TPP50R400C, TPA50R400C, TPU50R400C, TPD50R400C, TPC50R400C,TPB50R400C
Wuxi Unigroup Microelectronics Company
500V Super-Junction Power MOSFET
FEATURES
Very low FOM RDS(on)×Qg
100% avalanche tested
RoHS compliant
APPLICATIONS
Switch Mode Power Supply (SMPS)
Uninterruptible Power Supply (UPS)
Power Factor Correction (PFC)
Device Marking and Package Information
Device
TPP50R400C
TPA50R400C
TPU50R400C
TPD50R400C
TPC50R400C
TPB50R400C
Package
TO-220
TO-220F
TO-251
TO-252
TO-262
TO-263
Marking
50R400C
50R400C
50R400C
50R400C
50R400C
50R400C
Absolute Maximum Ratings TC = 25ºC, unless otherwise noted
Value
Parameter
Symbol
Drain-Source Voltage (VGS = 0V)
(note1)
Gate-Source Voltage
Unit
TO-220F
VDSS
500
V
ID
7
A
IDM
21
A
VGSS
±30
V
Continuous Drain Current
Pulsed Drain Current
TO-220, TO-251, TO-252
TO-262, TO-263
Single Pulse Avalanche Energy
(note2)
EAS
162
mJ
Avalanche Current
(note1)
IAR
1.4
A
Repetitive Avalanche Energy
(note1)
EAR
0.2
mJ
Power Dissipation (TC = 25ºC)
Operating Junction and Storage Temperature Range
PD
TJ, Tstg
63
28
-55~+150
W
ºC
Thermal Resistance
Value
Parameter
Symbol
Unit
TO-220, TO-251, TO-252
TO-262, TO-263
TO-220F
Thermal Resistance, Junction-to-Case
RthJC
2.0
4.5
Thermal Resistance, Junction-to-Ambient
RthJA
62
80
ºC/W
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Specifications TJ = 25ºC, unless otherwise noted
Value
Parameter
Symbol
Test Conditions
Unit
Min.
Typ.
Max.
VGS = 0V, ID = 250µA
500
--
--
VDS = 500V, VGS = 0V, TJ = 25ºC
--
--
1
VDS = 500V, VGS = 0V, TJ = 150ºC
--
--
100
IGSS
VGS = ±30V
--
--
±100
nA
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = 250µA
2.5
--
4.0
V
Drain-Source On-Resistance (Note3)
RDS(on)
VGS = 10V, ID = 3A
--
0.36
0.40
Ω
gfs
VDS = 10V, ID = 3A
--
5
--
S
--
587
--
--
31
--
Static
Drain-Source Breakdown Voltage
V(BR)DSS
Zero Gate Voltage Drain Current
IDSS
Gate-Source Leakage
Forward Transconductance
(Note3)
V
μA
Dynamic
Input Capacitance
Ciss
VGS = 0V,
VDS = 50V,
f = 1.0MHz
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
--
4
--
Total Gate Charge
Qg
--
14.5
--
Gate-Source Charge
Qgs
--
3
--
Gate-Drain Charge
Qgd
--
5.2
--
Turn-on Delay Time
td(on)
--
39
--
Turn-on Rise Time
tr
--
25
--
Turn-off Delay Time
td(off)
--
100
--
--
18
--
--
--
6.3
--
--
19
--
0.9
1.2
V
--
250
--
ns
--
2.1
--
μC
--
16
--
A
Turn-off Fall Time
VDD = 400V, ID = 7A,
VGS = 10V
VDD = 400V, ID = 7A,
RG = 25Ω
tf
pF
nC
ns
Drain-Source Body Diode Characteristics
Continuous Body Diode Current
IS
TC = 25ºC
Pulsed Diode Forward Current
ISM
Body Diode Voltage
VSD
Reverse Recovery Time
TJ = 25ºC, ISD = 7A, VGS = 0V
trr
Reverse Recovery Charge
Qrr
Peak Reverse Recovery Current
Irrm
VR = 400V, IF = IS,
diF/dt = 100A/μs
A
Notes
1.
Repetitive Rating: Pulse Width limited by maximum junction temperature
2.
IAS = 1.4A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3.
Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 1%
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Wuxi Unigroup Microelectronics Company
Typical Characteristics TJ = 25ºC, unless otherwise noted
Figure 1. Output Characteristics
Figure 2. Transfer Characteristics
25
20V
10V
8V
7V
6V
5V
25
20
15
VDS = 10V
ID, Drain Current (A)
ID, Drain Current (A)
30
10
20
TJ = 25ºC
15
TJ = 150ºC
10
5
5
0
0
0
5
10
15
20
0
2
VDS, Drain-to-Source Voltage (V)
10
104
0.48
VGS = 10V
TJ = 25ºC
0.46
Capacitance (pF)
RDS(on), On-Resistance (Ω)
8
Figure 4. Capacitance
0.5
0.44
0.42
0.4
0.38
0.36
Ciss
103
102
Coss
101
0.34
Crss
VGS = 0
f = 1MHz
0.32
100
0.3
0
4
8
12
16
0
20
ID, Drain Current (A)
10
20
30
40
50
60
VDS, Drain-to-Source Voltage (V)
Figure 5. Gate Charge
Figure 6. Body Diode Forward Voltage
102
10
Is, Source Current (A)
VGS, Gate-to-Source Voltage (V)
6
VGS, Gate-to-Source Voltage (V)
Figure 3. On-Resistance vs. Drain Current
8
VDD = 120V
6
VDD = 480V
4
2
TJ = 150ºC
101
TJ = 25ºC
100
10-1
10-2
10-3
0
0
5
10
0.2
15
Qg, Total Gate Charge (nC)
V3.0
4
0.4
0.6
0.8
1
1.2
1.4
VSD, Source-to-Drain Voltage (V)
3
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Wuxi Unigroup Microelectronics Company
Typical Characteristics TJ = 25ºC, unless otherwise noted
Figure 7. On-Resistance vs.
Junction Temperature
0.6
VGS = 10V
ID = 3A
2.5
2
1.5
1
0.5
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
0
-100
-50
0
50
100
150
-1.2
-100
200
101
100
D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
Single Pulse
10-2
10-3
10-7
10-6
10-5
10-4
10-3
10-2
0
50
100
150
200
Figure 10. Transient Thermal Impedance
TO-220F
Figure 9. Transient Thermal Impedance
TO-220,TO-251,TO-252,TO-262,TO-263
10-1
-50
TJ, Junction Temperature (ºC)
ZthJC, Thermal Impedance (K/W)
ZthJC, Thermal Impedance (K/W)
TJ, Junction Temperature (ºC)
10-1
101
100
D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
Single Pulse
10-1
10-2
10-3
10-7 10-6 10-5 10-4
Tp, Pulse Width (s)
V3.0
ID = 250µA
0.4
VGS(th), (Variance)we
RDS(on), (Normalized)
3
Figure 8. Threshold Voltage vs.
Junction Temperature
10-3 10-2 10-1 100 101
Tp, Pulse Width (s)
4
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TPP50R400C, TPA50R400C, TPU50R400C, TPD50R400C, TPC50R400C,TPB50R400C
Wuxi Unigroup Microelectronics Company
Figure A:Gate Charge Test Circuit and Waveform
Figure B:Resistive Switching Test Circuit and Waveform
Figure C:Unclamped Inductive Switching Test Circuit and Waveform
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TPP50R400C, TPA50R400C, TPU50R400C, TPD50R400C, TPC50R400C,TPB50R400C
Wuxi Unigroup Microelectronics Company
TO-220
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TPP50R400C, TPA50R400C, TPU50R400C, TPD50R400C, TPC50R400C,TPB50R400C
Wuxi Unigroup Microelectronics Company
TO-220F
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TPP50R400C, TPA50R400C, TPU50R400C, TPD50R400C, TPC50R400C,TPB50R400C
Wuxi Unigroup Microelectronics Company
TO-251
V3.0
8
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TPP50R400C, TPA50R400C, TPU50R400C, TPD50R400C, TPC50R400C,TPB50R400C
Wuxi Unigroup Microelectronics Company
TO-252
V3.0
9
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TPP50R400C, TPA50R400C, TPU50R400C, TPD50R400C, TPC50R400C,TPB50R400C
Wuxi Unigroup Microelectronics Company
TO-262
V3.0
10
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TPP50R400C, TPA50R400C, TPU50R400C, TPD50R400C, TPC50R400C,TPB50R400C
Wuxi Unigroup Microelectronics Company
TO-263
V3.0
11
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TPP50R400C, TPA50R400C, TPU50R400C, TPD50R400C, TPC50R400C,TPB50R400C
Wuxi Unigroup Microelectronics Company
Disclaimer
All product specifications and data are subject to change without notice.
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any legal liability or responsibility for the accuracy, completeness of any product or technology
disclosed hereunder.
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by this document or by any conduct of Wuxi Unigroup.
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damages arising or resulting from such use or sale.
Wuxi Unigroup disclaims any and all liability arising out of the use or application of any product
described herein or of any information provided herein to the maximum extent permitted by law. The
product specifications do not expand or otherwise modify Wuxi Unigroup’s terms and conditions of
purchase, including but not limited to the warranty expressed therein, which apply to these products.
Wuxi Unigroup Microelectronics CO., LTD. strives to supply high-quality high-reliability products.
However, any and all semiconductor products fail with some probability. It is possible that these
probabilistic failures could give rise to accidents or events that could endanger human lives that could
give rise to smoke or fire, or that could cause damage to other property. When designing equipment,
adopt safety measures so that these kinds of accidents or events cannot occur. Such measures
include but are not limited to protective circuits and error prevention circuits for safe design, redundant
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Information (including circuit diagrams and circuit parameters) herein is for example only. It is not
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