LND12N60/LNC12N60/LNE12N60/LNF12N60
Lonten N-channel 600V, 12A Power MOSFET
Description
Product Summary
The Power MOSFET is fabricated using the
VDSS
600V
advanced
ID
12A
planer
VDMOS
technology.
The
resulting device has low conduction resistance,
RDS(on),max
0.75Ω
superior switching performance and high avalance
Qg,typ
40.8 nC
energy.
Features
Low RDS(on)
Low gate charge (typ. Qg = 40.8 nC)
100% UIS tested
RoHS compliant
TO-262
TO-263
TO-220
TO-220F
D
Applications
G
Power factor correction.
Switched mode power supplies.
LED driver.
S
Pb
N-Channel MOSFET
Absolute Maximum Ratings
Parameter
Symbol
Drain-Source Voltage
VDSS
Continuous drain current
( TC = 25°C )
ID
Avalanche energy, single pulse
Peak diode recovery dv/dt
Power Dissipation
2)
3)
600
V
12
A
A
48
A
VGSS
±30
V
EAS
605
mJ
5
V/ns
IDM
Gate-Source voltage
Unit
7.5
( TC = 100°C )
Pulsed drain current 1)
Value
dv/dt
TO-220F ( TC = 25°C )
Derate above 25°C
42
W
0.34
W/°C
150
W
1.2
W/°C
-55 to +150
°C
PD
Power Dissipation
TO-220\ TO-262\ TO-263 ( TC = 25°C )
Derate above 25°C
Operating juncition and storage temperature range
TJ, TSTG
Continuous diode forward current
IS
12
A
Diode pulse current
IS,pulse
48
A
Thermal Characteristics
Parameter
Symbol
Value
TO-220F
TO-220\TO-251\TO-252
Unit
Thermal resistance, Junction-to-case
RθJC
2.98
0.83
°C/W
Thermal resistance, Junction-to-ambient
RθJA
110
62.5
°C/W
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2018
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LND12N60/LNC12N60/LNE12N60/LNF12N60
Package Marking and Ordering Information
Device
Device Package
Marking
Units/Tube
LNC12N60
TO-220
LNC12N60
50
LND12N60
TO-220F
LND12N60
50
LNE12N60
TO-263
LNE12N60
50
LNF12N60
TO-262
LNF12N60
50
Electrical Characteristics
Parameter
Units/Real
Tc = 25°C unless otherwise noted
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Static characteristics
Drain-source breakdown voltage
BVDSS
VGS=0 V, ID=0.25 mA
600
-
-
V
Gate threshold voltage
VGS(th)
VDS=VGS, ID=0.25 mA
2
-
4
V
Drain cut-off current
IDSS
VDS=600 V, VGS=0 V,
Tj = 25°C
-
-
1
μA
Tj = 125°C
-
100
Gate leakage current, Forward
IGSSF
VGS=30 V, VDS=0 V
-
-
100
nA
Gate leakage current, Reverse
IGSSR
VGS=-30 V, VDS=0 V
-
-
-100
nA
Drain-source on-state resistance
RDS(on)
VGS=10 V, ID=6A
-
0.53
0.75
Ω
Input capacitance
Ciss
VDS = 25 V, VGS = 0 V,
-
1960
-
Output capacitance
Coss
f = 1 MHz
-
163
-
Reverse transfer capacitance
Crss
-
7.2
-
Turn-on delay time
td(on)
VDD = 300 V, ID = 12 A
-
14.3
-
Rise time
tr
RG = 10 Ω, VGS=15 V
-
37.6
-
Turn-off delay time
td(off)
-
65.4
-
Fall time
tf
-
14.2
Dynamic characteristics
pF
ns
-
Gate charge characteristics
Gate to source charge
Qgs
VDD=480 V, ID=12 A,
-
11.0
-
Gate to drain charge
Qgd
VGS=0 to 10 V
-
15.6
-
Gate charge total
Qg
-
40.8
-
Gate plateau voltage
Vplateau
-
5
-
V
nC
Reverse diode characteristics
Diode forward voltage
VSD
VGS=0 V, IF=12 A
-
-
1.5
V
Reverse recovery time
trr
VR=300 V, IF=12 A,
-
387.2
-
ns
Reverse recovery charge
Qrr
dIF/dt=100 A/μs
-
3.87
-
μC
Peak reverse recovery current
Irrm
-
20.3
-
A
Notes:
