NP12N10G
100V N-Channel Enhancement Mode MOSFET
Description
Schematic diagram
The NP12N10G uses advanced trench technology
to provide excellent R DS(ON) and low gate charge.It can
be used in a wide variety of applications.
D
G
General Features
V DS =100V, I D =12A
R DS(ON) (Typ.)=105mΩ @V GS =10V
R DS(ON) (Typ.)=122mΩ @V GS =4.5V
High density cell design for ultra low Rdson
Fully characterized avalanche voltage and current
Good stability and uniformity with high E AS
Excellent package for good heat dissipation
Special process technology for high ESD
capability
S
Marking and pin assignment
TO-252-2L
(Top View)
Application
Automotive applications
Hard switched and high frequency circuits
Uninterruptible power supply
Package
XXXX—Wafer Information
YYYY—Quality Code
TO-252-2L
Ordering Information
Part Number
Storage Temperature
Package
Devices Per Reel
NP12N10G-G
-55°C to +150°C
TO-252-2L
2500
Absolute Maximum Ratings (TA=25℃ unless otherwise noted)
parameter
symbol
limit
unit
Drain-source voltage
V DS
100
V
Gate-source voltage
V GS
±20
V
TC=25°C
Continuous Drain Current
TC=100°C
Pulsed Drain Current
(note1)
Avalanche energy( L=0.5mH)
Maximum power dissipation
TC=25°C
Operating junction Temperature range
Rev.1.1 —Oct. 26. 2017
1
ID
12
8
A
I DP
48
A
E AS
25
mJ
PD
50
W
Tj
-55—150
℃
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NP12N10G
Electrical Characteristics (TA=25℃ unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
100
-
-
V
T J =25°C
-
-
1
T J =85°C
-
-
30
Static Characteristics
Drain-source breakdown voltage
BV DSS
V GS =0V, I D =250µA
Zero gate voltage drain current
I DSS
V DS =100V,
GS =0V
Gate Leakage Current
I GSS
V DS =0V, V GS =±20V
-
-
±100
nA
Gate threshold voltage
V GS(th)
V DS =V GS , I D =250µA
1
1.6
2.5
V
Drain-source on-state resistance1
R DS(ON)
V GS =10V, I D =12A
-
105
130
V GS =4.5V, I D =10A
-
122
150
12
-
-
A
-
-
12
A
-
22
-
ns
-
90
-
nC
-
730
-
-
36
-
On Status Drain Current
I D(ON)
VDS=100V, VGS=10V
µA
mΩ
Diode Characteristics
Diode Continuous Forward Current
IS
Reverse Recovery Time
trr
Reverse Recovery Charge
Qrr
IF=12A,
dI/dt=100A/us
Dynamic Characteristics2
Input capacitance
C ISS
V GS =0V ,V DS =50V
f=1.0MHz
Output capacitance
C OSS
Reverse transfer capacitance
C RSS
-
31
-
Turn-on delay time
t D(ON)
-
15
-
Turn-on Rise time
tr
-
5
-
Turn-off delay time
t D(OFF)
-
25
-
-
7
-
-
19
Turn-off Fall time
tf
Total gate charge
Qg
Gate-source charge
Q gs
Gate-drain charge
Q gd
V GS =10V, V DS =50V, I D =12A
V GS =10V,I D =12A
V DS =50V
pF
ns
nC
4.6
-
4.1
-
-
0.8
1.1
Drain-Source Diode Characteristics
Diode forward voltage
Note:
V SD
ISD=12A,VGS=0V
1:Eas test:VDD=50V,RG=50ohm,L=500uH
2:Pulse test; pulse width ≦ 300ns, duty cycle ≦ 2%.
3:Guaranteed by design, not subject to production testing.
Rev.1.1 —Oct. 26. 2017
2
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V
NP12N10G
Typical Performance Characteristics
30
25
24
ID-Drain Current(A)
ID-Drain Current(A)
27
21
10V
18
15
4.5V
12
9
6
3.3V
20
15
10
5
2.5V
3
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0.0
5.0
0.5
180
1800
160
1600
VGS=4.5V
120
100
VGS=10V
80
60
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1400
1200
1000
Ciss
800
600
40
400
20
200
0
Coss Crss
0
0.0
0.8
1.6
2.4
3.2
4.0
4.8
5.6
6.4
7.2
8.0
0
1
ID-Drain Current(A)
2
3
4
5
6
7
8
9
10
18
20
Vds Drain-Source Voltage(V)
Fig3 Rdson-Drain current
Fig4 Capacitance vs Vds
10
440
9
400
Vgs Gate-Source Voltage(V)
Rds- On Resistance(mR)
1.5
Fig2 Transfer Characteristics
2000
Capacitance(pF)
Rdson- On Resistance(mR)
Fig1 Output Characteristics
200
140
1.0
Vgs Gate-Source Voltage(V)
Vds Drain-Source Voltage(V)
360
320
280
240
200
160
120
8
7
6
5
4
3
2
1
80
0
0
1
2
3
4
5
6
7
8
9
0
10
2
4
6
8
10
12
14
Vgs Gate-Source Voltage(V)
Qg Gate Charge(nC)
Fig5 Rdson-Gate Drain voltage
Fig6 Gate Charge
Rev.1.1 —Oct. 26. 2017
3
16
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NP12N10G
100
IS- Reverse Drain Current(A)
100
Power Dissipation (W)
90
80
70
60
50
40
30
20
10
0
0
15
30
45
60
75
90
105
120
135
150
1
0.1
0.0
TJ-Junction Temperature(ºC)
0.2
0.4
0.6
0.8
1.0
Vsd Source -Gate Voltage(V)
Fig7 Power De-rating
Rev.1.1 —Oct. 26. 2017
10
Fig8 Source-Drain Diode Forward
4
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1.2
NP12N10G
Package Information
TO-252-2L
Rev.1.1 —Oct. 26. 2017
5
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