ME2801
Voltage Detectors , ME2801 Series
General Description
Features
ME2801 Series are highly precise , low power
consumption voltage detectors,manufactured using
CMOS technologies. Detect voltage is extremely
accurate with minimal temperature drift.CMOS output
configurations are available.
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Highly accuracy: ±1%
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Low power consumption:TYP 0.7uA (Vin=1.5V)
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Detect voltage range:2.0V~4.8V in 0.1V increments
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Operating voltage range:0.7V~7V
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Detect voltage temperature characteristics:
TYP±100ppm/℃
Selection Guide
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Output configuration: CMOS
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Package: SOT-23-3,SOT-89-3,TO-92
Typical Application
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Microprocessor reset circuitry
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Memory battery back-up circuits
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Power-on reset circuits
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Power failure detection
Typical Application Circuit
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Page 1 of 9
ME2801
Pin Configuration
TO-92
SOT-23-3
SOT-89-3
Pin Assignment
ME2801AXX/ME2801BXX
Pin Number
SOT-23-3
SOT-89-3
TO-92(T)
TO-92(T1)
2
1
3
3
1
2
3
1
2
2
3
1
Pin Name
Functions
GND
VOUT
VIN
Ground
Output Voltage
Input Voltage
Block Diagram
Absolute Maximum Ratings
PARAMETER
SYMBAL
RATINGS
UNITS
VIN Input Voltage
VIN
8
V
Output Current
Iout
50
mA
CMOS
Output Voltage
Vout
N-ch open drain
Continuous Total
Power Dissipation
Vss-0.3~Vin+0.3
SOT-23-3
SOT-89-3
V
Vss-0.3~12
150
Pd
500
TO-92
mW
300
Operating Ambient Temperature
TOpr
-40~+85
℃
Storage Temperature
Tstg
-40~+125
℃
Soldering temperature and time
Tsolder
260℃, 10s
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ME2801
Electrical Characteristics
(VDF(S)=2.0V to 4.8V±1% ,Ta=25OC ,unless otherwise noted)
Parameter
VDF
VHYS
Iss
VIN
Symbol
Conditions
Detect Voltage
VDF(S)*0.99
Hysteresis
Typ.
VDF(S)
Max.
Units
VDF(S)*1.01
V
V
VDF*0.02
VDF*0.05
VDF*0.08
Vin=1.5V
-
0.7
2.7
Vin=2.0V
-
0.8
3.2
Vin=3.0V
-
0.9
3.6
Vin=4.0V
-
1.0
3.8
Vin=5.0V
-
1.1
4.3
0.7
-
7
VIN=1.0V
1.0
2.2
=2.0V
3.0
7.7
=3.0V
5.0
10.1
=4.0V
6.0
11.5
=5.0V
7.0
13.0
Range
Supply Current
Min.
Operating
VDF(T)=1.6V to
Voltage
6.0V
uA
V
N-ch,VDS=0.5V
IOUT
Output Current
P-ch,VDS=2.1V
VIN=8.0V
ΔVDF/(Δtopr*VDF)
Temperature
characteristics
-40℃≤Topr≤85℃
-10.0
±100
mA
-2.0
mA
ppm/℃
Note: 1、VDF(S) :Specified Detection Voltage value
2、VDF :Actual Detection Voltage value
3、Release Voltage:VDR=VDF+VHYS (ME2801A 系列)
VDR=VDF-VHYS (ME2801B 系列)
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ME2801
Functional Description:
1、 When input voltage (VIN) rises above detect voltage (VDF), output voltage (VOUT) will be equal to VIN.
2、 When input voltage (VIN) falls below detect voltage (VDF), output voltage (VOUT) will be equal to the
ground voltage (VSS) level.
3、 When input voltage (VIN) falls to a level below that of the minimum operating voltage (VMIN), output will become
unstable. In this condition, VIN will equal the pulled-up output ( should output be pulled-up.)