1. Pulse width limited by maximum junction temperature.
2. L=10mH, IAS = 11A, Starting Tj= 25°C.
3. ISD = 12A, di/dt≤100A/us, VDD≤BVDS, Starting Tj= 25°C.
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2018
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LND12N60/LNC12N60/LNE12N60/LNF12N60
Electrical Characteristics Diagrams
Figure 1. Typical Output Characteristics
Figure 2. Transfer Characteristics
VGS=10V
VGS=9V
Tc = 25°C
ID, Drain current (A)
ID, Drain current (A)
VGS=8V
VGS=7V
VGS=5.5V
VGS=6V
Tc = 150°C
VGS=4.5V
VDS ,Drain−source voltage (V)
VGS ,Gate−source voltage (V)
On-Resistance
(Ω)
Vth , (Normalized)
Gate threshold voltage
Figure 4. Threshold Voltage vs. Temperature
VGS = 10 V
Tc = 25°C
Pulse test
IDS=0.25 mA
Pulse test
ID ,Drain current (A)
Tj ,Junction temperature (°C)
Figure 6. On-Resistance vs. Temperature
RDS(on), (Normalized)
Drain-Source On-Resistance
Figure 5. Breakdown Voltage vs. Temperature
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
RDS (on) , Drain-Source
Figure 3. On-Resistance Variation vs. Drain Current
VGS=0 V
IDS=0.25 mA
Pulse test
Tj ,Junction temperature (°C)
Tj ,Junction temperature (°C)
Version 1.0
2018
VGS=10 V
IDS=12 A
Pulse test
3
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LND12N60/LNC12N60/LNE12N60/LNF12N60
Figure 8. Gate Charge Characterist
VGS,Gate-Source Voltage (V)
Capacitance (pF)
Figure 7. Capacitance Characteristics
Ciss
Coss
Notes:f = 1 MHz,VGS=0 V
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Crss
VDS=480V
ID = 12 A
VDS ,Drain-Source Voltage (V)
QG ,Total Gate Charge (nC)
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Safe Operating Area
TO-220F
TO-220/ TO-262/TO-263
100us
ID ,Drain current (A)
10ms
ID ,Drain current (A)
100us
1ms
DC
Limited by R
DS(on)
Notes:
T = 25°C
c
T = 150°C
j
Limited by R
DC
DS(on)
Notes:
T = 25°C
c
T = 150°C
j
Single Pulse
Single Pulse
VDS ,Drain-Source Voltage (V)
VDS ,Drain-Source Voltage (V)
Figure 11. Power Dissipation vs. Temperature
Figure 12. Power Dissipation vs. Temperature
TO-220/ TO-262/TO-263
PD ,power dissipation, (W)
PD ,power dissipation, (W)
TO-220F
Tc ,Case temperature (°C)
Version 1.0
1ms
10ms
2018
Tc ,Case temperature (°C)
4
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LND12N60/LNC12N60/LNE12N60/LNF12N60
Figure 14. Body Diode Transfer Characteristics
ID ,Drain current (A)
ISD ,Reverse Drain Current (A)
Figure 13. Continuous Drain Current vs. Temperature
Tc = 150°
C
Tc = 25°C
VSD ,Source-Drain Voltage (V)
Tc ,Case temperature (°C)
Normalized Transient
P
DM
t
Z
θJC
Thermal Resistance
Figure 15 Transient Thermal Impendance,Junction to Case, TO-220F
In descending order
D= 0.5, 0.2, 0.1, 0.05, 0.02, 0.01, single pulse
Duty = t/T
T
Z (t)=2.98°C/W Max.
