
80
60
12
2
3
4
5
6
7
8
9
1.0
0.8
0.6
0.4
-50 -25
10
VGS - Gate - Source Voltage (V)
Copyright ã Sinopower Semiconductor Inc.
Rev. A.3 - December, 2018
1.2
0
25
50
75 100 125 150
Tj - Junction Temperature (°C)
5
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SM1A23NSU
®
Typical Operating Characteristics (Cont.)
Source-Drain Diode Forward
Drain-Source On Resistance
2.5
60
VGS = 10V
2.0
IS - Source Current (A)
Normalized On Resistance
IDS = 8A
1.5
1.0
0.5
10
o
Tj=150 C
o
Tj=25 C
1
o
RON@Tj=25 C: 80mW
0.0
-50 -25
0
25
50
0.1
0.0
100 125 150
0.3
0.6
0.9
1.2
Tj - Junction Temperature (°C)
VSD - Source - Drain Voltage (V)
Capacitance
Gate Charge
1100
1000
9
900
8
800
Ciss
700
600
500
400
300
200
100
Coss
0 Crss
0
8
16
24
32
VDS= 30V
IDS= 8A
7
6
5
4
3
2
1
0
40
VDS - Drain-Source Voltage (V)
Copyright ã Sinopower Semiconductor Inc.
Rev. A.3 - December, 2018
1.5
10
Frequency=1MHz
VGS - Gate-source Voltage (V)
C - Capacitance (pF)
75
0
3
6
9
12
15
QG - Gate Charge (nC)
6
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SM1A23NSU
®
Avalanche Test Circuit and Waveforms
VDS
L
tp
VDSX(SUS)
DUT
VDS
IAS
RG
VDD
VDD
IL
tp
EAS
0.01W
tAV
Switching Time Test Circuit and Waveforms
VDS
RD
VDS
DUT
RG
90%
VGS
VDD
10%
VGS
tp
td(on) tr
Copyright ã Sinopower Semiconductor Inc.
Rev. A.3 - December, 2018
7
td(off) tf
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SM1A23NSU
®
Disclaimer
Sinopower Semiconductor Inc. (hereinafter “Sinopower”) has been making
great efforts to development high quality and better performance products to
satisfy all customers’ needs. However, a product may fail to meet customer’s
expectation or malfunction for various situations.
All information which is shown in the datasheet is based on Sinopower’s
research and development result, therefore, Sinopower shall reserve the right
to adjust the content and monitor the production.
In order to unify the quality and performance, Sinopower has been following
JEDEC while defines assembly rule. Notwithstanding all the suppliers
basically follow the rule for each product, different processes may cause
slightly different results.
The technical information specified herein is intended only to show the typical
functions of and examples of application circuits for the products. Sinopower
does not grant customers explicitly or implicitly, any license to use or exercise
intellectual property or other rights held by Sinopower and other parties.
Sinopower shall bear no responsible whatsoever for any dispute arising from
the use of such technical information.
The products are not designed or manufactured to be used with any
equipment, device or system which requires an extremely high level of
reliability, such as the failure or malfunction of which any may result in a direct
threat to human life or a risk of human injury. Sinopower shall bear no
responsibility in any way for use of any of the products for the above special
purposes. If a product is intended to use for any such special purpose, such
as vehicle, military, or medical controller relevant applications, please contact
Sinopower sales representative before purchasing.
Copyright ã Sinopower Semiconductor Inc.
Rev. A.3 - December, 2018
8
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SM1A23NSU
®
Classification Profile
Copyright ã Sinopower Semiconductor Inc.
Rev. A.3 - December, 2018
9
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SM1A23NSU
®
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak
(Tp)*
package
body
Temperature
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
Volume mm