4、 When input voltage (VIN) rises above the ground voltage (VSS) level, output will be unstable at levels below the
minimum operating voltage (VMIN). Between the VMIN and detect release voltage (VDR) levels, the ground
voltage (VSS) level will be maintained.
5、 When input voltage (VIN) rises above detect release voltage (VDR), output voltage (VOUT) will be equal to VIN.
6、 The difference between VDR and VDF represents the hysteresis range.
Timing Chart:
ME2801AXX:
ME2801BXX:
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ME2801
Directions for use:
1、 Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or
permanent damage to the device.
2、When a resistor is connected between the VIN pin and the input with CMOS output configurations, oscillation may
occur as a result of voltage drops at RIN if load current(IOUT) exists.(refer to the Oscillation Description(1) below)
3、When a resistor is connected between the VIN pin and the input with CMOS output configurations, oscillation may
occur as a result of through current at the time of voltage release even if load current(IOUT ) does not exist. (refer
to the Oscillation Description(2) below)
4、With a resistor connected between the VIN and the input, detect and release voltage will rise as a result of the IC’s
supply current flowing through the VIN pin.
5、In order to stabilize the IC’s operations, please ensure that VIN pin’s input frequency’s rise and fall times are more
than several u Sec/V.
Oscillation Description:
1、 Output current oscillation with the CMOS output configuration
When the voltage applied at IN rises, release operations commence and the detector’s output voltage increase.
Load current(IOUT) will flow at RL. Because a voltage drop(RIN*IOUT) is produces at the RIN resistor, located
between the input(IN) and the VIN pin. The load current will flow via the IC’s pin. The voltage drop will also lead to
a fall in the voltage level at the VIN pin. When the VIN pin voltage level falls below the detect voltage level, detect
operations will commence. Fllowing detect operations, load current flow will cease and since voltage drop at RIN
will disapper, the voltage level at the VIN pin will rise and release operations will begin over again. Oscillation may
occur with this “release-detect-release” repetition. Futher, this condition will also appear via means of a similar
mechanism during detect operations.
2、 Oscillation as a result of
through current
Since the ME2801 series are CMOS IC’s, through current will flow when the IC’s internal circuit switching
operates(during release and detect operations). Consequently, oscillation is liable to occur as a result of drops in
voltage at the through current’s resistor(RIN) during release voltage operations.(refer to diagram 2) since
hysteresis exists during detect operations, oscillation is unlikely to occur.
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ME2801
Type Characteristics
1、 SUPPLY CURRENT VS. INPUT VOLTAGE
2、 DETECT,RELEASE VOLTAGE VS. AMBIENT TEMPERATURE
3、 OUTPUT VOLTAGE VS. INPUT VOLTAGE
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ME2801
Package
Information
SOT-89-3
SOT-23-3
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ME2801
TO-92
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Page 8 of 9
ME2801
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The information described herein is subject to change without notice.
Nanjing Micro One Electronics Inc is not responsible for any problems caused by circuits or diagrams
described herein whose related industrial properties, patents, or other rights belong to third parties.
The application circuit examples explain typical applications of the products, and do not guarantee the
success of any specific mass-production design.
Use of the information described herein for other purposes and/or reproduction or copying without the
express permission of Nanjing Micro One Electronics Inc is strictly prohibited.
The products described herein cannot be used as part of any device or equipment affecting the human
body, such as exercise equipment, medical equipment, security systems, gas equipment, or any
apparatus installed in airplanes and other vehicles, without prior written permission of Nanjing Micro
One Electronics Inc.
Although Nanjing Micro One Electronics Inc exerts the greatest possible effort to ensure high quality
and reliability, the failure or malfunction of semiconductor products may occur. The user of these
products should therefore give thorough consideration to safety design, including redundancy,
fire-prevention measures, and malfunction prevention, to prevent any accidents, fires, or community
damage that may ensue.
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Page 9 of 9
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