θJC
t ,Pulse Width (s)
Normalized Transient
P
In descending order
D= 0.5, 0.2, 0.1, 0.05, 0.02, 0.01, single pulse
DM
t
Duty = t/T
Z (t)=0.83°C/W Max.T
θJC
Z
θJC
Thermal Resistance
Figure 16. Transient Thermal Impendance,Junction to Case, TO-220/ TO-262/TO-263
t ,Pulse Width (s)
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2018
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LND12N60/LNC12N60/LNE12N60/LNF12N60
Gate Charge Test Circuit & Waveform
Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
Version 1.0
2018
6
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LND12N60/LNC12N60/LNE12N60/LNF12N60
Mechanical Dimensions for TO-220
UNIT:mm
SYMBOL
MIN
NOM
A
4
4.8
B
1.2
1.4
B1
1
1.4
b1
0.75
0.95
c
0.4
0.55
D
15
16.5
D1
5.9
6.9
E
9.9
10.7
e
2.44
F
1.1
1.4
L
12.5
14.5
L1
3
3.5
4
ΦP
3.7
3.8
3.9
Q
2.5
3
Q1
2
2.9
Y
8.02
2.54
8.12
MAX
2.64
8.22
TO-220 Part Marking Information
Lonten Logo
“AB”
Foundry & Assembly Code
Lonten
LNC12N60
ABYWW99
Part Number
“99”
Manufacturing Code
“YWW”
Date Code
Version 1.0
2018
7
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LND12N60/LNC12N60/LNE12N60/LNF12N60
Mechanical Dimensions for TO-220F
UNIT:mm
SYMBOL
MIN
NOM
MAX
A
4.5
4.9
A1
2.3
2.9
b
0.65
0.9
b1
1.1
1.7
b2
1.2
1.4
c
0.35
0.65
D
14.5
16.5
D1
6.1
6.9
E
9.6
10.3
E1
6.5
7
7.5
e
2.44
2.54
2.64
L
12.5
14.3
L1
9.45
10.05
L2
15
16
L3
3.2
4.4
ΦP
3
3.3
Q
2.5
2.9
TO-220F Part Marking Information
Lonten Logo
“AB”
Foundry & Assembly Code
“YWW”
Date Code
Version 1.0
2018
Lonten
LND12N60
ABYWW99
Part Number
“99”
Manufacturing Code
8
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LND12N60/LNC12N60/LNE12N60/LNF12N60
Mechanical Dimensions for TO-262
UNIT:mm
SYMBOL
MIN
NOM
A
4.42
4.72
A1
2.40
2.80
b
0.76
0.86
b1
1.22
1.40
c
0.33
0.43
c2
1.22
1.35
D
8.99
9.29
e
2.44
e1
4.98
5.18
E
9.95
10.25
L
12.50
13.60
L1
3.30
L2
1.22
Y
8.02
2.54
3.50
MAX
2.64
3.80
1.40
8.12
8.22
TO-262 Part Marking Information
Lonten Logo
“AB”
Foundry & Assembly Code
Lonten
LNF12N60
ABYWW99
Part Number
“99”
Manufacturing Code
“YWW”
Date Code
Version 1.0
2018
9
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LND12N60/LNC12N60/LNE12N60/LNF12N60
Mechanical Dimensions for TO-263
UNIT:mm
SYMBOL
MIN
NOM
A
4.42
4.72
B
1.22
1.4
b
0.76
0.86
b1
1.22
1.4
b2
0.33
0.43
C
1.22
1.35
D
9.95
10.25
E
8.99
9.29
e1
2.44
e2
4.98
L1
14.7
15.1
15.5
L2
2
2.3
2.6
L3
1.5
2
K
-0.1
0.1
Y
8.02
2.54
MAX
2.64
5.18
8.12
8.22
TO-263 Part Marking Information
Lonten Logo
“AB”
Foundry & Assembly Code
Lonten
LNE12N60
ABYWW99
Part Number
“99”
Manufacturing Code
“YWW”
Date Code
Version 1.0
2018
10
www.lonten.cc
LND12N60/LNC12N60/LNE12N60/LNF12N60
Disclaimer
The content specified herein is for the purpose of introducing LONTEN's products (hereinafter "Products"). The
information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account when
designing circuits for mass production.
LONTEN does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of the Products or technical information described in this document.
The Products are not designed or manufactured to be used with any equipment, device or system which requires
an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or
create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery,
nuclear-reactor controller, fuel-controller or other safety device). LONTEN shall bear no responsibility in any way
for use of any of the Products for the above special purposes.
Although LONTEN endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard them against the possibility of physical injury,
and injury or damage caused by fire in the event of the failure of a LONTEN product.
The content specified herein is subject to change for improvement without notice. When using a LONTEN product,
be sure to obtain the latest specifications.
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2018
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